Integrated Optical Circuit Patents (Class 385/14)
  • Patent number: 9817185
    Abstract: A silicon photonic platform includes a substrate supporting a buried oxide layer, an active silicon layer deposited on the buried oxide layer, a first silicon nitride layer separated from the active silicon layer by a first spacer, the first silicon nitride layer and the active silicon layer constituting a first light-transferring interlayer transition and a second silicon nitride layer covered by a cladding and separated from the first silicon layer by a second spacer, the second silicon nitride layer and the first silicon nitride layer constituting a second light-transferring interlayer transition. The second silicon nitride layer passes over one or more waveguides in the active silicon layer to thereby define a waveguide crossing. The silicon nitride layers may be substituted with an equivalent dielectric with a similar refractive index and high optical transparency in the desired operating wavelength range.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: November 14, 2017
    Assignee: The Governing Council of the University of Toronto
    Inventors: Wesley David Sacher, Joyce Kai See Poon
  • Patent number: 9817293
    Abstract: An object is to provide an optical modulator in which a light receiving element is disposed on a substrate configuring the optical modulator and which is capable of suppressing a decrease in the frequency bandwidth of the light receiving element even in a case in which two radiated lights from a combining part in a Mach-Zehnder type optical waveguide are received and monitored at the same time.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: November 14, 2017
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Tokutaka Hara, Norikazu Miyazaki
  • Patent number: 9810843
    Abstract: An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer (103) on an optical backplane die wafer using an orientation-dependent anisotropic wet etch process to form a first recess opening (107) with angled semiconductor sidewall surfaces (106) on the optical waveguide semiconductor layer, where the angled semiconductor sidewall surfaces (106) are processed to form an optical backplane mirror (116) for perpendicularly deflecting optical signals to and from a lateral plane of the optical waveguide semiconductor layer.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: November 7, 2017
    Assignee: NXP USA, INC.
    Inventors: Tab A. Stephens, Perry H. Pelley, Michael B. McShane
  • Patent number: 9810839
    Abstract: The invention describes an integrated photonics platform comprising a plurality of at least three vertically-stacked waveguides which enables light transfer from one waveguide of the photonic structure into another waveguide by means of controlled tunneling method. The light transfer involves at least three waveguides wherein light power flows from initial waveguide into the final waveguide while tunneling through the intermediate ones. As an exemplary realization of the controlled tunneling waveguide integration, the invention describes a photonic integrated structure consisting of laser guide as upper waveguide, passive guide as middle waveguide, and modulator guide as lower waveguides. Controlled tunneling is enabled by the overlapped lateral tapers formed on the same or different vertical waveguide levels. In the further embodiments, the controlled tunneling platform is modified to implement wavelength-(de)multiplexing, polarization-splitting and beam-splitting functions.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: November 7, 2017
    Assignee: Artic Photonics Inc.
