Abstract: The present invention includes a system for efficient and effective detection and characterization of dishing and/or erosion. An x-ray emission inducer is used to scan a target on a sample. The target can be scanned at an acute incident angle to allow characterization of the dishing and/or erosion and analysis of the metallization or thin film layer topology.

Abstract: A system for determining pipe wall thickness includes a supporting framework removably attachable to the outer surface of a pipe or pipe covering and supportive of an x-ray film holder. The holder and an x-radiation source are disposed on opposite sides of the pipe in a first plane which includes the axis of the pipe. The source may be moved along the axial plane to make successive exposures of the pipe on a single piece of film. Each image includes both the upper-and lower side walls of the pipe. The film holder may be radially indexed to the pipe on the supporting framework so that the film holder and source may be disposed successively in a plurality of other axial planes radially displaced from the first axial plane. For each plane, a fresh piece of film is installed in the holder.

Abstract: A three-dimensional density distribution of a log is reduced to a two-dimensional structure that provides a convenient image or visualization of defects like knots or voids in a log, to facilitate grading and/or optimization of a sawing strategy for the log. The two-dimensional data structure is based on cylindrical or modified cylindrical coordinates Z and &thgr;. To provide a more compact identification of defects, modified cylindrical coordinates use a Z-axis that follows the growth center in the log and determines data points by evaluating properties of the log along rays at an upward angle corresponding to limbs in a tree. A process for identifying the growth center at any distance Z along the length of the log examines or accumulates the gradient of density along lines through a cross-section of the log. Manual grading and sawing optimization can employ viewing of an image based on the two-dimensional data structure with superimposed marks indicating the boundaries of faces cut from the log.

Abstract: An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.

Abstract: An apparatus for measuring the lateral yarn density distribution of a yarn uses selected X-ray radiation. Radiation absorption is determined in a number of narrow planes across the yarn and in two or more rotational orientations. The measuring takes place without any damage to or physical interference with the yarn.

Abstract: A radiation inspection apparatus calculates the difference between pixel data of each pixel, which is outputted from radiation detector 3, and pixel data of each of surrounding pixels thereof. Then, the apparatus obtains a total of circumference length of an object to be inspected WA by totalizing the number of pixels, the gray level data obtained by difference processing correspondingly to each of which is within a predetermined gray level range of gray level profile from XL to XH. Thus, the apparatus determines from the value of the total of the circumference length of the object whether or not a crack or a nick occurs in the object.

Abstract: In a method and x-ray apparatus for making and reproducing a radiological tomogram of a subject, the subject is irradiated with radiation emanating from a focus disposed at a known distance from a focal plane, situated at the subject. The focal plane is disposed at a known distance from a radiation receiver, which is disposed in the image plane, and which contains a number of picture elements. In a digital radiological tomogram, either the slice position with the aforementioned distances is allocated to respective picture elements, or a correction factor, based on the slice position and the aforementioned distances, is allocated to the respective picture elements, from which a corrected image is obtained with the subject appearing with a corrected size corresponding to the size of the subject in the focal plane.

Abstract: An x-ray shielding system includes a beam controller configured to surround an x-ray source and includes a detector shield configured to position behind an x-ray detector. The beam controller includes a source shield and an aperture. The source shield and the detector shield are adapted to block x-rays, and the aperture is adapted to transmit x-rays. A shielded digital radiographic inspection system includes the x-ray source and the beam controller surrounding the x-ray source. The beam controller includes the source shield and the aperture. The aperture is configured to rotate around the x-ray source. The inspection system further includes a digital x-ray detector positioned radially outward from the x-ray source and facing the aperture. The digital x-ray detector is configured to be movable along an orbit around the x-ray source. The inspection system further includes the detector shield configured to be movable with and positioned behind the digital x-ray detector.

