Abstract: Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.

Abstract: An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted.

Abstract: A method of aligning an object may include obtaining a first actual image of a first pattern on the object, setting the first actual image as a first reference image, obtaining a second actual image of a second pattern on the object, comparing the second actual image with the first reference image to obtain first relative position difference values of the second actual image with respect to the first reference image, and converting the first relative position difference values into first absolute position difference values with respect to a reference point on the object.

Abstract: System and methods for determining a concentricity of a component mounted within an aperture of an electronic device housing. In particular, a method for determining concentricity of a camera includes obtaining an image of a camera mounted within the aperture of the housing and identifying a plurality of circular shapes within the image using a processor. One of the circular shapes represents the aperture in the housing and the other circular shape represents the camera. An offset between two of the plurality of circular shapes is calculated.

Abstract: A data memory storing Gerber data containing closed area information of a work; a display displaying a pattern image based on the closed area information of the Gerber data; a detection specification information display program displaying on the display a detection tool specifying a location of edge to be detected, a detection direction and detection length, by superimposing on the pattern image; an image capturing program and an image capturer capturing an image of an area corresponding to the detection tool of the work; an edge detection program performing an edge detection of the location of the edge to be detected with respect to data of a captured image; and a condition determination program determining a light-dark change condition indicating whether an image is changing from a light section to a dark section or from a dark section to a light section along a detection direction.

Abstract: A method detects a position of a mark based on an image signal of the mark. The method includes steps of obtaining a first position of the mark by performing a first process for the image signal, extracting plural feature values from the image signal based on the first position, and detecting the position of the mark by obtaining an offset value for the first position based on the plural feature values.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: Methods and systems for accurately determining dimensional accuracy of a complex three dimensional shape are disclosed. The invention in one respect includes determining at least a non-critical feature and at least a critical feature of the 3-D component, determining a first datum using at least the non-critical feature, aligning the first datum to at least a portion of a reference shape, determining a second datum corresponding to the critical feature subsequent to the aligning, and determining the dimensional accuracy of the 3-D component by comparing the second datum to another portion of the reference shape.

Abstract: A color-unevenness inspection apparatus includes: an image pickup section picking up an image of an inspection target for a color-unevenness inspection; an image generation section generating an uneven-color image by determining one or more uneven-color regions existing in the picked-up image of the inspection target obtained by the image pickup section, and by classifying unit regions included in each of the uneven-color regions into a plurality of color groups; a calculation section calculating, on the uneven-color regions in the uneven-color image, an evaluation parameter to be used in the color-unevenness inspection; a correction section making a correction to the calculated evaluation parameter in consideration of a difference of color-unevenness visibility between the color groups; and an inspection section performing the color-unevenness inspection, based on a resultant evaluation parameter obtained by the correction.

Abstract: A scanning electron microscope comprises an image processing system for carrying out a pattern matching between a first image and a second image. The image processing system comprises: a paint-divided image generator for generating a paint divided image based on the first image; a gravity point distribution image generator for carrying out a smoothing process of the paint divided image and generating a gravity point distribution image; an edge line segment group generation unit for generating a group of edge line segments based on the second image; a matching score calculation unit for calculating a matching score based on the gravity point distribution image and the group of edge line segments; and a maximum score position detection unit for detecting a position where the matching score becomes the maximum.

Abstract: A method for verifying repairs on masks for photolithography is provided. A mask fabricated based on a mask layout is inspected for defects, and the positions at which defects are found on the mask are stored in a position file. In a repair step, the defects are repaired and, for each repaired position, in a verification step, an aerial image of the mask is taken at that position and the aerial image is analyzed to determine whether at that position the mask meets tolerance criteria established for one or more selected target parameters, and if the tolerance criteria have been met, the repair is verified. The verification can include a) based on the position file, a desired structure is defined in the mask layout at the repaired position, b) an aerial image is simulated for the desired structure, c) the captured aerial image is compared with the simulated one, and d) based on the comparison, a decision is made as to whether the repair at that position is verified.

Abstract: A method of manufacturing a display device is disclosed. In one embodiment, the method includes: i) forming a semiconductor layer where a plurality of crystallized areas and a plurality of noncrystallized areas are alternately arranged on a substrate, ii) aligning the substrate based on a difference in contrast ratio between the crystallized and noncrystallized areas and iii) performing a photo process or a photolithography process.

