Abstract: The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a solder braze alloy. The novel alloy is characterized in that it comprises 1-10% by weight of an element or a mixture of elements of subgroup IVa and/or Va of the Periodic Table of the Elements and 0.1-20 wt% of an element or a mixture of elements of the group of the rare earths and the remainder consists of zinc, lead, tin, bismuth or indium or a mixture predominantly of two or more of the elements zinc, lead, tin, bismuth and indium and optionally of the elements silver, copper, gallium, antimony, nickel, manganese, chromium, cobalt possibly of customary impurities.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.

Abstract: Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper.

Abstract: Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.

Abstract: Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.

Abstract: Disclosed are a composite material having an anti-wear property and a process for producing the same. The composite material includes a matrix of a low melting point Sn alloy having a melting point of from 80.degree. to 280.degree. C., and metallic dispersing particles dispersed in the matrix in an amount of from 10 to 50% by volume. When the composite material is utilized to make a rough mold for preparing a prototype, it sharply improves the anti-wear property of the rough mold, and it can be re-used for a plurality of times without adversely affecting the sharply improved anti-wear property. The composite material provides the advantageous effect best when the metallic dispersing particles are Fe--C alloy dispersing particles and/or Fe--W--C alloy dispersing particles which were subjected to a surface treatment including an Sn or Ni electroplating followed by a ZnCl.sub.2.NH.sub.4 Cl flux depositing.

Abstract: Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are available wherein a solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a low melting point metal component having a melting point of about 70.degree. C. or less and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.

Abstract: We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising at least 40% by weight Bi, between 40% and 60% Sn, and between 0.05 and 1% Ag is effective to increase the total elongation of the solder by at least 20% under the same processing conditions. Moreover the solder is free of undesirable Ag-containing phases with a melting point in excess of the 183.degree. C. melting point of the Pb--Sn binary eutectic alloy. In a preferred embodiment, the composition comprises 54.75% Bi, 45% Sn, and 0.25 % Ag.

Abstract: Nanometer-scale crystals of III-V semiconductors are disclosed, They are prepared by reacting a group III metal source with a group V anion source in a liquid phase at elevated temperature in the presence of a crystallite growth terminator such as pyridine or quinoline.

Abstract: In measuring a cooling curve by means of thermal analysis of cast iron, a compressed powder moulding or sintered moulding of tellurium, bismuth, boron, zinc and/or aluminum is fixed to the inner surface of a cooling curve measuring cup, and a melt is poured into said cup when primaly crystalized and eutectic temperatures based on the metastable solidification of iron, cementite and silicon cleary appear. This method allows the carbon equivalent, carbon content and silicon content of the cast iron to be determined and the physical and mechanical properties of the iron to be estimated. Additionally, said compressed metallic powder moulding or sintered moulding is arranged at and fixed to said cooling curve measuring cup used in the method, while enclosing a thermocouple.

Abstract: The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.

Abstract: An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking.

Abstract: In a process of producing strip or wire, which consists of a monotectic aluminum-silicon alloy comprising a matrix consisting of aluminum and an aluminum-silicon eutectic system and as a minority phase 1 to 50% by weight lead or bismuth included in said matrix, which strip or wire has been continuously cast at a high casting velocity and a high cooling rate from a molten material which has been heated to a temperature above the segregation temperature, and which strip or wire has been subjected to plastic deformation and to a heat treatment, the minority phase which is embedded in the form of elongate platelets in the strip or wire is transformed to more compact shapes by a heat treatment at temperatures of 550.degree. to 600.degree. C.

Abstract: Lewis base-borane complexes such as (CH.sub.3).sub.2 S.BHBr.sub.2 are utilized as molecular precursors for the formation of both bulk powders, films and coatings of boron nitride. The complexes are subjected to slow heating under an ammonia atmosphere to displace the base and pyrolyze the resulting complex to BN. Analogous processes may be used to prepare Group IIIA-VA compounds of the formula MM' where M is selected from the group consisting of B, Al, Ga, In, and Tl, and M' is selected from the group consisting of N, P, As, Sb and Bi.

Abstract: A unique class of bonding alloys and methods for their use are provided which enable the user to electrically join superconductive materials to themselves, to normal conductive materials, or to semi-conductors. The bonding alloys have enhanced wetting properties and a melting point less than 100.degree. C. in all instances. The bonding alloys are unusual and advantageous in that they create an intimate, direct, mechanical and electrical contact between the superconductive material and any other electrical conductor while minimizing mechanical and chemical stresses and avoiding alterations to the superconductive material itself.

Abstract: An electroplating bath, cell and method for the electrodeposition of a wide range of tin-bismuth alloys onto a conductive substrate comprises tin and bismuth ion in aqueous solution, and an alkyl sulfonic or polysulfonic acid or salt as the electrolyte. The sulfonic component is present in amounts sufficient to maintain the bismuth in solution.In the operation of the method of the invention, electroplated tin-bismuth eutectic alloys of controlled composition are obtained. The alloys of tin and bismuth contain amounts of both metals such that the plated alloy has a melting point substantially lower than that of either metal alone, and a melting point lower than that of a tin-lead alloy.

Abstract: this invention relates to an alloy material for data storage of magneto-optical disk (ADSMO), as well as its manufacturing process. ADSMO is based on manganese, bismuth and doped with aluminum atoms and silicon atoms or by aluminum atoms and boron atoms. The above mentioned elements are deposited onto a transparent substrate in a certain sequence using an evaporation process or sputtering process, and then compact hexagonal cyrstalline structures are formed after being annealed in vacuum. ADSMO has a large magneto-optical Kerr rotation, a small size of crystal grains and a stable structure; its manufacturing process is easy and simple.

Abstract: Directional solidification of Bi and Mn compositions to produce magnetic single domain size MnBi particles with aligned morphologies.

Abstract: This invention relates to a method of manufacturing thermoelectric material which has the steps of quenching a thermoelectric alloy in a molten state at a quenching rate higher than 10.sup.3 .degree. C./sec into a membrane or powdery form and subjecting the membrane or powder to cold-forming or sintering. The thermoelectric alloy is a Bi--Sb series alloy having a composition represented by{(Bi.sub.100-x .multidot.Sb.sub.x).sub.100-y .multidot.E.sup.II.sub.y }.sub.100-z .multidot.E.sup.I.sub.zwhere E.sup.I represents a group III or group IV element, E.sup.II represents a group IV or group VI element, x represents a number of 5-20, y represents an integer of 0-20 and z represents a number of 0.05-10, respectively.

Abstract: The disclosed invention includes improved devices and materials for thermoelectric conversion, particularly for operation at temperatures of 300.degree. C. and below. Disordered p-type semiconductor elements incorporate compound adjuvants of silver and lead to achieve enhanced "figure of merit" values and corresponding increased efficiencies of thermoelectric conversion. Similar results are obtained with disordered n-type elements by employing lowered selenium contents, preferably in combination with cuprous bromide.Improved conversion devices include powder pressed elements from one or both of these materials.

Abstract: A bismuth-lead alloy containing lesser amounts of tin, antimony and zinc has been developed for use as a fusible metal, and particularly as a jewel metal alloy. The alloy meets the standards set by presently available jewel metals, has a lower melting temperature, better casting properties, and is less expensive than currently used alloys.