Abstract: A method of manufacturing a lens having a lens body integral with a functional sheet on one side thereof, includes an insert molding process including the steps of: placing the functional sheet as an insert in position in a mold defining a suction hole therein; and while attracting the functional sheet against a molding surface of the mold by a peripheral portion thereof by suction through the suction hole, supplying to the mold a molten plastic material for forming the lens body, to form the lens.

Abstract: The present invention provides an integrated, fully automated, high-throughput system for two-dimensional electrophoresis comprised of gel-making machines, gel processing machines, gel compositions and geometries, gel handling systems, sample preparation systems, software and methods. The system is capable of continuous operation at high-throughput to allow construction of large quantitative data sets.

Abstract: An apparatus for producing rollers covered with layers of elastic silicone-based material, including: a base frame; a hollow box-like cylindrical support-mold rotatably mounted on the base frame about a longitudinal axis,of the support-mold; a device for rotating the support-mold about its longitudinal axis; a hollow prepared and coverable cylindrical perforated supporting structure which is removably insertable coaxially and snugly inside the support-mold so as to provide a perimetric seal between opposite ends of the supporting structure and the support-mold and so as to define a sealed interspace between the outer surface of the supporting structure and the inner surface of the support-mold; slides mounted on the base frame; a device, slidably mounted on the slides, for introducing elastic silicone-based material inside the supporting structure such that upon rotation of the support-mold the elastic silicone-based material travels through the perforated supporting structure from the inside of the supportin

Abstract: The invention relates to a method and apparatus for providing a casing for a sensor which is to be thin-walled in places. The principle of the invention is to align the sensor circuit precisely and completely seal it in plastic using separately actuatable support devices and a slowly curing plastic.

Abstract: According to the invention, a novel guide member for integrally forming the fastening parts with the urethane mold and an integral molding method using the guide member are provided. The guide member includes a guide body that has an extended body which includes concave cross-section and at least one open end (4, 7), and isolation members (5, 6) provided near the ends of said guide portion. The isolation members are detachable, and by engaging with the fastening surface of the fastening parts, they effectively block any seepage of liquid foaming raw material. With the integral forming method using said guide member of the invention, it is possible to embed the ends of the fastening parts within the urethane molding and to improve its peeling strength at low cost.

Abstract: A composite camel structure includes an elongate hollow, rigid cylindrical core, opposite ends of the core having respective caps sealingly connected thereto, a buoyant material of cured urethane foam substantially filling the core and being sealingly enclosed therein. A cushion is thermally bonded to and sealingly surrounds the core, the cushion having a substantially unbroken outside surface, being formed of a polymeric component consisting of polyethylene being at least 80 percent low-density polyethylene, and a process additive component including an effective amount of an ultraviolet inhibitor. A pair of parallel-spaced, transversely oriented guides extend between opposite sides of the cushion in axially spaced relation to the core, each guide defining a guide opening through the cushion for receiving hawser chains whereby the camel structure rides up and down with the tide.

Abstract: An improved elastomeric mold for use in fabricating microstructures, the mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including an access opening or filling member that extends through the mold to the first surface and communicates with the recessed microchannel. The mold is used by placing it onto a substrate with the recessed microchannel facing the substrate. The access opening of the mold is filled with a liquid material which is capable of solidifying. The access opening continuously introduces the liquid material into the space defined between the microchannel and the substrate. After the liquid material solidifies, the mold is removed from the substrate thereby leaving a microstructure formed from the solidified liquid material on the substrate.

Abstract: A specimen processing method and cassette utilizes an open-topped, perforated collection cradle (12) and a flat, perforated embedding pedestal (10) which snap together in a male/female relationship to enclose and orient a specimen (14) during chemical processing. After chemical processing, the embedding pedestal (10) enables a specimen to be embedded in exactly the same plane as the cutting plane of a microtome during sectioning. This minimizes the number of sections required for histologic evaluation and eliminates the need for mechanical handling of the tissue specimen after its initial collection.

Abstract: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

Abstract: A composite molded product has a main body molded of a base material of a thermoplastic resin and defining at least one through opening. A porous skin material is integrated with the main body by thermal fusing. At least one rib is formed on the surface of the skin material at a position corresponding to the position of at least one through opening. At least one rib is integrated with the main body through porous structure of the skin material.

Abstract: A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.