    Inventors: Fang Wu, Yury Logvin, Kirill Y. Pimenov, Christopher D. Watson, Yongbo Tang
  • Patent number: 9810965
    Abstract: An optical module includes an optical modulator that includes a cutout portion and a first terminal projecting to the inside of the cutout portion, and is configured to perform optical modulation by using an electrical signal input to the first terminal; a driver, at least a part of the driver being housed inside the cutout portion, that is configured to generate an electrical signal; an electrode pattern that extends from the driver inside the cutout portion, and is configured to transmit the electrical signal generated by the driver; and a flexible board having flexibility, one end of the flexible board being electrically connected with the first terminal inside the cutout portion, another end of the flexible board extending in the direction away from the driver, the flexible board being connected with the electrode pattern and configured to input the electrical signal transmitted by the electrode pattern to the first terminal.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: November 7, 2017
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Akira Ishii, Shinji Maruyama, Masaki Sugiyama
  • Patent number: 9813529
    Abstract: The creation of an effective circuit between a sender device and a receiver device over the packet-switched network is described herein. To establish the effective circuit, the sender device sends a request to the receiver device through the packet-switched network. The request is associated with a bandwidth reservation from the receiver device for reception of a message from the sender device. The receiver device receives multiple requests from multiple sender devices and reserves bandwidth for at least one of the sender devices. The receiver device then sends a response to the at least one sender device providing clearance to send the message to the receiver device using the reserved bandwidth, the request and response establishing the effective circuit. The receiver device may also decline the requests of the other sender devices, causing the other sender devices to send other requests to other receiver devices.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: November 7, 2017
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Jeremy E. Elson, Edmund B. Nightingale
  • Patent number: 9806243
    Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: October 31, 2017
    Assignee: OSRAM OLED GmbH
    Inventors: Joerg Farrnbacher, Simon Schicktanz
  • Patent number: 9804328
    Abstract: There is provided an optical multiplexing and de-multiplexing element which is provided with a slab waveguide and a waveguide structure and can reduce radiation loss caused in a connection part between the slab waveguide and the waveguide structure. The waveguide structure includes a multimode interference (MMI) waveguide coupler and a narrow-width waveguide, the MMI waveguide coupler and the narrow-width waveguide are connected to each other in this order from a connection position with the slab waveguide along the waveguide direction, step portions are formed on both sides of the MMI waveguide coupler along the waveguide direction, and the thickness of the step portion is smaller than the thickness of the MMI waveguide coupler.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: October 31, 2017
    Assignees: Oki Electric Industry Co., Ltd., Photonics Electronics Technology Research Association
    Inventor: Hideaki Okayama
  • Patent number: 9798166
    Abstract: A method of forming an attenuator on an optical device includes forming a ridge for a waveguide. The ridge is formed in a light-transmitting medium that is positioned on a base. The ridge extends upwards from slab regions of the light-transmitting medium. The method also includes forming trenches in the slab regions of the light-transmitting medium such that the trenches extend through the light-transmitting medium to the base. The trenches are formed such that the ridge is located between the trenches. The method also includes forming a semiconductor in a bottom of each of the trenches and then doping a region of each of the semiconductors.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: October 24, 2017
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventors: Monish Sharma, Wei Qian, Dazeng Feng
  • Patent number: 9782814
    Abstract: A composite structure includes a base and an auxiliary portion of dissimilar materials. The auxiliary portion is shaped by stamping. As the auxiliary portion is stamped, it interlocks with the base, and at the same time forming a desired structured feature on the auxiliary portion, such as a structured reflective surface, an alignment feature, etc. With this approach, relatively less critical structured features can be shaped on the bulk of the base with less effort to maintain a relatively larger tolerance, while the relatively more critical structured features on the auxiliary portion are more precisely shaped with further considerations to define dimensions, geometries and/or finishes at relatively smaller tolerances. The auxiliary portion may include a composite structure of two dissimilar materials associated with different properties for stamping different structured features.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: October 10, 2017
    Assignee: NANOPRECISION PRODUCTS, INC.
    Inventors: Shuhe Li, Robert Ryan Vallance, Michael K. Barnoski, Yongsheng Zhao, Matthew Gean, Tewodros Mengesha, Rand D. Dannenberg
  • Patent number: 9774164
    Abstract: A tunable laser has a first mirror, a second mirror, a gain medium, and a directional coupler. The first mirror and the second mirror form an optical resonator. The gain medium and the directional coupler are, at least partially, in an optical path of the optical resonator. The first mirror and the second mirror comprise binary super gratings. Both the first mirror and the second mirror have high reflectivity. The directional coupler provides an output coupler for the tunable laser.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: September 26, 2017
    Assignee: Skorpios Technologies, Inc.
