Abstract: An image segmentation method is disclosed that allows a user to select image component types, for example tissue types and or background, and have the method of the present invention segment the image according to the user's input utilizing the superpixel image feature data and spatial relationships.

Abstract: A computer implemented method, a system and a computer readable storage medium configured to conduct the following: determining a reliability parameter of an initial hybrid metallization to determine a determined reliability parameter, comparing the determined reliability parameter to a reliability limit and determining a reliability ratio, determining a performance parameter of the initial hybrid metallization to determine a determined performance parameter, comparing the determined performance parameter to a performance limit and determining a performance ratio, determining a reliability indice from the reliability ratio, determining a performance indice from the performance ratio, determining a reliability score from a combination of the determined reliability parameter and the reliability indice, determining a performance score from a combination of the determined performance parameter and the performance indice, comparing the reliability score to the performance score, selecting a first interconnect and

Abstract: The present disclosure provides an integrated circuit (IC) method in accordance with some embodiments. The method includes building a mask model to simulate a mask image and a compound lithography computational model to simulate a wafer pattern; calibrating the mask model using a measured mask image; calibrating the compound lithography computational model using a measured wafer data and the calibrated mask model; and performing an optical proximity correction (OPC) process to an IC pattern using the calibrated compound computational model, thereby generating a mask pattern for mask fabrication.

Abstract: An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.

Abstract: There is described an online inspection method and system having an illumination system that provides bright-field and dark-field illumination concurrently or sequentially, at varying intensities, in order to acquire images that may be read by an image processing device. The image processing device may obtain measurements of features in the images and evaluate acceptability of the features.

Abstract: Apparatus to detect a defect in a printed image and methods of detecting detects in a printed image are described. In some examples, a printing operation is initiated using image data to generate a printed image. The printed image is then scanned to generate a scanned image. A resolution of the scanned image is estimated, calculated or determined on the basis of a characteristic of the printing operation, and a reference image, having a resolution corresponding to the estimated, calculated or determined resolution, is generated from the image data. Whether defects are present in the printed image may be determined on the basis of a comparison of the reference image with the scanned image.

Abstract: Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.

Abstract: A method of operating a multi-column electron beam array for quality inspection of a semiconductor wafer involves dividing the whole wafer area collectively in equally divided areas allocated to each column of the array, and assigning each of the areas as a column working space having the same dimensions and orientations. The array of column working spaces are assigned to an array of column optical axes, wherein a field of view of each column is defined as a covered region in which critical wafer patterns can be scanned by one or more columns to take an image. The stage supporting the wafer is moved such that each column working space is fully covered by the field of view of each column completely. By utilizing arbitrary waveform generators in electron inspection columns, this method also can be extended to write independent arbitrary patterns in predetermined positions in each die on a wafer.

Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.

Abstract: A mounting device mounts components on a board, and performs processing of arranging discard components discarded based on a captured image on a discard loading section. A CPU of a management computer acquires an identification image in which it is possible to identify a discard component to be discarded and a captured image of the discard component, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section. The CPU of management computer then outputs the created discard component arrangement image screen.

Abstract: There are provided a system, computer software product and method of generating a training set for a classifier using a processor. The method comprises: receiving a training set comprising training defects each having assigned attribute values, the training defects externally classified into classes comprising first and second major classes and a minor class; training a classifier upon the training set; receiving results of automatic classification of the training defects; automatically identifying a first defect that was externally classified into the first major class and automatically classified into the second major class; automatically identifying by the processor a second defect from the multiplicity of training defects that was externally classified into the minor class and automatically classified to the first or second major classes; and correcting the training set to include the first defect into the second major class, or to include the second defect into the first or the second major class.

Abstract: An assembly includes a sensor configured to obtain a data scan of a joint. A controller is operatively connected to the sensor. The controller includes a processor and tangible, non-transitory memory on which is recorded instructions for executing a method for automated quality assessment of the joint. Execution of the instructions by the processor causes the controller to: obtain the data scan of the joint (via the sensor) and generate a first image based on the data scan. The first image is divided into a plurality of pixels having respective numeric values. The controller is programmed to identify a region of interest as the plurality of pixels from the first image with a respective numeric value greater than a threshold value (I0). The controller is programmed to assess joint quality based on a porosity factor (PF) determined at least partially from the data scan.