Abstract: A conveyor (12) moves a workpiece (WP) past an x-ray source (14) to detect existence and location of any undesirable material included in the workpiece, such as bones, fat, metal, etc. Thereafter, the conveyor carries the workpiece further, wherein a cutter (22) segments the detected undesirable material from the workpiece into a segmented portion (SP) having a visually distinguishable shape, such as square, round, triangular, etc. A worker stationed downstream of the cutter along the conveyor may then easily spot the segmented portion (SP) in a distinguishable shape and offload the segmented portion from the conveyor, while leaving the rest of the workpiece (WP) on the conveyor for further processing. Alternatively, a pickup device (24) may be used to automatically offload the segmented portion from the conveyor. A computer (18) keeps track of the locations of the workpiece and the segmented portion at all times.

Abstract: An apparatus and method for inspecting electronic component orientation along with x-ray verification of connection integrity is presented. An comprises providing an electronic component 100 for surface mount integration and providing an x-ray visible orientation indicator 300, 402, 500, 600 for the electronic component 100 such that proper orientation of the electronic component 100 is verifiable by x-ray inspection after performing surface mount integration of the electronic component. The x-ray inspection also makes connection integrity of the electronic component 100 verifiable.

Abstract: The present invention provides a system for characterizing voids in test samples. An x-ray emission inducer scans a target such as a via on a test sample. A metallization or thin film layer emits x-rays as a result of the scan. The x-ray emission intensity can be measured and compared against a control measurement. The information obtained can be used to characterize a void in the scan target.

Abstract: A method of examining a wafer of crystalline semiconductor material by means of X-rays, in which method a surface of the wafer is scanned by means of an X-ray beam and secondary radiation generated by said X-ray beam is detected. Prior to the examination the surface of the wafer which is to be scanned by the X-ray beam during the examination is glued to a substrate, after which crystalline semiconductor material is removed at the side which is then exposed, removal taking place as far as the top layer which adjoins the surface. The top layer can thus be examined without the examination being affected by crystal defects or impurities present in layers of the wafer which are situated underneath the top layer.

Abstract: An inspection system utilized to inspect a structure for particularities, including defects, includes a first gantry with a detector inspection device that is placed in a known position on one side of the structure, and a second gantry with a source inspection device that is placed on the other side of the structure. In an embodiment, the detector inspection device is an x-ray detector inspection device and the source inspection device is an x-ray source inspection device. The movement of the first and second gantries is controlled by a gantry control system. A data acquisition system controls the data, e.g., image, collection process. During the data collection process, the relative positions of the source and detector inspection devices are initialized. The detector and source inspection devices are then moved in synchronized motion to each data collection position, such that the relative alignment of the inspection devices is maintained.

Abstract: The present invention relates to a method and an apparatus for the testing or inspection of objects, particularly for detecting defects or irregularities therein, by means of X-radiation, where the object to be inspected is brought into different spatial positions and stays there during image detection. For mechanical positioning of the objects, known methods and apparatuses require a relatively long time with limited inspection precision, whilst having a considerable space requirement. Accompanied by a small size, the invention obviates this problem in that the X-ray components, comprising X-ray tube and X-ray detector, are only moved in translatory manner and the inspection object or part in a gimbal suspension is only moved in rotary manner in at least one axis and a maximum of three axes x, y and z.

Abstract: A method for measuring a height of a bump formed on a work of substrate, the method comprising: irradiating X-rays having a predetermined wavelength and an incident intensity toward a first work of substrate which is the same as the above-mentioned work of substrate, but no bump is formed thereon, and detecting a first X-ray transmitted intensity at a position on which the bump is to be formed; irradiating X-rays having the same wavelength and incident intensity toward a material constituting the bumps and detecting a linear absorption coefficient of the X-rays; memorizing the first X-ray transmitted intensity and the linear absorption coefficient as known data; and irradiating X-rays having the same wavelength and the same incident intensity toward a second work of substrate which is the same as the above-mentioned work of substrate, but bump is formed thereon, and detecting a second X-ray transmitted intensity at a position on which the bump is formed; and determining the height of the bump from the second

Abstract: A system and method for radiographic inspection of an aircraft fuselage includes a radiation source located on one side of the fuselage and a plurality of radiation detectors located on another side of the fuselage. The system includes manipulators for moving the radiation source and the radiation detectors in a coordinated fashion. Radiation detected by the radiation detectors is processed to display stereoscopic images of areas of interest of the fuselage. The radiation source and detector positions are manipulated to obtain multiple sets of images from different viewing angles. The multiple sets of images are used to produce the stereoscopic images.

