Copper Containing Patents (Class 420/560)
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Patent number: 6843862Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.Type: GrantFiled: August 17, 2001Date of Patent: January 18, 2005Assignees: Quantum Chemical Technologies (Singapore) Pte Ltd, Singapore Asahi Chemical and Solder Industries Pte LtdInventors: Kai Hwa Chew, Wei Chih Pan
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Patent number: 6837947Abstract: This invention discloses a lead-free Sn—Zn—Al—Ag solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, and the balance of Sn; and a lead-free Sn—Zn—Al—Ag—Ga solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, up to 4.0 wt % of Ga; and the balance of Sn. The lead-free solder alloys of the present invention have better tensile strength and elongation than the conventional Sn—Pb solder alloys. In addition, the lead-free solder alloys of the present invention have a melting point lower than 200° C., which is close to the 183.5° C. of an eutectic Sn—Pb alloy.Type: GrantFiled: January 15, 2002Date of Patent: January 4, 2005Assignee: National Cheng-Kung UniversityInventors: Kwang-Lung Lin, Kang-I Chen, Shou-Chang Cheng, Jia-Wei Huang
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Publication number: 20040262779Abstract: A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.Type: ApplicationFiled: April 15, 2004Publication date: December 30, 2004Inventors: Masazumi Amagai, Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi, Takeshi Tashima, Daisuke Souma, Takahiro Roppongi, Hiroshi Okada
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Publication number: 20040258556Abstract: According to one aspect of the invention, a modified Sn—Ag—Cu, lead-free solder alloy is disclosed. The alloy comprises an additive element selected from the group consisting of Au, Ni, Pd, Fe, Co, Zn, Cr and combinations thereof, present in the alloy in an amount effect to form an intermetallic interface between the alloy a substrate, the intermetallic interface having a composite structure without scallop formation and including Sn islands.Type: ApplicationFiled: October 2, 2003Publication date: December 23, 2004Applicants: Nokia Corporation, Board of Regents, University of Texas SystemInventors: Choong-Un Kim, Jae-Yong Park, Rajendra R. Kabade, Ted Carper, Steven Dunford, Viswanadham Puligandla
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Patent number: 6805974Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.Type: GrantFiled: February 15, 2002Date of Patent: October 19, 2004Assignee: International Business Machines CorporationInventors: Won K. Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Sung K. Kang, Karl J. Puttlitz, Sr., Da-Yuan Shih
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Patent number: 6774490Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.Type: GrantFiled: March 25, 2003Date of Patent: August 10, 2004Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
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Publication number: 20040126270Abstract: Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow.Type: ApplicationFiled: June 3, 2003Publication date: July 1, 2004Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
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Publication number: 20040126269Abstract: A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60-64 mass % of Sn, 0.002-0.01 mass % of P, 0.04-0.3 mass % of Cu, and a remainder of Pb. The solder is particularly suitable for forming a solder bump on a Cu electrode which has been coated with Ni by electroless plating.Type: ApplicationFiled: September 24, 2003Publication date: July 1, 2004Inventors: Iwao Nozawa, Takashi Hori, Daisuke Soma, Takahiro Roppongi
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Publication number: 20040112474Abstract: Lead-free solder balls having a smooth surface and no shrinkage cavities or wrinkles are made of a lead-free solder which comprises, by atomic percent, 3%-6% of Ag, 1%-4% of Cu, 0.01%-2% of at least one element of the iron group and preferably Co, optionally 0.04%-4% of P, and a balance of Sn.Type: ApplicationFiled: October 15, 2003Publication date: June 17, 2004Inventors: Rikiya Kato, Shinichi Nomoto, Hiroshi Okada
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Publication number: 20040115088Abstract: A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5-8 mass % of Cu, 0.01-2 mass % of Co, optionally 0.01-1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001-0.5 mass %, and/or Ag in an amount of 0.05-2 mass % as a wettability-improving element.Type: ApplicationFiled: October 10, 2003Publication date: June 17, 2004Inventor: Tsukasa Ohnishi
