Abstract: A substrate support includes a base, a support portion, a first pin member, a second pin member and a driving unit. The base has a first surface on which an object to be supported is placed, a second surface opposite to the first surface, and a first through-hole. The support portion has a third surface in contact with the second surface, a fourth surface opposite to the third surface, and a second through-hole. The first pin member is stored in the first through-hole and a second pin member is stored in the second through-hole. The first through-hole is larger on the second surface side than on the first surface side, and/or the second through-hole is larger on the third surface side than on the fourth surface side.

Abstract: Methods and systems are provided for a sample holder for a multi-detector quantitative microscopy system. In one example, the sample holder includes a frame with a central opening, a pivotable arm positioned adjacent to the central opening and having a whippletree assembly at a first end of the pivotable arm, and a movable ram, in contact with a second end of the pivotable arm, the movable ram configured to pivot the pivotable arm.

Abstract: A substrate processing apparatus includes a holder, a nozzle arm and a position adjusting device. The holder is configured to hold a substrate. The nozzle arm has a nozzle configured to supply a processing liquid to a peripheral portion of the substrate. The position adjusting device is provided at the nozzle arm and is configured to adjust a position of the substrate to a given position on the holder.

Abstract: A setup change work support method includes a feeder information acquisition step, a production information acquisition step, and a target feeder determination step. The feeder information acquisition step acquires information on the capability of a feeder that can be disposed in a component supply unit of an electronic component mounting device for mounting an electronic component on a workpiece and that supplies the electronic component. The production information acquisition step acquires information on the production of the workpiece. The target feeder determination step determines a target feeder that is disposed in the component supply unit and is used to produce a target type based on information on the capability of the feeder and information on the production of the workpiece.

Abstract: A wafer transfer device includes a base, a plurality of fixed rings, a rotating shaft, a turntable, an air suction pump and a driving mechanism. The fixed rings are stacked sequentially and each has a channel and a ring groove. The channel is extended from an outer periphery of the fixed ring and communicates to the ring groove. The rotating shaft is connected to each fixed ring and has a plurality of flow passages corresponding to the fixed rings and communicating to the ring groove. The turntable is fixedly connected to the rotating shaft. The air suction pump sucks each wafer, and the driving mechanism drives and rotates the turntable and the rotating shaft, so that each flow passage rotates relative to each fixed ring and keeps communicating with each ring groove to maintain the suction of each wafer.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: A substrate processing apparatus includes a substrate processor and a substrate transporter. The substrate processor includes an upper holding device and a lower holding device configured to be capable of holding a substrate. In the substrate processor, the lower holding device is provided below the upper holding device. Therefore, a height position at which a substrate can be held by the upper holding device is different from a height position at which the substrate can be held by the lower holding device. The substrate transporter has first and second hands that hold a substrate. The second hand is located farther downwardly than the first hand. A substrate is received from or transferred to the upper holding device by the first hand. A substrate is received from or transferred to the lower holding device by the second hand.

Abstract: A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.

Abstract: Implementations relate to a direct drive for a mechanical arm assembly. In some implementations, a mechanical arm assembly includes a base member, a first arm member rotatably coupled to the base member at a first portion of the first arm member, and a second arm member having a first portion rotatably coupled to a second portion of the first arm member. The first arm member is rotatable with respect to the base member about a first axis, and the second arm member is rotatable with respect to the first arm member about a second axis. A first motor coupled to the base member, the first motor including a first drive shaft rotatable about the first axis and coupled to the first arm member. A grip member is coupled to a second portion of the second arm member.

Abstract: The present disclosure provides a photomask inspection system and an inspection method. The mask inspection system includes: a mask thickness measuring device having sensor modules arranged side by side for measuring the thickness of the mask; a bar code reading device; a calibration device including a calibration rod and an electromagnet, the calibration rod includes a calibration stick and a calibration base, the electromagnet is set at the bottom of the calibration base, and the calibration device calibrates the barcode reading device.

