Abstract: A method of providing motion compensation of a subsea package with a synthetic rope comprising attaching the synthetic rope to the subsea package, supporting a first gripper with a wire rope from a winch capable of motion compensation control characteristics and gripping the synthetic rope with the first gripper, supporting a second gripper with a second wire rope, and repeating the following sequence: lowering the first gripper, the synthetic rope, and the subsea package a first distance, gripping the synthetic rope with the second gripper, releasing the first gripper from the synthetic rope, raising the first gripper the first distance, gripping the synthetic rope with the first gripper, releasing the second gripper from the synthetic rope, such that when the subsea package is lowered proximate the subsea landing location the winch capable of operating with motion compensation characteristics can operate to compensate for the vessel motion and smoothly lower the subsea package to the subsea landing location

Abstract: A robotic dolly transfer system configured to transport dollies includes a full dolly transfer system and an empty dolly transfer system. The full dolly transfer system and the empty dolly transfer system individually include a rail assembly and a carriage. The carriage is slidably attached to the rail assembly and includes a bottom surface that has a post extending outwardly. The rail assembly includes a rail actuator assembly having an actuator and a receiver attached to the actuator. The receiver includes an opening that receives the post such that the post floats within the opening to permit the carriage to move a predetermined amount independent from the receiver. The actuator is configured to displace the receiver such that receiver contacts the post to slide the carriage with respect to the rail assembly. A end effector is pivotally connected to a transfer arm assembly and is configured to engage the dolly.

Abstract: An example system includes a flexible sleeve to be worn on a user's finger. A first end of the flexible sleeve is disposed near a tip of the finger. The system also includes a camera disposed at the first end of the flexible sleeve atop the finger. A lens of the camera is pointed distally along the finger. The system additionally includes a proximity-sensing device disposed at the first end of the flexible sleeve and configured to generate a proximity signal when brought within a threshold distance of an object. The system further includes a computing device connected to the flexible sleeve and configured to receive the proximity signal indicating that the object is within the threshold distance of the proximity-sensing device. While the object is within the threshold distance, the computing device receives image data from the camera and subsequently transmits the image data.

Abstract: A substrate transfer unit includes a rotation body, an arm member, and first and second blades. The arm member is on the rotation body, and the first and second blades are on the arm member. The arm member includes a first arm including a lower link on the rotation body and an upper link connected on one side of the lower link and a second arm including a first portion and a second portion. The first portion has a first pivot on the other side of the upper link and is connected with the first blade at a first height from the first pivot. The second portion is connected with the first portion and with the second blade at a second height, higher than the first height, from the first pivot.

Abstract: A substrate transfer robot is disposed in a robot installment area defined between a first apparatus and a second apparatus including an opening. The first apparatus includes a first wall, the second apparatus including a second wall. The first apparatus accommodates the substrate at each of a lowest height position and a highest height position. The substrate transfer robot includes a base stationary, a hand configured, and an arm. The arm is rotatably mounted to the base to move the hand. The hand and the arm move in a height direction between a movable range defined between a lowest position and a highest position. The arm rotates with partially entering the opening when the substrate transfer robot takes out the substrate from the first apparatus. The substrate is accommodated at each of the lowest height position and the highest height position.

Abstract: A substrate transfer system includes a substrate transfer robot disposed in a robot installment area defined between a first apparatus and a second apparatus. The first apparatus includes a first cassette, a second cassette and a first wall. The second apparatus includes a second wall. The substrate transfer robot transfers a substrate from each of the first cassette and the second cassette to the second apparatus. The substrate transfer robot includes a hand and an arm. The arm includes a first arm rotatable about a center of rotation. The first cassette is closer to the center of rotation than the second cassette. The arm moves with being partially disposed beyond the second wall in plan view and the arm moves without being disposed beyond the second wall in plan view when taking out the substrate from the first cassette.

Abstract: Disclosed is a cluster-batch type substrate processing system. The cluster-batch type substrate processing system comprises a substrate carry-in section 1 into which a substrate 40 is carried; a substrate conveyance robot 7 to rotate about a rotation axis and perform loading/unloading of the substrate 40; and a plurality of batch type substrate processing apparatuses 9 (9a, 9b) disposed radially around the substrate conveyance robot 7.

