Coacting Pressure Means Patents (Class 425/128)
  • Patent number: 9656320
    Abstract: A method and apparatus for simultaneously producing a first piston part and a second piston part via a forging device may include an upper die, at least one intermediate die, and a lower die. A first billet may be placed between the upper die and the intermediate die, and a second billet may be placed between the intermediate die and the lower die. The upper die and the lower die may be configured to be moved toward each other, whereby the first piston part is forged from the first billet and the second piston part is forged at the same time from the second billet. The upper die and the lower die may then be configured to be moved apart, and the piston parts may be removed.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: May 23, 2017
    Assignee: Mahle International GmbH
    Inventors: Klaus Keller, Rainer Scharp
  • Patent number: 9481279
    Abstract: A seat hack frame (100) for a vehicle made of a fiber-reinforced composite material containing a thermoplastic resin matrix and a reinforcing fiber, the seat back frame (100) including a seat back frame body (1), a metal plate (3) welded to the seat back frame body (1) at a reclining device (2) attaching position, and a metal reclining device (2) weld joined to the metal plate (3).
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: November 1, 2016
    Assignees: Johnson Controls Technology Company, Teijin Limited
    Inventors: Atsushi Sano, Yutaka Yagi
  • Patent number: 8827686
    Abstract: The present invention provides an imprinting apparatus or an imprint transfer method in which uniformity of curing quality by UV light is maintained and a uniform application thickness of a UV curable resin is achieved, even if glass is contaminated with dust and/or smudges or has a flaw.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: September 9, 2014
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Toshimitsu Shiraishi, Naoaki Yamashita, Masashi Aoki
  • Publication number: 20140203468
    Abstract: The present disclosure pertains to resins/filler composites that are formed via a resin infusion process. Certain embodiments are directed to methods and systems that may be used to produce a moulded composite article. An exemplary method comprising: a) filling to a predetermined level a mould tool with particles; b) infusing a resin composition into the mould tool filled with the particles in order to form a composite; c) vibrating the mould tool for a portion of time at one or more of the following stages: during the filling with the particles, after the filling with particles, during the infusing of the resin composition and after the infusions of the resin composition; wherein the composite comprises between 10% to 50% by weight of the resin composition and between 50% to 90% by weight of the particles; and d) curing the composite to form a moulded composite article.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 24, 2014
    Applicant: WEIR MINERALS AUSTRALIA LTD
    Inventors: Edward Humphries, Geoff Germon
  • Patent number: 8684718
    Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 1, 2014
    Assignees: Towa Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Tetsuya Yamada, Tomoyuki Gotoh
  • Patent number: 8556611
    Abstract: A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: October 15, 2013
    Assignee: Xerox Corporation
    Inventors: Bryan R. Dolan, Peter J. Nystrom, Gary D. Redding, Mark A. Cellura, John R. Andrews
  • Publication number: 20130154156
    Abstract: A golf ball mold body having a plurality of mold parts with a parting surface defining a parting line along an equator and removably mating to form a cavity having an inner wall with dimple-forming protrusions, and a support pin extendable into and retractable from the cavity, the support pin extending into the cavity to support a center sphere. An end face of the support pin defines a portion of the cavity inner wall when the support pin is retracted. The support pin has a shape satisfying certain conditions, and the support pin and mold body have a gap therebetween set within a specific range. The invention minimizes formation of uneven flash caused by deflection or shifting of support pins, appearance defects caused by damage to the cavity inner wall and contamination by rubbing debris, and the life of the mold is extended.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 20, 2013
    Applicant: BRIDGESTONE SPORTS CO., LTD.