Abstract: A vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and an internal wall separating the cassette handling space and the wafer handling space. The cassette handling space is provided with a cassette storage configured to store a plurality of wafer cassettes. The cassette handling space is also provided with a cassette handler configured to transfer wafer cassettes between the cassette storage and a wafer transfer position. The wafer handling space is provided with a wafer handler configured to transfer wafers between a wafer cassette in the wafer transfer position and a wafer boat. The internal wall is provided with a wafer transfer opening adjacent the wafer transfer position for a wafer cassette from or to which wafers are to be transferred. The cassette storage comprises a cassette storage carousel with a diameter between 1.1 and 1.6 meter.

Abstract: A substrate transfer device includes a manipulator, a substrate gripping hand, an actuator configured to rotate the substrate gripping hand about a roll axis, and a controller adapted to operate the manipulator to hold a substrate by a first engaging member and a second engaging member of the substrate gripping hand, then operate the actuator so that a first principal surface of the substrate is located above a base member, and a normal line of the first principal surface is oriented downward from a horizontal plane, and move a movable guiding member toward the tip-end part of the base member so that the second engaging member, a third engaging member, and the movable guiding member grip the substrate.

Abstract: A conveyance system comprising a movable element including a first coil group and a second coil group, and a stator including a plurality of magnetic bodies disposed along the first direction so that the plurality of magnetic bodies are capable of facing the first coil group and the second coil group. The first coil group includes a plurality of first coils disposed along a first direction, and the second coil group includes a plurality of second coils disposed along a second direction intersecting with the first direction. In a case where electric current is applied to the first coil group or the second coil group, a force is generated between the movable element and the plurality of magnetic bodies. The movable element is capable of moving in the first direction along the plurality of magnetic bodies while an orientation of the movable element is controlled by the generated force.

Abstract: A substrate transfer robot for transferring a substrate in a vacuum chamber, includes: a transfer arm platform having coupling holes, wherein a link connecting member with blades is engaged at a front area of the transfer arm platform and a support shaft of a lower support is inserted into the lower space of one of the coupling holes; and a first and a second transfer arm part each including an end effector for supporting the substrate, multiple transfer link arms and subordinate link arms, and a common link arm that are connected to each other or to the transfer arm platform, wherein, the transfer link arms include at least some of drive shafts, interlocked with transfer driving motors or speed reducers, and output shafts interlocked with the drive shafts, and wherein the end effectors are positioned at different heights from each other through using a bracket.

Abstract: A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

Abstract: A first sensor is disposed in such a way that optical axes of a light emitting element and a light receiving element thereof are parallel to a left-right direction. A second sensor is disposed in such a way that optical axes of a light emitting element and a light receiving element thereof are parallel to a front-rear direction. When a position of a wafer to be loaded on a loading portion is taught, a position of the loading portion or a teaching jig to be loaded on the loading portion in the front-rear direction is detected by the first sensor by moving a hand in the front-rear direction by a moving mechanism, and a position of the loading portion or the teaching jig in the left-right direction is detected by the second sensor by moving the hand in the left-right direction by the moving mechanism.

Abstract: A transport system includes: a mover having a first magnet group arranged in parallel to a first direction and a second magnet group arranged in parallel to a second direction crossing the first direction; and a plurality of coils arranged in parallel to the first direction so as to be able to face the first magnet group and the second magnet group, and the mover is able to move in the first direction along the plurality of coils by electromagnetic force received by the first magnetic group from the plurality of coils while an attitude of the mover is controlled by electromagnetic force received by the first magnetic group or the second magnetic group from the plurality of coils.

Abstract: There is provided a device for transferring a substrate under air pressure. The device comprises a base part, a transfer arm part configured to transfer a substrate, a telescopic shaft part which is provided between the base part and the transfer arm part, and divided into a plurality of division shaft parts having a tubular shape, an annular channel which is provided in a circumference of a surface of a division shaft parts, and an exhaust channel which is connected to the annular channel so as to exhaust the gas flowing into the annular channel.

Abstract: An encapsulated cleanroom system comprising a processing chamber and a storage section in which the processing chamber is stored, wherein, during operation, the pressure in the storage section is lower or higher than the pressures in the processing chamber and exterior space. The system can simultaneously prevent the entry of outside gases into its processing chamber and the leakage of the gases inside the processing chamber to the exterior space.