    Inventors: Hacene Chaouch, Guoliang Li
  • Patent number: 9772459
    Abstract: An optoelectronic module includes an interposer base having first and second recesses formed on a specified surface thereof; a joint material layer filled in the first and second recesses; a first optoelectronic element placed in the first recess and coupled to the interposer base via the joint material layer, wherein an optical signal is emitted from or passes through a lateral surface of the first optoelectronic element; and a second optoelectronic element placed in the second recess and coupled to the interposer base via the joint material layer, wherein a lateral surface of the second optoelectronic element faces the lateral surface of the first optoelectronic element for coupling to and receiving the optical signal emitted from or passing through the lateral surface of the first optoelectronic element. A fixture is used to place the first and second optoelectronic elements into the first and second recesses while controlling some critical distances.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: September 26, 2017
    Assignee: CYNTEC CO., LTD.
    Inventor: Ming-Che Wu
  • Patent number: 9772462
    Abstract: A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: September 26, 2017
    Assignee: International Business Machines Corporation
    Inventors: Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada
  • Patent number: 9773936
    Abstract: A semiconductor device is provided, which has a wide-bandgap semiconductor element, such as a SiC element, and which includes a sensor capable of responding sufficiently to characteristic requirements for protecting and controlling the semiconductor element. The semiconductor device includes a wide-bandgap semiconductor element mounted on a substrate; and a light-receiving element that receives light emitted from the wide-bandgap semiconductor element when the wide-bandgap semiconductor element is in a conduction state.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: September 26, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Hayato Nakano
  • Patent number: 9766408
    Abstract: A composite optical waveguide is constructed using an array of waveguide cores, in which one core is tapered to a larger dimension, so that all the cores are used as a composite input port, and the one larger core is used as an output port. In addition, transverse couplers can be fabricated in a similar fashion. The waveguide cores are preferably made of SiN. In some cases, a layer of SiN which is provided as an etch stop is used as at least one of the waveguide cores. The waveguide cores can be spaced away from a semiconductor layer so as to minimize loses.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: September 19, 2017
    Assignee: Elenion Technologies, LLC
    Inventors: Ari Novack, Ruizhi Shi, Michael J. Hochberg, Thomas Baehr-Jones
  • Patent number: 9766418
    Abstract: Optical connector systems are disclosed. In one embodiment, an optical port includes a substrate, a laser silicon chip, an interposer, and a receptacle housing. The laser silicon chip includes an optical source, a laser beam emitting surface, and a grating at the laser beam emitting surface. The laser silicon chip is coupled to the substrate such that the laser beam emitting surface is transverse to the mounting surface of the substrate. The interposer includes an interposer fiber support bore, and is coupled to the laser beam emitting surface of the laser silicon chip such that the interposer fiber support bore is substantially aligned with the grating of the laser silicon chip. The receptacle housing includes a receptacle mating surface and defines an enclosure operable to receive a fiber optic connector. The receptacle mating surface includes a receptacle fiber support bore aligned with the interposer fiber support bore.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: September 19, 2017
    Assignee: Corning Optical Communications LLC
    Inventors: Christopher Paul Lewallen, James Phillip Luther
  • Patent number: 9759982
    Abstract: The optical device includes an optical modulator positioned on a base. The modulator includes a ridge extending upward from the base. The ridge includes an electro-absorption medium through which light signals are guided. A thermal conductor is positioned so as to conduct thermal energy away from the ridge. The distance between the thermal conductor and the ridge changes along a length of at least a portion of the ridge.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 12, 2017
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventors: Dazeng Feng, Jacob Levy, Chatchai Bushyakanist, Mohammad Esmaeili Rad
  • Patent number: 9759865
