Abstract: An apparatus for forming stacks (2) of panels (3) from a vertical pile (4) of panels (3) to be fed to a user station comprises: a crossbar (5) that moves above the pile (4) of panels (3) and mounts selector means (6; 7, 8) designed to separate a certain number of panels (3) from the top of the pile (4); first gripper means (9; 10) and second gripper means (11; 12, 16) for clamping the panels (3); the selector means (6; 7, 8) include a first wedge-shaped selection element (8) that can be inserted between the panels (3) in the pile (4) to create a gap; the apparatus (1) also comprises second selector means (16) mounted on the crossbar (5) and mobile in a feed direction (40) and relative to the crossbar (5), lengthways along the crossbar (5) itself in a first horizontal direction (13), in such a way that they can be inserted into the pile (4) next to the first wedge-shaped element (8) at the gap so as to completely separate the pile (4) at a point away from the first wedge-shaped element (8) by sliding in the fi

Abstract: In a card processing apparatus a card tray and, a card-transporting device are provided. A device for sensing the position or detention of a card in the card tray and a holding device for a card that has stopped in an irregular manner in the card tray due to manipulation of the card-processing apparatus, are also included. The holding device is activated if a change in the position of the card is not detected even though a conveying signal has been issued to the card-conveying device.

Abstract: A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.

Abstract: The workpiece handling device comprises a cantilever (1) that is movable in a movement direction (Y), a carriage (11) that is arranged on the cantilever and movable with respect to the cantilever in the movement direction, and a gripper (15; 25) that is arranged on the carriage and movable transversally (Z) to the movement direction.

Abstract: The present invention concerns an apparatus for handling humid products. The apparatus includes a thermal face (1) with a cooled area (9) over at least a part of the face (1). At least one release element (2) is connected to the apparatus and includes at least one release shear. The release element (2) with the release shear is moveably provided in relation to the cooled area (9). Furthermore a method for handling humid products is described.

Abstract: An apparatus for convening a liquid crystal display panel for moving various size unit liquid crystal display panels. The present invention includes a horizontal driving unit controlling a revolution of a motor, a plurality of screw shafts protruding out of the horizontal driving unit. A pair of robot arms having first and second ends, the first ends are supported by corresponding screw shafts and extend from the screw shafts, and a plurality of clamping units connected to the second ends of the robot arms.

Abstract: An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1 prevailing in the first pressure chamber and the pressure p2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper.

Abstract: The invention relates to a device for the transport of work pieces with at least one transport device (T1, T2) which can be installed on a frame (14) of a processing device (P) and which has a transport bar (15) which is kept moveable in X- and Y-direction. To increase the rigidity of the device, it is suggested that the transport bar (15) be kept moveable with at least two parallelogram servo drives (PL1, PL2).

Abstract: An apparatus for accepting and transferring at least one disk-like member is provided. The apparatus includes a pick- and place-mechanism including gripping means. In effect, the mechanism is adapted to provide pick- and/or place-cycles, which during operation provides a movement of said gripping means between an up and a down position and vice versa, whereby, in the down position, said gripping means either picks the disk-like member from a load position or places the disk-like member onto the load position.

Abstract: The present invention relates to a method for rapid transfer of a work object in both the horizontal and vertical directions using a robot unit (10) having a gripping mechanism (12) preferably from one workstation (3) to another (4), the work piece (2) weighing between one kilo and forty kilos and the transfer in the horizontal direction being at least one meter but less than ten meters and at least partially being effected along an essentially horizontally extending beam unit (20), and the gripping mechanism (12) being arranged in such a way that, at least in one end situation (E1) along the beam (20), it can collect and/or deliver a work object (2) in a position (E2) situated beyond the end situation (E1) along the said horizontal beam (20), which robot unit is controlled by means of a control unit (50) and is driven by means of a belt member (24) and at least two motors (26, 27) comprising rotor units connected to drive wheels (26A, 27A) for the said belt member (24), the said motors (26, 27) being immovab

