Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.

Abstract: Provided is an optical coupling structure including an optical semiconductor element including a light receiving/emitting portion, an optical transmission path having an optical axis that intersects the optical axis of the optical semiconductor element at a predetermined angle, and an optical coupling portion configured to convert the optical path between the optical semiconductor element and the optical transmission path and optically couple them. The optical coupling portion is made of a resin that is transparent with respect to a transmitted light, the resin adhering to both at least a portion of the light receiving/emitting portion and at least a portion of the end portion of the optical transmission path, and the optical semiconductor element and the optical transmission path are bonded to each other with the resin itself that constitutes the optical coupling portion.

Abstract: An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror.

Abstract: An active optical cable has a connector containing an electrical-to-optical and optical-to-electrical (EO/OE) conversion processing chip. The EO/OE conversion processing chip has a TXin+ pin and a TXin? pin to be coupled to a TX+ terminal and a TX? terminal of an USB connector of an apparatus. The pair of pins TXin+ and TXin?, for a differential transmission signal, are provided base on a common mode impedance structure, to charge capacitors carried by the TX+ and TX? terminals and, according to the charging status of the capacitors, it is determined whether the active optical cable is connected to the apparatus.

Abstract: An optical-electrical connector assembly comprises a housing, a printed circuit board received in the housing and including a number of converting elements, a lens member, a ferrule aligned with the lens member and having a resisting portion, an integrated securing member, a coiled spring received in the securing member, and an optical cable having a number of optical fibers. The ferrule has a first engaging portion and a second engaging portion engaged with the housing. The coiled spring is compressed between the resisting portion and the first engaging portion.

Abstract: An optical fiber assembly includes an optical fiber connector, and an optical fiber adapter mating with the optical fiber connector. The optical fiber connector includes a fiber joining assembly, a first sealing member, an elastic member, and a housing assembly sleeved on the fiber joining assembly. The elastic member is slidably sleeved in the housing assembly with two ends of the elastic member resisting with the housing assembly. The optical fiber adapter includes a base board, a fixing seat protruding out from the base board, and a second sealing member sleeved on the outer surface of the fixing seat. The optical fiber adapter further includes two latching arms protruding out from the base board positioned at opposite sides of the fixing seat. The fixing seat axially defines an assembling groove for receiving the fiber joining assembly of the optical fiber connector.

Abstract: Provided is a compact optical communication module which is configured and structured so as to be suitable for high-speed transmission and which facilitates the fixing and positioning of optical elements and prevents misalignment of the optical axis during temperature change. An optical communication module is constituted so as to have a transceiver circuit as the circuit substrate, a submount unit, a fiber stub as an optical connector member, and an optical fiber coupling member. The optical communication module is configured as a modular component in which the optical axis of an optical element mounted on the submount unit is roughly parallel to the mounting surface of the transceiver circuit.

Abstract: A laser light source module includes a plurality of laser light sources, a synthesizing element, a light receiving element, a case unit and a sealing unit. The synthesizing element overlaps laser beams outputted from the laser light sources. The light receiving element detects the intensities of the laser beams outputted from the laser light sources. The case unit houses the laser light sources and the synthesizing element. The sealing unit seals the case unit. The light receiving element is attached to the sealing unit.

Abstract: An optical data communication module, such as a transceiver, transmitter or receiver, has two parallel substrates with metal layers. An opto-electronic device between the substrates is shielded against electromagnetic interference by the metal layers and conductors, such as vias, which are distributed around a periphery of the opto-electronic device and connect the metal layers.

Abstract: A method of the present invention is a method for manufacturing an optical module (10) including an optical fiber (3) and an optical fiber insertion pipe (2) into which the optical fiber (3) is inserted, and includes a sealing step in which the optical fiber insertion pipe (2) is hermetically sealed. The sealing step includes a contact step, a heating step, and a feeding step. In the contact step, a heat conductor member (5) is provided along and in contact with a side surface of the optical fiber insertion pipe (2), the heat conductor member having a heat conductivity greater than that of an environmental atmosphere of the sealing step and having a heat generating property of generating heat by induction heating, which heat generating property of the heat conductor member is inferior to that of the optical fiber insertion pipe (2) in terms of heat generation amount. In the heating step, the optical fiber insertion pipe (2) thus provided with the heat conductor member (5) is heated by induction heating.

