Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.

Abstract: A connector is mateable with and removable from a mating connector, which has an optical connector, along a mating direction. The connector is provided with a receptacle to be attached to a case and an adapter to be mounted on a circuit board located in the case. The adapter has an inner module to be connected to the optical connector and a cage which accommodates the inner module at least in part. One of the receptacle and the cage is provided with a contact portion which is in contact with a remaining one of the receptacle and the cage. The receptacle and the cage are electrically connected to each other through the contact portion without direct fixation between the receptacle and the cage.

Abstract: A pluggable optical module, including: a pluggable module unit including an optical connector disposed at a front end portion thereof and an electrical connector disposed at a rear bottom portion thereof, wherein the optical connector is configured to be optically coupled to an optical fiber, and wherein the electrical connector is configured to be electrically coupled to an electrical connector disposed on an electrical board. Optionally, the pluggable module unit includes a pluggable module adapter secured to a pluggable module body. The electrical connector is then disposed at a rear bottom portion of the pluggable module adapter.

Abstract: Optical bodies having a total internal reflection surface and a short optical path length along with electronic devices using the optical bodies are disclosed. The optical body comprises at least one optical channel and comprises a total internal reflection (TIR) surface and a lens located on a bottom of the optical body. By way of example, the short optical path length may have the lens of the optical body at a distance of 500 microns or less from a front end of the optical module. In another embodiments, the optical body may include a window adjacent to the front end. Methods for making an optical connector are also disclosed.

Abstract: An optical module includes a case including an optical filter, a receptacle coupled to the case, an optical receiver, and an optical transmitter. The receptacle includes a recess formed along an outer circumferential surface thereof. The recess may be formed by a first side wall and a second side wall which face each other and a bottom surface coupling the first side wall to the second side wall. Further, at least one of the first side wall and the second side wall may include an insulating material.

Abstract: A light detection module includes: a TO base and a TO cap; wherein the TO base is fixedly provided thereon with a first optical sensor, a support frame and a support base; the support frame is fixedly provided thereon with a beam splitter, and the beam splitter and the first optical sensor are at an angle of 45 degrees; an upper surface of the support base is fixedly provided thereon with an optical resonator and a second optical sensor, the optical resonator is located between the beam splitter and the second optical sensor, and the optical resonator, the second optical sensor and the beam splitter are on a straight line parallel to a surface of the TO base; and the TO cap is provided thereon with an opening, and the opening, the first optical sensor and the beam splitter are on a straight line perpendicular to the surface of the TO base.

Abstract: Aspects of the embodiments are directed to an optics module including a top-side inner wall and a bottom-side inner wall. The optics module may include a receiving element for receiving a small form factor pluggable (SFP) device; a heat sink including a first portion, the first portion including a top side and a bottom side, the bottom side of the heat sink in contact with the receiving element; and a first springing element residing between the first portion of the heat sink and the top-side inner wall of the optics module, the first springing element configured to bias the top side of the first portion of the heat sink onto the receiving element. In some embodiments, the optics module also includes a thermal interface material residing between the bottom-side inner wall of the optics module and the second portion of the heat sink, the thermal interface material configured to establish a thermal conduction path between the bottom-side inner wall of the optics module and the heat sink.

Abstract: The second wiring pattern includes extended regions from the main body side to the projecting portions as seen in a direction in which the pair of leads extend, and wiring regions continuously spreading from the extended regions in a direction away from the main body. Supposing that a length of the wiring region from an end of the projecting portion as a reference point to a farthest position in a direction away from the main body is a first width and a width of the extended region in a direction parallel to a side opposed to the main body side through the end of the projecting portion is a second width, the first width is smaller than the second width. The second insulating substrate is sandwiched between the second wiring pattern and a base, and thereby, a capacitance is formed.

Abstract: An optoelectrical connector system can include an optical coupler that is configured to be positioned over a photonic device on the PCB. The optoelectrical connector system can further include a connector housing that is configured to be attached to the optical coupler after the optical coupler is positioned over the photonic device, so that the coupler can be aligned and fixed without the housing attached thereto.