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

Abstract: In order to provide a method of carrying out working steps in at least one work station on miniaturised modules which are held by a module carrier provided with a holding device, whereby the method enables a plurality of processing steps to be carried out on a module, it is proposed that the module be moved by one of the module carriers to a plurality of work stations for carrying out the working steps and that it be precisely positioned for carrying out one of the working steps by means of a relative movement between the module carrier and the currently relevant one of the plurality of workstations, and in that the positioning of the module relative to the module carrier be maintained for carrying out the working steps.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are disposed on a movable holder is disclosed. The transport arrangement is designed to remove a selected chip-carrier plate from the magazine and deliver it to a chip processing station. After processing, the selected chip-carrier plate is removed and deposited in the magazine. Movement of the chip-carrier plates is controlled such that the selected chip-carrier plate is positioned at a collection point to be collected from the magazine. Movement of the transport arrangement holder is controlled such that the first and second clamping devices are disposed in a vertical arrangement on the holder and are constructed to individually release or grip a chip-carrier plate in a similar angular position of the holder.

Abstract: A micro device using assembly system for feeding, programming, and placing micro devices on circuit boards includes a robotic handling system capable of picking up and placing the micro devices on the circuit boards on a conveyor system. A control system controls the conveyor system and the robotic handling system. An input feeder provides the micro devices and a programming system is capable of programming a plurality of micro devices in sockets which are in line parallel with the input feeder. The input feeder responds to communication with the control system to feed the unprogrammed micro devices while the programming system programs the micro devices and communicates to the control system. The robotic handling system responds to communication of the programming system with the control system to pickup and places the programmed micro devices on the circuit boards at high speed.

Abstract: A method for sorting mail to a case having a plurality of slots is described, wherein each slot corresponds to a destination. The method includes steps of loading a mail piece to be sorted into a delivery robot, determining for the mail piece a destination slot the mail piece is to be delivered to, moving the delivery robot along a rail disposed at the front of the case near the slots into proximity with an open end of the destination slot, inserting the mail piece from the delivery robot into the associated slot, and returning the delivery robot to a loading station whereby the cycle may be repeated. Such a method, when using a large number of robots moving along a common rail system, can sort a large volume of mail in carrier delivery order.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: For producing wall panels (8) from bricks (1), a line-up path (4) on which bricks to be masoned are deposited in a row with a gripper, a transfer device (10) for transporting the brick row from the line-up path (4) to a bricklaying station (7) for masoning the wall panel, and a device for moving apart the bricks to form vertical joints (9) between the bricks (1) of the wall panel (8) are provided. The gripper depositing the bricks (1) on the line-up path (4) is formed by a depiling gripper (3) that depiles the bricks (1) of a pile (2) in rows with its two longitudinal grippers (13, 14). The device for moving apart the bricks (1) is formed by transverse grippers (21, 21a) disposed on the depiling gripper (3) between the longitudinal grippers (13, 14), said transverse grippers (21, 21a) individually holding the bricks (1) of the brick row depiled with the longitudinal grippers (13, 14) and being formed to be movable in the longitudinal direction of the depiling gripper (3).

Abstract: Apparatus for a dual powered actuator system. The system comprises a support member supporting an article in movement along a first direction and a second direction. A precision actuator is coupled with the support member and responsive to an input signal to selectively move the support member. A fluid actuator is also coupled with the support member to selectively move the support member. An active fluid regulator provides a first pressure to the fluid actuator in the first direction of the support member and a second pressure to the fluid actuator in the second direction of the support member, wherein the first and second pressures are different. A controller activates the active fluid regulator and the precision actuator.

Abstract: A transferring device usable in installations for cutting and/or bending metal bars, particularly bars intended for concrete reinforcement. The device comprises one or more gripping pliers movable along mutually orthogonal axes of an overhead traveling crane arrangement. Each set of pliers is carried by an articulated wrist.

Abstract: A transfer system provided, in particular, for multi-stage presses for large components is distinguished by a favorable design with a low moving mass and allows large transporting steps. By the regulation of 2 stationary drives both in the direction of rotation in relation to one another and in the rotational speed, it is possible to realize all desired traveling curves in one plane. A straightforward construction makes possible a cost-effective, modular solution for a highly dynamic transfer system.

Abstract: A small-sized feeding unit for a transfer press is provided. To this end, the feeding unit comprises: a feed box body one end of which is attached to side faces of uprights; feed driving means having servo motors disposed within the feed box body and pinions rotatively driven by the servo motors; feed racks movable in a feeding direction and meshing with the pinions respectively; feed carriers integrally attached to the feed racks respectively; and feed bars coupled to the feed carriers respectively so as to be movable at least either in a horizontal direction perpendicular to the feeding direction or in a vertical direction, wherein when the feed carriers are positioned at a stroke end on a press body side, the feed carriers are located in the vicinity of the feed driving means with respect to the feeding direction.