    Abstract: A compact polarization beam splitter is formed by cascading two stages of three restricted MMIs. Each MIMI is configured to set ultra compact width and length for a rectangular waveguide body to limit no more than 4 modes therein working as a polarization beam splitter in a 50 nm wavelength window around 1300 nm. Each MMI is further configured to couple an input at a first end and a TE bar output and a TM cross output at a second end of the rectangular waveguide body. The locations of the input/output waveguide ports are designated to be a distance of ? of the width away from a middle line from the first end to the second end. Two second-stage MMIs have their inputs coupled to the TE bar output and the TM cross output of the first-stage MMI and provide a second-stage TE bar output and a second-stage TM cross output, respectively.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: September 12, 2017
    Assignee: INPHI CORPORATION
    Inventor: Jie Lin
  • Patent number: 9753229
    Abstract: A double flexible optical circuit includes: a flexible substrate supporting a plurality of optical fibers; a first connector terminating the optical fibers at a first end of the double flexible optical circuit; and a second connector terminating the optical fibers at a second end of the double flexible optical circuit. Each of the optical fibers is positioned in one of a plurality of separate extensions formed by the flexible substrate as the optical fibers extend from the first connector to the second connector. The first and second connectors are configured to be tested when the first and second connectors are connected through the double flexible optical circuit. The double flexible optical circuit is configured to be divided in half once the testing is complete to form two separate flexible optical circuits.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: September 5, 2017
    Assignees: CommScope Connectivity UK Limited, Commscope Connectivity Spain, S.L., CommScope Asia Holdings B.V., CommScope Technologies LLC
    Inventors: David Patrick Murray, Ton Bolhaar, Paul Schneider, Rafael Mateo, Luis Cabacho, Michael Wentworth, Steven J. Brandt, Marcellus P J Buijs, Alexander Dorrestein, Jan Willem Rietveld
  • Patent number: 9748733
    Abstract: The semiconductor laser device includes a base member having a recess that opens upward, a semiconductor laser element disposed on a bottom surface of the recess, and a light reflecting member being disposed forward of a light emitting surface of the semiconductor laser element and including a light reflecting surface to reflect laser light emitted from the semiconductor laser element. The semiconductor laser element and the light reflecting member are arranged such that a direction of an optical axis of light that is reflected by the light reflecting member is different from a direction that is perpendicular to a lower surface of the base member.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: August 29, 2017
    Assignee: NICHIA CORPORATION
    Inventor: Eiichiro Okahisa
  • Patent number: 9746606
    Abstract: The present invention provides three waveguide structures, including a protruding-type waveguide structure, a buried-type waveguide structure, and a redeposited-type waveguide structure, the protruding-type waveguide structure includes two axisymmetrically disposed first ends, and the first end is sequentially divided into a first region, a second region, and a third region in a direction toward an axis of symmetry; and the waveguide structure includes a first silicon substrate layer, a second silicon substrate layer, a first silicon dioxide layer, a second silicon dioxide layer, and a first silicon waveguide layer. The waveguide structure and the waveguide coupling structure that are provided in the present invention have advantages of a small size, low polarization dependence, and low temperature sensitivity, and a crosstalk value is greater than 25 dB, which meets a requirement of a passive optical network system, and provides feasibility for commercialization of the arrayed waveguide grating.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: August 29, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jing Hu, Xiaoping Zhou
  • Patent number: 9746613
    Abstract: Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: August 29, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9739941
    Abstract: Disclosed herein are apparatuses that include a first layer that includes glass and a plurality of waveguides disposed in the glass; a second layer that includes a second layer polymer and a plurality of waveguides disposed in the second layer polymer; and a third layer that includes a third layer polymer and a plurality of waveguides disposed in the third layer polymer.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: August 22, 2017
    Assignee: XYRATEX TECHNOLOGY LIMITED
    Inventor: Richard Pitwon
  • Patent number: 9739942