Abstract: Systems and methods for analyzing for images in an x-ray inspection system are provided. One embodiment is a system for analyzing images in an x-ray inspection system. Briefly described, one such system comprises: a means for receiving an image of an object that is generated by an x-ray inspection system, the image of the object having a first field of view (FOV); a means for determining whether the first FOV associated with the image of the object matches a reference FOV corresponding to design data that models the object being inspected by the x-ray inspection system; and a means for modifying the design data based on the difference between the first FOV and the reference FOV.

Abstract: A method for performing inspection of raised electrical contacts, such as ball grid array (BGA) and “flip-chip” type contacts, and associated underlying vias, comprises steps of: providing an electrical or electronic device or component having a major surface including an array of closely spaced apart BGA or flip-chip type raised contacts with respective underlying vias; selecting an area-of-interest (AOI) including at least one BGA or flip-chip type contact/via structure; cutting through the device or component along parallel lines to form a narrow, elongated strip including the AOI; mounting the elongated strip on a transparent substrate; and performing X-ray radiographic analysis of the elongated strip to inspect the at a least one BGA or flip-chip type contact/via structure for the presence of misalignments, voids, and delaminations.

Abstract: A system and method for radiographic inspection of an aircraft fuselage includes a radiation source located on one side of the fuselage and a plurality of radiation detectors located on another side of the fuselage. The radiation detectors are located in known positions relative to the radiation source so as to receive radiation from the radiation source at different angles. The system further includes manipulators for moving the radiation source and the radiation detectors in a coordinated fashion. The system processes the radiation detected by the radiation detectors so as to display stereoscopic images of areas of interest of the fuselage.

Abstract: Inspection systems with rho-theata x-ray source motion for inspection of populated printed circuit boards and the like. The inspection systems include a transport system for transporting articles to be inspected into and out of the inspection system. An x-ray source is mounted on a first radial translation system adjacent one side of the article to be inspected for translation along an axis parallel to the article to be inspected. The first translation system is rotatably mounted about an axis perpendicular to the article to be inspected so that the x-ray source may be positioned and moved anywhere within an area by proper coordination of the angle of rotation of the rotary transport system and the translational position of the first translational system. The exemplary embodiment disclosed also includes a second translational system supported on the first translational system for movement of the x-ray source in a direction parallel to the axis of rotation of the rotary transport system.

Abstract: An X-ray inspection system and methodology is disclosed. The system comprises a conveyor, an X-ray source that exposes an item under inspection to X-ray radiation and at least one X-ray detector that detects X-ray radiation modified by the item. The X-ray source and X-ray detector may be movable in any of first and second dimensions. The X-ray source may also be moved in a third dimension to zoom in and out on regions of interest in the item order inspection. The system further comprises a controller that controls movement of the X-ray source and X-ray detector, independently of each other, in any of collinear and different directions, to provide a plurality of X-ray views of the item at varying examination angles of the X-ray radiation. A processor coupled to the controller may be configured to receive and process detection information from the X-ray detector and to provide processed information to an operator interface.

Abstract: A radiation inspection apparatus calculates the difference between pixel data of each pixel, which is outputted from radiation detector 3, and pixel data of each of surrounding pixels thereof. Then, the apparatus obtains a total of circumference length of an object to be inspected WA by totalizing the number of pixels, the gray level data obtained by difference processing correspondingly to each of which is within a predetermined gray level range of gray level profile from XL to XH. Thus, the apparatus determines from the value of the total of the circumference length of the object whether or not a crack or a nick occurs in the object.