Abstract: A hermetically sealed media converter apparatus configured to operate in harsh high-pressure differential environments, such as deep marine environments, and oil and gas. A hermetically sealed media converter apparatus is provided having a vessel forming an inner chamber that is hermitically sealed from surrounding ambient environment outside the vessel. Media conversion circuitry is contained within the inner chamber. At least one hermetic electrical feedthrough is mounted on the vessel enabling a transmit wire and a receive wire to pass therethrough and connect to the media conversion circuitry, while maintaining the hermetic seal of the inner chamber of the vessel from the surrounding ambient environment. Similarly, a hermetic optical feedthrough also is mounted on the vessel enabling an optical fiber to pass therethrough and connect to the media conversion circuitry, while maintaining the hermetic seal of the inner chamber of the vessel from the surrounding ambient environment.

Abstract: An optical module includes a housing, an actuator and a fiber clamp having at least one spring member. The actuator and housing are moveable in a sliding manner relative to one another such that the actuator can assume a first actuator position or a second actuator position relative to the housing. The spring member has a first portion in sliding contact with a ramped surface of the actuator and a second portion movable between a first clamp position and a second clamp position in response to sliding movement of the actuator between the first actuator position and second actuator position, respectively. Movement of the second portion of the spring member to the second clamp position reduces a dimension of a fiber passage in the module to frictionally engage an optical fiber in the fiber passage.

Abstract: In one exemplary embodiment, an optical coupler of a fiber optic system can include a light-source input cavity packaged in an outer casing. The cavity can receive an optical signal from a light source. An optical collimator packaged in the outer casing such that a receiving end of the optical collimator can receive the light source from the light-source input cavity. The optical collimator can include at least one beam forming stage. The optical collimator can generate a collimated beam output from the optical signal. An optical cavity can receive the collimated beam output of the optical collimator. The optical cavity can be coaxially included in a receiving optical fiber coupled with the outer casing coupled with optical cavity. The optical cavity can receive the collimated beam output of the optical collimator and input the collimated beam into the receiving optical fiber.

Abstract: An optical connector includes a substrate, a photoelectric element and a positioning element on the substrate, a lens element, and an optical fiber. The positioning element defines a through hole, in which the photoelectric element is received to allow visual inspection for determining if the photoelectric element is positioned to a designated position in relation to the positioning element, and includes a positioning structure. The lens element includes an incident surface, an emitting surface, a reflecting surface, a locating structure and a first lens formed in the incident surface, and a second lens formed on the emitting surface and optically aligned with the first lens via the reflecting surface. The lens element is precisely positioned on the positioning element by matching the locating structure with the positioning structure, to align the first lens with the photo electric element. The optical fiber is aligned with the second lens.

Abstract: An optical connecting structure has an optical fiber, a pressing member having a circular outer cross section, and an optical member, wherein the optical member has an optical element, an optical fiber stopper structure, and an optical fiber holding groove, wherein the optical fiber stopper structure is positioned between the optical element and the optical fiber holding groove, wherein the optical fiber is inserted along the optical fiber holding groove so as to contact with the optical fiber stopper structure, and wherein the pressing member is arranged on the optical fiber holding groove mutually perpendicular, the pressing member presses the upper surface of the optical fiber to a direction of a bottom of the optical fiber holding groove, and the optical fiber and the optical element are thereby optically connected.

Abstract: An optical communication module according to the present invention includes an optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function, a first resin member which covers the optical semiconductor element and is made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region, and a second resin member which covers the first resin member. A portion of the first resin member is exposed from the second resin member. The optical communication module further includes an attachment hole for attaching an optical fiber. The attachment hole includes an opening that opens at the portion of the first resin member which is exposed from the second resin member.

Abstract: An optical module has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of the optical transmission path or a light incidence surface of the optical transmission path is arranged such that the optical element and the optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of the optical element. The optical element is sealed by a sealing agent. A gap is provided between the optical transmission path and the surface of the sealing agent on the light receiving surface or the light emitting surface of the optical element.

Abstract: A protect cap for an optical fiber adapter according to the present disclosure is provided. The protect cap includes a casing defining a passage for receiving the optical fiber adapter, a pair of supporting lugs formed on the casing, a covering lid, and a pair of supporting arms extending from the covering lid. Each of the supporting lugs defines a shaft hole. Each of the supporting arms is provided with a shaft, wherein the shafts are positioned in the shaft holes, respectively such that the covering lid is pivotally connected to the casing. A first protrusion is formed on one of the shafts and a second protrusion is formed on an inner surface of one of the shaft holes. When the shafts are rotated to bring the first protrusion into contact with the second protrusion, the covering lid is kept in an open position with respect to the casing.

Abstract: A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.

Abstract: A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.