    Abstract: A method for manufacturing an optical circuit board includes: forming an optical waveguide having a structure that a core is sandwiched between a lower clad layer and an upper clad layer so as to extend along an upper surface of a glass plate; forming a glass plate-side positioning mark composed of the same material as the core, between the lower clad layer and the upper clad layer in a region other than the core; forming a reflection surface at a part of the core; preparing a wiring board having a board-side positioning mark; and mounting the glass plate having the optical waveguide formed thereon so that the glass plate-side positioning marks and the board-side positioning mark are superimposed on each other.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: August 22, 2017
    Assignee: KYOCERA CORPORATION
    Inventor: Itsuroh Shishido
  • Patent number: 9733442
    Abstract: Optical communication apparatus includes a printed circuit board (PCB), a photoelectric unit electrically connected to the PCB, a supporting member positioned on the PCB, a coupler supported on the supporting member, and an optical fiber unit. The coupler optically couples the photoelectric unit to the optical fiber unit. The supporting member defines a through stepped hole having a larger first hole and a smaller second hole. The supporting member includes a step portion between the first hole and the second hole. The second hole is closer to the PCB than the first hole. The supporting member defines a number of positioning holes, and the coupler comprises a number of positioning poles corresponding to the positioning holes. The coupler is connected to the supporting member by inserting the positioning poles into the corresponding positioning holes.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: August 15, 2017
    Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
    Inventor: Yi Hung
  • Patent number: 9726840
    Abstract: Methods, structures, apparatus, devices, and materials to facilitate the integration of electronic integrated circuits (chips) including drivers, amplifiers, microcontrollers, etc., onto/into photonic integrated circuits (chips) using recessed windows exhibiting controlled depths onto/into the photonic chip. The electronic chips are positioned into the recessed windows and electrical connections between the electronic chips and the photonic chip are achieved by flip-chip techniques with predefined traces at a bottom of the recessed windows or direct wire bonding. Advantageously, this integration may be performed on a wafer level for large-volume productions.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: August 8, 2017
    Assignee: Acacia Communications, Inc.
    Inventor: Long Chen
  • Patent number: 9726836
    Abstract: An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: August 8, 2017
    Assignee: KAIAM CORP.
    Inventors: Bardia Pezeshki, John Heanue
  • Patent number: 9720188
    Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: August 1, 2017
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Jerome Bougie, Darrell Childers, Paul Francis Fortier, Alexander Janta-Polczynski, Stephan L. Martel
  • Patent number: 9716350
    Abstract: The invention relates to a connector including a thermal protection circuit which detects abnormal heating to cut off the power supply. The connector (200) of the invention has: a cover portion (21); a plug portion (22); and a printed circuit board (27). The thermal protection circuit includes: an FET (34) which is inserted in a power supply line of a printed circuit board; and a temperature switch IC (33) which detects a temperature, and which, when the detected temperature exceeds a predetermined temperature, outputs an abnormal heating signal for causing the FET to cut off the power supply line. The connector includes a metal bonding member (360) which thermally couples a metal shell (25) to the temperature switch IC (33). The connector in which power supply can be cut off with high sensitivity with respect to abnormal heating in a plug portion is provided.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: July 25, 2017
    Assignee: HOSIDEN CORPORATION
    Inventors: Keiichi Taniguchi, Tsuyoshi Kitagawa, Hiroyuki Kaibara
  • Patent number: 9715066
    Abstract: Embodiments herein relate to orthogonally coupling light transmitted from a photonic transmitter chip. An optical apparatus may include a splitter to split light from a light source into a first path and a second path, and a grating to receive light from the first path at a first side and light from the second path at a second side opposite the first side to transmit diffracted light from the first path and the second path in a direction orthogonal to the photonic transmitter chip. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: July 25, 2017
    Assignee: Intel Corporation
    Inventor: Judson D. Ryckman
  • Patent number: 9709748