    Inventors: Takuma NAKAGAWA, Katsunori SATO
  • Patent number: 8215943
    Abstract: A heat-transfer label assembly and an apparatus for applying heat-transfer labels. In a preferred embodiment, the heat-transfer label assembly includes a support. A plurality of labels are positioned over the support for transfer from the support to an article, each of the labels including an ink design. A plurality of spacers are positioned over the support but not over the label, the spacers not being transferable with the labels from the support to an article. The distance from the top of the spacers to the support exceeds the distance from the top of the labels to the support so that, when the assembly is wound into a roll, the labels do not come into contact with the bottom surface of an underlying portion of the support. In a preferred embodiment, the apparatus for applying heat-transfer labels includes a pad, a die-mark reduction device on the pad, a heated die positioned over the pad, and a motor for moving the heated die into and out of engagement with the die-mark reduction device.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: July 10, 2012
    Assignee: Avery Dennison Corporation
    Inventors: Kuolih Tsai, Dong-Tsai Hseih, Yi-Hung Chiao, Alan Morgenthau, Roger Recupero, Julio Adalberto De La Cruz Escobar
  • Patent number: 8210838
    Abstract: A method and device for producing a battery electrode (5) by: pouring a powder mixture quantity (6a) into a cavity (2), laying an electrically conductive diverter (4) on powder mixture (6a), pouring a further quantity (6b) of same powder mixture (6) into same cavity (2), and compressing the two powder mixture quantities (6a, 6b). The device has a filling cavity (2) for powder mixture (6), at least one compression means (1) for compressing powder mixture (6), and support (7) and fixing means (8) for positioning and fixing an electrically conductive diverter (4). The diverter (4) is situated so that partial quantities (6a, 6b) of powder mixture (6) are located above and below diverter (4). The support means (7) and fixing means (8) are situated in such a way that a ratio of the partial quantities (6a, 6b) of powder mixture (6) above and below the diverter (4) remains essentially maintained.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: July 3, 2012
    Assignee: Biotronik CRM Patent AG
    Inventors: Gerd Fehrmann, Thomas Fischer, Thomas Hucke, Roland Staub, Jürgen Drews, Tim Traulsen
  • Patent number: 8137095
    Abstract: A device and a method for forming a ceramic ferrule blank are provided. A shaped wire (2) is disposed in a mold cavity (1) for form a blank, a knock pin mold (4) is disposed in a lower opening of the mold cavity (1), an axle hole (5) for the shaped wire (2) to pass through is opened in the knock pin mold (4), two punching half dies (6) and corresponding half die press heads (7) are disposed over the mold cavity (1), a wire groove (8) for receiving the shaped wire (2) is opened on a side of the half die press head (7), one end of the shaped wire (2) is fixed over the knock pin mold (4), and the other end is clipped by a wire clip unit (9).
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: March 20, 2012
    Inventor: Shunfeng Liu
  • Patent number: 8105524
    Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: January 31, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tetsuya Yamada, Tomoyuki Gotoh
  • Publication number: 20110171337
    Abstract: The present invention relates to a device for molding by impregnation of at least one reinforcing layer constituting a piece to be molded or at least one reinforcing layer covering a piece, with a resin in liquid form, said device comprising a mold extending around the reinforcing layer by defining a resin circulation space, an end piece for supplying resin in the circulation space, an end piece for evacuating the surplus resin as well as means for generating a flow of resin in the circulation space. According to the invention, the mold comprises a flexible conduit and means for mechanically deforming said flexible conduit to shape the circulation space according to the impregnation parameters.
    Type: Application
    Filed: May 6, 2010
    Publication date: July 14, 2011
    Applicant: EUROCOPTER DEUTSCHLAND GMBH
    Inventors: Sven MEYER-NOACK, Jörg RADEKOPF
  • Patent number: 7927086
    Abstract: Disclosed herein is a membrane electrode assembly with a superior power generating efficiency and a method of manufacturing the same. Also disclosed is a manufacturing apparatus thereof wherein a gasket with an optimum thickness can be easily applied to the membrane electrode assembly without preparing various types of gaskets. A method of manufacturing the membrane electrode assembly with catalytic layers and gas diffusion layers on surfaces of the electrolyte membrane comprises controlling a molding thickness according to thicknesses of the catalytic layers and the gas diffusion layers and integrally molding the gasket portions formed with resin materials on at least one surface of the electrolyte membrane.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: April 19, 2011
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Kazuyoshi Takada
  • Patent number: 7906056
    Abstract: A cup-shaped closing material having a convex section is fitted on a protrusion-like engagement section of a distal end of a mandrel with a gap from the engagement section of the mandrel, a molten resin is then disposed in a cavity of a molding die and a holepin having an outer peripheral section of a distal end that is smaller than an outer periphery of the distal end surface of the convex section of the closing material is pressed against the distal end surface of the convex section of the closing material, whereby the distal end surface of the convex section of the closing material is pleated to form an annular protrusion section at the outer peripheral section, and the molten resin is caused to envelope the annular protrusion section, while being pushed and charged into the cavity, whereby the head part with the closing material attached thereto is formed.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: March 15, 2011
    Assignee: Kansai Tube Co., Ltd.