Abstract: An avionic system for an aircraft including at least two pieces of equipment which can exchange information by means of at least one electrical bus for simultaneous bidirectional communication, in which the information can be exchanged between pieces of equipment via an optical bus that can be connected to the electrical interfaces of the equipment. The optical bus of the avionic system includes at least one optical cable having at least one optical fiber and, at each end, a connector having means for converting electrical signals into optical signals and means for converting optical signals into electrical signals. The optical bus is connected to the electrical outlets of existing equipment.

Abstract: An opto-electronic device assembly adapted for mounted on a mother board includes a case and opto-electronic devices. The case has multiple cavities opening forwards and downwards. Each opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface and an electrical transmission interface with electrical pads. The electrical socket has a plurality of terminals with one ends contacting with PCB and another opposite ends contacting with the electrical pads. Each electrical transmission interface is removeably assembled in the electrical sockets to complete electrical connection between the substrate and the mother board. The opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case.

Abstract: An optical transceiver with an enhanced productivity is disclosed. The optical transceiver of the invention includes a plurality of OSAs, an optical component of an optical multiplexer or an optical de-multiplexer, and inner fibers connecting the OSAs with the optical component. The optical transceiver further includes a gasket to shield the inside of the housing and put the inner fibers therein to guide them.

Abstract: A semiconductor device of the present invention includes: a circuit substrate; an optical semiconductor element provided on the circuit substrate; and a sealing resin provided on the circuit substrate, with which the optical semiconductor element is sealed, the sealing resin having a cuboid shape or a cubic shape, the sealing resin having an outer shape having at least one cutout part, in a case where a single cutout part is formed, the cutout part being provided in an area other than a center area of a top surface of the sealing resin, in a case where a plurality of cutout parts are provided, the cutout parts are formed so as not to be symmetric with respect to the central point on the top surface. With this arrangement, it is possible to provide a semiconductor device which can secure prevention of a sealing resin from being, in an erroneous direction, fitted into a connector.

Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

Abstract: According to the electronic apparatus and cellular phone of the present invention, in an optical waveguide forming body of a flexible cable, an air layer is provided in a deforming section which experiences bending deformation as a result of the movement of a second body relative to a first body (either a pivoting or sliding movement), and the position of this air layer becomes located on the outer circumferential side of a core when the deforming section undergoes bending deformation. As a result of this, it is possible to ensure sufficient flexibility and to also achieve a sufficient improvement in the folding endurance of the core portion for this optical waveguide forming body to be utilized in practical applications. Moreover, it is possible to suppress light loss and achieve high-speed, large-capacity transmissions even when the optical waveguide forming body of a flexible cable experiences bending deformation due to the relative movement of the second body relative to the first body.

Abstract: An optocoupler having an optical transmitter die, an optical receiver die, a light guide, a limiting element and a body is disclosed. The light guide is confined to upper portion of the body by using the limiting element. In one embodiment, the limiting element is a dielectric tape. In yet another embodiment, the limiting element is a pre-molded plastic attached to the lead frame via non-conductive epoxy. The use of the limiting element yields light guides having consistent shape.

Abstract: Methods and systems are provided for a dry silicone gel. The dry silicone gel comprises a base polymer having a vinyl-silicone group and a crosslinker having thiol groups. The dry silicone gel may be made without the use of a catalyst by reacting the base polymer and crosslinker in the presence of a photo or thermal initiator. In some embodiments, the gel also comprises a chain extender having thiol groups. In certain embodiments, the dry silicone gel may comprise: (1) a hardness between 100 g and 300 g, (2) a stress relaxation between 30% and 60% when subjected to a deformation of 50% of the original size of the gel, (3) a compression set between 4% and 20% after 50% strain has been applied to the gel for 1000 hours at 70° C., and/or (4) less than 10% oil bleed out under compression of 1.2 atm after 60 days at 60° C.

Abstract: An optocoupler with a light guide defining element is presented. The light guide defining element has at least one cavity configured to define the shape of the light guide formed by a transparent encapsulant encapsulating the optical transmitter and receiver dies. The transparent encapsulant in liquid form may be injected into the cavity prior to a curing process to harden the encapsulant into a light guide with a predetermined shape. The cavity of the light guide element may be defined by a reflective surface having micro-optics formed thereon. A multichannel optocoupler with multiple transmitter and/or receiver dies having such light guide defining element is also presented. The light guide defining element may have a single cavity enveloping all the optical transmitter or receiver dies, or a multiple cavities by having a pair of transmitter and receiver dies inside each cavity.

