Abstract: Improve semiconductor device performance. The wiring WL1A on which the semiconductor chip CHP1 in which the semiconductor lasers LD is formed is mounted has a stub STB2 in the vicinity of the mounting area of the semiconductor chip CHP1.

Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.

Abstract: An example adaptor for passively aligning an optical component of an optical connector with a ferrule of the optical connector. The adaptor may include first alignment feature and second alignment features. The first alignment features may be to, when the adaptor is connected to the ferrule, cooperate with alignment features of the ferrule to passively force the adaptor into a first configuration relative to the ferrule. The second alignment features may be arranged such that, when the optical component is held in contact with the second alignment features and the adaptor is in the first configuration relative to the ferrule, the optical component is in an aligned position relative to the ferrule.

Abstract: This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.

Abstract: A device. At least some example embodiments are a device including a filter element configured to receive optical energy from a first optical fiber. The filter element is reflective in a preselected band of optical wavelengths. A first lens is configured to receive optical energy transmitted through the filter element. A shell is disposed about the optical filter and the first lens; surfaces of the first lens, the filter element and the shell form a first boundary portion of an internal volume of an interior of the shell. A fluid is sealably disposed within the internal volume.

Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.

Abstract: The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

Abstract: A vascular optical fiber guidewire includes an optical fiber guidewire and a plug connected to the optical fiber guidewire. The plug may be a memory alloy plug including a handle, a fixing groove and a sleeve which are sequentially connected. A radius of a segment of the fixing groove is larger than a radius of a segment of the fixing groove. The fixing groove cooperates with an external connector to provide a locking effect. The sleeve is provided with an elastically deformable spiral structure. The memory alloy plug is sleeved on a metal tube sleeved outside the optical fiber guidewire and connected with the optical fiber guidewire. A part of the metal tube extending from the memory alloy plug forms a spiral shape by spirally cutting to protect and support the optical fiber guidewire. The insertion and extraction operations and rotating operations can be facilitated.

Abstract: A sensor housing assembly for enclosing an electrical interface circuit, a sensor or sensor input, and a connector for interfacing with a data unit. The sensor housing assembly generally includes a housing containing a circuit board and interface circuitry to condition a sensor input signal, and a connector mounted on the circuit board, the assembly being insertable into a data unit. The housing can include a protrusion that prevents the assembly from being inserted into the data unit incorrectly, which also allows a symmetrical connector to be used. The sensor housing assembly is adapted to be inserted into a receptacle in the data unit, which has blocking tabs that act with the protrusion to ensure that the assembly can only be inserted one way.

Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: A communication device includes a mechanical frame, which is configured to be inserted into a multi-channel Small Form-Factor Pluggable (SFP) receptacle that is compliant with a first SFP standard and to receive inside the frame an SFP connector that is compliant with a second SFP standard, which is different from the first SFP standard. First electrical terminals, held by the mechanical frame, are configured to mate with respective first pins of the SFP receptacle, and second electrical terminals, electrically coupled within the mechanical frame to the first electrical terminals, are configured to mate with respective second pins of the SFP connector. A heat sink is mounted on the mechanical frame and configured to make a positive contact with the SFP connector when the SFP connector is inserted into the mechanical frame and to be contained completely within the SFP receptacle when the mechanical frame is inserted into the SFP receptacle.

Abstract: Provided are: a light source module capable of having a reduced packaging area size while ensuring wavelength precision; and a method for manufacturing this light source module. This light source module is provided with a light amplifying means, a wavelength monitoring means for detecting a change in wavelength of light outputted from the light amplifying means, and a reflecting means which is disposed between the light amplifying means and the wavelength monitoring means, and which is for reflecting the light outputted from the light amplifying means toward the wavelength monitoring means.

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Abstract: The present invention relates generally to a passive optical network (PON)-based video overlay pluggable type optical network device that is easily connected and detached from an indoor optical network terminal (ONT) at a subscriber side, which transmits and receives an optical signal in which a video RF optical signal and a PON optical signal are overlaid, wherein a PON board for receiving and processing the PON optical signals and a video RF board for receiving and processing the video RF optical signals are easily removed for replacement from a housing including an optical sub-assembly (OSA), which separates the PON optical signal and the video RF optical signal, and the PON board and the video RF board are individually designed and configured in a removable manner so that interference between the signals is minimized and selective combinations and production are possible according to various types of PONs and video services.

Abstract: [Object] To provide an optical connector and an optical connector set which are excellent in environment resistance and suitable for the use in medical instruments, an image pickup unit and an image pickup system that use the optical connector, and an optical transmission module. [Solving Means] An optical connector according to the present technology includes a lens support, a fiber ferrule, a lens, and a lens retainer. The lens support includes a through-hole. An optical fiber is connected to the fiber ferrule. The fiber ferrule is press-fitted in the through-hole. The lens is inserted into the through-hole. The lens retainer is press-fitted in the lens support and sandwiches the lens between the lens retainer and the fiber ferrule.