Abstract: A sectional image photography system includes a mounting table adapted to receive an object to be examined; a radiation projector for projecting a radiation toward an object being examined, the radiation being projected at a same level from different locations; a plane radiation detector for obtaining a plurality of partial radiation images formed from the radiations transmitted through the object in the form of electrical image signals; and an image processor for composition-processing the partial radiation images obtained by the plane radiation detector into a sectional image of a desired section of the object. Here, X-rays are used as the radiation. The plane radiation detector has a plurality of plane radiation detectors which are disposed to correspond to the radiation projected from different locations of the radiation projector. Accordingly, since the radiation images transmitted through the object are directly obtained by the plane radiation detectors, there is no radiation image distortion.

Abstract: The present invention is directed to an apparatus and method for examining small structures such as micro circuit structures. Exemplary embodiments can generate narrow electron beams for examining the micro circuits, and can eliminate the traversing of the x-rays through materials other than a target material and the sample structure. Exemplary embodiments eliminate having the x-rays traverse both a wafer and a plating target on the wafer being examined, by using a target material placed closer to the sample structure. Exemplary embodiments provide adequate magnification to perform fault analysis of small structures and provide an adequate contrast pattern for viewing images of the micro circuit being examined.

Abstract: A system and method for radiographic inspection of aircraft fuselages includes a radiation source preferably located inside of the fuselage and a radiation detector preferably located outside of the fuselage. A source positioning system is provided for moving the radiation source longitudinally with respect to the fuselage, and a detector positioning system is provided for positioning the radiation detector in longitudinal alignment with the radiation source. The detector positioning system also moves the radiation detector circumferentially with respect to the fuselage. In operation, the radiation detector is moved over the fuselage in a circumferential direction while the radiation source illuminates an adjacent region of the fuselage with radiation.

Abstract: An automated real-time, non-destructive inspection system usable to inspect a selected structure for a defect and visually identify a defect's location. In one embodiment, the inspection system is an x-ray inspection system mounted to an articulatable robot arm movable relative to the selected structure. A support system is attached to the articulatable robot arm that supports an imaging source on a first support portion and a detector panel on a second support portion spaced apart from the first support portion. A visual targeting system configured to identify where an imaging beam axis intersects the selected structure is positioned adjacent to the imaging source. The inspection system is configured to maneuver the imaging source and detector panel around the selected structure such that the desired areas on the selected structure may be fully inspected without having to reposition the selected structure.

Abstract: An industrial inspection device uses measurements at two x-ray energy to measure the relative proportions of two materials of a binary industrial composition by determining a mass ratio of a preselected selected first and second material expected to be in the binary composition and such as would provide a photoelectric absorption and Compton scattering consistent with the attenuation of the x-rays at the first and second energy. A relative proportion at different locations can be used to develop an image of one basis material. The image can be used to determine whether a product has an unacceptable composition or inclusions of foreign bodies.

Abstract: An x-ray imaging device includes a borescope and an x-ray detector positioned at a distal end of the borescope. The x-ray detector can be configured to be movable into and out of an optical path and can include a scintillation screen. The movably configured x-ray detector can be moved into the optical path, when x-rays are impinging, and out of the optical path, when a visible image of a test object is desired, facilitating navigation of the x-ray detector through a test object. The x-ray imaging device can include an imager, for converting an image to an electronic format. The imager can be positioned at the proximal end of the borescope, with the borescope including a waveguide, for guiding light to a proximal end thereof. Alternatively, the imager can be positioned between the distal end of the borescope and the x-ray detector.

Abstract: A method for performing inspection of raised electrical contacts, such as BGA and flip-chip-type contacts, and associated underlying vias. An electrical or electronic device or component having a major surface is provided including an array of closely spaced apart BGA flip-chip-type raised contacts with respective underlying vias. An area-of-interest (AOI), including at least one BGA or flip-chip-type contact/via structure is selected. The row containing the AOI is isolated, by computed tomography imaging, via electrical testing, or by removal, for example, from the electrical or electronic device or component. The AOI is mounted on an X-ray transparent substrate; and X-ray transmission imaging of the AOI is performed to inspect the at least one BGA or flip-chip-type contact/via structure for the presence of misalignments, voids, and delaminations.