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Publication number: 20040062679Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.Type: ApplicationFiled: September 22, 2003Publication date: April 1, 2004Applicant: Senju Metal Industry Co., Ltd.Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Patent number: 6702176Abstract: A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.Type: GrantFiled: December 11, 2001Date of Patent: March 9, 2004Assignees: NEC Toppan Circuit Solutions, INC, Solder Coat Co., Ltd.Inventors: Toshihide Ito, Shiro Hara
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Patent number: 6692691Abstract: A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.Type: GrantFiled: June 29, 2001Date of Patent: February 17, 2004Assignees: Nihon Alimit Co., Ltd., Matsushita Electric Industrial Co., Ltd.Inventors: Tadashi Sawamura, Hisashi Komiya, Tsuguo Inazawa, Fujio Nakagawa
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Patent number: 6689488Abstract: A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetallic compound formed at the interface between the bulk of solder and a Ni or Cu conductor.Type: GrantFiled: February 7, 2002Date of Patent: February 10, 2004Assignee: Taiho Kogyo Co., Ltd.Inventors: Daisuke Yoshitome, Yasuhisa Tanaka
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Patent number: 6687324Abstract: A metallic uranium article having a protective coating of a copper-tin alloy containing from 45 to 50% by weight of copper and from 55 to 50% by weight of tin, said alloy being firmly bonded to the metallic uranium.Type: GrantFiled: July 19, 1951Date of Patent: February 3, 2004Inventors: Ernest R. Boller, Lowell D. Eubank
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Patent number: 6669077Abstract: A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.Type: GrantFiled: September 1, 2000Date of Patent: December 30, 2003Assignee: NEC CorporationInventors: Kazuyuki Kawashima, Yasunori Tanaka
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Patent number: 6660226Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of, Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.Type: GrantFiled: August 7, 2000Date of Patent: December 9, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Hidekiyo Takaoka, Kiyotaka Maegawa
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Publication number: 20030189086Abstract: One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 E C lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.Type: ApplicationFiled: April 9, 2002Publication date: October 9, 2003Applicant: Ford Motor CompanyInventors: Nigel Frederick Clay, Tsung-Yu Pan, Alan Edward Gickler, Frederic Hilaire LePrevost
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Publication number: 20030175146Abstract: A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting range of about 215° C. to about 222° C. The solder alloy is noneutectic, and therefore characterized by solidus and liquidus temperatures, the former being in a range of about 215° C. to about 218° C., while the latter is about 290° C. or more. However, the melting mechanism exhibited by the alloy is such that the alloy is substantially all melted and does not exhibit a “mushy zone” above the effective melting range, enabling the alloy to behave similarly to the SnAgCu eutectic alloy.Type: ApplicationFiled: March 15, 2002Publication date: September 18, 2003Inventors: Shing Yeh, Bradley H. Carter, Curtis W. Melcher
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Publication number: 20030156969Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.Type: ApplicationFiled: February 15, 2002Publication date: August 21, 2003Applicant: International Business Machines CorporationInventors: Won K. Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Sung K. Kang, Karl J. Puttlitz, Da-Yuan Shih
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Publication number: 20030091463Abstract: Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented.Type: ApplicationFiled: October 25, 2002Publication date: May 15, 2003Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
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Patent number: 6555052Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.Type: GrantFiled: March 7, 2001Date of Patent: April 29, 2003Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