Abstract: The present invention provides an integrated, fully automated, high-throughput system for two-dimensional electrophoresis comprised of gel-making machines, gel processing machines, gel compositions and geometries, gel handling systems, sample preparation systems, software and methods. The system is capable of continuous operation at high-throughput to allow construction of large quantitative data sets.

Abstract: A mold for BGA semiconductor packages which includes a height adjusting member adapted to adjust the height of the top cavity insert of the top mold or the bottom cavity insert of the bottom mold, an elastic member disposed between the height adjusting member and associated insert, clamping regions of different heights formed at its top or bottom cavity insert, or air vents having a width and depth of an optimum ratio to the area and depth of cavities, thereby being capable of maintaining an optimum and uniform clamping pressure between the top and bottom molds for a variety of PCB strips having a thickness deviation among different portions thereof or having various average thicknesses, upon molding resin encapsulants on those PCB strips, thereby achieving an improvement in the quality of finally produced packages while preventing a sweeping phenomenon of bonding wires electrically connecting a semiconductor chip to conductive traces.

Abstract: A mold system for encapsulating substrate-mounted ICs comprises a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation.

Abstract: In order to prevent the formation of flash on a gasket used to seal a filter element when the filter element is mounted in a housing to filter a fluid, such as air for an internal combustion engine, a molding method and apparatus utilizes a pair of mold components which abut along a mold line and define a cavity for forming the gasket. As the expandable material expands to fill the cavity and form the gasket, a portion of the material adjacent the mold line is received in an annular groove in one of the mold components so that flash is not formed at the mold line. One of the mold components also has an upwardly sloping ramp surface so that air and gas move along the ramp surface as the material expands and does not become trapped in the cavity, thus avoiding defects and blemishes in the gasket due to trapped air bubbles.

Abstract: A fixture for encapsulating microelectronic devices includes a structure defining a device-receiving pocket and a well communicating with the pocket so that the passage and well define an interior space whereby the pocket is disposed above the well when the structure is in a first orientation and the well is disposed above the pocket when the structure is in a second orientation. The fixture also includes an element for sealing the interior space and a port for connecting the sealed interior space to an evacuation device.

Abstract: The present invention is directed to a cassette for use in the preparation of small specimens for histological examination. While the cassette of the present invention is particularly adapted for use with small specimens, it is equally suitable for use in the processing of large specimens. The cassette includes an open container having a bottom wall, two side walls, a front wall and a back wall. The bottom wall has a plurality of first apertures disposed in the wall for passage of fluid through the cassette in a direction orthogonal to the plane of the bottom wall. At least two of the other walls also have a plurality of second apertures for the passage of fluid through the cassette in a direction parallel to the plane of the bottom wall. Each of the back wall, side walls and front wall are disposed at an angle outwardly from the bottom wall. All of the apertures of the cassette bottom, top and inner side walls have a longest dimension no greater than about 0.5 mm.

Abstract: A mold press includes an upper mold carrier mounted to slide up and down along an upright mold press frame and to rotate about a horizontal rotation axis. The mold press frame is supported on a mold press base to tip forward and aft about a horizontal upper mold pivot axis disposed parallel to and below the rotation axis. A lower mold carrier is supported on the mold press base below the upper mold carrier and above the upper mold pivot axis. The lower mold carrier includes a lower mold mounting plate that is pivotally supported on the mold press base for tipping motion along a hinged edge about a lower mold pivot axis that lies parallel to and below the rotation axis and above the upper mold pivot axis. An electronic motion controller may be programmed to coordinate the reciprocating, tipping and rotating motions to accommodate a variety of mold/retainer configurations.

Abstract: The present invention relates to an apparatus for forming semiconductor chip packages which is able to compensate for the flatness of substrates and the true straightness of edges of substrates, which substrates are inserted in molds in a forming process of semiconductor chip packages. According to the present invention, the semiconductor package strips excellent in surface flatness and side straightness of a substrate can be manufactured, because the thickness deviation and the side nonuniformity of a substrate can be compensated for in the resin molding process of the semiconductor package by use of a forming apparatus which comprises the individual cavity blocks, elastically mounted so as to float up and down, and the elastic pressing members, mounted on one end of the upper and lower chases.