Abstract: Methods and apparatuses are provided for performing electromagnetic interference (EMI) containment in a parallel optical communications system. The apparatus includes a curved surface formed in the system housing near the opening through which a stack of ribbon cables passes, and a spring device. The stack of ribbon cables is sandwiched in between the curved surface of the housing and the spring device. The spring device exerts a force on the stack of ribbon cables that presses the stack against the curved surface of the housing and forms a sharp bend in the stack just before the stack passes through the opening in the housing. Because EMI radiation is restricted to propagation along the sharply bent pathway of the stack of ribbon cables, most or all of the EMI radiation traveling along that pathway is either attenuated or reflected before it reaches the opening.

Abstract: Embodiments are directed to laser emitter modules and methods and devices for making the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are convenient and cost effective to assemble and provide for active alignment of optical elements of the module.

Abstract: A photoelectric conversion module includes: a plurality of optical connectors each connectable to an optical communication path; an electrical connector connectable to an electrical communication path; a circuit board equipped with a light receiving and emitting element, the light receiving and emitting element converting an optical signal received by the optical connector into an electrical signal to be transmitted to the electrical connector and converting an electrical signal received by the electrical connector into an optical signal to be transmitted to the optical connector; and a waveguide optically connecting the optical connector and the electrical connector.

Abstract: Methods and apparatuses are provided for performing electromagnetic interference (EMI) containment in a parallel optical communications system. The apparatus includes a curved surface formed in the system housing near the opening through which a stack of ribbon cables passes, and a spring device. The stack of ribbon cables is sandwiched in between the curved surface of the housing and the spring device. The spring device exerts a force on the stack of ribbon cables that presses the stack against the curved surface of the housing and forms a sharp bend in the stack just before the stack passes through the opening in the housing. Because EMI radiation is restricted to propagation along the sharply bent pathway of the stack of ribbon cables, most or all of the EMI radiation traveling along that pathway is either attenuated or reflected before it reaches the opening.

Abstract: An optical connector defining a receiving space for receiving a corresponding plug includes an insulative housing, an optical module mounted to the insulative housing, and a protecting mechanism assembled into the receiving space. The insulative housing has a front surface at a rear side of the receiving space. The optical module has a light receiving element located behind the front surface and forwardly exposed to the receiving space. The protecting mechanism has a door lying in a vertical plane in front of the front surface to shield the light receiving element along an insertion direction when the plug is not inserted into the receiving space, and moving downwardly out of the receiving space to unveil said light receiving element in said insertion direction when the plug is inserted into the receiving space.

Abstract: An optical module includes a housing, an actuator and a fiber clamp having at least one spring member. The actuator and housing are moveable in a sliding manner relative to one another such that the actuator can assume a first actuator position or a second actuator position relative to the housing. The spring member has a first portion in sliding contact with a ramped surface of the actuator and a second portion movable between a first clamp position and a second clamp position in response to sliding movement of the actuator between the first actuator position and second actuator position, respectively. Movement of the second portion of the spring member to the second clamp position reduces a dimension of a fiber passage in the module to frictionally engage an optical fiber in the fiber passage.

Abstract: A fiber optic and electrical connection system includes a fiber optic cable, a ruggedized fiber optic connector, a ruggedized fiber optic adapter, and a fiber optic enclosure. The cable includes one or more electrically conducting strength members. The connector, the adapter, and the enclosure each have one or more electrical conductors. The cable is terminated by the connector with the conductors of the connector in electrical communication with the strength members. The conductors of the connector electrically contact the conductors of the adapter when the connector and the adapter are mechanically connected. And, the conductors of the adapter electrically contact the conductors of the enclosure when the adapter is mounted on the enclosure.

Abstract: An optical subassembly is disclosed, in which an optical device is assembled with an optical receptacle using an anchor effect for the ultraviolet curable resin. The optical receptacle includes a sleeve portion that receives an external optical fiber and a sheath portion that receives the optical device. A bore formed in the sheath portion circumferentially provides a plurality of ribs; while the pillar portion of the optical device that encloses a semiconductor optical device provides a plurality of hollows in positions corresponding to the ribs. The rib shows the anchor effect for the resin filled within the hollow.

Abstract: An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.

Abstract: A heat transferring mechanism of an optical transceiver is disclosed. The optical transceiver includes a metal cover, a OSA that generate heat, and a heat conductor. The OSA has the heat transferring surface extending to a direction intersecting, or substantially in perpendicular, to the longitudinal direction of the optical transceiver. The heat conductor, which is formed only by cutting and bending of metal plate, includes a contact plate and the transfer plate in thermally contact to a heat transferring surface of the OSA and an inner surface of the metal cover to form an effective heat transferring path from the OSA to the cover.