    Abstract: A method of manufacturing a device includes forming an optical coupler having a first end contacting a front side of a semiconductor substrate and a second end contacting an optical waveguide on an insulator layer on the substrate. The optical coupler is curved between the first end and the second end. The optical coupler is configured to change a direction of travel of light from a first direction at the first end to a second direction at the second end.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: July 18, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yoba Amoah, Brennan J. Brown, John J. Ellis-Monaghan, Ashleigh R. Kreider
  • Patent number: 9709761
    Abstract: The optical receptacle of the invention includes plural first optical surfaces allowing light emitted from plural light emitting elements to be incident thereon, plural second optical surfaces emitting the light incident on the first optical surfaces toward plural optical transmission members, and a third optical surface reflecting the light incident on the first optical surfaces toward the second optical surfaces. The distances between the center of the first optical surface and the light-emitting surface of the light emitting element and between the center of the second optical surface and the light-emitting surface of the light emitting element is longer toward the center from both ends of the row. The center-to-center distances of the first optical surfaces and of the second optical surfaces are shorter, respectively, than the distance between optical axes of light emitted from the light emitting elements and the center-to-center distance of light-receiving surfaces of optical transmission members.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: July 18, 2017
    Assignee: Enplas Corporation
    Inventors: Shimpei Morioka, Kazutaka Shibuya
  • Patent number: 9712353
    Abstract: A method and system is provided for allowing signals across electrical domains. The method includes applying a clock signal (of at least 1 GHz) to an electronic element in a location having first electrical properties. Data is output from the first electronic element; and received at a second electronic element located in a location having second electrical properties. The first and second electrical properties are different by either voltage and clock frequency.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: July 18, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Andy Sung, Leon Lai, Daniel Wang
  • Patent number: 9709768
    Abstract: A pipe section for coupling to one or more pipe sections in order to form an elongate tubular. The pipe section has an optical fiber extending along a longitudinal axis of the pipe section and a waveguide disposed near one end of the pipe section and is in optical communication with the optical fiber to guide light in a plane substantially perpendicular to the longitudinal axis.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: July 18, 2017
    Assignee: STATOIL PETROLEUM AS
    Inventors: Håvard Nasvik, Kjetil Johannessen
  • Patent number: 9703056
    Abstract: A method and apparatus are provided for fabricating an electro-optical interconnect on an integrated circuit (101, 114) in which an optical circuit element (102) is formed by forming a cylinder-shaped conductive interconnect structure (120, 122, 126, 128) with one or more conductive layers formed around a central opening (129) which is located over an optically transparent layer (118) located over the optical circuit element (102).
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: July 11, 2017
    Assignee: NXP USA, INC.
    Inventors: Sriram Neelakantan, Trent S. Uehling
  • Patent number: 9703047
    Abstract: A spot-size converter for coupling light between first and second waveguides respectively supporting first and second propagation modes having substantially different dimensions is provided. The spot-size converter includes a lower and an upper waveguiding structure each characterized by an effective refractive index. The lower waveguiding structure is coupled to the first waveguide to receive light therefrom or transmit light thereto in the first propagation mode. The upper waveguiding structure is coupled to the second waveguide to transmit light thereto or receive light therefrom in the second propagation mode. The upper waveguiding structure includes a plurality of longitudinally extending high-index elements arranged in multiple vertically spaced rows.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: July 11, 2017
    Assignee: Ciena Corporation
    Inventors: Yves Painchaud, Marie-Josée Picard, Christine Latrasse, Michel Poulin
  • Patent number: 9697163
    Abstract: A data path configuration component for configuring at least one data path setting within a signal processing device is described. The data path configuration component is arranged to receive an indication of an operating mode of the signal processing device, and dynamically configure the at least one data path setting within the signal processing device based at least partially on the received indication of an operating mode of the signal processing device.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: July 4, 2017
    Assignee: NXP USA, Inc.