Abstract: The fish bait molder is a two element mold in which one mold element is inserted into the other in a manner that the fish bait molder may be opened and closed. Each mold element has a portion of a mold cavity such that when the two mold elements are closed together a mold cavity is formed. An access port is contained in one of the two mold elements to allow insertion of a fish hook and removal of a baited fish hook. A slot is provided to allow a fish line to protrude out of the fish bait molder. There is a bait holder with a bait cavity attached to one of the mold elements. The bait cavity is filled with fish bait and a piston slides in the bait cavity to force the fish bait through an inlet passage into the mold cavity and around the fish hook. The piston can be operated by rotating the bait holder into a fish bait container having a threaded lid or rotating a rotational injector with a piston attached into the bait cavity. A ratchet mechanism may also be used to force the piston into the bait cavity.

Abstract: An apparatus for producing a fiber reinforced synthetic resin provides a fiber feed passage through an outer chamber to which the synthetic resin for feed. A feed passage for the fiber extends concentrically in this chamber and has a tubular formation of a diameter less than that of a cleaning piston which is displaceable in the annular space between this tubular formation and the inner wall of the chamber.

Abstract: A molding die set includes an upper die having an upper cavity; and a lower die including a lower cavity to be arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity. The lower cavity is provided with a projection region which is projecting inwardly. The gate is arranged to be extending in the projection region.

Abstract: Apparatus for processing tissue samples for histological examination comprises a cassette defining a chamber to receive a tissue specimen and having an opening to allow processing fluids to enter and leave the chamber and to allow, eventually, molten wax to enter the chamber for embedding the tissue sample. The apparatus incorporates a temperature-sensitive valve mechanism for closing said opening once the cassette, with the tissue specimen therein, has been immersed in a container of hot molten wax, so that the wax can be retained in the cassette, around the specimen, when the cassette is withdrawn from the molten wax container, until the wax around the specimen has solidified. The temperature sensitive valve mechanism may comprise a shape-memory element.

Abstract: A method of molding golf balls using an injection mold. The golf ball includes a plurality of dimples closely distributed on the surface of the ball. The injection mold for golf balls including a pair of separable mold segments (12, 12) defining a spherical cavity (22) when mated along a parting line (PL). A plurality of hollow tubular gates (20) are disposed in the surfaces of the mold segments to be mated along the parting line and in fluid communication with the cavity. Each gate (20) has a non-circular cross section at its outlet. Opposed portions (20-1, 20-2) of the gate cross section separated by the parting line (PL) have an equal area. A stock material is injected into the cavity through the gates to mold a golf ball.

Abstract: An improved golf ball injection mold is characterized by upper and lower support plates each containing corresponding hemispherical cavities which define spherical mold cavities when the plates are brought together. A plurality of retractable core pins are arranged in each cavity for supporting a core of a golf ball. A runner within the plates delivers fluid thermoplastic material to each cavity to form a cover on the golf ball core supported therein, and a cooling channel is provided adjacent to each cavity to provide even cooling of the thermoplastic material. Independently operated ejection assemblies are provided for the golf ball and for the residual thermoplastic material in the runner. With the improved ejection mold, the size and roundness of the golf ball and the surface configuration of the golf ball cover are more consistent and the molding time is reduced.

Abstract: A temperature sensor forming method and forming die are provided which perform insert-forming of a temperature sensor with a minimum of processes and in a short time. The temperature sensor formed has a temperature sensing element 1 arranged in a predetermined position inside a resin case 2. The process does not leave traces of pins that would allow water to penetrate the interior of the case. The process comprises a first step of supporting the temperature sensing element 1 with first and second slide blocks 6c and 6g. The process comprises a second step of injecting a molten forming resin 2a into a forming die 6 and retracting the first slide block 6c by injection pressure while the temperature sensing element 1 is being supported by the second slide block 6g. The process comprises a third step of retracting the second slide block 6g while injecting the molten forming resin 2a into the forming die 6.

Abstract: A passenger seat comprising: a frame element, vehicle anchorage means connected to the frame element, a seat body comprising a resilient material fixed with respect to the frame element and trim cover attachment means, the trim cover attachment means comprising a relatively high density, rigid foam member having a groove disposed in a surface thereof, the groove capable of receiving connection means comprised in a trim cover. A process, system and mold for producing a passenger seat are also described.

Abstract: A mold for manufacturing a steering shaft formed with inner and outer shafts which are telescopically contractible on impact is disclosed. The mold includes an outer shaft supporting mold portion and an inner shaft supporting mold portion that respectively receive the outer and inner shafts in a telescoped position. A first molten resin injection guide portion formed in the outer shaft supporting mold is located in alignment with a hole formed in the outer shaft and a circumferential groove formed in the inner shaft to enable injection of resin through the hole into the groove. A second molten resin injection guide portion communicates with a first opening formed between the outer and inner shafts to enable injection of resin material into this opening to fix the shafts in concentric alignment with each other.