Abstract: A control system configured to use a database and a data storage area includes a control device for controlling a process executed on an object; and an image processing device arranged in association with the control device for taking an image of the object and processing image data acquired from taking the image of the object. The control device and the image processing device may work independently or collaboratively to send the database at least one of an attribute value or results information, and designation information in association with each other for the same object, the attribute value managed by the control device and corresponding to any attribute defined in the database, the results information representing a process result from the image processing device, and the designation information specifying a storage destination in the data storage area for the image data acquired from taking an image of the object.

Abstract: When the degree of matching between patterns decreases due to a pattern fluctuation or an appearance fluctuation that has occurred during manufacturing steps, a heavy work burden would be placed on an operator. A data processing unit of a pattern matching apparatus calculates a threshold for determination of matching between a first template image and a partial region of a search target image obtained by capturing an image of the surface of a sample, on the basis of a result of evaluation of a similarity between the search target image and a second template image, the second template image having been captured in a wider range than the first template image.

Abstract: Described is a system for detecting multiple salient objects in an image using low power hardware. From consecutive pair of image frames of a set of input image frames, image channels are generated. The image channels are resized into multiple image scales that specify a relative size of a salient object in the image frames. A patch-based spectral transform is applied to overlapping image patches in the resized image channel, generating salient patches. Saliency patches are combined into a saliency map for each resized image channel, resulting in multiple saliency maps. The saliency maps are combined into an aggregate saliency map. An adaptive threshold is applied to the aggregate saliency map to determine which pixels in the aggregate saliency map correspond to a detected salient object region including a salient object. An object bounding box is generated for each salient object and output to a display.

Abstract: A control unit of a substrate processing apparatus has a storage medium that stores operation commands as a single macro. The operation commands include an operation command for shutdown of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred from a normally-operating condition to a condition suitable for man power maintenance, and an operation command for startup of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred to a condition suitable for normal operation after completion of the man power maintenance. The control unit makes a display unit display both the operation commands for shutdown and startup together on a single ejection screen of the display unit, and allows editing of the macro on the single edit screen by using the input unit.

Abstract: The present disclosure relates to a system for predicting abnormality occurrence using a PLC log data, the system including a controller configured to receive a data from a lower-level device connected to a PLC data log module and determine the data, and to store the data in an event storage when the data is a data related to abnormality occurrence, an analyzer configured to generate an abnormality analysis result by analyzing the data related to abnormality occurrence, and an analysis result storage configured to store the abnormality analysis result, wherein the controller compares the data transmitted from the lower-level device with the abnormality analysis result stored in the analysis result storage, and generates an abnormality occurrence prediction signal, when it is determined that the data transmitted from the lower-level device is similar to the abnormality analysis result.

Abstract: A pattern correction amount calculating apparatus includes: an accepting unit that accepts pattern information; a micro side group acquiring unit that acquires a micro side group, which is a group of continuous sides forming a contour of a pattern figure indicated by the pattern information, and is a group of micro sides that are each small enough to satisfy a predetermined condition; a virtual side acquiring unit that acquires a virtual side, which is a side that approximates micro sides contained in the micro side group; a virtual side correction amount calculating unit that calculates a virtual side correction amount, which is a correction amount for the virtual side; and a micro side correction amount calculating unit that calculates micro side correction amounts, which are correction amounts respectively for the micro sides contained in the micro side group corresponding to the virtual side, using the virtual side correction amount.

Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.

Abstract: The present invention relates to a method for tuning lithography systems so as to allow different lithography systems to image different patterns utilizing a known process that does not require a trial and error process to be performed to optimize the process and lithography system settings for each individual lithography system. According to some aspects, the present invention relates to a method for a generic model-based matching and tuning which works for any pattern. Thus it eliminates the requirements for CD measurements or gauge selection. According to further aspects, the invention is also versatile in that it can be combined with certain conventional techniques to deliver excellent performance for certain important patterns while achieving universal pattern coverage at the same time.

