Abstract: Multi-station process chamber lids comprising a plurality of station openings are described. A station separation purge channel is around the station openings. A plurality of angular purge channels separate station openings from adjacent station openings. A lid support beam can compensate for deflection of the chamber lid body.

Abstract: In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.

Abstract: A load port includes a first pin projecting on a dock plate and provided on the dock plate so as to be pushed down, and a first detection unit provided on the base portion and configured to detect that the dock plate is located at a first position. The first detection unit includes a movable member capable of displacing in a moving direction of the dock plate, and a first sensor configured to detect the displacement of the movable member. The movable member is arranged at a position to abut against the first pin that is in a pushed down state in a process in which the dock plate moves from a second position to the first position.

Abstract: A wafer manipulator includes a first arm connected to a base, a second arm connected to the base, a first pad connected to the first arm, a second pad connected to the second arm, a light transmitter connected to the wafer manipulator, and a light sensor connected to the wafer manipulator. The light sensor is configured to receive light transmitted from the light transmitter when the wafer is not properly in contact with the wafer. The light sensor is configured to not receive light transmitted from the light transmitter when the wafer is properly in contact with the wafer manipulator. The first pad has a horizontal friction and a vertical friction. The horizontal friction is at least ten times greater than the vertical friction. Multiple pads can be attached to the first arm and multiple pads can be attached to the second arm.

Abstract: A substrate treating apparatus includes an indexer, a first processing section, a first transport mechanism, a second processing section, a second transport mechanism, a first mount table, a second mount table, and a controller. The first transport mechanism repeatedly performs a first cycle operation composed of three access operations (specifically, a first access operation, a second access operation, and a third access operation). The second transport mechanism repeatedly performs a second cycle operation composed of three access operations (specifically, a fourth access operation, a fifth access operation, and a sixth access operation).

Abstract: An automated biological or chemical sample processing system includes a dock frame and at least one dock frame module. The dock frame includes at least one docking interface that operably couples and interfaces the dock frame with laboratory equipment. The dock frame defines a spine structure of the system alongside which a variable number of laboratory equipment are arrayed. The dock frame extends longitudinally and has a variable elongated configuration and longitudinal length. The at least one dock frame module includes the docking interface, where each module is interchangeable with another module, and has control features with a predetermined relationship to a reference datum of the dock frame module and with a reference datum of the dock frame so that the at least one dock frame module is interchangeably coupled in linear configuration with at least the other dock frame module to select the variable elongated configuration and longitudinal length.

Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.

Abstract: A transportation preparation operation for transporting a semiconductor wafer from a treatment chamber is started before a temperature of the semiconductor wafer decreases to a transportable temperature. A gate valve is closed after a treatment on the semiconductor wafer is started, and an operation of transporting the semiconductor wafer into the treatment chamber is completed. A period of time for treating the semiconductor wafer and a period of time for transporting the semiconductor wafer in and out are overlapped with each other, thus a time required for transporting the semiconductor wafer W into and out of the treatment chamber can be reduced.

Abstract: Methods and apparatus for substrate processing are provided herein. The apparatus, for example, can include a plurality of multi environment chambers coupled to a buffer chamber configured to load a substrate therefrom into each of the plurality of multi environment chambers for processing of the substrate using a plurality of processing mini environment chambers coupled to each of the plurality of multi environment chambers, at least one of the plurality of multi environment chambers comprising a robot and at least one of the plurality of multi environment chambers comprising a carousel, wherein each of the robot and the carousel is configured to transfer the substrate to and from each of the processing mini environment chamber of the plurality of processing mini environment chambers.

Abstract: Provided is equipment for transferring a vacuum chamber that solves a problem of heat dissipation of a driver by (i) placing a permanent magnet, which is a stator structure of a linear motor and causes linear motion, inside a vacuum chamber and (ii) by placing a coil of a driver structure outside the vacuum chamber. Under this structure, (i) no cable is installed in inside the chamber, and (ii) heat generated from the driver structure can be smoothly dissipated. The transfer equipment includes: a first-axis linear coil (24) that is fixed to an outside of the vacuum chamber at a bottom surface of the housing (11) of the vacuum chamber (10); a first-axis slider (60) that is installed inside the vacuum chamber (10) and moves in a first-axis direction relative to a bottom of an inner space of the vacuum chamber (10); and a first-axis linear permanent magnet (63).