Abstract: A door-type automatic material-taking device includes a feed table for holding workpieces and a material-taking mechanism having a lifting unit, a linear displacement unit and a robotic arm. The lifting unit has a fixed member, a sliding member and a positioning member. The fixed member is fixed to the feed table. The sliding member moves vertically with respect to the fixed member. The positioning member is deposited between the fixed member and the sliding member, for positioning the sliding member with respect to the fixed member. The linear displacement unit is attached to the sliding member, for moving the robotic arm along X, V and Z axes to take and place workpieces. The automatic material-taking device is adaptive to machine tools of various specifications, making it suitable for standardized and mass production, and helpful to reduce costs for development and installation, thereby providing economic benefits.

Abstract: A front door-type automatic material-taking device includes a feed table, a material-taking mechanism and a sliding mechanism. The feed table is positioned in front of a machine tool and serves to hold workpieces. The material-taking mechanism includes a linear displacement unit and a robotic arm. The linear displacement unit is fixed to the feed table, and drives the robotic arm to move along a first axis, a second axis, and a third axis and to rotate against the first axis up to a specific angle. The material-taking mechanism is slidably attached to the sliding mechanism for sliding away from the front of the machine tool. The disclosed feed table has good stability, thereby enabling the material-taking mechanism to take and place workpieces with enhanced precision, and the sliding mechanism allows the feed table to perform prompt movement, thereby improving working efficiency.

Abstract: A bilateral door-type automatic material-taking device includes a feed table located between two machine tools and a material-taking mechanism having a lifting unit, a linear displacement unit and a robotic arm. The lifting unit has a fixed member, a sliding member and a positioning member. The fixed member is fixed to the feed table. The sliding member is configured to move vertically with respect to the fixed member. The positioning member is deposited between the fixed member and the sliding member position the sliding member with respect to the fixed member. The linear displacement unit is attached to the sliding member, for moving the robotic arm along X, Y and Z axes to take and place workpieces between the feed table and the machine tools. Thereby, the automatic material-taking device helps to reduce costs for equipment deployment, and is suitable for standardized and mass production, thereby providing economic benefits.

Abstract: A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

Abstract: It is an object of the embodiment of the invention to enhance the work efficiency of a substrate transfer test between a plurality of units. A test control section (CPU) which is provided in a loading/unloading unit 2 performs a substrate transfer test for the loading/unloading unit 2 alone by receiving a wafer mounted on a substrate table 2300 or 2400 which is installed outside the loading/unloading unit 2 and transporting the wafer into the loading/unloading unit 2 by a transport mechanism or transporting a wafer placed in the loading/unloading unit 2 to a substrate table 2200 and mounting the wafer on the substrate table 2200 by the transport mechanism while the loading/unloading unit 2 is not assembled together with the cleaning unit and the polishing unit.

Abstract: A laboratory vial transfer device for automatically transferring laboratory vials from a transport package containing a plurality of said vials, comprising: a vial feeder configured to connect to the transport package after the package has been opened, so as to feed vials directly from the package without manual contact, wherein the vial feeder comprises a rotatable carousel having a plurality of vial receiving positions located on the carousel each for receiving a single vial and adapted to collect the vials from the opened package into respective vial receiving positions upon operation of the carousel, wherein the carousel is operable to feed the vials from their respective vial receiving positions to an exit position

Abstract: Embodiments of the present disclosure provide apparatus and methods for loading and unloading a multiple-substrate processing chamber segment by segment. One embodiment of the present disclosure provides an apparatus for processing multiple substrates. The apparatus includes a substrate supporting tray having a plurality of substrate pockets forming a plurality of segments, and a substrate handling assembly configured to pick up and drop off substrates from and to a segment of substrate pockets of the substrate supporting tray.