    Inventors: Alistair Robertson, Manfred Thanner
  • Patent number: 9696496
    Abstract: A semiconductor optical device includes a semiconductor substrate having first to fourth regions, a 90-degree optical hybrid provided in the third region on a principal surface of the semiconductor substrate, first and second waveguides provided in the first region and being optically coupled to the 90-degree optical hybrid, a photodiode provided in the fourth region, a third waveguide provided in the second region to optically couple the 90-degree optical hybrid to the photodiode, and a metal layer provided on a back surface of the semiconductor substrate. The metal layer includes a first part provided in the first region and a second part provided in the second region that is spaced apart from the first part by a distance. The 90-degree optical hybrid has a first length. The distance between the first and second parts is more than or equal to the first length.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: July 4, 2017
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Ryuji Masuyama, Yoshihiro Yoneda, Hideki Yagi, Kenji Sakurai, Takehiko Kikuchi
  • Patent number: 9696507
    Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and each including a first electric wiring of an electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion defined on a portion of the insulation layer extending from the opto-electric module portions, and including an optical waveguide optically coupled with the optical elements. A metal reinforcement layer provided on a back surface of the insulation layer as extending over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present the interconnection portion has a smaller width than the opto-electric module portions, and the smaller width portion has rounded proximal corners.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: July 4, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Yuichi Tsujita
  • Patent number: 9690046
    Abstract: The optical circuit board includes a wiring board including a plurality of laminated insulating layers, and a wiring conductor disposed between the insulating layers; an optical waveguide including a lower clad layer, an upper clad layer and a core sandwiched between the lower clad layer and the upper clad layer, disposed on an upper surface of the wiring board, and extending in one direction; a reflection surface including an inner surface of a groove formed in a part of the core of the optical waveguide, and being perpendicular to an extending direction in a plane view and having a predetermined angle with respect to the upper surface in a cross sectional view; and a metal layer disposed on an upper surface of the insulating layer on the upper side than the wiring conductor of the wiring board, and set as a bottom surface of the groove.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: June 27, 2017
    Assignee: KYOCERA CORPORATION
    Inventors: Kenji Terada, Akifumi Sagara
  • Patent number: 9690059
    Abstract: An optical module includes a first ferrule, a second ferrule, a clip for holding the first ferrule and the second ferrule together, a board including a light-emitting element and a light-receiving element, an optical waveguide connecting the board to the first ferrule, an outer case forming a housing of the optical module and including a protrusion, and an inner case disposed in the outer case and to which the clip is attached. A pressing surface is formed at an end of the inner case. A first end of the board is in contact with the protrusion and a second end of the board is in contact with the pressing surface such that the board is clamped between the protrusion and the pressing surface.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: June 27, 2017
    Assignee: FUJITSU COMPONENT LIMITED
    Inventors: Shinichiro Akieda, Osamu Daikuhara
  • Patent number: 9683928
    Abstract: An integrated optical system includes a photonic integrated circuit (PIC) having a frequency tunable optical source, a coherent optical receiver, and an optical phased array for coupling light to/from a sample. The integrated optical system is configured such that when the optical source is tuned in optical frequency the receiver produces electrical signals that are processed to produce optical profile information about the sample.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: June 20, 2017
    Inventor: Eric Swanson
  • Patent number: 9684127
    Abstract: An optical device includes a first optical cavity, a second optical cavity, a first light guide and a second light guide. Each of the first and second optical cavities is formed on a semiconductor substrate, and is configured to store light. The first light guide has an input, and is optically coupled to the first optical cavity by a first coupling strength. In addition, the first light guide is optically coupled to the second optical cavity by a second coupling strength. The second light guide has an output, and is coupled to the second optical cavity by a third coupling strength. The first coupling strength is greater than the second coupling strength, and the third coupling strength is greater than the second coupling strength.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: June 20, 2017
    Assignee: Purdue Research Foundation
    Inventors: Minghao Qi, Li Fan, Jian Wang, Leo Tom Varghese
  • Patent number: 9678278