Abstract: A pluggable optical module includes a pluggable electric connector, a control unit, an optical signal output unit, and a pluggable optical receptor. The pluggable electric connector can communicate a modulation signal and a control signal with an optical communication apparatus. The optical signal output unit outputs an optical signal modulated by the modulation scheme by the control signal in response to the modulation signal. The pluggable optical receptor is configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptor. The pluggable optical receptor can output the optical signal output from the optical signal output unit. The control unit controls the optical signal output unit to output the optical signal of a modulation amplitude set corresponding to the modulation signal in the modulation scheme specified by the control signal.

Abstract: A photosensor includes a light emitting element that radiates light onto an object to be detected and a light receiving element that has a light-receiving surface for receiving light radiated from the light emitting element. An incident light regulation portion covering the light-receiving surface is provided on a path along which the light radiated from the light emitting element directed toward the light-receiving surface, and the incident light regulation portion transmits light having an incident angle less than a predetermined value and blocks light having the incident angle greater than or equal to the predetermined value among light incident on the light receiving element.

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract: There are provided an optical receiver module with an improvement in high frequency characteristic and reduction in size. The optical receiver module includes a substrate, an IC provided with two or more IC terminals, a light receiving element disposed in front of the IC, provided with two or more PD terminals and having a light receiving window, and a first optical component disposed in front of the IC provided with two bridge footing sections, and a lens main body section located between upper portions of the two bridge footing sections, the lens main body section is provided with a lens and a mirror, and a distance L1 between a position A of the lens and a position B of the light receiving window is longer than a distance L2 between the position B and a position C of an end part of the two bridge footing sections.

Abstract: A spectroscopic measurement device emits light to a measurement target and measures the measurement light output from the measurement target in accordance with the light emission. A spectroscopic measurement device includes: a first housing having a light shielding property and configured to house a light source that emits light and having a first opening through which the light emitted from the light source passes; a second housing having a light shielding property and having a second opening through which the measurement light passes and configured to house a spectrometer that receives the measurement light that has passed through the second opening; and a junction configured to join the first housing and the second housing such that relative positions of the first housing and the second housing can be changed.

Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.

Abstract: An optical transceiver housing structure comprising a first latch arm, a second latch arm, a fixing mechanism, and a release mechanism is provided. The first and the second latch arms have a first and a second guide slot disposed on bottom ends thereof, respectively. The fixing mechanism is attached to the first latch arm and second latch arm at a top end thereof and the release mechanism is attached to the first latch arm and second latch arm at a bottom end thereof. Two side guide lugs of an optical transceiver are moveable in the first guide slot and the second guide slot, respectfully. When the release mechanism moves toward the optical transceiver, the first and the second latch arms slide along the first and second guide slots to move the fixing mechanism in an opposite direction away from the optical transceiver.

Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.

Abstract: A double-lever handle includes a main handle and an assisting handle. The main handle is rotationally mounted to a support body to form a first rotating pair. The assisting handle includes a power arm portion. The power arm portion is rotationally coupled to an end of the main handle away from the first rotating pair to form a second rotating pair. An end of the main handle adjacent to the first rotating pair defines a first latching slot. The main handle rotates about a first latching pin latched in the first latching slot. An end of the power arm adjacent to the second rotating pair defines a second latching slot. The power arm rotates about a second latching pin latched in the second latching slot.

Abstract: A plug connector includes: a metallic enclosure enclosing a printed circuit board; a heat sink member exposed to an exterior surface of the metallic enclosure; and a set of electronic components assembled upon the printed circuit board, wherein the heat sink member is to dissipate heat from at least one of the set of electronic components, and the heat sink member is detachably attached upon the metallic enclosure.

Abstract: An optical module includes a semiconductor laser with an active layer disproportionately positioned closer to the first surface. The semiconductor laser includes a reflector for reflecting the light outgoing from the active layer in a direction along the first surface toward another direction. The active layer and the reflector are monolithically integrated in the semiconductor laser. The optical module includes a carrier formed from a light transmissive material and having a third surface and a fourth surface opposite to each other. The semiconductor laser is mounted on the carrier so as for the light to enter the third surface. The carrier has a lens integrally on the fourth surface. The optical module includes a substrate having an optical waveguide and an optical coupler for guiding the light to the optical waveguide. The optical waveguide and the optical coupler are integrated in the substrate.

Abstract: An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.

Abstract: An optical module that provides a feedthrough to carry an electrical signal output from and/or provided to a semiconductor optical device is disclosed. The feedthrough has a signal pad that carries the electrical signal thereon and at least two ground pads sandwiching the signal pad therebetween. The feedthrough further provides a cavity provided under the signal pad and spaces each between the signal pad and the ground pads.

Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

Abstract: An optical-to-optical (O2O) signal path, O2O and hybrid transceivers including the same, a network system or device including one or more of the transceivers, and methods of making and using the same are disclosed. The O2O signal path generally includes first and second ports and an optical amplifier configured to receive an optical signal from a host or a network through the first port and provide an amplified optical signal for the other of the host and the network through the second port. In some examples, the O2O signal path further includes one or more optical isolators and/or clock and data recovery functions. The optical signals in the O2O signal path are processed entirely in the optical domain. The transceiver includes the O2O signal path and may include an optoelectronic signal path, a pass-through connector, or a second O2O signal path.

Abstract: When an optical module is inserted into a compartment of a receptacle cage in a state where a heatsink is detached from the receptacle cage, a tip end portion of a protection wall portion of the optical module comes into contact with end portions of guide pieces of a guide plate even if the optical module is inserted with the protection wall portion being lifted up, and the tip end portion of the protection wall portion is thereby pushed down and guided to a clearance below the guide pieces.

Abstract: The invention provides a connector module and optical signal processing device connected thereto. The optical signal processing device and the connector module are connected together via at least one fiber cable, they are allowed to transmit at least one optical signal therebetween. The connector module comprises a circuit board, a high frequency connector, and at least one photoelectric transducer. The high frequency connector and the photoelectric transducer are configured on the circuit board in a way of COB. Accordingly, the high frequency connector and the photoelectric transducer are implemented on the circuit board in the way of COB, which can effectively reduce the volume and the manufacture cost of the connector module. Besides, the connector module is capable of transmitting signals in the way of optical communication so as to improve the data transfer rate and transmission distance of the connector module.

Abstract: The present disclosure is generally directed to a transmitter optical subassembly (TOSA) having a hermetically-sealed housing with a feedthrough device that electrically isolates RF and power traces. In more detail, a TOSA consistent with the present disclosure includes a substrate with driving circuitry disposed thereon. A first end of the substrate may electrically couple to transmit connecting circuitry and a second end may couple to a hermetically-sealed housing. The hermetically-sealed housing can include one or more laser packages for emitting associated channel wavelengths in addition to monitor photodiodes (PDs), and temperature control devices such as TECs. The hermetic-sealed housing includes a first end with a feedthrough device that provides traces to electrically couple to the circuitry of the substrate. The hermetic-sealed housing further includes an optical coupling port, e.g., a LC connector, for coupling to an external fiber, for example.

Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

Abstract: An optical transceiver includes: a TOSA that converts an electrical signal into an optical signal; an ROSA that converts an optical signal into an electrical signal; a receptacle that houses an external optical connector for transmitting or receiving an optical signal through the external optical connector; an internal fiber that optically connects one of the ROSA and the TOSA to the receptacle; a circuit board that includes a circuit that is electrically connected to the TOSA and the ROSA via an FPC; a holding member that is attached to the circuit board and holds the ROSA and the TOSA; and a housing that houses the TOSA, the ROSA, the receptacle, the internal fiber, the circuit board, and the holding member. The holding member includes a plurality of guides that guide the internal fiber.

Abstract: An optical module includes a substrate and terminals. The substrate has: a first planar part having first through holes into which the terminals are inserted respectively; a second planar part that opposes the first planar part as a result of the substrate being folded and has second through holes into which the terminals are inserted respectively; at least one first land part that is formed on the first planar part around at least one of the first through holes and that is connected to at least one of the terminals inserted through the first through hole; and at least one second land part that is formed on the second planar part around at least one of the second through holes into which another one of the terminals not being connected to the first land part is inserted and that is connected to the terminal inserted through the second through hole.

Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.

Abstract: An optical fiber including a circuit board, a converter, an optical fiber, an external connecting part, and a pressable part. The circuit board includes first and second faces opposite to each other. The first face has first and second regions being different regions. The second face has third and fourth regions on the opposite side to the first and second regions, respectively. The converter is an opto-electronic or electro-optic converter on the first region of the circuit board. The optical fiber includes a leading end portion optically connected to the converter. A circuit on the first region of the circuit board is electrically connected to the converter. The external connecting part is disposed on the fourth region of the circuit board. The pressable part is fixed to the circuit board and positioned on the second region of the circuit board without contacting the converter, the optical fiber, or the circuit.

Abstract: An optical connector includes a first connector and a second connector configured to be mated to the first connector. The first connector includes a plate having an opening, a substrate stacked on the plate, and an adapter having an opening and connected to the plate. The second connector includes a housing and a ferrule configured to connect to an optical fiber. The ferrule is provided in the housing to project from the housing to have an end of the ferrule exposed outside the housing. The ferrule is inserted in the openings when the first connector and the second connector are mated together.