Abstract: Pre-stressed concrete railroad ties are manufacture by the slip form process in the absence of mold members, other than the slip form itself. Tie casting occurs on a portable casting soffits between portable soffit anchored deadmen supporting the pre-stressed tie tensile members immediately overlying the casting soffit. Tie formation occurs with the slip form passing around and over the pre-stressed tension members. Track fastening hardware is vibrationally inserted through windows of the slip form to place the track fastening hardware to precise measured dimension along the route of slip form movement and to configure that portion of the tie adjacent the track fastening hardware. End of tie locations as well as tie batch identification are likewise marked during the slip form process. Upon cure, the ties are cut at their marked end location.

Abstract: A system for filling a gap between jacket ends at a joint between two lengths of jacketed pipe is disclosed, comprising: a mold and two pairs of side straps encircling the mold. The mold comprises a sheet of material having first and second ends and opposing side edges, the sheet including a pair of slots cut into the side edges at a predetermined distance from the second end and defining a flap. One pair of straps encircles the mold but passes under the flap through the slots. The second pair of straps encircles the mold and passes over the flap. The mold is positioned around a pipe joint so as to define an annular gap and an infill material is placed in the gap.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: Molds for injection molding tire components have controlled temperature passages leading to a manifold surrounding each mold cavity. The manifold is positioned to minimize weld lines in the injected tire component. In addition, a narrow gate opening between the manifold and mold cavity provides an elevated temperature of the injected material for decreasing the curing time of the tire component in the mold. Blade members may support and position tire components such as bead apex assemblies in the mold. These tire components may be unloaded by an unloader ring in communication with a source of vacuum for pulling the tire component out of the mold.

Abstract: After a thermoplastic synthetic resin has been injection molded onto a transfer plate in a thermoplastic injection mold, the transfer plate is shifted into a silicone injection mold maintained at a high temperature and a silicone member is injection molded onto the thermoplastic member. The heat transfer to the thermoplastic body is minimized by, for example, providing insulating material between heated portions of the mold system and other portions thereof and/or by maintaining air gaps from which the silicone is excluded between the thermoplastic member and heated portions of the silicone injection mold.

Abstract: A water and oil impermeable geosynthetic clay liner is formed by supporting a layer of bentonite on an impermeable plastic layer. Integrally formed protrusions extend from one surface of the plastic layer to support a permeable plastic cover layer. The cover layer confines the bentonite clay layer and is heat sealed to the protrusions.

Abstract: A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: Brackets for holding a porous tube in a fixed position in a surrounding production mold material, which production mold is used in non-pressurized slip casting for forming vitreous china products, and to molding systems in combination with the brackets. The bracket is angled to provide first and second leg portions of elongated dimensions. The first leg portion is comprised of a magnetic material for removably adhering to magnets embedded in a case mold section for forming the production mold. Thus, the elongated dimension of the first leg portion corresponds to that which provides an adhering relationship to the embedded magnet. The second leg portion comprises a receptacle for holding a porous tube. In one embodiment of the invention, the receptacle is an aperture whereby the porous tube is threaded. In another embodiment, the receptacle is a depression whereby the porous tube snaps into position.

Abstract: There is provided a mold die set for molding a package body which is composed of a lead frame and a semiconductor chip mounted on the lead frame, and the lead frame has a hole. The mold die set is composed of an upper mold die and a lower mold die and the package body being clamped by the upper mold die and the lower mold die. The lower mold die includes a runner section, a table section connected to the runner section and protruding from a bottom of the runner section, a lower concave section connected to the table section, and a lower gate disposed between the table section and the lower concave section.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: A mold system for encapsulating substrate-mounted ICs includes a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation.

Abstract: A mold device for resin-packaging semiconductor devices is provided which includes a first cavity block having a first molding cavity, a second cavity block having a second molding cavity in corresponding relation to the first molding cavity, and a gate for injecting a resin material into the first and second cavities through a runner. The gate is defined between an opposed pair of first and second gate pins at a corresponding corner portion of each molding cavity. The first gate pin is removably insertable into the first cavity block, whereas the second gate pin is removably insertable into the second cavity block. Further, the gate is directly open to both of the first and second molding cavities.