Abstract: Certain embodiments of the invention may include apparatuses, systems, and methods for providing a connector cover for outside plant application. According to an example embodiment of the invention, a connector cover assembly is provided. The assembly can include an elongated hollow cylindrical cover having a closed first end, and open second end. The assembly includes a plug comprising an elastomeric material and having a plug first end, a plug second end, a bore extending through the plug from the plug first end to the plug second end, and a cover mating surface adjacent to the plug first end. The cover mating surface is operable to slidingly engage the cover, and the plug is operable to surround and slidingly engage optical fiber cordage extending through the bore.

Abstract: A waterproof optical fibre connector includes a flange and a terminal connector. The terminal connector includes an outer casing, an inner casing, an optical fibre and a connecting component coupled with the fibre. The inner casing is tubular for housing the fibre and the connecting component. The outer casing is tubular for housing the inner casing. The inner casing includes a body and a waterproof clip connected to a back end of the body. The fibre passes through the clip. The tail of the inner wall of the outer casing tapers from the front to the back, pressing the clip inwards such that the clip and the fibre are fixed together. At least one first protrusion is provided on the inner surface of the front end of the sleeve of the flange, and the front end of the body of the inner casing bears against the first protrusion.

Abstract: A parallel optical communications module is equipped with an EMI waveguide (WG) device having a tube-like structure that surrounds portions of one or more optical fiber ribbon cables that pass through the tube-like structure and connect to the module. The EMI WG device attenuates EMI to acceptable levels to provide the module with effective EMI shielding capability.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: An adapter cassette including a housing and an adapter plate that mounts to a front opening of the housing by a snap-fit connection. The adapter cassette also including a cover that mounts to the housing by a snap-fit connection to enclose cable terminations within an interior of the housing. The adapter plate of the adapter cassette can further be mounted directly to a telecommunications panel without the housing for use in applications having non-enclosed cable terminations.

Abstract: An optical connector and lens block connecting structure includes a substrate, an optical element, a lens frame including two side ribs, and a fore rib, a lens block for bending the optical path of the optical element to convert into an optical path parallel to the substrate, an optical connector provided at a fore end of an optical fiber cable, an optical connector frame including two side ribs and a rear rib, and an elastic member interposed between the rear rib of the optical connector frame and the optical connector. The optical connector frame is fixed to the substrate such that the optical connector is mounted to the lens block while the rear rib of the optical connector frame allows the elastic member to press the optical connector toward the lens block.

Abstract: A device other than a projectile including: a casing, at least a portion of which contains a potting material acting as the optical waveguide material; a transmitter for transmitting a pulse based signal at least partially through the potting material; and a receiver for receiving the pulse based signal after one or more reflections of the pulse based signal from interior surfaces of the casing; the pulse based signal having a pulse rate configured such that a subsequent pulse doesn't interfere with reflections from an immediately previous pulse.

Abstract: In a wavelength monitor that monitors a wavelength of laser light emitted from at least two semiconductor lasers formed in parallel on a semiconductor substrate, the wavelength monitor includes a collimating lens that collimates laser light from each of the semiconductor lasers, an etalon that is arranged so that laser light collimated by the collimating lens is capable of entering and has a periodicity, and a photodetector that receives laser light transmitted through the etalon and detects a light intensity, wherein a beam propagation angle in the etalon of laser light emitted from each of the semiconductor lasers becomes a predetermined angle obtained by formula 1.

Abstract: An optical connector defining a receiving space for receiving a corresponding plug includes an insulative housing, an optical module mounted to the insulative housing, a rotary door retained at a rear side of the receiving space and a slider engaging with the door. The optical module has a light receiving element forwardly exposed to the receiving space and shielded by the door. The slide can drive the door moving along an inserting direction, and rotating along an anticlockwise direction at the same time to make the light receiving element of the optical module be exposed to the receiving space when the plug is inserted into the receiving space and pushes the slider backwardly.

Abstract: A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.

Abstract: An assembly includes an optical device including an optical component and a plurality of supporting electrical components, a housing that is configured to house the optical component, a cap that is configured to substantially enclose the optical component in the housing, and a mounting member that is configured to removably electrically and mechanically connect the optical component to a printed board. In some examples, the housing does not house any electrical components of the optical device. The housing is physically separate from the mounting member and is configured to removably mechanically connect to the mounting member. The housing and mounting member define an electrically conductive pathway from the optical component to the printed board. When the cap is mechanically disconnected from the housing, the optical component may be exposed. The cap may also be configured to mechanically and optically connect an optical fiber assembly to the optical component.