Abstract: Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects.

Abstract: Provided is a substrate processing apparatus which can efficiently transfer substrates using a conveying mechanism including a plurality of substrate holding members. The substrate processing apparatus transfers a processed substrate to an intermediate conveying unit using a transport mechanism when the processed substrate returns to a substrate receiving unit.

Abstract: Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes a housing having an entrance in a side thereof and providing a space for performing a process, a door for opening and closing the entrance, and a support member disposed on the door to receive a substrate thereon.

Abstract: A method includes: detecting a splice by splicing in a tape feed process of supplying a component by pitch-feeding the carrier tape; and performing data processing of writing splice component information over in-use component information when the splice is detected, and rewriting only a number of remaining component of the in-use component information by means of the number of remaining component of the splice component information without issuing a component depletion alarm when the splice is not detected and when the number of remaining component in the in-use component information has decreased to a predetermined value.

Abstract: A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more chip handling units configured to pick a chip from the supply station, transport the chip to the mounting station, and place the chip at a mounting location; wherein each chip handling unit is configured to temporarily retain the chip in a defined position relative to the chip handling unit. The chip handling apparatus further comprises means for inducing sonic vibrations in the chip when retained by one of the chip handling units; and means for measuring the vibrations induced in the chip.

Abstract: Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; and a pressing member configured to apply a force to the door so as to close the housing during the high pressure process.

Abstract: A method and apparatus for processing material cascading through a treatment chamber uses a plurality of vertically stacked shelves divided into trays by spaced apart openings. As the shelves rotate, material contained with each tray is discharged through one of the openings to one or more trays of an underlying shelf. The material to be processed is supplied to the uppermost shelf through one or more material inlets, and discharged from the lowermost shelf through one or more material outlets. The material that enters each feed opening stays substantially together as it spirals down through the chamber. The multiple trays provide for shorter retention time of material within each tray which is adaptable for processing heat sensitive materials along separate material flow paths within the treatment chamber.

Abstract: A multiplicity of wafer-type workpieces are buffer stored in a device having, a frame, at least two transport elements which each circulate in a vertical direction around an upper and a lower deflection device connected to the frame and are provided, at uniform intervals, with a multiplicity of bearing areas for the horizontal mounting of workpieces, wherein at least one of the deflection devices of each transport element is driven and a free space is situated between the transport elements, a loading position between the upper deflection devices at which a workpiece can be placed onto corresponding bearing areas, and a stationary removal device below the loading position, comprising a horizontal transport device, the first end of which lies within the free space between the transport elements. The invention also relates to a method for buffer-storing a multiplicity of wafer-type workpieces using the abovementioned device.

Abstract: An apparatus for positioning a functional device, wherein the apparatus has a main body, a carrier element that can be disposed on the main body to receive the functional device, positioning stops, which are mounted displaceably to clamp the functional device, an actuating device which is adapted such that, by actuating the actuating device, the positioning stops can be transferred between an operating state engaging the functional device and an operating state releasing the functional device, and a force transmitting element which is adapted to transmit an actuating force from the actuating device to the positioning stops, wherein the actuating device and the force transmitting element are coupled in such a manner that, in the operating state engaging the functional device, the force transmitting element transmits a functional device force of the functional device to the actuating device in such a manner that the actuating device remains in a rest position with respect to the carrier element, in spite of the

Abstract: A control apparatus in a substrate treating system with a substrate treating apparatus having a physical load port for receiving pods for storing substrates, and a carrier transport system for transporting the pods to and from the physical load port. The control apparatus includes a virtual load port control device for allotting a virtual load port to the physical load port, and instructing the carrier transport system to perform a transporting operation to and from the virtual load port on an assumption that the virtual load port really exists.

Abstract: In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.

Abstract: In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.

Abstract: An automated ply layup system uses a robot and an end effector for selecting plies from a kit and placing the plies at predetermined locations on a tool.