Abstract: A pattern inspection apparatus includes a stage to mount thereon a substrate with patterns formed thereon and be able to move two-dimensionally, plural detectors of a two-dimensional scale, whose height positions are mutually different and arranged at positions on the stage different from the substrate position, to perform measurement, the body of the two-dimensional scale arranged fixed to a position facing the plural detectors, a sensor to acquire an optical image of the pattern on the substrate, in a state where the stage with the substrate is moving in one direction on a surface for the two-dimensional movement, a calculation circuitry to calculate an image acquiring position of the optical image by using position information measured by the two-dimensional scale, and a comparison circuitry to compare, using a reference image corresponding to the image acquiring position of the optical image, the optical image with the reference image for each pixel.

Abstract: An appearance inspection device and an appearance inspection method, capable of teaching a line pattern having an arbitrary shape as a portion to be inspected, in relation to a captured image of an inspection object, by a simple teaching operation. The device has an image storing part, a teaching part, an inspecting part and an inspection factor storing part. The teaching part obtains an image of the inspection object in the teaching process, and teaches the position of an inspection point, the position and the angle of an inspection region relative to the inspection point, the inspection factor and a judgment condition. The teaching factor storing part stores a setting parameter and a teaching factor. The inspecting part executes inspection based on the teaching factor in the inspecting process.

Abstract: Some of pixels in a general image sensor for image capturing are designated as vision pixels used for vision recognition. Optical information obtained only from the vision pixels is used to perform vision recognition in the vision recognition mode. Capturing image data is generated based on optical information obtained from all the pixels in the image data in the image-shooting mode. A digital signal converter that converts optical information obtained only from vision pixels into a digital signal is separately provided in addition to a digital signal converter that converts optical information of all pixels in the image sensor into a digital signal.

Abstract: Disclosed is a defect detection apparatus. The defect detection apparatus includes an angle extractor configured to extract a slope angle of a pattern from an original image in which a plurality of the patterns are formed at periodic intervals, a pattern period extractor configured to extract a pattern period at which the patterns are separated from each other, by using the slope angle, and an image shifter configured to shift the original image by the pattern period in a direction perpendicular to the slope angle to form the shifted image. The present invention shifts an image by using the slope angle and pattern period of the periodic pattern, thus easily extracting a defect of the original image.

Abstract: Methods and systems for generating simulated output for a specimen are provided. One method includes acquiring information for a specimen with one or more computer systems. The information includes at least one of an actual optical image of the specimen, an actual electron beam image of the specimen, and design data for the specimen. The method also includes inputting the information for the specimen into a learning based model. The learning based model is included in one or more components executed by the one or more computer systems. The learning based model is configured for mapping a triangular relationship between optical images, electron beam images, and design data, and the learning based model applies the triangular relationship to the input to thereby generate simulated images for the specimen.

Abstract: An optical proximity correction method includes loading a target layout for a mask, generating a correction density map based on manipulation of flare to correct global errors caused by exposing equipment, generating a flare map via convolution integration of the correction density map and a point spread function (PSF) regarding the flare, and correcting the target layout using the flare map and an OPC model.

Abstract: A system to manage clustering vertices of a streaming graph includes a memory storing a computer program, a vertex structure storing vertices of the graph, and a cluster structure storing clusters of the graph, and a processor. Each cluster structure comprises a plurality of edge structures represent edges of the graph and each edge structure comprises two of the vertices. The processor is configured to execute the program to cluster the vertices using the structures and a maximum cluster size that is constant.

Abstract: A method for local pattern density control of a device layout used by graphoepitaxy directed self-assembly (DSA) processes includes importing a multi-layer semiconductor device design into an assist feature system and determining overlapping regions between two or more layers in the multi-layer semiconductor device design using at least one Boolean operation. A fill for assist features is generated to provide dimensional consistency of device features by employing the overlapping regions to provide placement of the assist features. An updated device layout is stored in a memory device.

Abstract: A luminescent tag based defect detection system comprises a luminescent tag attachment assembly, an illumination source, one or more detectors, and a set of optical elements. The luminescent tag attachment assembly exposes a sample to one or more luminescent tag materials selectively attached to one or more defects on the sample. The illumination source generates illumination including one or more wavelengths corresponding to the one or more absorption spectra associated with the one or more luminescent tags. At least a portion of the set of optical elements directs illumination from the illumination source to the sample, and at least a portion of the set of optical elements directs illumination emitted from the one or more luminescent tag materials to the one or more detectors. A luminescent tag based defect detection system may also include a luminescent tag removal assembly to remove the luminescent tags after detection.