Abstract: A method for selecting sample positions on a substrate from a set of all available sample positions is provided, in which a representation of a model, which may represent the variation of one or more properties across the substrate, is analyzed in order to identify the sample positions having the greatest effect on the model.

Abstract: A method of determining misalignment between a first image and a second image, the first and second images being viewable stereoscopically, the method comprising: determining a feature position within the first image and a corresponding feature position within the second image; defining, within the first image and the second image, the optical axis of the cameras capturing said respective images; and calculating the misalignment between at least one of scale, roll or vertical translation of the feature position within the first image and the corresponding feature position within the second image, the misalignment being determined in dependence upon the location of the feature position of the first image and the corresponding feature position of the second image relative to the defined optical axis of the respective images is described. A corresponding apparatus is also described.

Abstract: Techniques for associating a graphics object with one of a plurality of target regions of a graphical object template are disclosed. The graphics object is associated with one of the target regions based on the distance between the center of mass of the graphics object and the center of mass of the target region and the overlap amount of the graphics object with the target region. A pre-generated graphics object (stamp object) may also be automatically incorporated into one of the target regions based on the alignment of the minimum bounding box of the stamp object and the minimum bounding box of the target region.

Abstract: A computer program and apparatus function to extract objects from a video by identifying regions to be tracked, tracking the regions across several frames, calculating motions of the regions, and identifying new regions to be tracked. Regions of a selected frame of the video that are appropriate for tracking are selected. Tracking of the identified regions is then performed across frames subsequent to the selected frame of the video. Motions of the identified regions are calculated, and new regions for tracking are identified.

Abstract: Prior to a mark imaging process executed for the purpose of detecting a position of recognition marks for positioning the substrate and the mask, an optical axis calibration processing process of detecting a horizontal relative position between imaging optical axes, and a surface correction data creation processing process of detecting a local positional deviation of the imaging optical axes, which is caused by the travel of the imaging unit, are executed. Before starting production, a production pre-start precision evaluation process for evaluating a substrate positioning precision is executed by using a verification substrate and a verification mask, and after starting the production, a production post-start precision evaluation process for evaluating a substrate positioning precision after starting the production is executed by using a commercial production substrate and a commercial production mask.

Abstract: In summary, the present invention relates to a method for analyzing and/or testing at least one user interface, comprising the steps of: transmitting an address of at least one user interface, in particular a web-based user interface, and/or a source code together with the associated graphical elements of at least one user interface, in particular a web-based user interface, to an evaluation apparatus (10); transmitting the address of the at least one user interface and/or the source code together with the associated graphical elements of the at least one user interface to at least two differently configured presentation apparatuses (12, 14); generating at least one pixel image of the user interface on each presentation apparatus (12, 14); transmitting each generated pixel image to the evaluation apparatus (10); automatically determining and/or representing at least one difference between the generated pixel images of the at least one user interface.

Abstract: A method of analyzing of a semiconductor integrated circuit includes inspecting a physical defect in a semiconductor wafer, subjecting the semiconductor integrated circuit chip to a logic test and extracting a malfunctioning chip, analyzing a detected signal observed from the malfunctioning chip by an analyzer, obtaining the layer and coordinates of a circuit related the detected signal, collating the physical defect with the circuit, and identifying the physical defect associated with the circuit. The layer and coordinates of the circuit is extracted using design data. An inspection step identifying information is collated with the layer of the circuit, and an in-chip coordinates of the physical defect is collated with the coordinated of the circuit.

Abstract: A pose of an object is estimated from an from an input image and an object pose estimation is then stored by: inputting an image containing an object; creating a binary mask of the input image; extracting a set of singlets from the binary mask of the input image, each singlet representing points in an inner and outer contour of the object in the input image; connecting the set of singlets into a mesh represented as a duplex matrix; comparing two duplex matrices to produce a set of candidate poses; and producing an object pose estimate, and storing the object pose estimate.

Abstract: Embodiments described herein are directed to detecting and/or measuring distortions of substrate media that can occur during a printing process. The distortion can be detected and/or measured using a composite image generated from a reference image having a first periodic pattern and print image, disposed on a test substrate media, having a second periodic pattern. The first and second periodic patterns are specified so that the composite image includes a moiré pattern having moiré fringes resulting from interference between the first periodic pattern associated with the reference image and the second periodic pattern associated with the print image. The moiré fringes can be used to detect and calculate an amount of distortion of the test substrate media.

Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.

Abstract: Disclosed are methods (900) and apparatuses (600) for determining a location of a graphical object (2220) printed onto a print medium (230), said graphical object comprising a plurality of object marks, the method comprising the steps of superposing a two-dimensional reference pattern (710) having a pre-defined degree of accuracy over the printed graphical object, the two-dimensional reference pattern comprising a plurality of pattern marks (770); scanning the superposed printed graphical object and reference pattern to produce a scanned image (2400); determining a location coordinate (2923) of the graphical object in the scanned image (2400); and refining the location coordinate dependent upon the scanned reference pattern to determine a reference pattern coordinate (2904?) associated with the location coordinate (2923). Also disclosed are methods (1800), apparatuses, and computer program products for determining a head size (420) of a print head (3110) of a printer (3100) using the aforementioned method.

Abstract: A method of performing inspection alignment point selection for semiconductor devices includes importing, with a computer device, one or more semiconductor design files corresponding to an area of a semiconductor die; aligning a design taken from the one or more semiconductor design files with an image taken from a die of a semiconductor wafer; and selecting an alignment point and recording a portion of the design file corresponding to the alignment point as a master reference image.

Abstract: When computation of a three-dimensional measurement processing parameter is completed, accuracy of a computed parameter can easily be confirmed. After a parameter for three-dimensional measurement is computed through calibration processing using a calibration workpiece in which plural feature points whose positional relationship is well known can be extracted from an image produced by imaging, three-dimensional coordinate computing processing is performed using the computed parameter for the plural feature points included in the stereo image used to compute the parameter. Perspective transformation of each computed three-dimensional coordinate is performed to produce a projection image in which each post-perspective-transformation three-dimensional coordinate is expressed by a predetermined pattern, and the projection image is displayed on a monitor device.

Abstract: A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.

Abstract: A method for producing a semiconductor device comprising a process step of forming a device configuration pattern in a device formation region in a chip formation region on a film side of a semiconductor wafer having the film for forming a pattern, and forming inspection patterns in a plurality of inspection regions in the chip formation region, and an inspection step, wherein the inspection patterns have a repeat pattern and a uniform pattern formed in a first inspection region in the plurality of inspection regions, the inspection step has at least a pattern inspection step including a first inspection to measure a parameter of the repeat pattern, by using an optical measurement method capable of measuring a three-dimensional pattern shape, and a second inspection to measure a film thickness of the uniform pattern by using an optical measurement method capable of measuring the film thickness.

Abstract: Disclosed are methods and apparatus for automatic optoelectronic detection and inspection of objects, based on capturing digital images of a two-dimensional field of view in which an object to be detected or inspected may be located, analyzing the images, and making and reporting decisions on the status of the object. Decisions are based on evidence obtained from a plurality of images for which the object is located in the field of view, generally corresponding to a plurality of viewing perspectives. Evidence that an object is located in the field of view is used for detection, and evidence that the object satisfies appropriate inspection criteria is used for inspection. Methods and apparatus are disclosed for capturing and analyzing images at high speed so that multiple viewing perspectives can be obtained for objects in continuous motion.

Abstract: When generating an intermediate image which is an image in the middle of changing from one to the other of two pseudo three-dimensional images generated by ray casting a three-dimensional image from an arbitrary viewpoint under two different opacity level setting conditions, determining an opacity level setting condition by determining an opacity level to be allocated according to each pixel value such that a variation in the opacity level for a change in a changing phase of the intermediate image become smaller as the changing phase approaches closer to a pseudo three-dimensional image generated under either one of the two different opacity level setting conditions in which a smaller value is allocated as the opacity level to be allocated according to each pixel value, and generating an intermediate image by ray casting the three-dimensional image from an arbitrary viewpoint under the determined opacity level setting condition.

Abstract: Disclosed are methods and systems for dynamic feature detection of physical features of objects in the field of view of a sensor. Dynamic feature detection substantially reduces the effects of accidental alignment of physical features with the pixel grid of a digital image by using the relative motion of objects or material in and/or through the field of view to capture and process a plurality of images that correspond to a plurality of alignments. Estimates of the position, weight, and other attributes of a feature are based on an analysis of the appearance of the feature as it moves in the field of view and appears at a plurality of pixel grid alignments. The resulting reliability and accuracy is superior to prior art static feature detection systems and methods.