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Publication number: 20030044636Abstract: A free-space optical communication apparatus includes a storage unit which stores angle-setting information for the mirror for communicating with each of the plurality of other apparatuses, a mirror driving unit which drives the mirror to an angle corresponding to the stored angle-setting information, an optical detecting unit which, on one occasion for communicating with a specified communication apparatus among the plurality of other apparatuses, detects the incident state of an optical beam sent from the specified apparatus, and a control unit which, based on the detected incident state of the optical beam, determines angle-correcting information for correcting the stored angle-setting information for the specified apparatus, and which, on the next occasion for communicating with the specified apparatus, uses the mirror driving unit to drive the mirror to an angle corresponding to the angle-setting information corrected by the angle-correcting information.Type: ApplicationFiled: August 23, 2002Publication date: March 6, 2003Applicant: Canon Kabushiki KaishaInventor: Tetsuo Sakanaka
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Publication number: 20030021718Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.Type: ApplicationFiled: June 20, 2002Publication date: January 30, 2003Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Publication number: 20030007885Abstract: Lead-free solder comprising Sn, Zn and 0.001 to 0.005 wt. % Ti. The lead-free solder does not contain toxic lead, and has sufficient bonding strength to oxide materials such as glass and ceramics.Type: ApplicationFiled: June 13, 2002Publication date: January 9, 2003Inventors: Shinjiro Domi, Koichi Sakaguchi, Shigeki Nakagaki, Katsuaki Suganuma
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Publication number: 20030007886Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.Type: ApplicationFiled: August 17, 2001Publication date: January 9, 2003Applicant: Quantum Chemical Technologies ( Singapore) Pte Ltd.Inventors: Chew Kai Hwa, Chih Pan Wei
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Publication number: 20030003011Abstract: Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.Type: ApplicationFiled: June 14, 2002Publication date: January 2, 2003Inventors: Rikiya Kato, Shinichi Nomoto, Hiroshi Okada
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Publication number: 20020192106Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderabiliy in solder joints and shows a high resistance to electrode teaching upon soldering or when the resulting soldered article is left at high temperatures.Type: ApplicationFiled: June 25, 2002Publication date: December 19, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Hidekiyo Takaoka, Kiyotaka Maegawa
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Publication number: 20020159913Abstract: A Pb-free solder is provided, which has a satisfactory low melting point and suppresses effectively the “copper leaching” phenomenon. The solder is difficult to be oxidized and has a high wettability. The solder consists essentially of (a) 1.0 to 4.0 wt % of Ag, (b) 0.4 to 1.3 wt % of Cu; (c) at least one of 0.02 to 0.06 wt % (or 0.02 to 0.04 wt %) of Ni and 0.02 to 0.06 wt % (or 0.02 to 0.05 wt %) of Fe; and (d) a balance of Sn. The solder has a copper dissolution rate of 0.20 or 0.15 &mgr;m or less. Preferably, the solder has a liquidus temperature of 240° C. or lower, in which a satisfactory low melting point is ensured. More preferably, the solder has a liquidus temperature of 230° C. or lower. It is preferred that the solder has a viscosity of 2.5 cP or lower.Type: ApplicationFiled: April 23, 2002Publication date: October 31, 2002Inventors: Toshihide Ito, Shiro Hara
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Publication number: 20020150787Abstract: A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetallic compound formed at the interface between the bulk of solder and a Ni or Cu conductor.Type: ApplicationFiled: February 7, 2002Publication date: October 17, 2002Applicant: Taiho Kogyo Co., Ltd.Inventors: Daisuke Yoshitome, Yasuhisa Tanaka
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Publication number: 20020131887Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.Type: ApplicationFiled: March 5, 2002Publication date: September 19, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Hidekiyo Takaoka, Kiyotaka Maegawa
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Publication number: 20020117539Abstract: A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.Type: ApplicationFiled: December 11, 2001Publication date: August 29, 2002Applicant: NEC CORPORATIONInventors: Toshihide Ito, Shiro Hara