Abstract: A pluggable module includes a pluggable body extending between a front end and a mating end receivable in a module cavity of a receptacle assembly to mate with a communication connector. The pluggable body has a top, a bottom, a first side wall and a second side wall between the top and the bottom and has an upper shell defining the top and a lower shell defining the bottom coupled together at a seam. A seam cover is coupled to the pluggable body at the first side wall covering the seam between the upper shell and the lower shell on the first side wall. The seam cover is conductive and provides EMI shielding at the seam for a communication circuit board held in the pluggable body.

Abstract: A testing pluggable module includes a pluggable body extending between a front end and a mating end defining a mating interface with a communication connector of a receptacle assembly. The mating end is receivable in a module cavity of the receptacle assembly to mate with the communication connector. The pluggable body has an exterior forward of the mating end. The testing pluggable module includes an internal circuit board held in the pluggable body having a testing circuit operating at least one testing function. The testing pluggable module includes a user interface on the exterior of the pluggable body. The user interface has an input configured to operably control the at least one testing function of the testing circuit.

Abstract: A fiber optic connector includes a ferrule configured to receive and support one or more optical fibers and at least one component coupled to a surface of the ferrule by an adhesive. The at least one component overlays a footprint area defined on the surface to which the adhesive is applied, and the surface has a plurality of recessed formations within the footprint area to accommodate the adhesive.

Abstract: An apparatus for combining optical radiation, wherein the apparatus comprises a bundle of input optical fibers formed of glass, a taper, and an output optical fiber, wherein the taper is fused to the output optical fiber; and the apparatus comprises at least one cladding mode stripper to strip out higher order modes that would otherwise degrade a polymer coating on at least one of the input optical fibers and the output optical fiber.

Abstract: An optical fiber connector includes a main body unit having a guiding groove, and two position limiting portions that respectively protrude from two walls respectively defining two sides of the guiding groove toward each other, a sleeve unit, and a coupling unit including two coupling members each having two first protruding block portions that respectively protrude away from each other. The sleeve unit is configured to be movable rearwardly on the main body unit to press the first protruding block portions toward each other, so as to allow the first protruding block portions to pass past the position limiting portions, thereby allowing for movement of each of the coupling members between a non-working position and a working position.

Abstract: A receptacle for transceiver optical sub-assembly is configured for optical elements such as a light-emitting unit, a light guide unit, a light-receiving unit and a filter to connect thereto. The receptacle includes a lower receptacle body having a through bore, to which the light-emitting unit is connected; and an upper receptacle body having an axial receiving bore, to which the light guide unit is connected. The upper and the lower receptacle body are movable relative to each other in the x-y plane. The lower receptacle body can be moved relative to the upper receptacle body until an optical signal emitted from the light-emitting unit is optically coupled and collimated with an optical fiber in the light guide unit, and then the upper and lower receptacle bodies are fixedly connected together.

Abstract: A housing that includes a polymer, a reinforcing material, and a thermally conductive filler. A first housing component is defined by the polymer such that the reinforcing material and a thermally conductive filler are embedded within the polymer. The thermally conductive filler is configured such that heat can be passively conducted through the first housing component. The housing can be configured to be an aircraft gearbox housing.

Abstract: A shielding cage of a connector is disclosed. The shielding cage includes an opening defined by four walls and configured to receive a plug of a mating connector, and a plurality of shielding spring sheets held on the four walls, each shielding spring sheet having an inner spring sheet portion located inside the opening and an outer spring sheet portion located outside the opening.

Abstract: An optical data coding method includes at least steps of selecting a modulation scheme comprising an X-polarization constellation format having first and second amplitude rings with circular grids corresponding to predetermined phase angles and a Y-polarization constellation format having the first and second amplitude rings with the circular grids corresponding to the predetermined phase angles, arranging a first part of the symbol on a first circular grid of the first amplitude ring on the X-polarization constellation format, and arranging a second part of the symbol on a second circular grid of the second amplitude ring on the Y-polarization constellation format.

Abstract: An adapter for a communication transceiver is provided. The adapter includes a main body having a first end and opposed second end. The first end of the main body has an OSFP (octal small form factor pluggable) edge connector arranged for electrical and physical connection to an OSFP host connector in an OSFP host port. The main body has a QSFP (quad small form factor pluggable) host connector arranged to receive a QSFP edge connector of a QSFP transceiver through the second end of the main body so that the adapter adapts the QSFP transceiver to an OSFP host. A method of using a communication adapter is also provided.

Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Abstract: It is made possible to amplify signal light of an optical fiber sensor and to perform measurement in a long distance. At least one of a plurality of core wires in a multicore optical fiber is used as a signal-light propagating core wire 133 and the other is used as a reference-light propagating core wire 134. Also, homodyne detection of signal light and reference light reflected by an FBG sensor unit 132 arranged in each measurement point is performed. Thus, signal light is amplified. In order to make a difference between optical path lengths of the signal light and the reference light equal to or smaller than a coherence length, an optical path-length adjustment unit including a piezoelectric element or the like is arranged in an optical path of the reference light.

Abstract: A bi-directional optical module that provides an Rx unit and a Tx unit, where optical axes are perpendicular to each other, is disclosed. The optical module provides a housing that installs a WDM filter therein and assembles the coupling unit in a surface through the front alignment unit, the Tx unit in another surface opposite to the former surface, and the Rx unit in still another surface connecting the former two surfaces through the rear alignment unit. The axes of the Tx unit and the coupling unit are in parallel to each other, but the axis of the Rx unit is in perpendicular to the former two axes. The Rx unit installs a photodiode (PD) with an optically sensitive surface leveled with the surface of the rear alignment unit to which the Rx unit is attached.

Abstract: An exemplary optical connector assembly may include a substrate of an optical printed circuit board (OPCB) with at least one optical device thereon, the substrate including one or more recesses, an optical connector with one or more alignment members for coupling an end of an optical waveguide to the optical device, and one or more inserts, each having an orifice for receiving one of the one or more alignment members and each arranged to be received in one of the one or more recesses. When assembled, the one or more inserts may be received in the one or more recesses and the one or more alignment members may be received in the orifices of the one or more inserts thereby coupling the optical waveguide to the substrate to form the exemplary optical connector assembly.

Abstract: Gradient index (GRIN) lens holders employing groove alignment feature(s) and total internal reflection (TIR) surface, and related components, connectors, and methods are disclosed. In one embodiment, the GRIN lens holder contains one or more internal groove alignment features configured to secure one or more GRIN lenses in the GRIN lens holder. The groove alignment features are also configured to accurately align the end faces of the GRIN lenses. The GRIN lens holders disclosed herein can be provided as part of an optical fiber ferrule and/or a fiber optic component or connector for making optical connections. A fiber optic connector containing the GRIN lens holders disclosed herein may be optically connected to one or more optical fibers in another fiber optic connector or to an optical device, such as a laser-emitting diode (LED), laser diode, or opto-electronic device for light transfer.

Abstract: Methods and systems for optical power monitoring of a light source assembly coupled to a silicon photonically-enabled integrated circuit (chip) are disclosed and may include, in a system comprising an optical source assembly coupled to the chip: emitting a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser, directing the primary beam to an optical coupler in the chip, directing the secondary beam to a surface-illuminated photodiode in the chip, and monitoring an output power of the laser utilizing an output signal from the photodiode. The primary beam may comprise an optical source for a photonics transceiver in the chip. The focused primary beam and the secondary beam may be directed to the chip using reflectors in a lid of the optical source assembly.

Abstract: An optical connector includes a lens block mounted in a MPO housing and optically coupled between an optical light guide and an external coupling light guide. A first lens formed on a first surface of the lens block to totally reflect and collimate light emitting from the optical light guide to a second surface. The second surface is coated with a partial transmission coating on a transmitter side and a total reflective coating on a receiver side. A second lens formed on a third or fourth surface on the lens block for focusing light from the second surface onto the external coupling light guide.

Abstract: An optical source that implements a wavelength tunable laser diode (t-LD) and a Mach-Zehnder (MZ) modulator within a single package is disclosed. The optical source, which outputs a modulated signal beam and a local beam of a continuous wave (CW), accompanies a control circuit mounted on several circuit boards. Only one of the circuit boards is rigidly mounted on the housing of the optical source. Rest of the circuit boards is moderately fixed to the housing through the rigidly fixed circuit board to suppress stresses caused in the housing and the circuit boards when the optical source is rigidly installed in the host system.

Abstract: Provided is a bending type optical module, which includes a substrate and one or more optical devices disposed on the substrate. An integrated circuit (IC) device is disposed on the substrate for driving the one or more optical devices. One or more optical fibers are in optical communications with the one or more optical devices. An optical bench is attached to the substrate and has a first curved surface on a top surface thereof. A cover block is attached to the optical bench and has second curved surface on a bottom surface thereof. The one or more optical fibers extend curved between the first curved surface of the optical bench and the second curved surface of the cover block.