Abstract: A plurality of wafer marks on a wafer is detected while a wafer stage moves from a loading position where a wafer is delivered onto the wafer stage to an exposure starting position where exposure of a wafer begins, with a part of an alignment system also moving, using the alignment system. Accordingly, the time required for mark detection can be reduced, therefore, it becomes possible to increase the throughput of the entire exposure process.

Abstract: An inspection system of a printed substrate, the printed substrate at least includes a three-dimensional pattern, the system includes a light source, for emitting light beams toward the substrate, the light beams being substantially aligned when impinging on the substrate, an imager, for acquiring an image of the substrate, the image including a representation of the three-dimensional pattern and of the matter printed on the substrate and a processor, coupled with the light source and the imager, for processing the acquired image to determine the correctness of the three-dimensional pattern.

Abstract: In a pose estimation for estimating the pose of an object of pose estimation with respect to a reference surface that serves as a reference for estimating a pose, a data processing device: extracts pose parameters from a binarized image; identifies a combination of pose parameters for which the number of cross surfaces of parameter surfaces that accord with surface parameter formulas, which are numerical formulas for expressing a reference surface, is a maximum; finds a slope weighting for each of cross pixels, which are pixels on each candidate surface and which are pixels within a prescribed range, that is identified based on the angles of the tangent plane at the cross pixel and based on planes formed by each of the axes of parameter space; and identifies the significant candidate surface for which a number, which is the sum of slope weightings, is a maximum, as the actual surface that is the reference surface that actually exists in the image.

Abstract: A technique is provided for measuring an object based on multiple views. The technique includes registering each of the plurality of images and a first model of the object with one another and reconstructing a second model of the object based on the plurality of images and the first model registered with one another.

Abstract: A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.

Abstract: A semiconductor wafer may include a dummy field configured to enable overlay measurements. The enhanced dummy field may include a plurality of encoding blocs that enable OVL measurements to be made throughout the enhanced dummy field.

Abstract: The present invention provides a method of registering image data for a series of images acquired over a period of time. The images may be acquired from a medical imaging device, such as an MRI scanner. The method allows image-by-image registration to a partially compressed dataset in which motion artifacts are suppressed in a series of target images generated to resemble the original dynamic data. The registration process is refined with each iteration of the process. The method uses Principal Component Analysis which allows accurate registration to be performed without the need to make any assumptions about pharmacokinetic model parameters, which not only avoids the problems of accurate model-fitting but permits the use of much larger target areas of the dataset.

Abstract: An image comprising varying illumination is selected. Instances of a repeating pattern in the image is determined. Illumination values for pixels at locations within instances of the repeating pattern are calculated responsive to pixel intensities of pixels at corresponding locations in other instances of the repeating pattern. The varying illumination is removed form the image responsive to the illumination values.

Abstract: Disclosed herein are a system of measuring position information of a workpiece, such as a substrate (or a semiconductor wafer) using one or more alignment systems, and a position measurement method using the same. Positions of respective alignment systems are calculated using multiple fiducial marks (FMs) disposed on a fiducial alignment scope unit mark array (FAA) on a table, and positions of alignment marks (AMs) disposed on the workpiece are measured by moving the table so that the AMs are located within a field of vision (FOV) of the alignment system. The position information of the workpiece is measured using the position information of the alignment system and the position information of the FMs.

Abstract: Methods and systems are provided for mapping substrates in a substrate carrier. The invention includes a substrate carrier including one or more windows; and an imaging system coupled to a substrate carrier handling robot and adapted to determine or image substrate positions in the substrate carrier via the one or more windows. Numerous other aspects are provided.

Abstract: A failure analysis apparatus 1A is provided with a voltage applying unit 14 for applying a bias voltage to a semiconductor device S, an imaging device 18 for acquiring an image, and an image processing unit 30 for performing image processing, and the imaging device 18 acquires a plurality of analysis images each including a thermal image in a voltage applied state and a plurality of background images in a voltage non-applied state. The image processing unit 30 includes an imaging position calculating section 32 for calculating an imaging position of each of the analysis images and the background images, an image classifying section 33 for classifying the analysis images and the background images into N image groups based on a region division unit prepared for the imaging position, and a difference image generating section 34 for generating difference images between the analysis images and the background images individually for N image groups.