Abstract: A method for obtaining wood-cell attributes from cellulose containing samples includes the steps of radiating a cellulose containing sample with a beam of radiation, the radiation having an energy capable of passing through the sample. Radiation attenuation information is collected from radiation which passes through the sample. The source is rotated relative to the sample and the radiation and collecting steps repeated. A projected image of the sample is formed from the collected radiation attenuation information, the projected image including resolvable features of the cellulose containing sample. Cell wall thickness, cell diameter (length) and cell vacoule diameter can be determined.

Abstract: A pair of stereoscopic images of an object are produced, one image is subtracted from the other, and the resulting two dimensional image is then checked against and compared with a similar two dimensional image (the golden image) which has been produced in an identical manner using a known perfect sample (the golden sample).

Abstract: An improved circuit board inspection system incorporates electrically controlled selection of Z-axis position for generation of laminographic images of electrical connections. Analysis of the laminographic images is performed by comparing the laminographic images to the CAD data representing the area of the circuit board in the image. The CAD data based on a reference Z-axis level is converted on-the-fly to compensate for changes in the field of view, magnification factors, etc. for non-reference Z-axis levels. Thus, laminographic images at the reference Z-axis level are compared directly to the reference level CAD data while laminographic images at non-reference Z-axis levels are compared to the on-the-fly modified non-reference level CAD data.

Abstract: A method and system for verifying the contents of a cargo container includes acquiring at least one image of the cargo container and of the contents of the cargo container, the image being one of a backscatter X-ray image of the cargo container, and a transmission X-ray image of the cargo container. The image is stored with a manifest associated with the cargo container. The manifest is sent to another location, and, at the other location, selectively, a second image of the contents of the cargo container is acquired; and compared with the image stored with the manifest associated with the cargo container.

Abstract: At least two linear arrays of x-ray detectors are placed below a conveyor belt in a poultry processing plant. Multiple-energy x-ray sources illuminate the poultry and are detected by the detectors. Laser profilometry is used to measure the poultry thickness as the x-ray data is acquired. The detector readout is processed in real time to detect the presence of small highly attenuating fragments in the poultry, i.e., bone, metal, and cartilage.

Abstract: Detection of components (22-24) missing from sealed packages (16) is accomplished by combining a multiplicity of electrical outputs representing the mass in volumes of the package (16) and comparing the combined value with a standard value for packages (16) including all components (22-24). In the preferred form, the mass is represented by the absorption of x-rays, with the packages (16) being conveyed on a conveyor (18) between an x-ray radiator (12) generating a fan-shaped x-ray beam (14) and a line array (20) of individual detectors (20a, 20b, etc.). The detectors (20a, 20b, etc.) detect radiation after passing through the package (16) and provide a numerical electrical signal equal to the amount of radiation detected. If the sum of the multiplicity of numerical electrical signals is less than the standard value, the package (16) is rejected from the conveyor (18) by a rejection device (30).

Abstract: A method for measuring a height of a bump formed on a work of substrate, the method comprising: irradiating X-rays having a predetermined wavelength and an incident intensity toward a first work of substrate which is the same as the above-mentioned work of substrate, but no bump is formed thereon, and detecting a first X-ray transmitted intensity at a position on which the bump is to be formed; irradiating X-rays having the same wavelength and incident intensity toward a material constituting the bumps and detecting a linear absorption coefficient of the X-rays; memorizing the first X-ray transmitted intensity and the linear absorption coefficient as known data; and irradiating X-rays having the same wavelength and the same incident intensity toward a second work of substrate which is the same as the above-mentioned work of substrate, but bump is formed thereon, and detecting a second X-ray transmitted intensity at a position on which the bump is formed; and determining the height of the bump from the second

Abstract: A tire interior inspecting method irradiates a tire being continuously conveyed by a conveyor with x-rays emitted from a predetermined position, receives the x-rays penetrated through the tire by a high resolution linear x-ray sensor to obtain x-ray information about the tire, compares the x-ray information with normal tire image information about the metallic components of a normal tire, removes parts of the x-ray image information coinciding with the normal tire image information, and decides the quality of interior of the tire on the basis of image information obtained by removing parts of the x-ray image information coinciding with the normal timer image information.