Abstract: The invention relates to a planar multi-joint robot arm system. An example of such planar multi-joint robot arm system comprises a base platform having a longitudinal axis, a product manipulator having a longitudinal axis perpendicular to the longitudinal axis of the base platform, a double crank-conrod mechanism consisting of a first crank-conrod link and a second crank-conrod link, wherein both the first and the second crank-conrod links having a crank end connected to the base platform and a conrod end connected to the product manipulator, and as well as a link element linking both crank-conrod joints of the first and the second crank-conrod links, a first driving unit arranged for rotating the crank end of the first crank-conrod link of the double crank-conrod mechanism, a multi-joint arm having first arm end connected to the base platform and a second arm end connected to the product manipulator as well as a second driving unit arranged for rotating the first arm end of the multi-joint arm.

Abstract: A storage device for use with at least one batch furnace for batch treatment of wafers supported in a wafer boat is disclosed. The storage device comprises a cassette storage carousel for storing a plurality of wafer cassettes on rotatable platform stages. A carousel housing bounds a mini-environment chamber in which the platform stages are accommodated. A gas recirculation circuit of the storage device subsequently comprises a gas inlet channel, a gas inlet filter, the mini-environment chamber, a plurality of gas outlet openings in a bottom wall of the carousel housing, a plenum housing bounding a plenum chamber, a plenum chamber outlet, a gas circulation pump connecting the plenum chamber outlet to an inlet end of the gas inlet duct.

Abstract: A substrate processing apparatus includes: a stage for performing at least one of heating and cooling on a substrate placed thereon and having a through-hole vertically penetrating the stage; a substrate support pin having an insertion portion inserted into the through-hole and configured so that the insertion portion protrudes from an upper surface of the stage through the through-hole; and a pin support member for supporting the substrate support pin. The substrate support pin has a flange portion located below a lower surface of the stage. The support member supports the substrate support pin by engagement with the flange portion. The through-hole is smaller than the flange portion. The substrate support pin includes a first member including the flange portion and a second member having the insertion portion. The first member has a sliding surface which slidably supports the second member.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

Abstract: An apparatus including a drive having motors and at least two coaxial drive shafts; an arm connected to the drive, where the arm is configured to support at least one substrate thereon; and a transmission connected between the drive and the arm, where the transmission includes an eccentric bearing and a linkage, where the linkage is connected between a first one of the coaxial drive shafts and the arm, where the eccentric bearing is connected to a second one of the coaxial drive shafts, where the arm comprises an aperture, where the eccentric bearing is located in the aperture, and where the eccentric bearing is configured to contact the arm in the aperture.

Abstract: An illustrative device disclosed herein includes a plate and a reticle pod receiving structure on the front surface of the plate that at least partially bounds a reticle pod receiving area on the front surface. In this example, the back surface of the plate has a pin engagement structure that is adapted to engage a plurality of pins and a fluid flow channel that is adapted to allow fluid communication with an interior region of a reticle pod when the reticle pod is positioned in the reticle pod receiving area.

Abstract: Embodiments provide for a conveying system to move multiple articles from one location to another. The conveying system may use a transport device to grasp each article from an initial location, rotate the articles away from the initial locations, move the articles linearly, and rotate the articles to destination locations. Rather than moving each article one-by-one, in the embodiments described herein, the conveying system can move multiple articles simultaneously to various locations where each location may contain a different process to perform on the article. Moving multiple articles simultaneously shortens the time required to process the articles.

Abstract: The inventive concept provides an apparatus for supporting a substrate. An apparatus for treating a substrate includes a process chamber that performs a predetermined process on the substrate and a reversing unit that reverses the substrate. The reverse unit includes a grip unit that grips the substrate and a drive unit that rotates the grip unit to reverse the substrate gripped by the grip unit. The grip unit includes a first body that supports one of an upper surface and a lower surface of the substrate and a second body that supports the other surface of the substrate. Each of the first body and the second body includes a support protrusion that is brought into contact with the substrate when the grip unit grips the substrate.