Abstract: A freely positionable placement head (1) removes presented flip chips (6) from a wafer (5), the connection side of said chips being directed upward. The placement head has a turning device (9), in which, by the time they are placed onto a substrate (8) to be provided with placed components, the flip chips are turned in such a way that they can be placed with their connection side onto the substrate. This makes it possible to dispense with a complex turning device assigned to the wafer (5).

Abstract: A bending apparatus for bending and transporting an aluminum metal sheet. The bending apparatus includes a central retaining portion that has gripping elements mounted on the central retaining portion for retaining an aluminum metal sheet. There is also included a bending mechanism that is mounted to the central retaining portion. The bending mechanism is capable of axial movement in relation to a central axis of the central retaining portion for imparting a curvature to an aluminum metal sheet. There is also included a method of stretch forming an aluminum metal sheet including the steps of heating an aluminum metal sheet in an oven, transferring the heat of an aluminum sheet to a hot forming tool, bending the heated aluminum sheet during the transfer step to conform the sheet to a shape of the hot forming tool, and then placing the bent metal sheet in the hot forming tool and forming an A-shaped part.

Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.

Abstract: A polar coordinate stage that may be used in a chamber includes a rotating chuck that moves in a linear direction and has the motors that drive the motion of the chuck outside the chamber. The stage can include a linkage of arms to support and drive the linear motion of the chuck. The chuck is coupled to a horizontal rail such that rotational motion of a first arm is translated into precise linear motion of the chuck along the horizontal rail through a second arm. In addition, a system of pulleys within the arms translates rotational (or linear) motion through the arms and rotates the chuck. Vertical motion may be provided by an actuator between the second arm and the chuck or by a motor under the stage. Because of the compact nature of the stage, it can be easily placed within a chamber.

Abstract: A robotic device for moving at least one object between locations, including a servo motor system having a single servo axis for effecting motion in at least two directions of motion. The robotic device includes a link arm rotationally coupled to said servo motor system for lifting and placing said at least one object, a head assembly having gripper arms for gripping and releasing said at least one object at said locations. The head assembly includes a leveling mechanism for maintaining said at least one object in a desired orientation, and a split ring sensing mechanism, disposed between said gripper arms, for determining the presence of said at least one object.

Abstract: A manipulator device for the repositioning of parts having at least one pivot arm able to be driven to perform an oscillating pivotal movement about a pivot axis, such pivot arm so acting during the pivotal movement on a gripper carrier serving for carrying a gripper that the gripper carrier is shifted in position without changing its alignment in space along a predetermined manipulation path. The gripper carrier is connected with a cam follower, engaging a path cam defining the desired course of the manipulation path and extending some distance about the pivot axis. Furthermore, in order to move along a manipulation path at least partially departing from a circular path, the gripper carrier is movably arranged in relation to the pivot axis in a direction which is radial with respect to such radial direction so that it may perform a radial movement combined with the orbital movement about the pivot axis.

Abstract: An automated system for handling material and parts cut therefrom. The system includes means for unloading a material pallet positioned on a shelf within a first storage device and loading the material on a movable cart, transporting the material to an unloading station wherein the material is positioned onto a first shuttle table, the shuttle moving to a laser cutting station, unloading the cut material from the cutting station after parts are cut in the material, and transporting the cut parts on a pallet to a selected shelf in a second storage device using movable carts. The skeleton material remaining after the cutting operation is collected for eventual disposal. A second shuttle table is used to prepare additional material for cutting after the material brought by the first shuttle table is moved to the laser cutting station.

Abstract: The present invention provides apparatus for supporting during a testing operation a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus comprises a main body and a leadframe support member, and the leadframe support member is formed with at least one groove for receiving semiconductor devices such that in use leads extending from said devices lie on a surface of said support member. The invention also relates to a system for transporting devices to and from a test probe head.