Abstract: A system and method to image a layer of a wafer based on a coordinate of a defect in a pre-layer of the wafer are disclosed. A design file for the current layer can be aligned to the wafer using an image of the current layer. A design file for a previous layer can be aligned to the design file for the current layer.

Abstract: Hybrid inspectors are provided. One system includes computer subsystem(s) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.

Abstract: A method for controlling the functional output of a verification tool upon receipt of a circuit description comprises searching for a predetermined base pattern in the circuit description. The method further comprises searching for predetermined sub-patterns that are assigned to the base pattern, in the circuit description. The method further comprises the validation of each found sub-pattern based on a predetermined rule to minimize the set of reported errors that based on verification of the circuit description.

Abstract: A method for detecting defects of wafer by wafer sort is introduced. In the method, a wafer sort testing apparatus is used to obtain a DTL or ADART result, wherein a plurality of repaired sites in a wafer is highlighted according to the DTL or ADART result. A plurality of physical locations of the repaired sites is then output. An analysis equipment is used to match the physical locations with a graphic data system (GDS) design layout coordinate of the wafer so as to generate a data correlating with defects at the repaired sites.

Abstract: A layout of an integrated circuit design is provided and a plurality of multiple patterning decompositions is determined from the layout. Each decomposition of the plurality of multiple patterning decompositions includes patterns separated into masks. One or more files are generated that include sensitivities of pattern capacitances to changes in spacing between patterns due to mask shifts. Using the sensitivities and changes in spacing, respective worst-case performance values are determined for each decomposition. A mask set is selected based on the worst-case performance values.

Abstract: Disclosed herein is a computer-implemented method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method comprising: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.

Abstract: To provide an electronic device that can restrict a delayed execution of a process whose existence is impossible to confirm for an overwrite erasure thread. An MFP includes a job execution part that executes a job and an overwrite erasure thread that performs overwrite erasures of obsolete files. The overwrite erasure thread performs the overwrite erasures intermittently even while the job is in execution if the obsolete files have a size more than a threshold value size. The job execution part performs the overwrite erasures while the job is in execution if the obsolete files have a size less than the threshold value size.

Abstract: A method for generating a pattern includes defining a footprint of a main pattern in each cell, arranging a first cell and a second cell which has an auxiliary pattern outside the footprint of the main pattern, side by side in such a manner that the auxiliary pattern outside the footprint of the second cell is present in the footprint of the main pattern of the first cell, and generating the pattern of the mask by removing a pattern element of the auxiliary pattern outside the footprint of the second cell in a portion where the pattern element of the auxiliary pattern outside the footprint of the second cell is close to or overlaps with the main pattern in the first cell of the first cell and the second cell arranged side by side.

Abstract: A modeling technique is provided. The modeling technique includes inputting tool parameters into a model and inputting basic model parameters into the model. The technique further includes generating a simulated, corrected reticle design using the tool parameters and the basic model parameters. An image of test patterns is compared against the simulated, corrected reticle design. A determination is made as to whether ?1<?1, wherein ?1 represents model vs. exposure difference and ?1 represents predetermined criteria. The technique further includes completing the model when ?1<?1.

Abstract: A method for selecting samples of reticle design data patterns in order to calibrate the parameters based on which the reference image used in a die-to-database reticle inspection method is rendered, the method comprising the steps of applying local binary pattern (LBP) analysis to a plurality of samples to obtain a p-dimensional vector output for each of the plurality of samples, clustering the q-D data points to M groups, selecting one sample from each clustered group, calculating evaluation scores for the samples selected, and, selecting a portion of the M samples on the representativeness score and the diversity score.

Abstract: In some embodiments, the present application is directed to a method and system for process control of a lithography tool. The method transfers a reference pattern to exposure fields of a reference workpiece to form pairs of overlapping reference layers. Misalignment between the overlapping reference layers is measured to form first and second baseline maps, and a ? baseline map is formed from the first and second baseline maps. A production pattern is transferred to exposure fields of a production workpiece to form second production layers arranged over and aligned to first production layers. Misalignment between the first and second production layers is measured to form a production map. The ? baseline map is transformed and subsequently added to the production map, to form a final production map. Parameters of a process tool are updated based on the final production map.