Abstract: A device including a plurality of motors is disclosed. The device includes a body comprising a plurality of magnet arrays. Each magnet array comprises a plurality of magnets which define a polygon and the plurality of magnets are arranged in a semi-Halbach configuration. The polygons of the plurality of magnet arrays form a tessellating pattern in which the magnet arrays each share at least one magnet with another one of the magnet arrays. Each magnet is configured to be rotatable relative to the body, or in the case of coils as magnets, the input of each coil can be manipulated to replicate the same or similar effect. The device further comprises a plurality of rotors, wherein each magnet array is configured to receive a rotor rotatable relative to the body.

Abstract: An error measurement device and an error measurement method are provided. The optical measurement assembly of the error measurement device includes a light source, an optical lens, and a photoelectric sensor. The light beam emitted by the light source is transmitted to a sensing area on the photoelectric sensor to form a first optical path illuminating on a first light-spot position of the sensing area. The moving stage is moved by a linear displacement, so that the light beam is transmitted to the photoelectric sensor to form a second optical path illuminating on a second light-spot position of the sensing area. The processor calculates a movement error of the moving stage and controls the actuator to drive one or more of the light source, the optical lens, and the photoelectric sensor to perform a relative motion, so that the light beam illuminates on the first light-spot position again.

Abstract: A substrate transport apparatus having a drive section and a scara arm operably connected to the drive section to move the scara arm. The scara arm has an upper arm and at least one forearm. The forearm is movably mounted to the upper arm and capable of holding a substrate thereon. The upper arm is substantially rigid and is adjustable for changing a predetermined dimension of the upper arm.

Abstract: Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit. The at least one recess is aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base. The sensel is configured to sense a clamping force applied by the cover to the at least one unit.

Abstract: A substrate production, manufacturing, and processing system includes storages with one or more separations that store substrates, loading stations that include robots, opener systems, and a software management system. The storage separations hold first containers that store carriers and the substrates in stacks. Each robot is able to access and move at least one of: the first container, a second container or carrier, and one of the substrates. The opener systems open the first containers such that the carriers and the substrates are able to be accessed by the robots in the loading station, and the software management system assigns at least one category to each stack of carriers and the substrates. The first containers store the substrates with a higher density than the second container or carrier, and the opener systems each include effectors that each hold an individual one of the substrates.

Abstract: Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit. The at least one recess is aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base. The sensel is configured to sense a clamping force applied by the cover to the at least one unit.

Abstract: Embodiments of substrate transfer robot blades to engage and support a substrate during transfer are provided herein. In some embodiments, a substrate transfer robot may include a blade body having a blade support surface; and a plurality of compliant pads, each comprising a contact surface and an opposite bottom surface supported by the body and arranged to support a substrate when disposed on the substrate transfer robot blade.

Abstract: Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit. The at least one recess is aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base. The sensel is configured to sense a clamping force applied by the cover to the at least one unit.

Abstract: Presented herein is a device comprising a device processing boat comprising a base at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit, the at least one recess aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base and having the sensel configured to sense a clamping force applied by the cover to the at least one unit.

Abstract: Provided is a substrate conveyance method where a segment which can simultaneously hold M pieces of substrates defined by an integer M of 2 or more is provided, and a substrate conveyance part can simultaneously convey N pieces of substrates defined by an integer N of 2 or more which is not a divisor of the integer M from the segment or toward the segment. The substrate conveyance part performs a substrate conveyance cycle repeatedly where when N pieces of variables ik defined by integers k of 1 to N are arbitrary integers of 0 or more and not more than (M/N) and satisfy a relationship of M=N×i1+ . . . +1×iN, a conveyance step where a substrate conveyance step of simultaneously conveying (N?k?1) pieces of substrates from the segment or toward the segment by the substrate conveyance part is performed ik times is performed with respect to the conveyance step where the number of times of the substrate conveyance steps is defined by each variable which is a natural number out of N pieces of variables ik.

Abstract: A substrate processing system and substrate transferring method capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system includes a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the bi-directional substrate transferring device have a moving unit inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit in the moving unit, the bi-directional substrate transferring u

Abstract: A load part has a nozzle unit having outlets for generating outflow and/or inflow of gas used for replacing the atmosphere of a wafer storage container, in a direction approximately parallel to spaces between adjacent wafers being stored, are a driving unit for extending the nozzle unit to a door opening portion.

