Abstract: There is described a dispensing apparatus for dispensing a food product from a container. The dispensing apparatus comprises a support for supporting a container of product when the container is loaded into the apparatus, an actuator for effecting movement of the support in a first direction during a product dispensing stroke of the apparatus and in a second direction during a return stroke of the apparatus; and a retainer for retaining a spent container of product so that a spent container is removed from the support during the return stroke.

Abstract: Pick and place tape release techniques and tools that allow thin, fragile semiconductor dies to be removed from wafer tape with reduced tape release forces applied to the semiconductor dies. For example, a method for removing semiconductor die from wafer tape includes mounting a wafer ring having wafer tape and one or more dies attached to the wafer tape, and aligning an ejector pin assembly under a target die to be removed from the wafer tape. The ejector pin assembly includes a vacuum housing, an ejector pin, a suction plate, and an aperture formed in the suction plate in alignment with the ejector pin. A vacuum is generated in the vacuum housing to draw the tape against a surface of the suction plate.

Abstract: The present invention is a method and apparatus for the automatic loading and advancement of component feeder tape in a component feeder for use with a pick-and-place system. The feeder employs sensing technology to determine when a component tape leader is inserted into a tape guide, and subsequently auto-loads the feeder with the tape, including initiating the peeling of cover tape. Subsequently, the feeder operates to sense the presence of parts or components in the component tape pockets and to advance the component tape to a position where the first component is presented at the pick location. The feeder is also capable of detecting repeatable features in the component tape in order to automatically determine the component tape pitch.

Abstract: A high speed device and method for transporting work pieces from one container to another is disclosed. This high speed device utilizes a rotary wheel having a number of pick heads located along the circumference of the rotary wheel. These pick heads are utilized to lift work pieces from a container. The rotary wheel then rotates to position the next pick heads over the next workpiece which it then picks up. Once all work pieces in a container are picked up they may then be deposited in a similar manner in a receiving container. This device and method reduces the time involved in moving work pieces and reduces the cost of manufacturing.

Abstract: An off-loading system comprising an array of suction tubes which are each able to pick up an associated semiconductor device from the matrix of devices and a pump which pulls air through the suction tubes to create a sufficiently low pressure within the suction tubes to allow each suction tube to pick up an associated device. In another embodiment of the invention, the off-loading system also includes a pin board which supports an array of pins configured to raise a selected array of the semiconductor devices to assist in picking up the selected array of devices from the matrix of devices. Another embodiment of the invention includes a rack that includes multiple elongated rails which form multiple channels through which the semiconductor devices travel so that they may properly enter a subsequent phase of the manufacturing process.

Abstract: A substrate handling system with integrated door removal assembly for an environmentally controlled substrate processing chamber is provided. The system includes a robot positioned within the chamber. A drive mechanism is connected to the robot. A door interface mechanism is attached to the drive mechanism and includes a door key and a door key control assembly. The drive mechanism provides mechanical control of the door key control assembly such that that door key is manipulated to couple a substrate carrier door to a port door. The coupled doors are storable within the chamber or on the robot. The drive mechanism may also include a substrate end effector, thereby allowing the robot to transport substrates within the chamber. The robot is movable within the chamber to multiple processing stations.

Abstract: A pick-up apparatus for picking up semiconductor chips comprising an integrated or a separately rotatable composite cam formed by a plurality of cylindrical cams, and a plurality of cylindrical pin holders having a plurality of push-up pins, and at least part of the pin holder is in contact with the composite cam. The rotation of the composite cam selects one of the pin holders suited for pushing up a desired semiconductor chip, and the counter rotation selects another pin holder suited for another semiconductor chip having a different size. In this manner, a plurality of semiconductor chips having different sizes can be properly picked up without replacing the pin holder.

Abstract: A reticle transfer system is disclosed for transferring reticles between a reticle-carrying SMIF container and a process tool. The reticle transfer system according to the present invention includes an arm assembly having a transfer arm and a gripping mechanism affixed to the end of the transfer arm. Once the container carrying the reticle has been opened, the gripping mechanism is rotated and translated to a position adjacent the reticle so that it may access the reticle and transfer it into the minienvironment through an access port in the minienvironment. In order to precisely, easily and repeatedly position the gripping mechanism in the desired location to grip and transfer the reticle, the gripping mechanism includes four downwardly extending posts spaced apart from each other so as to contact an outer rim of the container door as the gripping mechanism is lowered into position to grip and transfer the reticle.

Abstract: For stripping selected chips from a wafer of diced chips adhered, bottom surface down, to a flexible, elastic membrane, the bottom surface of the membrane is disposed against an apertured plate of a vacuum chuck for firmly holding the membrane in place with a group of the chips directly overlying push-up pins vertically movable through slots through the apertured plate. Selected pins are fired upwardly with sufficient speed to dislodge struck chips, but not non-selected adjacent chips, off the membrane and to hurl them, in free flight, upwardly against an overlying chip catching member. The stripped and caught chips are then transferred for storage or use.

Abstract: An apparatus for handling and positioning wafers or other flat objects. The apparatus has an XY stage with an X-drive and a Y-drive, and a bed attached to the XY stage. A chuck (e.g. a vacuum chuck) is disposed on the bed and an effector is attached to the bed. The effector can rotate about an axis of rotation extending in the Z-direction. The effector can pick up objects and place the objects onto the chuck. The effector can also pick up objects from the chuck. Preferably, the chuck has a recessed region for accommodating the effector so that the effector can be inserted under a flat object on the chuck. The X-drive or Y-drive of the XY stage provides linear motion for the effector so that the effector can pull wafers from a cassette such as used in the semiconductor industry. Alternatively, the effector is attached to a linear actuator disposed on the bed.