Abstract: [Problems] To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head. [Means for Solving the Problems] A component mounting apparatus (1) includes a placing head (4) that transports a chip component (6) supplied from a component supply portion (5) by sucking the chip component (6), and a suction position recognition camera (32) that is provided to be movable independently of the placing head (4) and takes an image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supply portion (5).

Abstract: An analyzer system comprising: a transporting apparatus having a rack stocker for stocking a rack which holds one or more samples, the transporting apparatus being configured to transport the rack in the rack stocker; a measuring apparatus configured to perform a measurement on a sample of the rack transported by the transporting apparatus; an obtaining section configured to obtain identification data of a person who sets the rack on the rack stocker; a data storage; and a system controller, is disclosed. The system controller is configured to store, in the data storage, a result of the measurement of the sample as well as the identification data obtained from the person who had set the rack holding the sample on the rack stocker.

Abstract: A storage device transfer station is provided for transferring storage devices from a human operator to automated machinery for testing. The storage device transfer station includes a plurality of slots each capable of holding a storage device. The plurality of slots is arranged in at least one field, and the field is arranged between two parallel planes. Each slot has a first open end and a second open end, such that each open end is accessible for loading and unloading a storage device. The first open ends are accessible at a first plane of the two parallel planes and the second open ends are accessible at a second plane of the two parallel planes.

Abstract: In stacking tray supplying for receiving in a stacked state a plurality of trays that are received in a state in which components to be mounted onto a board are aligned, two tray stages are provided rotationally transferably on a concentric circle. In a state in which one is positioned in a feeding tray placement position and the other is positioned in a standby tray placement position, components are fed from the tray stage positioned in the feeding tray placement position. When a component depletion state occurs, the tray stages are rotationally transferred to switchover the mutual placement positions, by which waste of time required to feed components is reduced.

Abstract: Embodiments of the present invention provide apparatus and methods for positioning a substrate in a processing chamber using capacitive sensors. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes first and second capacitive sensors disposed in an inner volume. The first capacitive sensor is positioned to detect a location of an edge of the substrate at a first angular location. The second capacitive sensor is positioned to detect a vertical position of the substrate.

Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.

Abstract: In a palette movement in which a palette (24) which holds a tray (6) whose components are used up is moved from a palette carrying part (27) where the palette (24) was carried for the exchange with a new tray (6) to a palette accommodating part (23), the accommodating address of the return destination is specified based on a readout result of a palette identification mark of a palette information readout sensor (32) and palette accommodating data which are stored in advance. Therefore, even if the components in two or more palettes (24) are used up in the same period, the palettes (24) can be returned to the palette accommodating parts (23) corresponding to the specified accommodating addresses of the return destinations.

Abstract: Embodiments of the present invention generally provide an apparatus and method for transferring substrates in a processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint when compared to conventional techniques.

Abstract: A spiral cam has a tubular shaped portion defined by an interior cavity and an exterior surface that includes a cam contour. A linear slide assembly having a length defined along a rotational axis is defined to slide lengthwise into the interior cavity of the spiral cam. The linear slide assembly allows for movement of the spiral cam along the rotational axis and prevents rotation of the spiral cam relative to the linear slide assembly. A cam roller is fixed at a position proximate to the exterior surface of the spiral cam. The cam roller is disposed separate from the linear slide assembly and within the cam contour of the spiral cam. The cam roller engages the cam contour to move of the spiral cam along the rotational axis when the linear slide assembly and spiral cam are rotated in unison about the rotational axis relative to the cam roller.

Abstract: Embodiments of multiple substrate transfer robots and substrate processing systems have been disclosed herein. In some embodiments, a multiple substrate transfer robot is provided and may include an arm capable of extending along a horizontal direction; and a wrist coupled to the arm and having a plurality of blades coupled thereto, each blade configured to horizontally support a substrate thereupon and vertically disposed with respect to each of the other blades. In some embodiments, a substrate processing system is provided and may include a substrate processing chamber having a plurality of susceptors, wherein each susceptor is vertically disposed and capable of holding a semiconductor substrate; and a substrate transfer robot having a plurality of blades for transferring a plurality of substrates to and from the processing chamber, each blade configured to horizontally support a substrate thereupon and vertically disposed with respect to each of the other blades.