Abstract: A manipulator for transporting work pieces, especially between two subsequent molding presses of a press working line, including a moving mechanism allowing three dimensional movements on the path between the molding presses, a supplemental arm attached to the moving mechanism and connected to this moving mechanism via a support member that allows a swiveling movement of the supplemental arm around a vertical axis of the support member as well as a translation movement of the supplemental arm with respect to the support member, and a tool support provided at the outer end of a supplemental arm, the tool support being rotatable around a horizontal first axis and around a second axis perpendicular to the first axis, the tool support including a tool reception that is rotatable around a third axis perpendicular with respect to the second axis.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

Abstract: Provided is a substrate processing module. The substrate processing module includes a lower chamber having an opened upper portion, the lower chamber having a passage, through which a substrate is accessible, in a side thereof, a plurality of susceptors on which the substrate is placed on each of top surfaces thereof, the plurality of susceptors being disposed within the lower chamber and fixedly disposed around a preset center of the lower chamber, a rotation member disposed on the preset center of the lower chamber, the rotation member being rotatable with respect to the preset center, a plurality of holders connected to the rotation member and rotated together with the rotation member, the plurality of holders having at least one seat surface on which the substrate is placed, and a driving module connected to the rotation member, the driving module moving one of the holders to a transfer position corresponding to the passage by driving the rotation member.

Abstract: A robot that includes an end effector for holding a substrate in a substantially horizontal state; a vertical driving unit for driving the end effector to move in a vertical direction; a horizontal driving unit for driving the vertical driving unit to move in a horizontal direction; and a rotation driving unit for rotating the horizontal driving unit about a rotation axis extending in the vertical direction. In this case, one end of the end effector is connected with the vertical driving unit. One end of the vertical driving unit is connected with the horizontal driving unit.

Abstract: A transport arrangement (100) for bi-directionally transporting substrates towards and from a load lock (5) comprises a first substrate handler (1) swivelable about a first axis (A1) and with at least two first substrate carriers (1a, 1b). A second substrate handler (20) swivelable about a second axis (A20) comprises at least four second substrate carriers (20a to 20d). First and second substrate carriers are mutually aligned respectively in one position of their respective swiveling trajectory paths as one of the first substrate carriers is aligned with one of the second substrate carriers and the other of the first substrate carriers is aligned with the load lock (5). The first substrate carriers (1a, 1b) are movable towards and from the load lock (5) once aligned there with and thereby form respectively external valves of the load lock (5).

Abstract: An electronic device processing system is disclosed. The system includes a transfer chamber including facets and a plurality of single-entry process chambers coupled to the facets, wherein at least some process chambers are non-focalized process chambers, at least one load lock chamber, and a robot apparatus operable to transport substrates between the process chambers and the load lock chamber(s). Robot apparatus includes an upper arm, a forearm, and a wrist member adapted for independent rotation relative to the forearm about a wrist axis, and an end effector adapted to carry a substrate. Various degrees of yaw may be imparted to the wrist member in order to service the non-focalized process chambers. Systems and methods are also provided as are other aspects.

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract: A manufacturing system includes a first robot cell apparatus including a first manufacturing robot and a first rack to which the first manufacturing robot is fixed, a second robot cell apparatus including a second manufacturing robot and a second rack to which the second manufacturing robot is fixed, the second robot cell apparatus being disposed adjacent to the first robot cell apparatus, and a transport path setter that sets a transport path of a transport robot that performs at least one of receiving a workpiece from the first robot cell apparatus and supplying a workpiece component to the first robot cell apparatus. A space through which the transport robot is movable is provided under each of the first and second racks, and the transport path setter sets the transport path of the transport robot so that the transport path passes through at least one of the spaces.

Abstract: A loader module of a substrate processing system includes a transportation arm configured to move towards a wafer accommodated in a carrier and receive the wafer, and a control unit configured to confirm a delivery position of the wafer based on an upward movement amount of an end effector of the transportation arm, and a contact sound generated when the end effector comes in contact with the wafer. The control unit confirms the delivery position of the wafer based on an average height of the end effector when the contact sound of each pad of the end effector comes in contact with the wafer to generate a contact sound a plurality of times.

Abstract: A substrate transfer system includes a substrate transfer robot disposed in a robot installment area defined between a first apparatus and a second apparatus comprising an opening. The substrate transfer robot includes a hand and an arm. The hand is configured to support a substrate. The arm is configured to move the hand. The arm and the hand supporting the substrate are configured to rotate on a horizontal surface within a minimal rotation area of the substrate transfer robot such that an outer periphery of the minimal rotation area overlaps an inside of the second apparatus through the opening so as to transfer the substrate from a first position in the first apparatus to a second position in the second apparatus through the opening.