Abstract: An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted.

Abstract: A position detector, which detects the position of a mark formed on a substrate (W), comprises a creating unit (9), a search unit (13), and a correction unit (14). The creating unit (9) creates a template used for identifying a mark to be detected (WM) based on an image including the mark (WM). The search unit (13) searches an image by using the template created by the creating unit (9), and determines whether there is a pseudo pattern, other than the pattern of the mark (WM), whose degree of matching with the template is higher than a reference value. The correction unit (14) corrects the template based on the information of the pseudo pattern when it is determined that there is the pseudo pattern, and creates a corrected template whose degree of matching with the pseudo pattern is lower than the reference value.

Abstract: A method is provided for determining the position of a structure on a carrier, relative to a reference point of the carrier, said method comprising the steps of: a) providing an image including a reference structure; b) recording an image of the structure on the carrier by means of a recording device, with a known recording position relative to the reference points; c) superimposing the two images to form one superimposed image; d) determining the image distance of the two structures in the superimposed image; e) shifting the two structures in the superimposed image relative to one another, depending on the determined image distance; f) checking whether the determined image distance is below a predetermined maximum value; wherein, if the image distance is below the maximum value, the method is continued in step g), and, if the image distance is not below the maximum value, steps d)-f) are repeated, taking into account the determined image distance/distances: g) determining the position of the structure relati

Abstract: A line scan imager is used to determine the motion of a subject. Each line of image data from the line scan imager is compared with a reference image. The location of a matching line in the reference image reveals the displacement of the subject. The current subject displacement can be determined based on each line of image data. The resulting displacement information can be used to correctly place other optical beams on the subject. The method can be applied to tracking the human eye to facilitate measurement, imaging, or treatment with a beam of optical radiation.

Abstract: An electronic device testing apparatus for conveying electronic devices to be tested to sockets of a contact portion and bringing the electronic devices to be tested electrically contact with the sockets to conduct a test of electric characteristics of the electronic devices to be tested, comprising an image pickup portion that takes an image of the sockets; a memory portion that stores reference image data of the sockets in a state of not being attached with any electronic devices to be tested obtained by taking images by the image pickup portion; and a mislay determination portion that obtains check image data of the sockets from the image pickup portion, reads the reference image data from the memory portion, compares the check image data with the reference image data and determines whether any of the electronic devices to be tested remain on the sockets.

Abstract: The invention relates to a method, which comprises the capturing of image data representing a physical object using an electronic device. First visual objects are determined in the image data. Second objects are determined among the first visual objects. Position information is determined for the second visual objects within the physical object. Third visual object are obtained based on the position information from object data storage. The third visual objects are matched to the first visual objects and differences between third visual objects and the first visual object are indicated to a user.

Abstract: A method of manufacturing a semiconductor device, includes providing a mark above a main surface on a semiconductor substrate, separating the semiconductor substrate into a plurality of semiconductor elements by cutting the semiconductor substrate, determining a reference semiconductor element on the basis of a coordinate data indicating coordinates of the mark and coordinates of all of the semiconductor elements on the semiconductor substrate, and picking-out the semiconductor elements on the basis of the coordinate data using a pick-out apparatus. The providing operation includes forming a protective coat onto the main surface of the semiconductor substrate, irradiating a point on the main surface of the semiconductor substrate with a laser beam through the protective coat, and eliminating the protective coat from the main surface of the semiconductor substrate.

Abstract: A binarizing method for binarizing an original image of an electrode pad on a substrate. The method includes the steps of processing an electrode image to generate a binary image of the electrode by binarzing the original image with a first threshold value, calculating a contact trace area to calculate the contact trace area including a portion that is predicted to be a trace of an object that contacted the electrode from the binary image of the electrode, processing a contact trace image to generate the contact trace area binary image by binarizing the original image of the area extracted by the contact trace area extracting unit with a second threshold value different from the first threshold value, and synthesizing the images to synthesize the binary image of the electrode and the contact trace area binary image by taking a logical sum on a corresponding pixel to pixel basis.

Abstract: In one embodiment, a metrology target for determining a relative shift between two or more successive layers of a substrate may comprise; an first structure on a first layer of a substrate and an second structure on a successive layer to the first layer of the substrate arranged to determine relative shifts in alignment in both the x and y directions of the substrate by analyzing the first structure and second structure overlay.