Abstract: The invention is based on a method for examining structures on a semiconductor substrate. The structures are imaged with X-radiation in an X-ray microscope. The wavelength of the X-radiation is established as a function of the thickness of the semiconductor substrate in such a way that both a suitable transmission of the X-radiation through the semiconductor substrate and a high-contrast image are obtained. As a result, the structures can be observed continuously with short exposure times, high resolution and even while they are in operation.

Abstract: An improved linear scan geometry laminography system that allows for generation of high speed and high resolution X-ray laminographs using an electronic detector operating in a time-domain integration mode coupled with a moving source of X-rays. In one embodiment, the improved scanning laminography system does not require any mechanical motion of the object being inspected, the X-ray source or detectors. Higher speed is achieved over conventional laminography systems due to the electronic nature of the scan. The same architecture also allows for both two-dimensional radiography and digital reconstruction techniques. Usage of the technique provides for higher throughput, higher resolution, and simpler designs than do currently available systems. An analysis of different system design parameters for the basic X-ray imaging architecture utilizing time-domain integration to generate cross-sectional images is included to facilitate specific design configurations.

Abstract: Brightness information of, e.g., an average value of brightnesses at an X-ray image of a first connected part when an electronic component (422) is mounted onto only one face of a printed board (421) is obtained. Binary images of an X-ray image of the board with the electronic components mounted to both faces are formed by an upper and a lower levels relative to the brightness information. The binary images are synthesized with each other so as to extract an image of only a second connected part. The image of only the second connected part can be obtained in this manner on the basis of the X-ray image of the double face-mounted board, so that an accuracy for connection inspection is improved in comparison with the related art. Also, a relationship between a density in the X-ray image of the connected part and a thickness of the connected part is obtained beforehand, based on which a plurality of thickness images are obtained for a plurality of X-ray images of different image storage times.

Abstract: An image quality indicator for determining the quality of an image is disclosed which includes a flat sheet of material of predetermined thickness having a series of elongated slots of various widths and a series of round holes formed therein, the elongated slots and round holes running through the entire thickness of the flat sheet. When energy from a source of radiation is directed through an object whose structural integrity is to be tested, viewing the image formed on an imaging device by a beam of energy following passage through the image quality indicator and the test object provides an indication of the contrast sensitivity and spatial resolution of the formed image.

Abstract: An X-ray detection unit integrally includes an X-ray detection part, which detects X-rays and a conveyor part, which conveys an object to be inspected, for detecting a foreign body contained in the object by receiving the X-rays, which are radiated from an X-ray generation part to the object conveyed by the conveyor part and are transmitted through the object, by means of the X-ray detection part, the X-ray detection part and the conveyor part being integrally attached to a predetermined part in a casing, such that the X-ray detection part and the conveyor part are freely attachable and detachable. The X-ray detection unit comprises an X-ray detection part container made of metal, front and rear roller support parts, front and rear rollers and a conveyor belt.

Abstract: A method and an apparatus for examining luggage by X-ray scanning, wherein the pieces of luggage to be examined are moved on a conveyor belt into a scanner which contains the X-ray components, i.e., an X-ray unit and a detector unit. The scanner together with the X-ray unit and the detector unit is moved over the piece of luggage which stands still. After each scanning process, the piece of luggage is moved on the conveyor belt in a timed manner and the step of scanning the piece of luggage is repeated.