Abstract: A molding die has a plurality of cavity groups each occupying four corners of a rectangular area for accommodating semiconductor chips mounted on a lead-frame, pots each occupying a central area of the rectangular area and a plurality of runner groups each having straight runners equal in length and connecting the pot to the cavities in the four corners, and molten resin concurrently reaches the cavities in the four corners so as to produce semiconductor devices without non-filling or partially filling cavity.

Abstract: An apparatus for making an encapsulated shelf assembly includes a mold defining a mold cavity. A shelf panel and a shelf support bracket extend partially into the mold cavity. The shelf support bracket is spaced from the sides of the mold by the head of a post on one side and a nut on the other side. The post head and nut are partially encapsulated by a moldable material injected into the mold cavity. The nut and post head are removable from the mold cavity with the encapsulated shelf assembly.

Abstract: A mold for molding a semiconductor package which is capable of guiding a resin material for encapsulating a semiconductor device uniformly into the cavity and prevents the island portion of the support member from being exposed from the molding main body, the mold comprising a pair of mold members for encapsulating a semiconductor device held on the support member, and a gate for guiding a molding resin material into the cavity, the gate being provided in the parting face of parting face of at least one of the mold members, wherein the gate is defined by a U-shape groove including the slanted bottom face inclined at an elevation angle toward the cavity to orient the flow of the resin material, supplied to the gate, toward the half of the cavity defined by the other mold member from the gate, and wherein in the slanted bottom face, there is provided an auxiliary groove for making the resin material, generally guided along the slanted bottom face, partially oriented to a direction different from the direction o

Abstract: The present invention is directed to a system for providing an embedded tissue specimen subsequent to fluid treatment of the specimen and preparatory to histological examination. The system includes the combination of a cassette for use in the preparation of tissue specimens for histological examination and an embedding mold having a first cavity for receiving the treated specimen and a second cavity for receiving the cassette. The system includes means for dispensing a predetermined amount of molten wax into the embedding mold.

Abstract: A resin encapsulating molding die for manufacturing a semiconductor device includes a cavity piece having a cavity on which a lead frame with a mounted semiconductor element may be placed, with the semiconductor element in the cavity, and a gate piece having a gate portion including a sub-runner through which a molten resin for encapsulating the semiconductor element is introduced into the cavity, the gate piece being detachable from the cavity piece. The molding die also includes a sealing dam disposed adjacent the sub-runner for blocking flow of molten resin from the sub-runner toward leads of the lead frame. The sealing dam may be a clamp structure for clamping the leads closest to the gate portion, the sealing dam and cavity piece may be a continuous unitary structure, and the sealing dam may have a parting surface substantially coplanar with a parting surface of the cavity piece.

Abstract: There is disclosed a mold for molding a box-shaped product which is open at one side face thereof, and has a resilient insert extending into an interior of the product through a side face of the product opposite to the opening. The insert has a convex portion formed on one surface thereof. A mold cavity is defined by a pair of metal mold halves and a pair of slide cores. The mold halves form an outer shape of the product, and the slide cores form an inner shape of the product. One of the slide cores has a recess for receiving the convex portion of the insert. In the molding, after a resin is cured, the other slide core is retracted before the metal mold halves are opened apart from each other, and then the one slide core with the recess is retracted.

Abstract: A molding die for sealing a semiconductor element with a resin includes an upper and a lower mold half. A leadframe having a resin passage aperture is sandwiched between the lower mold half and the upper mold half. The lower mold half has a lower runner space, a lower cavity, and a lower gate provided between the lower runner space and the lower cavity. The upper mold half has an upper resin well, an upper cavity, and an upper gate provided between the resin well and the upper cavity. The length of the upper resin well in the direction of the flow of resin is equal to or greater than the distance from the lower gate to the front edge of a lower runner rising slope, to thereby obtain a final product which is free from resin burrs formed in the upper resin well.

Abstract: A mold for encapsulating a transformer coil assembly in thermoplastic rubber includes a bottom mold portion having a mold cavity, an upstanding pin disposed within the mold cavity, a mold cover for closing the mold cavity, and a vent space positioned in the bottom surface of the mold cavity for venting gas within the mold cavity to the exterior of the mold during the injection of thermoplastic rubber into the mold cavity.

Abstract: The invention is to a transfer mold design utilized with conventional transfer encapsulation. The design utilizes a varying runner cross section with an intermediate varying depth well or reservoir from which a constant gate depth and gate entry angled to the mold cavities is employed. The method and apparatus of the invention is applicable to single and multiplunger molding utilizing thermoset and thermoplastic encapsulants for semiconductors.