Abstract: In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.

Abstract: An optical module includes a first optical block and a second optical block. The first optical block includes a base part, two extending parts which extend in a first direction, locking parts, and a first reference surface. The second optical block includes a holding part, two arm parts, spring pieces which extend in the first direction, locked parts which are formed on the spring pieces, and a second reference surface. In a state that the first optical block and the second optical block are assembled with each other, the locking parts are hooked on the locked parts, the second reference surface is pressed against the first reference surface by a spring force of the spring pieces so as to realize positioning in the assembling direction, and an optical path between the base part and the holding part is parallel to the first direction.

Abstract: A connector assembly and heat sink configured to be received by a radio unit are provided. An example connector assembly includes a printed wiring board (PWB) at least partially disposed within the radio unit when in an operational configuration, and the PWB defines an extension at least partially disposed exterior to the radio unit when in the operational configuration. The connector assembly includes one or more optoelectronic components configured to convert between optical signals and electrical signals supported by the PWB, and at least a portion of the one or more optoelectronic components are disposed on the extension of the PWB. The connector assembly also includes a heat sink housing attached to the PWB that encloses the extension of the PWB and optoelectronic components disposed on the extension in order to dissipate heat from the optoelectronic components to an exterior environment of the connector assembly.

Abstract: An apparatus is provided for irradiating at least a portion of a patient's brain with electromagnetic radiation to treat stroke, Parkinson's Disease, Alzheimer's Disease, or depression. The apparatus includes a source of the electromagnetic radiation. The apparatus further includes an output optical element including a rigid and substantially thermally conductive material and a surface configured to be in thermal communication with the patient's body. The apparatus further includes a cooler thermally coupled to the output optical element to remove heat from the output optical element. The apparatus further includes a heat sink thermally coupled to the cooler, wherein the heat sink is positioned so that the electromagnetic radiation from the source propagates through the heat sink and through the output optical element.

Abstract: An optical transceiver that optionally exchanges between the bail and the pull-tab for disengaging the optical transceiver with the cage is disclosed. The optical transceiver provides a slider to be assembled with both of the bail and the pull-tab. The slider provides an opening common to the bail and the pull-tab, and a composite opening that includes a portion for the bail and another portion for the pull-tab. The bail, by rotating around the common opening, may induce forward and rearward motions for the slider, while, the pull-tab, by pulling and pushing, may directly cause the forward and rearward motions for the slider through the composite opening.

Abstract: The present disclosure provides a multi-channel parallel optical transceiver module. The disclosed optical transceiver module/device may include a shell body and a circuit board located in the shell body, and an optical emitter base soldered to a first end of the circuit board. A notch located on the base, for engaging the first end of the circuit board, and the optical emitter base engaged with the first end of the circuit board may be soldered to two sides of the circuit board. The optical emitters may be disposed in parallel on the base, and separated from each other by a block. A lens and a laser may be disposed at a first side of each of the optical emitters that is adjacent to the circuit board, and an optical monitor may be disposed on a second end of the circuit board adjacent to the laser.

Abstract: Translating lens holder assemblies employing bore relief zones, as well as optical connectors employing such lens holder assemblies, are disclosed. In one embodiment, a lens holder assembly includes a lens holder body having a mating face, a first forward slide portion and a first rear slide portion disposed on a first side of the lens holder body, and a second forward slide portion and a second rear slide portion disposed on a second side of the lens holder body. The first forward slide portion is separated from the first rear slide portion by a first bore relief zone, and the second forward slide portion is separated from the second rear slide portion by a second bore relief zone. In one embodiment, the lens holder assembly further includes at least one groove alignment feature disposed in the lens holder body that is configured to support at least one GRIN lens.

Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.

Abstract: A connector assembly includes a cage member having a plurality of walls defining first and second module cavities configured to receive corresponding pluggable modules therein. The module cavities are separated by a separator wall. The connector assembly includes a separator spring plate along the separator wall. The separator spring plate has a base section coplanar with the separator wall along a separator wall plane. The separator spring plate has first separator spring beams extending out of the separator wall plane to a first side of the separator wall plane into the first module cavity to couple to the pluggable module received therein and second separator spring beams extending out of the separator wall plane to a second side of the separator wall plane into the second module cavity to electrically couple to the pluggable module received therein.

Abstract: A guided wave radar fluid level measurement system can measure the level of product in a tank. A pulse of RF energy sent along a waveguide in the tank can be reflected where the waveguide enters the product. A time of flight measurement can indicate the product level. The product inside the tank can flow and that flow can push the waveguide and thereby torque and possibly bend the waveguide. A streamlined wave guide is torqued less when the streamlining is aligned with the direction of flow. A rotating connector can provide for the waveguide to rotate and a weathervane effect can align the streamlined waveguide with the flow.