Abstract: Pluggable connector includes a connector housing having a unitary housing shell that includes a top wall, a bottom wall that is spaced apart from the top wall, and a side wall that extends between and joins the top and bottom walls. The pluggable connector also includes a communication assembly positioned within an interior cavity of the pluggable connector. The communication assembly includes internal electronics that generate thermal energy during operation. The top wall has an exterior surface that forms an output area configured to dissipate the thermal energy therefrom. The bottom wall has an interior surface that is coupled to the internal electronics such that the thermal energy is conveyed from the internal electronics into the bottom wall. The unitary housing shell forms a seamless thermal-transfer path that extends from the bottom wall, through the side wall, and to the output area.

Abstract: A light-beam therapeutic apparatus for ensuring patient safety. The light-beam therapeutic apparatus includes an apparatus body portion having a light source; a light guide rod that guides light from the light source, a connecting socket, a cooling fan, an electronic component that performs control required for a therapy, and a control display panel that displays contents of the therapy; a therapeutic portion including a light guide portion including a plurality of bundled optical fibers, and a pad portion formed of the optical fibers spread out adjacently to one another into a flat-panel shape. The therapeutic portion is formed into a light-receiving plug that is insertable into a connecting socket of the apparatus body portion. The light-receiving plug is configured to be kept in a coupled state by an attracting action of a permanent magnet provided on a side of the connecting socket.

Abstract: A connector assembly includes a cage member for EMI containment for a pluggable module having a cage sleeve defining a chamber, a base coupled to the cage sleeve, and a cage liner received in the chamber. The cage liner defines a module cavity configured to receive a pluggable module. The cage sleeve extends between a front end and a rear end and includes a plurality of cage walls defining the chamber and surrounding a communication connector at or near the rear end. The cage liner is electrically connected to the cage sleeve and surrounds a mating perimeter of the pluggable module. The cage liner extends a majority of a length of the pluggable module within the chamber to provide EMI shielding for the pluggable module. The cage liner provides an electrical path between the pluggable module and the cage sleeve.

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

Abstract: A connector assembly includes a cage member having walls defining a module cavity receiving a pluggable module. The walls extend rearward from a front end to a rear end and surround a communication connector at or near the rear end. An EMI skirt is provided at or near the mating interface between the pluggable module and the communication connector. The EMI skirt includes plural spring beams configured to surround a mating perimeter of the pluggable module forward of a mating end of the pluggable module configured to be mated with the communication connector. The spring beams are deflectable and are elastically deformed against the mating perimeter when the pluggable module is mated with the communication connector. The spring beams have mating interfaces configured to engage and electrically connect to the pluggable module.

Abstract: An embodiment of the present invention relates to an optoelectronic device comprising an optoelectronic component, a waveguide having an optical waveguide section and an electrical conductor section, the optical waveguide section being transparent for radiation of a given wavelength or a given wavelength range and capable of guiding the radiation along the longitudinal axis of the waveguide, wherein the optical waveguide section is optically butt-coupled to an optical surface section of the optoelectronic component, and wherein the electrical conductor section is mechanically butt-coupled to an electrical contact of the optoelectronic component.

Abstract: A connector is disclosed. The connector includes a conductive housing having a port and a peripheral wall surrounding the port, a conductive elastic sheet riveted on the peripheral wall of the port of the housing by a plurality of rivets, and a plurality of contact spots formed on at least one of the housing and the elastic sheet. The housing and elastic sheets are electrically connected by the plurality of contact spots when the elastic sheet is riveted on the housing.

Abstract: Described are embodiments of apparatuses and systems of an active optical cable assembly including a connector plug configured to resist stress to optical fibers of the cable assembly. The connector plug may include a light engine mounted on a substrate, a jumper mounted on the substrate and configured to convey optical signals between an optical fiber and the light engine, and a fiber holder assembly configured to constrain motion of the optical fiber, the fiber holder assembly including a fiber holder on a first side of the substrate and a fiber holder cover on a second side of the substrate such that the optical fiber is fixedly held between the fiber holder and the fiber holder cover. Other embodiments may be described and/or claimed.