Abstract: An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, only lower circumferential portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, remaining circumferential portions of the substrates. A drive mechanism separates the first support unit and the second support unit when loading and unloading the substrates, and for connecting the first support unit and the second support unit after the substrates are placed in the substrate holder.

Abstract: Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Abstract: To generate a gas-curtain for a load-port-apparatus and to supply a purge-gas into a pod by a single gas source, provided is a gas purge device including: purge nozzles extending along an outer side of side edges of the opening portion; a curtain nozzle arranged above an upper edge of the opening portion; a gas supply pipe arranged in parallel to each purge nozzle, for supplying an inert gas to the purge nozzle and the curtain nozzle, the gas being supplied from the gas supply pipe to the purge nozzle in a direction orthogonal to an extending direction of the gas supply pipe; and a conductance adjusting unit arranged at an end portion of the gas supply pipe, for generating a pressure loss in a gas flow in a configuration in which the gas is supplied to the curtain nozzle at the end portion of the gas supply pipe.

Abstract: To prevent an overload from being imposed on a door drive mechanism when driving a door increased in weight due to upsizing so that reproducibility of a stop position of the door can be ensured, provided is a load port apparatus in which the door drive mechanism for driving the door in a direction perpendicular to an opening-portion forming plane is constituted by: a rotary cylinder capable of pivoting a cam follower from an angle of 0° to an angle of 180°; and a slider including a cam groove capable of housing the cam follower within a plane perpendicular to a rotational axis of the rotary cylinder, the cam groove extending in a vertical direction, and in which the door is supported by the slider.

Abstract: In recent years, frames have gotten larger in size and thinner, and warping of the frames has posed a problem. If a warp of a frame is large, there is a high possibility that fetching the frame may fail. If fetching the frame fails, that is, if the frame cannot be fetched, the lead time of mounting gets longer. Further, the frame that cannot be fetched has to be manually removed by an operator. Therefore, a man-hour increases. According to the present invention, before a loader feeder fetches a frame from a frame magazine, a loader lifter is moved in a Y direction. Thereafter, the loader feeder fetches the frame from the frame magazine.

Abstract: A robot arm apparatus includes an arm mechanism including a base member and a link pivotally connected to the base member for pivotal motion in a horizontal plane through a rotational shaft. The link holds a regular circular transport object at its distal end. The apparatus also includes an edge detector, provided on the base member, that detects two edges of the regular circular transport object as the link pivotally rotates with respect to the base member, a pivotal angle detector that detects a pivotal angle of the link with respect to the base member, and a center position calculator that calculates a center position of the regular circular transport object with respect to the link. The calculation is based on two pivotal angles detected by the pivotal angle detector when the edge detector detects the two edges of the regular circular transport object.

Abstract: A method for fabricating a semiconductor device includes a first step of forming, on a first substrate, a first element region in which a plurality of elements are collectively arranged, a second step of relocating the plurality of elements formed on the first substrate to a holding member in the same arrangement as in the first element region to have the plurality of elements held on the holding member, a third step of rearranging the plurality of elements held on the holding member and having the plurality of elements held on an intermediate substrate, thereby forming a second element region having a shape different from a shape of the first element region on the intermediate substrate, and a fourth step of dispersing the plurality of elements held on the intermediate substrate and adhering the plurality of elements to a second substrate.

Abstract: A method of carrying out a transfer of one or more first components or of a first layer onto a second substrate including: a) application and maintaining, by electrostatic effect, of the one or more first components or of the first layer, on a first substrate, made of a ferroelectric material, electrically charged, b) placing in contact, direct or by molecular adhesion, and transfer of the components or the layer onto a second substrate, and c) dismantling of the first substrate, leaving at least one part of the components or the layer on the second substrate.

Abstract: Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.

Abstract: A substrate support apparatus which can support a substrate having a center hole, comprises a support portion which can support the substrate. The support portion includes a support groove with a cross-sectional shape in which a groove width gradually increases in a counter-gravitational direction, and a width of the support groove between two end portions is larger than a width of the support groove at the center thereof.