Abstract: A Substrate processing apparatus including a wafer transport apparatus with a transport arm including an end effector, an arm pose deterministic feature integral to the substrate transport apparatus and disposed so that a static detection sensor of the substrate processing apparatus detects at least one edge of the at least one arm pose deterministic feature on the fly with radial motion of the transport arm, and a controller configured so that detection of the edge effects a determination of a proportion factor identifying at least a thermal expansion variance of the transport arm on the fly and includes a kinematic effects resolver configured to determine, from the detection of the edge on the fly, a discrete relation between the determined proportion factor and each different discrete variance respective to each different link of the transport arm determining at least the thermal expansion variance of the transport arm on the fly.

Abstract: Disclosed is a substrate processing apparatus that includes an interference member for minimizing a collision between a descending flow of gas supplied by a fan unit and a gas flow directed toward a transfer space from the inside of a container.

Abstract: An advancing/retracting mechanism includes a first arm, a second arm, a first coupling part that couples the first arm and the second arm, and a second coupling part that couples a supporting body and the first arm. A transfer device is configured to move the supporting body back and forth with the first coupling part located on a first side relative to the second coupling part, by rotating the first arm and the second arm. In a first region, which is a region in the depth direction and includes an end on the front side of the rack body, a distance from the width directional center to the first supporting portion is longer than a distance from the width directional center to the second supporting portion.

Abstract: An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.

Abstract: A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum atmosphere, and a vacuum processing unit including vacuum process chambers connected to the transfer unit and for performing a process on the workpieces in each process chamber. The vacuum processing unit simultaneously performs the process on the workpieces in each process chamber. The process chambers are arranged along a first direction. The transfer unit includes first and second common transfer devices installed along the first direction to transfer the workpieces along the first direction. The first common transfer device is connected to each process chamber at a first side in a second direction perpendicular to the first direction, the second common transfer device is connected to each process chamber at a second side in the second direction.

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

Abstract: Load lock assemblies for a sample analysis system, such as a mass spectrometry system, include a load lock chamber having longitudinally opposing first and second end portions and a through channel, a door coupled to the second end portion, and a seal assembly coupled to the first end portion. The seal assembly includes a rigid seal housing member coupled to a housing of the load lock chamber. The rigid seal housing member includes a port forming part of the first end portion of the through channel of the load lock chamber. The rigid seal housing member can include a self-centering cartridge and/or a flexure member coupled to the housing of the load lock chamber. Where used, the flexure member has an outer perimeter that extends above and below the rigid seal housing member and includes an aperture that is aligned with the port of the rigid seal housing member.

Abstract: A holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber is provided. The holding arrangement includes two or more alignment actuators connectable to at least one of the substrate carrier and the mask carrier, wherein the holding arrangement is configured to support the substrate carrier in, or parallel to, a first plane, wherein a first alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in a first direction, wherein a second alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in the first direction and a second direction different from the first direction, and wherein the first direction and the second direction are in the first plane.

Abstract: A substrate processing apparatus is provided to deposit a film including a reaction product on a substrate by repeating a supply cycle of sequentially supplying at least two kinds of reaction gases reactable with each other to a surface of the substrate in a chamber. The substrate processing apparatus includes a turntable provided in the chamber and having a concave portion for receiving the substrate formed in its surface and through-holes formed in the concave portion, a lifting mechanism including lift pins used when transferring the substrate placed on the concave portion, and a control unit configured to control the lifting mechanism. The control unit controls the lifting mechanism to carry the substrate out of the concave portion by moving the lifting pins upward in a vertical direction and inward in a radial direction of the turntable after the lifting pins contact the substrate through the through-holes.

Abstract: An automated batch stainer for staining biological specimens on microscope slides. The automated batch stainer includes a slide rack assembly configured to hold microscope slides, a robotic arm that manipulates the slide rack assembly, at least one bath containing reagents and capable of receiving the slide rack assemblies, a heating chamber capable of heating multiple slide rack assemblies, a bar code reader, at least one software program including a graphical user interface and configured to calculate the timing and sequence of the staining protocol and implement the staining protocol by controlling the movements of the robotic arm.

Abstract: A purge device capable of appropriately purging a container while saving purge gas includes a first purge nozzle that supplies a purge gas to a container to be purged, an internal state detector capable of detecting an internal state of the container before a purging process with the first purge nozzle is started, and a purge determiner that determines purge conditions for the container based on a detection result from the internal state detector.

Abstract: A robot system includes: a transport device; an article accumulating part that can block the article without stopping the operation of the transport device; a robot performing a task on the article in a working area defined on a downstream side; a control unit; an article-decelerating unit that can reduce the speed of the article in the working area; a detecting unit detecting the traveling distance of the article; a sensing unit that detects the position of the article on an upstream side; and a management unit that causes the article to be blocked and causes the speed of the article to be reduced when the management unit determines that the task will not be completed within the working area. The control unit calculates the current position of the article based on the position and the traveling distance and causes the robot to follow the article to complete the task.