Abstract: An analyzer for detecting or quantitating an analyte comprising a temporary storage unit for storing a reagent cassette and a method for presenting a reagent cassette present in a temporary storage unit to a pipetting device are described.

Abstract: An automated analyzer with an on-board fridge for long-term cooling of reagents, and a method for isolating and analyzing an analyte comprising long-term cooling of reagents.

Abstract: Various embodiments describe a method of quantifying bow in a wafer. In one embodiment, the method includes measuring a first plurality of distances from a first sensor to a first surface of the wafer to calculate the bow in the wafer. The first sensor is positioned outside of a set of process modules of the plasma processing system. A determination is made whether the calculated bow of the wafer is within a pre-determined range. If the calculated bow of the wafer is within the pre-determined range, the wafer is moved into a process module of the set of process modules for processing and a recipe for processing the wafer is adjusted based on the calculated bow of the wafer. If the calculated bow of the wafer is outside the pre-determined range, the wafer is removed from the plasma processing system. Other methods are described as well.

Abstract: A plant for building tyres includes a plurality of working locations, at least one first working location being associated with at least two loading/unloading locations, a proximal one and a distal one, each of said working locations and loading/unloading locations being associable with a forming drum. The production cycle is controlled by the method of: (i) loading a first forming drum into the at least one first working location; (ii) loading a second forming drum into the loading/unloading location; (iii) at the end of the working provided in the at least one first working location, unloading the first forming drum into the proximal loading/unloading location.

Abstract: The invention relates to a device for loading and unloading a heat treatment furnace and to a corresponding method. Heat treatment furnaces are normally loaded and unloaded by means of a so-called elevator. During unloading, a removed workpiece is usually lowered by means of the elevator into an oil bath, in which it is then removed from the elevator. Oil is then transferred into the furnace chamber via the oil-covered elevator. Such an application of oil is avoided by means of a device comprising a frame rack having a first and a second level, which are disposed parallel above each other, and are connected to each other by means of a plurality of frame braces, wherein the first and the second levels have a plurality of openings and the frame braces have guide means.

Abstract: The invention relates to a method for execution upon processing of at least one histological sample that is arranged, in particular after an infiltration process, in a closed cassette (2). The method is characterized in that prior to opening of the cassette (2), the sample is detached from the cover of the cassette (2) and/or isolated.

Abstract: Passive devices fabricated on glass substrates, methods of manufacture and design structures are provided. The method includes forming an opaque or semi-opaque layer on at least a first side of a glass substrate. The method further includes forming one or more passive devices on the opaque or semi-opaque layer on a second side of the glass substrate.

Abstract: A device for use in the semiconductor industry includes a robotic arm whose end effector includes at least two prongs designed to hold a substrate carrier. A pushing member located between the prongs can move independently of the prongs and is configured to exert force against the substrate carrier while the prongs are retracted from the substrate carrier, after the substrate carrier has been brought to its intended position. In this manner, the position of the substrate carrier is maintained at its intended position as the prongs are retracted. Each of the prongs may include a claw or gripping member for grasping the substrate carrier.

Abstract: A substrate transporting method includes: after a holding unit of a substrate holding apparatus receives a substrate from one placement location for a substrate and holds it, detecting a first positional deviation of the substrate from a reference position of the substrate on the holding unit; transporting the substrate held by the holding unit to a position facing another placement location; detecting a second positional deviation of the substrate from the reference position of the substrate on the holding unit, when the substrate is located at the position facing the another placement location; calculating, based on the first and second positional deviations, a positional displacement of the substrate relative to the holding unit that occurred during the transporting of the substrate to the position facing the another placement location; and determining whether or not the positional displacement thus calculated falls within a predetermined range.