Abstract: Detection of components (22-24) missing from sealed packages (16) is accomplished by combining a multiplicity of electrical outputs representing the mass in volumes of the package (16) and comparing the combined value with a standard value for packages (16) including all components (22-24). In the preferred form, the mass is represented by the absorption of x-rays, with the packages (16) being conveyed on a conveyor (18) between an x-ray radiator (12) generating a fan-shaped x-ray beam (14) and a line array (20) of individual detectors (20a, 20b, etc.). The detectors (20a, 20b, etc.) detect radiation after passing through the package (16) and provide a numerical electrical signal equal to the amount of radiation detected. If the sum of the multiplicity of numerical electrical signals is less than the standard value, the package (16) is rejected from the conveyor (18) by a rejection device (30).

Abstract: An apparatus and method for a wellsite &ggr;-ray analysis of core samples is implemented. A wheeled carriage supporting a &ggr;-ray detector stably straddles a core sample, which may be encased in a core barrel. A bracket attached to the carriage may hold a radionuclide source of &ggr; radiation positioned distally from the detector, thereby forming a space therebetween for passage of the core. The density of the core may be determined by counting the &ggr; flux attenuated by the core; by traversing the carriage along a length of the core, the density may be determined as a function of position, and disrupted core or partial recovery detected thereby. Additionally, the natural &ggr; emission of the core may be observed by traversing the apparatus along the core without the radionuclide source.

Abstract: An integrated X-ray and visual inspection system having an inspection subsystem with a holder holding an object to be inspected, an X-ray source, a camera receiving an X-ray image of an object to be inspected and a camera receiving a visible image of an object to be inspected, the X-ray source and camera receiving the X-ray image being positioned on opposite sides of the holder. A display may also be provided for displaying the images. The system is well suited to the inspection of printed circuit boards having electronic components mounted thereon, in which case the holder may be a conveyor for the printed circuit boards. Independent positioning of the X-ray source and camera receiving the X-ray image allows offset images of the printed circuit board topside and bottomside features of the board. Various other features of the system and methods are disclosed.

Abstract: A method and an apparatus generate a plurality of inspection signals each indicative of an internal physical characteristic of a portion of an object. Each of the inspection signals is generated with a different orientation relative to the portion of the object. A signal is generated indicative of a measure of correlation between the inspection signals. The method and the apparatus can be used to reduce the effect of noise and/or distortion in regard to inspection of objects. In one detailed embodiment, the inspection signals are x-ray images indicative of a density of an object. The x-ray images are processed to identify indications in the x-ray images that indicate a density associated with a defect. The indications in the images are then compared to each other to determine whether there is a correlation between the indications. Low correlation between the indications tends to indicate the presence of distortion in the inspection signals.

Abstract: An X-ray inspection system incorporates an improved technique for determining, in an X-ray image of a multilayered assembly, the gray level component of a first material in the presence of a second material. The total gray level of the image is dependent upon the physical characteristics of each material comprising the assembly. The present invention accurately determines the component of the total image gray level due to the first material. In the case of circuit board inspections using X-ray images of solder connections, a calibration procedure facilitates the direct conversion of the gray level component due to the solder connection to the thickness of the solder connection.

Abstract: The invention concerns a process and circuit arrangement for testing solder joints, preferably on printed circuit boards, whereby the quality of the solder joints is examined for defects using X-rays and qualitative information on the individual solder joints is obtained. According to the invention, the qualitative and/or the measured values of the individual solder joints that characterize the measured physical parameters of the tested solder joints, are used to control the manufacture of further solder joints in the production process in which solder joints are tested.

Abstract: The doping of the core of an optical fiber may be precisely characterized by cutting sample slices of the fiber by means of a focused ion beam (FIB) machine and by carrying out a contact radiography of the slices using a soft X-ray source. Maps of the distribution of the dopant ions in the glassy matrix of the optical fiber's core may be obtained by analyzing the contact radiographies at the electronic or atomic force microscope. A dopant concentration value per unit length of fiber may be determined by interpolating the results over a plurality of slices of different thicknesses.