Abstract: A pluggable optical transceiver module for inserted into plugging slot includes main body and sliding component. The main body has opposite two side surfaces and two sliding slots. The two sliding slots are located at the two side surfaces. The sliding component includes linkage arm and two extending arms. The two extending arms are connected to the linkage arm. Each extending arm has a second fastening part. The main body is between the two extending arms. The two extending arms are disposed on the two sliding slots to have fastening position and releasing position. Two first fastening parts are fastened to the two second fastening parts when the two extending arms are located at fastening position. The two second fastening parts press the two first fastening parts, respectively, for the two first fastening parts being farther from each other when the two extending arms are located at releasing position.

Abstract: A track system comprises a track having a first end, a second end, and defining one or more first channels extending from the first to the second end of the track for accommodating one or more optical fibers therein. The track is attachable to a support and defines a first plane. The track system also comprises a ramp having a first end, a second end, and defining one or more second channels extending from the first end of the ramp to the second end of the ramp for accommodating the one or more optical fibers therein. The ramp is attachable to the support such that the first end of the ramp is adjacent to the second end of the track, the one or more first channels is aligned with the one or more second channels, and the second end of the ramp extends in a second plane.

Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.

Abstract: An optoelectronic component includes a housing including a base having an upper side and a lower side, and a cap, and a laser chip arranged between the upper side of the base and the cap, wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base, the laser chip includes a second electrical contact pad, and the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.

Abstract: A light receptacle comprises: a column-shaped fiber stub; a cylindrical holder made of an insulating material, the holder being in contact with whole circumference of an outer peripheral surface at one end of the fiber stub and holding the fiber stub; a sleeve being in contact with whole circumference of the outer peripheral surface at the other end of the fiber stub; a first metal case being in contact with whole circumference of an outer peripheral surface of a part of the holder and surrounding the part of the holder and the sleeve; and a second metal case being in contact with whole circumference of an outer peripheral surface of a remaining portion of the holder located outside of the first metal case, leaving a space between the first metal case and the second metal case.

Abstract: A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.

Abstract: An optical transceiver module is provided with a delatching mechanism that allows module mounting density to be increased while also providing an ergonomic solution that allows the modules to be easily delatched and extracted from their cages. The delatching mechanism is configured to perform early disengagement of the module housing from the cage by delatching the module housing from the cage after the bail has been rotated to an angle that is less than 90°. Because delatching occurs when the bail has been rotated to a delatching angle that is less than 90°, the modules can be more densely stored with less space between modules that are mounted one above the other than with existing solutions.

Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Abstract: Embodiments include an electronic module having a chassis, a locking member rotatably connected to the chassis, and a bus bar system comprising a plurality of bus bars. The electronic module includes a plurality of power plug connectors configured such that each of the plurality of bus bars is connected to at least one power plug connector, wherein each of the power plug connectors is configured to receive at least a portion of a system bus thereby establishing an electrical connection between each of the plurality of bus bars and the system bus. The locking member is configured to connect the electronic module to the system bus such that the plurality of power plug connectors establish an electrical connection between the bus bar system and the system bus and wherein the locking member is configured to lock to the chassis once the electrical connection has been established.

Abstract: A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

Abstract: One embodiment of the present invention provides a switch. The switch includes a printed circuit board (PCB), a number of multi-channel optical transceivers mounted on the PCB, and a number of switch ports accessible from a front panel of the switch. The switch ports include a number of electrical interfaces that are electrically coupled to a switch chip mounted on the PCB, and a number of optical interfaces that are coupled to the switch chip via the multi-channel optical transceivers.

Abstract: Disclosed is a photoelectric wiring module which includes: a substrate; a frame mounted on the substrate; an optical device package configured to perform photoelectric conversion or electro-optic conversion of a signal; an optical control device configured to control an operation of the optical device package; and an optical transmission line configured to transmit an optical signal that is emitted from the optical device package or incident on the optical device package. Electrical terminals are disposed on the frame, the optical device package is mounted on the frame, and the optical control device is disposed within the frame and mounted on the substrate.

Abstract: Systems and methods are described for creating a very cost effective optical/electrical interface connecting system with high tolerance to misalignment. Low cost sealed optical devices can be fabricated with easily detachable top cable assemblies. This approach can be used for hermetically sealed optical devices without the need for hermetic fiber feed-through. The system also has features that enable fiber optic components to operate and survive in harsh environments, particularly in large temperature extremes.