Abstract: The invention relates to methods and apparatus in which a plurality of ALD reactors are placed in a pattern in relation to each other, each ALD reactor being configured to receive a batch of substrates for ALD processing, and each ALD reactor comprising a reaction chamber accessible from the top. A plurality of loading sequences is performed with a loading robot. Each loading sequence comprises picking up a substrate holder carrying a batch of substrates in a storage area or shelf, and moving said substrate holder with said batch of substrates into the reaction chamber of the ALD reactor in question.

Abstract: A substrate transfer method for transferring target substrates proceeds in a substrate processing system for performing processes including a photolithography sequence on the target substrates. The system includes a first automated substrate transfer line configured to transfer the target substrates among a plurality of process sections for respectively performing processes on the target substrates, and a second automated substrate transfer line of a cyclical type dedicated to a plurality of process apparatuses of a photolithography process section, which are configured to perform a series of processes in the photolithography sequence, the second automated substrate transfer line being located relative to the first automated substrate transfer line so as for the target substrates to be transferred therebetween.

Abstract: A device, method and computer readable-storage for mechanically handling impact-sensitive sheets of various formats ready for dispatch is described. The device has the following features: a) a control device in the form of a multi-axis robotic arm connected to a gripper device and means for mechanically gripping the sheets; b) the gripper device is hinged onto and suspended from the control device at a gentle incline by means of an adjustable damping device; c) the gripper device has sliding sections for the relative displacement of the means for mechanically gripping the sheets; d) the gripper device has means for determining the geometric dimensions of the sheets to be seized and for determining their set-down position; e) the gripper device has means for determining the exact positional co-ordinates of the set-down position; and f) the gripper device has means for gently feeding and depositing the sheets in the set-down position.

Abstract: Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.

Abstract: An integrated robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly can comprise a multiple end effector for moving a plurality of workpieces, a single end effector for moving a single workpiece, a rotation chuck incorporated on the robot body to provide alignment capability, and an optional identification subsystem for identify the object during transport. The present invention robot assembly can be used in a sorter or stocker equipment, in processing equipment, and a transfer system.

Abstract: A method for estimating the effective volumetric capacity of a truck body is provided. The method includes the step of establishing a side-to-side profile of a generic load model by extending load side lines upward at a predetermined material angle of repose from the upper edge of each of the side walls of the truck body. A front-to-rear profile of the generic load model is also established by extending a front load line upward from the upper edge of the front wall of the track body at the predetermined material angle of repose and a rear load line upward from at or near a rear edge of the floor of the truck body at the predetermined material angle of repose. The volume of the final three-dimensional generic load model can then be calculated.

Abstract: Embodiments of the present invention relate to apparatus and methods for loading substrates into processing chambers, processing the substrates in the processing chamber, and transferring the substrates out of the processing chamber using a single lift and rotational mechanism. One embodiment of the present invention provides a method for processing one or more substrates. The method includes transferring a substrate carrier, having one or more substrates disposed thereon, to a chamber volume, supporting the substrate carrier within the chamber volume using a set of lift pins, transferring the substrate carrier from the set of lift pins to an edge ring within the chamber volume, and contacting the edge ring with the set of lift pins to control the position of the substrate carrier within the chamber volume.

Abstract: A substrate transport apparatus includes a first fork which is disposed to be movable in a forward/backward direction to a substrate holding part to transport a stacked member to or receive the stacked member from the substrate holding part. A second fork is arranged to be reversible and disposed above the first fork to be movable in a forward/backward direction to an accommodating part that accommodates substrates and spacer members to transport a substrate or a spacer member between the accommodating part and the first fork. A first grip module is disposed on a first surface of the second fork to hold and support the substrate from an upward direction. A second grip module is disposed on the first surface of the second fork on the same side as the first grip module to hold and support the spacer member from an upward direction.