    Abstract: The present invention is related to an integrated optical circuit, in particular, to an optical-field writable array, as well as to methods for its manufacturing and reconfiguring. The integrated optical circuit comprises at least one nanophotonic device and at least one photonic wire, wherein the nanophotonic device comprises a substrate equipped with at least one reception for at least one external connector, wherein the reception is coupled to at least one connector waveguide, and at least one set of nano-optic components, wherein the nano-optic component is one of a nanophotonic waveguide or a nanophotonic component, wherein the nano-photonic component is nano-optically coupled to at least one nanophotonic waveguide, wherein at least one of the nanophotonic waveguides is selectively coupleable to at least one of the connector waveguides, wherein the photonic wire connects at least one of the nanophotonic waveguides to at least one of the connector waveguides.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: June 13, 2017
    Assignee: Karlsruher Institut für Technologie
    Inventors: Matthias Blaicher, Wolfram Pernice, Martin Wegener
  • Patent number: 9681067
    Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: June 13, 2017
    Assignee: OLYMPUS CORPORATION
    Inventors: Noriyuki Fujimori, Kazuaki Kojima
  • Patent number: 9671572
    Abstract: A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and/or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and/or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and/or received from the optical integrated circuit through the interposer.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: June 6, 2017
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Patrick J. Decker, Kannan Raj, Alan T. Hilton-Nickel
  • Patent number: 9671576
    Abstract: A CWDM transceiver module includes: a substrate; a plurality of light sources disposed on the substrate; a spacer layer disposed above the substrate, a cavity being defined in the space layer to accommodate the light sources; a cap layer transparent to light emitted from the light sources and disposed on the spacer layer, a notch for assembling a waveguide being formed in the cap layer; a plurality of lenses disposed on the cap layer facing the light sources; reflector coating and filter coating disposed on surfaces of the cap layer; an active alignment element disposed on the cap layer; and a reflector disposed at bottom of the notch.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: June 6, 2017
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Dennis Tak Kit Tong, Vivian Wei Ma, Vincent Wai Hung
  • Patent number: 9673929
    Abstract: An optical transmission apparatus including: an attenuator that attenuates a power of a first optical signal generated in a first modulation method to a first target level and attenuates a power of a second optical signal generated in a second modulation method, a modulation level in the second modulation method being lower than the modulation level in the first modulation method, to a second target level, the second target level being lower than the first target level; and a transmitter that sends a WDM signal including the first optical signal and the second optical signal that have been attenuated by the attenuator.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: June 6, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Makoto Yamashita, Satoru Okano, Masahiro Yuki
  • Patent number: 9671574
    Abstract: An optical integrated circuit comprises optical waveguides, grooves formed by etching the upper cladding layer, the core layer and all or parts of the lower cladding layer close to a end section of the optical waveguide to intercept light transmitted through the core layer of the optical waveguide or to couple light into the core layer, a plurality of bonding pads formed around the groove, micro-mirrors and active optical elements. Such a PLC based optical integrated circuit and a method of manufacturing the same provides a low-cost manufacturing of optical integrated circuits and high quality mirrors for vertical optical coupling scheme.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: June 6, 2017
    Assignee: Wooriro Co., Ltd.
    Inventors: Sang Hwan Lee, Chan Yong Park, Young Hye Kim
  • Patent number: 9664981
    Abstract: An integrated light source includes an optical circuit (3) including at least an interference optical switch and a light emitting unit (2) outputting optical signals having the same phase to multiple input ends, and an interference optical switch (21), for example, includes an optical coupler (33ab) coupling or splitting and outputting optical signals input through multiple optical waveguides to a first and a second output ports, a first optical waveguide (32a) having one end inputting an optical signal and the other end connected to the optical coupler (33ab), a second optical waveguide (32b) having one end inputting an optical signal, the other end connected to the optical coupler (33ab), and the same optical path length as the first optical waveguide (32a), and a phase shifter (31a) disposed on the first optical waveguide (32a) and switching phase differences of an optical signal transmitted through the first optical waveguide (32a) according to a control signal (S21).
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: May 30, 2017
    Assignee: NEC CORPORATION
    Inventors: Takanori Shimizu, Masashige Ishizaka