Abstract: The present invention is directed to a macrocapsule for encapsulating microcapsules containing biologically active material, such as living cells or free living cells, to make the system more biocompatible by decreasing the surface area and surface roughness of microencapsulated biological materials; increasing mechanical stability of microencapsulated biological materials; enhancing cytoprotectivity by increasing diffusion distance of encapsulated biological material from cytotoxins secreted in vivo; providing retrievability of microencapsulated material; and providing a system of sustained release of the cellular products. The method for producing such a macrocapsule containing the microcapsules is also disclosed.

Abstract: A wire for electric railways comprises a copper alloy which consists essentially, by weight percent, of 0.1 to 1.0% Cr, 0.01 to 0.3% Zr, 0.05 to 0.15% Sn, and 10 ppm or less O, and if required, further contains 0.01 to 0.1% Si, or 0.01 to 0.1% Si and 0.001 to 0.05% Mg, with the balance being Cu and inevitable impurities.

Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

Abstract: The object of the present invention is to provide an abrasion resistant aluminum bronze alloy for sliding members of various industrial machines.The abrasion resistant aluminum bronze alloy consists of Al: 7-12%, Mn: 1.5-5.5%, Si: 0.45-2.7%, respectively in weight, and the rest is substantially Cu, wherein metallic compound of Mn and Si is dispersed among said alloy structure, and elongation percentage is at least 5%.The abrasion resistant aluminum bronze alloy is superior to conventional aluminum bronze alloy (JIS-ALBC2) in seizure resistance and abrasion resistance by more than two times.

Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.

Abstract: A copper base alloy suitable for use as a material of a sliding member, superior in seizure resistance, wear resistance and corrosion resistance. The alloy comprises 1.0 to 3.5 wt % Mn, 0.3 to 1.5 wt % Si, 11.5 to 25 wt % Zn, 5 to 18 wt % Pb and the balance substantially Cu and incidental impurities, the lead being uniformly distributed through the structure of the alloy. The alloy has a microstructure of which matrix is composed of .alpha.-phase alone. The alloy can further contain at least one selected from the group consisting of 0.02 to 1.5 wt % Mg and 0.1 to 1.5 wt % Te and/or at least one selected from the group consisting of 0.5 to 3.0 wt % Ni and 0.3 to 3.0 wt % Al.

Abstract: An age-hardening type special Cu alloy prepared by compounding 0.1 to 5% by weight of Ni, 0.01 to 7% by weight of Si, 0.01 to 10% by weight of Fe, 0.01 to 7% by weight of Ti and 0.001 to 1% by weight of B in Cu as the main component.This alloy is improved in the electrical conductivity, heat-conductivity and mechanical properties such as, in particular, the hardness and resiliency compared to the hitherto known alloys, and is useful for electronic parts.

Abstract: A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %,Ni: 10.0 to 30.0%;Si: 0.5 to 3%;Co: 2.0 to 15.0%;at least one metal selected from the group consisting of Mo, W, Nb and V:2.0 to 15.0%; andthe balance being Cu and unavoidable impurities, and having a structure in which hard phase grains containing 5 vol% or more of silicide of at least one metal selected from the group consisting of Mo, W, Nb and V are uniformly dispersed in an amount of 10 to 60 vol% in a copper-rich matrix, to which 2.0 to 15.0% of Fe and/or 1.0 to 10.0% of Cr may be further added.

Abstract: A laser padding material in accordance with the present invention comprises copper as its main component and at least one, as other contained elements, selected from the group consisting of 1-5 weight % of nickel (Ni), 0.2-5 weight % of silicon (Si), less than 1 weight % of boron (B), less than 2 weight % of phosphorus (P) and less than 3 weight % of manganese (Mn), whereby there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.In accordance with a laser padding method of the present invention, since material powder having such a composition as mentioned above is blown onto a metal base material and at the same time a laser beam is irradiated thereon in an inert gas atmosphere to thereby melt the material powder and form a padded layer, there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.

Abstract: A copper alloy comprising:(A) 0.15-1.0 wt % Fe,(B) 0.05-0.3 wt % P, and(C)(1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or(2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or(3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or(4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si,with the balance being essentially composed of Cu.

Abstract: A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, and the balance of Cu and inevitable impurities. The copper-based alloy connector can withstand use for a long term in a high-temperature and high-humidity environment.

Abstract: A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., the working direction and the direction perpendicular to it. A very thin-walled member can be produced from this spring material since its anisotropy in characteristics is small and will not increase even if the amount of working is increased.The copper base alloy of which this spring material is made consists essentially of 2.2-5% Ti, 0.1-0.8% Co, 0.02-0.5% Cr, 0-0.6% of Ni and/or Fe, 0-0.5% of at least one of Ca, Mg, Zn, Cd, Li, Zr, Si, Mn, Sn and Al, and the balance being Cu and incidental impurities.