Abstract: A substrate relay apparatus (200) includes a chassis (202) that is arranged to surround openings (144) formed at side walls of adjacent transfer apparatuses and has a dimension in the width direction between the side walls of the transfer apparatuses that is smaller than the substrate size, a gate valve (201) that is arranged inside the chassis (202) between the side walls of the adjacent transfer apparatuses and is configured to open and close with respect to the openings (144), and support pins (250) that are arranged on both sides of the gate valve (201) and are configured to support a wafer (W) that straddles the gate valve (201).

Abstract: In various exemplary embodiments described herein, a system includes a plurality of carrier arms each having concentrically mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the opposing ends of the carrier arms. A hub includes a plurality of concentrically mounted drives where each of the plurality of drives is coupled near the midpoint of a respective one of the plurality of carrier arms. Each of the plurality of drives is configured to be controlled independently of the remaining plurality of concentrically mounted drives. A respective motor is coupled to each of the concentrically mounted drives and is configured to move the coupled carrier arm in a rotary manner. A linear wafer transport mechanism moves wafers to or from select ones of the wafer carriers on the plurality of carrier arms to an easy handoff location for a load/unload robot.

Abstract: A carrier device according to embodiments includes a carrier chamber that is provided with a plurality of connecting holes that are communicated with the outside, an articulated robot that is placed inside the carrier chamber, and a linear moving mechanism that makes at least the arm part of the articulated robot linearly move in a short side direction of the carrier chamber. The bottom end of the arm part of the articulated robot is provided on a base via an arm spindle to be rotatable horizontally and its leading end is provided with a hand that is rotatable horizontally and holds a board to be taken in and out via the connecting holes.

Abstract: A system and a method for maintaining, transferring and transporting a flexible package. The system includes a manipulating system, preferably a five axis robot, for transferring and displacing the flexible package and a lift-assist platform positioned within a reach of the manipulating system for transporting the package and for supporting a weight of the flexible package. The system may be used more specifically for the transport and transfer of upright flexible packages. The system simplifies the tool supported by the robot, thus allowing use of a smaller robot.

Abstract: There is provided a machine tool capable of housing workpieces of different sizes in a same workpiece storage unit without requiring a new workpiece storage unit. In a machine tool including a workpiece storage unit having a plurality of housing spaces housing workpieces and a processing machine processing a workpiece supplied from one of the housing spaces, the workpiece storage unit is structured so that the size of each housing space is changeable.

Abstract: A substrate treatment system comprise a treatment station having a plurality of treatment units provided at multiple tiers in an up-down direction, a cassette mounting table on which a cassette housing a plurality of wafers W is mounted, and a wafer transfer mechanism arranged between the treatment station and the cassette mounting table, wherein a delivery block in which a plurality of delivery units are provided at multiple tiers is provided between the treatment station and the wafer transfer mechanism, the delivery units temporarily housing a wafer to be transferred between the cassette mounting table and the treatment station and a wafer to be transferred between the tiers of the treatment units. The wafer transfer mechanism includes a first transfer arm that transfers a wafer between the cassette mounting table and the delivery block, and a second transfer arm that transfers a wafer between the tiers of the delivery units.

Abstract: Substrate transport systems, apparatus, and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then independently actuating an upper arm link housing and one or more wrist members to put or pick one or more substrates at the destination wherein the wrist member is independently actuated relative to the forearm link housing and the motion of the forearm link member is kinematically linked to the motion of the upper arm link housing. Numerous other aspects are provided.

Abstract: A tactile wafer lifting apparatus includes a pedestal and a vertical drive connected to the pedestal. The vertical drive is defined to provide controlled upward and downward movement of the pedestal. The tactile wafer lifting apparatus also includes a wafer support member disposed over the pedestal. A tactile switch is disposed between the wafer support member and the pedestal such that sufficient downward force on the wafer support member causes activation of the tactile switch. The tactile switch is connected to the vertical drive so as to interrupt upward movement of the pedestal and wafer support member disposed thereover upon activation of the tactile switch.