Abstract: A substrate transfer hand coupled to a robot arm includes a base part coupled to the robot arm; and a substrate holding part coupled to the base part to hold a substrate. When viewed in a substrate perpendicular line direction perpendicular to the substrate held by the substrate holding part, the substrate transfer hand is bent at a coupling portion at which the base part and the substrate holding part are coupled to each other or a region which is in the vicinity of the coupling portion, and the base part and the substrate transfer hand have a V-shape, as a whole.

Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

Abstract: A suspended automation system includes a rail array secured to a ceiling. A gantry moves in an X-Y plane defined by the rail array with a drive mechanism. A controller with a human user interface allows for selective movement of the gantry to transport, and in some instances store or manipulate articles. A motorized rotating platform and one or more of a robotic arm, a camera, or a counter-balance are added to the platform to facilitate storage and manipulation, as well as actions in the area below the ceiling. A rail array in some embodiments is equipped with storage modules located above the rail array, the storage modules can take a variety of shapes and sizes for storage of an article. A related process of article movement and actions can be accomplished by the suspended automation system. Still another related process is overhead storage and selectively delivery of an article.

Abstract: In accordance with one or more aspects of the disclosed embodiment a semiconductor processing apparatus is provided. The semiconductor processing apparatus includes a frame forming a sealable chamber having a longitudinal axis and lateral sides astride the longitudinal axis, the sealable chamber being configured to hold a sealed environment therein, at least one transport module mounted to the sealable chamber and having a telescoping carriage being configured so that the telescoping carriage is linearly movable relative to another portion of the transport module where the telescoping carriage and the other portion define a telescoping motion along the longitudinal axis, and at least one transfer robot mounted to the carriage, each of the at least one transfer robot having at least one transfer arm configured for holding a substrate thereon.

Abstract: A rack body includes a first supporting portion, a second supporting portion, and a third supporting portion, and is configured to be able to support a plurality of articles aligned in a depth direction from below. Assuming that, an article storage place on the backmost side of the rack body is a first storage place, and an article storage place on the frontmost side of the rack body is a second storage place, the first supporting portion, the second supporting portion, and the third supporting portion respectively include first engaging parts that engage with the recesses of the article that is stored at the first storage place, and the first supporting portion and the second supporting portion respectively include restricting parts that are arranged opposing side faces of the bottom of the article that is stored at the second storage place, and are configured to restrict horizontal movement of the article.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: There is provided a substrate processing apparatus that includes: a polygonal transfer chamber; a process chamber connected to the polygonal transfer chamber via a transfer port through which a substrate is transferred; and a transfer mechanism provided in the polygonal transfer chamber and configured to transfer the substrate between the polygonal transfer chamber and the process chamber via the transfer port, wherein the polygonal transfer chamber and the process chamber have regions overlapping each other when viewed from the top.

Abstract: A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.

Abstract: Dual load lock chambers for use in a multi-chamber processing system are disclosed herein. In some embodiments, a dual load lock chamber, includes a first load lock chamber having a first interior volume and a first substrate support, wherein the first substrate support includes a first plurality of support surfaces vertically spaced apart by a first predetermined distance; at least one heat transfer device disposed within the first substrate support to heat or cool the first plurality of substrates; and a second load lock chamber disposed adjacent to the first load lock chamber and having a second interior volume and a second substrate support, wherein the second substrate support includes a second plurality of support surfaces vertically spaced apart by a second predetermined distance that less than the first predetermined distance.

Abstract: A substrate processing apparatus includes a plurality of placement parts on which a substrate container is placed, a driving part configured to move the plurality of placement parts, a transport mechanism configured to load the substrate container into one of the plurality of placement parts and to unload the substrate container from one of the plurality of placement parts, and a controller configured to control the driving pan and the transport mechanism so that by raising or lowering the transport mechanism while keeping a support of the transport mechanism unmoved in an initial position, the substrate container is delivered from one of the plurality of placement parts to the support of the transport mechanism, and the substrate container is delivered from the support of the transport mechanism to one of the plurality of placement parts.

Abstract: A substrate processing system includes a substrate loading unit which loads a plurality of substrates, a substrate transfer unit which transfers N (where N is natural number) substrates at the same time from the substrate loading unit, and a substrate processing unit including a plurality of process chambers which receives the N substrates at the same time from the substrate transfer unit and processes the received substrates where each of the process chambers includes a stage on which the N substrates are disposed and an insulation layer disposed between the N substrates.

Abstract: A robot system includes a first robot and a second robot, and the second robot has a base, a shaft provided translationally along an axis direction of a first axis on the base, and an arm provided rotatably with respect to the shaft, and the first robot can perform work on a work object that can be carried by the second robot.