Abstract: According to one embodiment, a cargo inspection method includes transporting a first guideway vehicle over a guideway from a first inspection station to a second inspection station. A first non-intrusive scanning mechanism associated with the first inspection station is used to acquire a first set of data associated with cargo stored in the first guideway vehicle. The first set of data acquired by the first non-intrusive scanning mechanism associated with the first inspection station is analyzed to determine the identity of the cargo stored on the first guideway vehicle. The first set of data acquired by the first non-intrusive scanning mechanism is compared with a first manifest that describes the cargo that is declared to be stored on the first guideway vehicle. It is determined that the first guideway vehicle contains contraband cargo if the identity of the cargo does not match the first manifest.

Abstract: In some aspects, an unloading device for a pipe processing system includes a depositing carriage having a depositing surface for depositing a pipe during and/or after a pipe processing operation, the depositing carriage being configured to move in a longitudinal direction of the pipe, and a supporting carriage having a supporting member for the pipe, the supporting member having a wall for radially supporting the pipe, and the supporting carriage being configured to move in a longitudinal direction of the pipe, where the depositing surface of the depositing carriage and/or the supporting member of the supporting carriage is configured to move in at least one other direction in addition to the longitudinal direction of the pipe so that the depositing carriage and the supporting carriage can be at least partially moved past each other along the longitudinal direction of the pipe.

Abstract: A substrate cartridge includes a cartridge main body that houses a substrate and an information-maintaining section that is housed in the cartridge main body and maintains information that includes at least specification information of specification values of the substrate housed in the cartridge main body.

Abstract: A system and method for production of manufactured parts including a production process having at least one industrial robot equipped with a handling tool for picking up the manufactured part. The robot is arranged in a quality inspection cell and the robot is programmed to hold the manufactured part in at least one known position in the quality inspection cell and present the part for a quality inspection. The quality inspection may be made visually by an operator or with the aid of a tool or sensor or by means of automatic sensors. In other aspects of the invention a method, system and a computer program for carrying out the method are described.

Abstract: A device and a method for loading a food processing machine, in particular a filling machine or a cutter, with food, including a container for receiving the food, a lifting means by which the container can be driven upwards, a drive for the lifting means, and a measuring means for detecting the amount of food in the container.

Abstract: A substrate processing method includes transferring unprocessed substrates to a first substrate holder by way of lowering a first substrate accommodation unit and loading the unprocessed substrates into a processing chamber in sequence while sequentially rotating a substrate mounting table at a preset angle in one direction, performing a preset process on substrates in a batch-type, and unloading processed substrates from the processing chamber by the first substrate holder after a completion of the preset process, transferring the processed substrates into the first substrate accommodation unit from the first substrate holder by way of raising the first substrate accommodation unit, transferring unprocessed substrates to a second substrate holder by way of lowering a second substrate accommodation unit and loading the unprocessed substrate into the processing chamber in sequence while sequentially rotating the substrate mounting table at the preset angle in the another direction.

Abstract: A system and device for use in a security area, and more particularly, a rack system and holding device for placing various objects that are processed through a security area are taught.

Abstract: A system and method concurrently processes multiple wafers. A cassette structure includes multiple chucks and a drive spool for supporting and rotating the chucks. Each chuck holds a wafer in position while rotating. The cassette structure is loaded into a process chamber. Each chuck includes a self-locking mechanism that is activated by the centrifugal force generated from the rotation of the chuck. The self-locking mechanism centers and holds a wafer in position with respect to the chuck. A drive motor drives the drive spool, which causes the chucks to rotate. As the chucks are being rotated, a dispensing assembly delivers a processing chemical to the wafers.

Abstract: A system and method for receiving, handling and storing used rolls following unwinding of sheet material therefrom includes: (a) transferring the cores to a remnant cleaning station, (b) inspecting for (i) remnant material, (ii) repairable damage or (iii) irreparable damage; and (c) for those cores cleaned, repaired, or satisfactory as is, transferring them to a storage rack for the specific size and length.

Abstract: A method according to Claim 25, wherein essentially homogeneous material mixtures are achieved or maintained in these liquid containers.