Abstract: Methods and apparatus for cleaning electrostatic chucks in processing chambers are provided. The process comprises flowing a backside gas comprising a reactive agent into a zone in a process chamber, the zone defined by a space between a surface of an electrostatic chuck or of a cleaning station and a surface of a substrate. The surface of the electrostatic chuck is etched with the reactive agent to remove debris. An apparatus for cleaning an electrostatic chuck is also provided, the apparatus comprising: a process chamber; an elongate arm having a reach disposed through a wall of the process chamber; an electrostatic chuck attached to the elongate arm; a cleaning station located within the reach of the elongate arm; and a reactive gas source that is operatively connected to the cleaning station.

Abstract: A manipulator for transporting work pieces, especially between two subsequent molding presses of a press working line, including a moving mechanism allowing three dimensional movements on the path between the molding presses, a supplemental arm attached to the moving mechanism and connected to this moving mechanism via a support member that allows a swiveling movement of the supplemental arm around a vertical axis of the support member as well as a translation movement of the supplemental arm with respect to the support member, and a tool support provided at the outer end of a supplemental arm, the tool support being rotatable around a horizontal first axis and around a second axis perpendicular to the first axis, the tool support including a tool reception that is rotatable around a third axis perpendicular with respect to the second axis.

Abstract: A transfer device 17 in a semiconductor processing system includes first and second actuation mechanisms 9A, 9B having first and second support sections movable on first and second vertical planes, respectively, the latter being parallel with each other. First and second movable blocks 18A, 18B are supported on the first and second support sections so that they may be horizontally moved by the first and second actuation mechanisms. Disposed on the first and second movable blocks are first and second handling mechanism 19A, 19B capable of extension and contraction for handling a processing subject substrate W. A control section 20 controls the operation of the first and second actuation mechanisms so that the first and second movable blocks may not interfere with each other.

Abstract: A workpiece transfer system includes a transfer chamber in which a workpiece transfer apparatus is installed, and a load port provided adjacent to the transfer chamber. The transfer chamber includes a frame structure made of steel. The frame structure includes a first frame member and a second frame member. The first frame member is set on the floor, and the workpiece transfer apparatus is installed thereon. The second frame member is arranged in a standing posture with respect to the first frame member and which supports the load port.

Abstract: A robot according to this invention includes a driving mechanism, a first arm rotatably connected to the driving mechanism, a second arm rotatably connected to the first arm, and an X-shaped end effector rotatably disposed at the distal end of the second arm. Of the four distal ends of the end effector, two distal ends include holding units which can hold substrates in one direction, and the remaining two distal ends include holding units which can hold substrates in the opposite direction.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

Abstract: An apparatus and method for handling disks as part of a magnetic disk manufacturing process is provided. In one embodiment, during a drying process the disks are engaged at the inner diameter rather than the outer diameter to eliminate the formation of residue on the surface of the disks at or proximate data zones. The disks may be engaged individually or in pairs.

Abstract: A substrate conveyance apparatus includes a first driving shaft, an arm portion having one end connected to the first driving shaft, a substrate holding unit capable of holding a substrate, and a connecting portion that connects the other end of the arm portion and the substrate holding unit. The connecting portion includes a rotating support portion that supports the substrate holding unit rotatably with respect to the arm portion, and a moving unit that moves the substrate holding unit upward or downward with respect to the arm portion in the direction of the rotating shaft about which the substrate holding unit is rotated by the rotating support portion.

Abstract: A substrate processing system includes a control section configured to control a series of transfer operations and preset to control operation of a container transfer apparatus, operation at a substrate access area, and operation of a substrate handling apparatus independently of each other. The control section includes a schedule creating portion configured to create a transfer schedule by individually adjusting operation timing of the container transfer apparatus, operation timing at the substrate access area, and operation timing of the substrate handling apparatus such that, in a state while a first lot of substrates are treated in the processing system, but the container transfer apparatus and the substrate access area are unoccupied, a container with a second lot of unprocessed substrates stored therein is transferred onto the substrate access area, thereby minimizing total transfer time.