Abstract: A pattern inspection apparatus includes a data processing circuitry to input detection data based on a secondary electron from a substrate for each irradiation unit region, where n1×m1 irradiation unit regions in irradiation unit regions configure one of n2×m2 image reference regions configuring an inspection measurement image, to calculate, for each of the n2×m2 image reference regions, a statistic value acquired from the detection data of all the n1×m1 irradiation unit regions in one of the n2×m2 image reference regions, and to define the statistic value as image reference data for the image reference region, and a comparison processing circuitry to receive transmission of the image reference data for each image reference region, and to compare, using a reference image corresponding to the inspection measurement image composed of the n2×m2 image reference regions, the measurement image with the reference image for each image reference region.

Abstract: Methods and systems for setting up a classifier for defects detected on a wafer are provided. One method includes generating a template for a defect classifier for defects detected on a wafer and applying the template to a training data set. The training data set includes information for defects detected on the wafer or another wafer. The method also includes determining one or more parameters for the defect classifier based on results of the applying step.

Abstract: Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire at least two images at different imaging configurations from each pattern area of the reticle. A reticle pattern is reconstructed based on each at least two images from each pattern area of the reticle. For each reconstructed reticle pattern, a lithographic process with two or more different process conditions is modeled on such reconstructed reticle pattern to generate two or more corresponding modeled test wafer patterns. Each two or more modelled test wafer patterns is analyzed to identify hot spot patterns of the reticle patterns that are susceptible to the different process conditions altering wafer patterns formed with such hot spot patterns.

Abstract: Conventionally, there was no method for automatically selecting the layers to be overlaid, so when the number of layers to be overlaid was large, there was a problem that much time was required for selecting the layers. It is an object of the present invention to provide a defect image analysis method capable of specifying patterns and layers in which a defect occurs by overlaying defect images to be analysis targets and design layout data, and a defect image analysis system capable of improving the efficiency to select the layers from the design layout data. The present invention is characterized in dividing analysis target images for each hierarchy corresponding to a manufacturing process and generating a plurality of layers; calculating a degree of matching between each of the layer division images and each design layer of the design layout data; and specifying a design layer with a highest degree of matching of the each design layer as a design layer corresponding to the layer division image.

Abstract: Cases in which defects are analyzed in a manufacturing process stage in which a pattern is not formed or in a manufacturing process in which a pattern formed on a lower layer does not appear in the captured image are increasing. However, in these cases, there is a problem of not being able to synthesize a favorable reference image and failing to detect a defect when a periodic pattern cannot be recognized in the pattern. In the present invention, a defect occupation rate, which is the percentage of an image being inspected occupied by a defect region, is found, it is determined whether the defect occupation rate is higher or lower than a threshold, and, in accordance with the determination results, it is determined whether to create, as the reference image, an image comprising pixels having the average luminance value of the luminance values of a plurality of pixels contained in the image being inspected.

Abstract: A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.

Abstract: A method includes providing a pre-optical proximity correction (OPC) layout of at least a portion of at least one reticle. The pre-OPC layout defines a test cell including a first test cell area having a plurality of first target features having a first pitch and a second test cell area having a plurality of second target features having a second pitch. A post-OPC layout of the portion of the reticle is formed on the basis of the pre-OPC layout. The formation of the post-OPC layout includes performing a rule-based OPC process, wherein a plurality of first reticle features for the first test cell area are provided on the basis of the plurality of first target features, and performing a model-based OPC process, wherein a plurality of second reticle features for the second test cell area are provided on the basis of the plurality of second target features.

Abstract: A method and a system for inspection of a patterned structure are provided. In various embodiments, the method for inspection of a patterned structure includes transferring the patterned structure into a microscope. The method further includes acquiring a top-view image of the patterned structure by the microscope. The method further includes transferring the patterned structure out of the microscope and exporting the top-view image to an image analysis processor. The method further includes measuring a difference between a contour of the top-view image and a predetermined layout of the patterned structure by the image analysis processor.

Abstract: A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.

Abstract: A misalignment/alignment compensation method for a lithography process includes the steps of: obtaining misalignment data associated with an alignment mark disposed on a substrate; and obtaining a compensation parameter by performing asymmetry compensation calculation on at least one of a first directional component of the misalignment data, which is associated with a first direction, and a second directional component of the misalignment data, which is associated with a second direction.