Abstract: A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied to the motor, and a detecting device for detecting movement of the shall in the axial direction. A method of operating the component holding head comprises using the detecting device to detect movement of the shaft in the axial direction resulting from the shaft being driven by the motor, and controlling power supplied to the motor in response to the movement of the shaft as detected by the detecting device such that the distance that the shaft is driven by the motor in the axial direction is controlled.

Abstract: The present invention provides an apparatus for bonding a semiconductor chip to substrate using a non-conductive adhesive tape. The non-conductive adhesive tape may be a polyimide tape. The apparatus may include a tape provider having a reel on which the non-adhesive tape may be spooled, rollers, and a tape cutter which cuts the tape to a suitable size. A tape holder and a tape presser may also be provided to hold the tape in place while the tape cutter cuts the tape. A tape pick-up tool may be provided to transfer the cut tape to a die bonding area on the substrate. The tape holder and the tape pick-up tool may include a suction opening for providing a suction force. The apparatus may further include a die pick up tool for transferring a semiconductor chip from a semiconductor chip provider to the adhesive tape affixed to the substrate.

Abstract: A device for, and method of, handling and mounting a boat sundeck. The device includes a platform having first and second ends. A clamp structure is connected to the first end of the platform such that the clamp structure can be used to hold and move the sundeck of a boat. In addition, control modules are connected to the second end of the platform to aid in manipulation of the sundeck by the device. A lift connection location is positioned between the first and second ends of the platform and allows the device to be connected to an articulated boom.

Abstract: A substrate processing apparatus comprising a frame, a drive section, an articulated arm, and at least one pair of end effectors. The drive section is connected to the frame. The articulated arm is connected to the drive section. The articulated arm has a shoulder and a wrist. The arm is pivotally mounted to the drive section at the shoulder. The drive section is adapted to rotate the articulated arm relative to the frame about an axis of rotation at the shoulder, and to displace the wrist relative the shoulder. The pair of end effectors is connected to the articulated arm. The pair of end effectors is pivotally jointed to the wrist of the articulated arm to rotate relative to the articulated arm about a common axis of rotation at the wrist. Each end effector is independently pivotable relative to each other about the common axis of rotation at the wrist. At least one end effector is independently pivotable about the common axis of rotation of the wrist relative to the articulated arm.

Abstract: An automatic bending system includes an automatic bending press (46) including a pair of bending tools (48, 50) cooperating with each other, and an automatic manipulator (10) including a head (26) movable in a work space and provided with a toolholder member (29) intended to receive at least two take-up members (32, 34, 38, 42) independent from each other. The head (26) is rotatable about a first axis (28) and the toolholder member (29) is provided with tool attachment seats (30) arranged on opposite sides of said first axis (28) and rotatable about a second common axis (36) orthogonal to the first axis (28).

Abstract: An arm operation mechanism for an industrial robot includes a support, a first arm, a second arm, a link base, a parallel link and a conversion mechanism. The first arm has a base end pivotally connected to the support for rotation relative to the support. The second arm has a base end pivotally connected to a tip end of the first arm for rotation relative to the first arm. The link base is pivotally connected to the first arm for rotation relative to the first arm. The parallel link keeps a constant posture of the link base upon the rotation of the first arm. The conversion mechanism converts the rotation of the link base relative to the first arm into the rotation of the second arm relative to the link base.

Abstract: A machine tool having a C-shaped frame has a workpiece processing station adjacent the open end of the throat, and an elongated guide rail extends in a first axis perpendicularly to the throat. A carrier extends along the guide rail, and a multiplicity of guide units are spaced along and movable on the carrier in the first axis. Workpiece clamping units are carried by the guide units, and drive means moves the guide units on the carrier. The guide rail is movable in the throat along a second axis perpendicular to the first axis, and a second carrier supported on the frame extends in a second axis parallel to the throat. A multiplicity of guide elements is spaced along and movable on the second carrier and supports the guide rail for movement in the second axis of the second guide rail.

Abstract: An electronic parts-mounting method for mounting parts on a board in which at least two electronic parts can be picked up by a plurality of nozzles including a plurality of first nozzles arranged substantially parallel to the direction of movement of the board and a plurality of second nozzles arranged substantially perpendicular to the direction of movement of the board such that the positions of the parts picked up by the second nozzles can be recognized by a line sensor and corrected.