Abstract: The invention relates to contact material for vacuum interrupter, and in order to be splendid in the breakdown voltage ability and increase the interrupting ability, a contact material is constituted by containing copper and chromium, and moreover adding one component selected from silicon, titanium, zirconium and aluminum as another component, and is used in a vacuum interrupter.

Abstract: The invention relates to a copper-chromium-titanium-silicon-alloy, which consists essentially of 0.10 to 0.50% chromiun; 0.01 to 0.25% titanium; silicon; the remainder being copper and the usual impurities, wherein the silicon content (a) is more than 0.1-times of the titanium content, (b) when the titanium content is up to 0.099% the silicon content is limited by the equation:Silicon content (%)=0.05%+0.5 titanium content (%),and (c) when the titanium content is more than 0.099%, the silicon content is limited by the equation:silicon (%)=0.149%-0.5% titanium content (%).Because of its excellent properties, the alloy is used as a material for electronic components, in particular semiconductor carriers for transistors, integrated circuits or the like, for plug connectors and parts for electrical systems for cars.

Abstract: This invention pertains to an anode current collector for alkaline electrochemical cells having zinc anodes. An anode current collector made from silicon bronze alloy has improved welding characteristics and has a minimal effect on gassing.

Abstract: Connectors which are essentially, by weight, 85% to 93% copper, with silicon in the amount of 1.5% to 2.5% is disclosed. The balance of the material is zinc, desirably in the range of 5% to 12%. Trace elements of tin, lead and aluminum can be tolerated but should be minimized to less than 0.05%. Ideally the material is 81% to 91% copper, 1.75% to 2.4% silicon and the balance zinc of 6% to 10%. The traces may be 0.05% tin, 0.01% lead, and 0.005% aluminum.

Abstract: Rapid thermal annealing, involving rapid heating to a temperature of between 550 degrees C. and 750 degree C. for between 30 and 90 seconds and rapid cooling, is used to dissolve the precipitates of transition metals which tend to occur in a silicon wafer and to keep such metals in solution after cooling. Such annealing can be used in the manufacture of bipolar transistors to limit the emitter-collector shorting caused by metallic precipitates. It is also useful more generally to improve the leakage current of p-n junctions either in diodes or as parts of bipolar or field-effect transistors.

Abstract: The invention relates to a copper-chromium-titanium-silicon alloy which consists of 0.1 to 0.5% chromium, 0.05 to 0.5% titanium and 0.01 to 0.1% silicon, the remainder comprising copper and usual impurities. Because of its excellent properties as regards electrical and thermal conductivity, mechanical strength, resistance to softening, homogeneity and flexibility, the alloy is employed as a material for electronic components, in particular semiconductor carriers for transistors, integrated circuits or the like, and parts for electrical systems for cars.

Abstract: A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from about 2% to about 4.25% aluminum, from about 0.25% to about 1.2% silicon, from about 5% to about 15% zinc, up to about 5% iron and the balance essentially copper. When iron is included in an amount from about 3% to about 5% and zinc is restricted to a range of from about 8% to about 10%, the alloy is capable of forming the desired structure in the as-cast condition using a process which does not include stirring during casting.

Abstract: A liquid metal ion source for emitting P ions, wherein a Cu alloy which contains at most 25 at. % of P and if necessary, further contains Ag, C or Si, and/or B is melted and fed to an emitter tip so as to generate an ion beam under a high electric field.

Abstract: The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.

Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bead formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.

Abstract: A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.

Abstract: A brazing alloy having a composition consisting essentially of from about 1% to about 3% by weight boron, from about 8% to about 12% by weight silicon, and the balance copper is beneficial in brazing stainless steels and other ferrous metals.

Abstract: NbSn.sub.2 is made by passing NbCl.sub.5 volatilized in an argon stream at 550.degree. C. to liquid tin. The product precipitates as a solid, while the tin chloride by product is carried away by the argon. Nb.sub.6 Sn.sub.5 is made from this NbSn.sub.2 by reacting it with more niobium halide vapor. NbSn.sub.2 or Nb.sub.6 Sn.sub.5 are useful intermediates in making the Al5-structure superconductor Nb.sub.3 Sn.

Abstract: A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.

Abstract: A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of 0.001-1.0% by weight of one or two or more elements as an accessory ingredient or ingredients selected from the group consisting of 0.001-0.1% by weight each of P and As and 0.01-0.5% by weight each of Ti, Cr, Sn, Mn, and Mg.