Abstract: In various exemplary embodiments described herein, a system includes a plurality of carrier arms each having concentrically mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the opposing ends of the carrier arms. A hub includes a plurality of concentrically mounted drives where each of the plurality of drives is coupled near the midpoint of a respective one of the plurality of carrier arms. Each of the plurality of drives is configured to be controlled independently of the remaining plurality of concentrically mounted drives. A respective motor is coupled to each of the concentrically mounted drives and is configured to move the coupled carrier arm in a rotary manner. A linear wafer transport mechanism moves wafers to or from select ones of the wafer carriers on the plurality of carrier arms to an easy handoff location for a load/unload robot.

Abstract: An ergonomic tool lifting machine and method particularly useful for manipulating a machine tool or another heavy object. In one embodiment of the invention, the machine tool is a large milling cutter. The ergonomic tool lifting machine generally includes an articulating arm attached at a fixed end to a vertical lift mechanism, and at a free end to a grasping device or tool holder adapted for gripping and retaining an object of interest. When the object is a milling cutter, the ergonomic tool lifting machine may be used to transfer the cutter between a stored position and an installed position in a milling machine. Consequently, the tool holder of this embodiment is preferably able to rotate between a pick-up/drop-off position and an installation/removal position associated with the cutter. In general, the ergonomic tool lift machine allows heavy loads to be accurately moved with very little effort required on the part of an operator.

Abstract: A storage device transporter includes a transporter body having first and second body portions. The first body portion is configured to be engaged by automated machinery for manipulation of the storage device transporter. The second body portion is configured to receive and support a storage device. The first body portion is configured to receive and direct an air flow over one or more surfaces of a storage device supported in the second body portion.

Abstract: An industrial robot may include a first hand and a second hand on which an object is mounted, a first arm which turnably holds the first hand on a first end side, a second arm which turnably holds the second hand on a first end side, a common arm which turnably holds a second end side of the first arm and a second end side of the second arm, a first turning center part which is a turning center of the first arm with respect to the common arm, a second turning center part which is a turning center of the second arm with respect to the common arm, and a main body part which turnably holds the common arm. The first hand and the second hand may be disposed so as to superpose each other, and the first hand and the second hand may be formed with an escape part.

Abstract: The present disclosure relates to methods and apparatuses for manufacturing absorbent articles, and more particularly, apparatuses and methods utilizing multiple processing stations for processing absorbent articles and being configurable to move along various predetermined travel paths defined by radii that may be constant or variable. Particular embodiments of apparatuses and methods of manufacture include a processing wheel having a plurality of processing stations which orbit around a rotation axis. The processing stations may be configured to perform various types of operations associated with the manufacture of absorbent articles while the processing stations orbit around the rotation axis. The processing wheel can be configured to adjust the path along which the processing stations orbit as the processing wheel rotates around the rotation axis.

Abstract: A cutting machine having a workpiece changer possessing a receiving element for the workpieces and/or workpiece palettes, said receiving element pivots about a vertical axis and is linearly shiftable in a plane normal to such axis. A tool spindle moves on two parallel side walls which are divided by a transverse wall or by door which can opened or shut between a front machining area and a rear supply area. The radius of the receiving element extends at least partly into a supply area and the tool spindle is movable over the front machining area. Accordingly a person minding or controlling the functioning cutting machine is not hampered by workpiece changing.

Abstract: A compact multiple diameter wafer testing device with a footprint of about 33 by 34 inches features on-chuck wafer calibration and integrated cassette-chuck transfer. It includes a five axes wafer handling system, a quick exchange chuck and a fixed through beam sensor fixed. Two of the five axes are provided by an X-Y stage, a third axis is provided by a rotary stage on top of the X-Y stage, a fourth axis belongs to a rotating effector and a fifth axis is provided by motion controlled pin lifters all combined with the X-Y stage. The quick exchange chuck may be easily changed for different wafer diameters and also calibrated by the through beam sensor. The through beam sensor provides on-chuck position calibration of the chucked wafers in conjunction with the X-Y stage and rotary stage. The compact wafer testing device handles wafers between six and twelve inches diameter.

Abstract: A plate handling system for a sampling device with a drawtube that includes a vertical actuation system that adjusts the vertical distance between the drawtube and a sample tray, a horizontal linkage system that positions a sample tray in a horizontal plane, and a drive system that drives the rotational motion of the horizontal linkage system. The horizontal linkage system includes a base arm that rotates about a base joint, and a sample arm that rotates about a sample arm joint on the base arm.