Abstract: An apparatus comprising a frame, a mobile platform and first and second linearly-actuated slides supported on a base connected to the frame. The first and second slides are movable along a line defining a first axis. The apparatus may include a first driving connector movably coupled to the first slide and to the mobile platform, and a second driving connector movably coupled to the second slide and to the mobile platform, such that the mobile platform is displaceable within at least two degrees of freedom defined by linear motions along the first axis and a second axis, the second axis being coplanar and orthogonal to the first axis. An end effector may be also coupled to the mobile platform, the end effector having an axis aligned in a direction defined by the second axis. The end effector may comprise, for example, a tool or a gripper.

Abstract: A wafer handling device includes a platform having a plurality of movable grippers. A driver is mounted on the platform and selectively couples to at least one of the plurality of grippers to selectively move at least one of the plurality of grippers with regard to the platform. The driver may be magnetically coupled to at least one gripper to move it between a first proximal position and a first distal position. The driver may be mounted on the platform with a track assembly that effectuates a linear magnetic propulsion field to move the driver between the first axial position and the second axial position.

Abstract: A component suction method including feeding components (8) accommodated in component storage spaces (9c) of a tape base (9a) to a predetermined position, lowering a nozzle (7) capable of sucking the components supplied to the predetermined position, stopping the nozzle (7) at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

Abstract: A removal apparatus is provided which includes a travelling frame, first and second carriages provided on the travelling frame, first and second cross frames provided on the first and second carriages, first and second cross carriages provided on the first and second cross frames, first and second vertical units provided on the first and second cross carriages, and first and second chucking units secured to the first and second vertical units. In addition, a control unit is provided for synchronously controlling the movement of the first and second carriages, the first and second cross carriages, and the first and second vertical units so as to enable the first and second chucking units to be moved in three dimensions for removal of a molded product from a molding machine.

Abstract: A workstation has a transfer device with a gripper which is suitable for gripping sample tubes by a gripper clamp and for moving them from a sample tube rack to a sample tube bucket, for example for centrifuging. The transfer device has a receiving device (23) which can be gripped on a cylindrical upper handling part (25) by the gripper and removed from a holder (24) in which it has been placed in a defined position. It has an intermediate part (33) with, on its lower end, four hooks (37) which are arranged at the apices of a rectangle and can engage eyes in the sample tube buckets. After use, the receiving device (23) is replaced in the holder (24).

Abstract: A jig for accommodating and transferring a carrier, the carrier having a first container with a first opening larger than the article, and the carrier having a first flange structure which extends from a peripheral portion of the first opening, the first flange structure having a first size defined to be a distance between opposite edges of the first flange structure in a first direction, the jig including a second container having a second opening with a second size larger than the first size of the first flange structure of the carrier, the jig further having a second flange structure in an opposite side to a side provided with the second opening, the second flange structure having a third size larger than the second size, the jig also having at least a window structure which extends at least opposite sides which is positioned adjacent to the second flange structure, so that the window structure is closer to the second opening than the second flange structure, the first opening of the carrier sealable with

Abstract: It is an object of the present invention to provide a work holder for a through hole examination apparatus that reduces the generation of scrubbed-off metal powder caused by abrasion during the movements, and has a high operability. Also, it is an object to provide a work holder for a through hole examination apparatus that can readily adjust the holder to be parallel at low costs. A work holder 18 is provided for a through hole examination apparatus, which retains a work having through holes provided therein and transfers the same between a work replacement operation region and a through hole examination region. A roller movement device 50 is mounted on the holder main body to enable a rolling movement thereof, and the roller movement device is made to be height-adjustable such that the parallel degree of the holder is adjustable.

Abstract: A new parts handling apparatus is provided which can shorten the index time and increase working ability without increasing the number of components and can restrict the rise of manufacturing cost. X driving member 12 to be moved rightward and leftward in correlation to the rotation of a ball screw 2 by a servomotor 1 is provided with a pair of right and left movable members 7 mounted movably in the Z direction. Two contact hands 5 are attached to each movable member 7 through aligning mechanisms 8 respectively. Each movable member 7 is provided with a Z driving member 6 mounted slidably in the X direction. The Z driving member 6 is engaged with a ball screw 4, and the ball screw 4 is connected to a servomotor 3. When the ball screw 4 is rotated by the servomotor 3, the Z driving member 6 moves vertically in the figure, thereby also moving the movable member 7 vertically.