Abstract: A semiconductor apparatus includes a transfer chamber, an annealing station, a robot arm, and an edge detector. The transfer chamber is configured to interface with an electroplating apparatus. The annealing station is arranged to anneal a wafer. The robot arm is arranged to transfer the wafer from the transfer chamber to the annealing station. The edge detector is disposed over the robot arm for the purpose of monitoring at least one portion of an edge bevel removal area of the wafer carried by the robot arm.

Abstract: An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.

Abstract: A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end of the arm. The arm includes at least three links connected in series to form the arm. The arm is configured to be moved by the robot drive to move the at least one end effector among load locks and two or more sets of opposing process modules.

Abstract: Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.

Abstract: Embodiments provide systems, apparatus, and methods for an improved load port that includes a backplane assembly supporting a docking tray and a substrate carrier opener, wherein the backplane assembly includes a backplane; a leveling block coupleable to an equipment front end module (EFEM); a conical hole adjustment assembly coupled between the leveling block and the backplane; and a slotted hole adjustment assembly coupled between the leveling block and the backplane. The conical hole adjustment assembly includes a conical hole block coupled to the leveling block at a first end; a threaded block coupled to the backplane; and an adjustment bolt coupled to the conical hole block and the threaded block. Numerous additional aspects are disclosed.

Abstract: An industrial robot system including a dual arm robot having two arms independently movable in relation to each other, and a hand-held control device for controlling the robot and provided with a visual display unit for displaying information about the arms. The control device is provided with a measuring device for measuring the orientation of the control device, and the control device is configured to display information about one of the arms in a first area on the display unit and to display information about the other arm in a second area on the display unit, and to change the positions of the first and second areas in dependence on the orientation of the control device in relation to the robot so that the positions of the first and second area on the display unit reflects the orientation of the control device in relation to the positions of the arms.

Abstract: A gas purge unit 20 introduces a cleaning gas into a purging container 2 with an opening 2b therethrough. The gas purge unit 20 includes a first nozzle outlet 26 and a second nozzle outlet 28. The first nozzle outlet 26 blows out the cleaning gas from a lateral side line part of the opening 2b toward the inside of the purging container 2. The second nozzle outlet 28 blows out the cleaning gas from the lateral side line part of the opening 2b toward an opening surface of the opening 2b.

Abstract: An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

Abstract: A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end of the arm. The arm includes at least three links connected in series to, form the arm. The arm is configured to be moved by the robot drive to move the at least one end effector among load locks and two or more sets of opposing process modules.

Abstract: A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.

Abstract: The present disclosure discloses a positioning apparatus, including an identification code reading assembly which comprises a support part and an identification code reader mounted on the support part, wherein the support part is connected with a running part of a conveyor mechanism; and further comprising a shield, in which at least a portion of the support part is located and out of which the identification code reader is located. The present disclosure also discloses a conveyor mechanism. The shield provided by the positioning apparatus according to the present disclosure may function to protect the identification code reader without affecting the normal reading operation of the identification code reader, thereby ensuring the accuracy of the positioning of the conveyor mechanism conducted by the positioning apparatus.

Abstract: A supporting device includes a supporting member including a first positioning member positioning a bottom of a first article and inhibiting horizontal movement of the first article, and a second positioning member positioning a bottom of a second article and inhibiting horizontal movement of the second article. The first and second positioning members release the articles when elevated. The supporting device includes a first anti-drop member preventing the first article from being elevated and released and a second anti-drop member preventing the second article from being elevated and released. The first positioning member is higher than the second positioning member. The end of the first article closer to the first and second anti-drop members is nearer or equally distant to the first and second anti-drop members than a corresponding end of the second article. The second anti-drop member is retracted from the end of the first article when the first positioning member positions the first article.

Abstract: A first conveyance mechanism and a second conveyance mechanism convey a pair of two wafers to an alignment device from a wafer container via a buffer device, and then bring the wafers respectively into a first load lock chamber and a second load lock chamber after alignment. An intermediate conveyance mechanism conveys one of the pair of two wafers between the first load lock chamber and a vacuum processing chamber. The intermediate conveyance mechanism conveys the other of the pair of two wafers between the second load lock chamber and the vacuum processing chamber. The first conveyance mechanism and the second conveyance mechanism take out the pair of two wafers subjected to an implantation process from the first load lock chamber and the second load lock chamber and store the wafers into the wafer container.

Abstract: Disclosed is a substrate treating system. The substrate treating system includes an index unit having a port, on which a container containing a substrate is positioned, and an index robot, a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate, and a buffer unit disposed between the process executing unit and the index unit and in which the substrate fed between the process executing unit and the index unit temporarily stays. Each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed 1/2 of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).