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Patent number: 6440360Abstract: The present invention proposes Pb-free soldering alloy which does not contain Pb to prevent the environment from being contaminated by Pb when the soldered product is put on a wasteyard and to enhance the mechanical strength at the soldered joint by the soldering alloy. The Pb-free soldering alloy is characterized in that it contains Cu in 0.05 to 2.0 wt. %, Ni in 0.001 to 2.0 wt. % and Sn in the balance.Type: GrantFiled: March 2, 2001Date of Patent: August 27, 2002Assignee: Tokyo First Trading CompanyInventors: Tadashi Sawamura, Hisashi Komiya
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Patent number: 6371361Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.Type: GrantFiled: February 19, 1999Date of Patent: April 16, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Atsushi Yamaguchi, Tetsuo Fukushima
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Patent number: 6319461Abstract: A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.Type: GrantFiled: January 30, 2001Date of Patent: November 20, 2001Assignee: Nippon Sheet Glass Co., Ltd.Inventors: Shinjiro Domi, Koichi Sakaguchi, Shigeki Nakagaki, Katsuaki Suganuma
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Patent number: 6313412Abstract: A method of assembling a substrate and an electrical or electronic component, the component having electrically conductive leads with surfaces of an alloy from the list consisting of tin, nickel, tin copper, tin silver, nickel palladium, gold palladium, and silver palladium, and the leads being soldered to copper-based terminals of the substrate by a solder alloy, the solder alloy comprising, by weight, 99.3% tin and 0.7% copper. The soldering takes place in a chamber having a nitrogen inert atmosphere. Lead solder is thus avoided.Type: GrantFiled: August 6, 1998Date of Patent: November 6, 2001Assignee: Nortel Networks LimitedInventors: William P. Trumble, Murray W. Hamilton, David Bilton
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Publication number: 20010025875Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.Type: ApplicationFiled: May 16, 2001Publication date: October 4, 2001Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Atsushi Yamaguchi, Tetsuo Fukushima, Kenichiro Suetsugu, Akio Furusawa
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Patent number: 6296722Abstract: A lead-free solder characterized as comprising 0.1 to 2 wt % of Cu, 0.002 to 1 wt % of Ni with the residue being Sn. The solder preferably contains Cu in an amount of 0.3 to 0.7 wt %, and more preferably it contains Cu in an amount of 0.3 to 0.7 wt % and Ni in an amount of 0.04 to 0.1 wt %. The solder can be prepared by adding Ni to a molten mother alloy of Sn—Cu, or by adding Cu to a molten mother alloy of Sn—Ni. A lead-free solder which further comprises 0.001 to 1 wt % of Ga is also disclosed. The lead-free solder can form a solder joint having a high strength and stability comparable to those of a conventional Sn—Pb eutectic solder.Type: GrantFiled: June 28, 2000Date of Patent: October 2, 2001Assignee: Nihon Superior Sha Co., Ltd.Inventor: Tetsuro Nishimura
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Patent number: 6231691Abstract: A Sn—Ag—Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn—Ag—Cu eutectic solder alloy based on the ternary eutectic Sn—4.7%Ag—1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.Type: GrantFiled: February 10, 1997Date of Patent: May 15, 2001Assignee: Iowa State University Research Foundation, Inc.Inventors: Iver E. Anderson, Robert L. Terpstra
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Patent number: 6229248Abstract: The invention provides a solder alloy of Sn, Sb, Ag and Cu, wherein the Sb is about 1.0-3.0 wt %; the Ag is about 1.0 wt % or more and about 2.0 wt % or less; the Cu is about 1.0 wt % or less; and the remainder is Sn. The solder alloy has a comparatively low Young's modulus and sufficient tensile characteristics. Therefore, it resists peeling from the bonded electrode, etc., even though a heat stress is added. Also, a solder which has an excellent solderbility to metal phases such as Cu and Ni can be provided. Therefore, a solder alloy excellent in thermal shock resistance can be provided. The solder alloy may be used for soldering the inside of an electronic component.Type: GrantFiled: February 26, 1999Date of Patent: May 8, 2001Assignee: Murata Manufacturing Co., Ltd.Inventors: Shigemasa Kusabiraki, Manabu Sumita
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Patent number: 6228322Abstract: A lead-free solder composition having superior mechanical strength is produced by adding a rare earth element to a Sn—Ag alloy or a Sn—Ag—Bi—Cu alloy. The rare earth element is Sm, Gd, or a mixture of these elements with other rare earth elements.Type: GrantFiled: September 17, 1999Date of Patent: May 8, 2001Assignee: Sony CorporationInventors: Naoko Takeda, Kazutaka Habu, Kazushi Yamauchi
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Publication number: 20010000321Abstract: A lead-free solder composition having superior mechanical strength is produced by adding a rare earth element to a Sn-Ag alloy or a Sn-Ag-Bi-Cu alloy.Type: ApplicationFiled: November 29, 2000Publication date: April 19, 2001Inventors: Naoko Takeda, Kazutaka Habu, Kazushi Yamauchi
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Patent number: 6204490Abstract: Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20° C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5° C./second.Type: GrantFiled: June 1, 1999Date of Patent: March 20, 2001Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Toshiharu Ishida, Tetsuya Nakatsuka, Hanae Shimokawa, Koji Serizawa, Yasuo Amano, Suguru Sakaguchi, Hiroshi Yamaguchi
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Patent number: 6187114Abstract: This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350° C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 &mgr;m. A substrate and an IC chip (electronic element) are die-bonded substantially in parallel by a solder material provided between an Ni plating on the lower side of an IC chip (semiconductor) and an Ni plating on a die.Type: GrantFiled: October 14, 1997Date of Patent: February 13, 2001Assignees: Matsushita Electric Industrial Co. Ltd., Tanaka Denshi Kogyo K.K.Inventors: Toshinori Ogashiwa, Takatoshi Arikawa, Masami Yokozawa, Kazuhiro Aoi, Yoshiharu Sawada
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Patent number: 6180055Abstract: A lead-free solder which is comprised of three elements Sn-Cu-Ni. Cu and Ni are 0.1-2 wt % and 0.002-1 wt % respectively. Preferable weight percentage of Cu and Ni are 0.3 to 0.7 percent and 0.04 to 0.1 percent respectively. Both methods of additive Ni to a base alloy of Sn—Cu and additive Cu to a base alloy of Sn—Ni are applicable.Type: GrantFiled: November 24, 1999Date of Patent: January 30, 2001Assignee: Nihon Superior Sha Co., Ltd.Inventor: Nishimura Tetsuro
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Patent number: 6179935Abstract: A solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Ag≦4.0; 0<Cu≦2.0; 0<Ni≦1.0; and 0<Ge≦1.0, wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film. Additionally, a solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Sb≦3.5; 0≦Ag ≦4.0; 0<Ge≦1.0; and at least one first additive selected from the group consisting of (a) 0<Ni≦1.0 and (b) a combination of 0<Ni≦1.0 and 0<Cu≦1.0; wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film.Type: GrantFiled: April 14, 1998Date of Patent: January 30, 2001Assignee: Fuji Electric Co., Ltd.Inventors: Mitsuo Yamashita, Shinji Tada, Kunio Shiokawa
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Patent number: 6176947Abstract: Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215° C.Type: GrantFiled: October 12, 1999Date of Patent: January 23, 2001Assignee: H-Technologies Group, IncorporatedInventors: Jennie S. Hwang, Zhenfeng Guo
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Patent number: 6158350Abstract: The instant invention is a lightweight enhanced velocity bullet consisting of a hollow cylindrically shaped metal jacket component made of brass, the body of which is filled nearly to capacity with a malleable tin-copper-silver alloy material and with the body having a flattened posterior end and with there being a second end anterior to the body which said second end is hollow within, devoid of any alloy material and tapering symmetrically to a blunt point.Type: GrantFiled: May 28, 1999Date of Patent: December 12, 2000Inventor: Valentino Pulcini
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Patent number: 6139979Abstract: A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the workpiece so as to be electrically and mechanically bonded to the transition metal conductor. The lead-free solder and soldered article barely cause electrode erosion during soldering or during aging after soldering, and have high tensile strength and thermal impact resistance.Type: GrantFiled: April 9, 1999Date of Patent: October 31, 2000Assignee: Murata Manufacturing Co., Ltd.Inventors: Hidekiyo Takaoka, Kiyotaka Maegawa
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Patent number: 6096245Abstract: Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.Type: GrantFiled: August 7, 1998Date of Patent: August 1, 2000Assignee: Aisin Seiki Kabushiki KaishaInventors: Tsuyoshi Tanigaki, Shogo Izawa, Akikazu Matsumoto, Tadahiko Kohama