    Inventor: Kazuo Nishikawa
  • Patent number: 7690913
    Abstract: An apparatus is provided that forms embossed portions on a workpiece. The apparatus includes a melting chamber filled with melt, such as ceramic, nozzles provided at a lower portion of the melting chamber, and presses provided adjacent to each of the injection nozzles. The injection nozzles drop the melt on the workpiece and the presses press the dropped melt into a predetermined shape of the embossed portions in a state where the dropped melt is being solidified after being dropped on the workpiece.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: April 6, 2010
    Assignee: Advanced Display Process Engineering Co., Ltd.
    Inventor: Hyoung-Kyu Son
  • Patent number: 7648666
    Abstract: In one embodiment of the present invention, a method comprises a plurality of operations. An operation is performed for depositing a quantity of article-forming media within a media receiving cavity of article forming equipment. After depositing at least a portion of the article-forming media within the media receiving cavity, an operation performed for depositing a volume of a prescribed fluid into the media receiving cavity. Depositing the prescribed fluid includes moving a first fluid delivery device through the quantity of the article-forming media while injecting the prescribed fluid through the first fluid delivery device into the quantity of the article-forming media.
    Type: Grant
    Filed: September 15, 2008
    Date of Patent: January 19, 2010
    Inventor: Steve Eugene Everett
  • Publication number: 20090200704
    Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
    Type: Application
    Filed: October 22, 2007
    Publication date: August 13, 2009
    Inventors: Tetsuya Yamada, Tomoyuki Gotoh
  • Patent number: 7572121
    Abstract: Embodiments of the invention provide a method and apparatus for manufacturing dental aligners. The system includes a workpiece introduction system having at least one workpiece preparation chamber. The system further has a mold manipulation system, having a mold introduction chamber, where a series of different molds may be introduced one after the other; a mold preparation chamber; a workpiece operation chamber; and a mold manipulator to move the mold between the mold introduction chamber, the mold preparation chamber, and the workpiece operation chamber; and a workpiece manipulator to move the workpiece between the workpiece preparation chamber and the workpiece operation chamber.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: August 11, 2009
    Assignee: Align Technology, Inc.
    Inventors: Roman Wrosz, James C. Culp, Craig E. Farren
  • Patent number: 7497981
    Abstract: A system for producing composite or bonded metal components including: first and second pressure chambers, each pressure chamber having an elastically deformable chamber wall; means for circulating fluid at an elevated temperature and pressure through each said pressure chamber; and at least one mould assembly including at least one separate mould section providing a mould cavity within which a composite or bonded metal lay-up can be located; wherein when the system is in use, the pressure chambers are held together with the elastically deformable chamber walls located in opposing relation, the at least one mould assembly containing a said lay-up being accomodated between the chamber walls while fluid at elevated temperature and pressure is circulated through each pressure chamber such that the lay-up can be compressed and cured or formed.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: March 3, 2009
    Assignee: Quickstep Technology Pty Ltd.
    Inventor: Neil Graham
  • Patent number: 7431577
    Abstract: An object of the present invention is to provide a die and a method for manufacturing a core, wherein the core includes a ring-shaped supporting member 16 that is formed by a plate-like member, that is disposed inside a pneumatic tire, and that supports a pneumatic tire by allowing an inner side of a tread portion of the pneumatic tire to be brought into contact with an outer peripheral surface of the supporting member at the time of a deformation of the pneumatic tire due to a decrease of an internal pressure of the tire, and ring-shaped rubber portions that are joined respectively to both widthwise direction edge portions of the supporting member.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: October 7, 2008
    Assignee: Bridgestone Corporation
    Inventors: Yoichiro Kondo, Hiroyuki Isoi
  • Patent number: 7404707
    Abstract: A hydraulic sample mounting press utilizes a face seal against the top face of a molding cylinder. The face seal employs a hydraulic cylinder to press a disk-shaped surface of a cap piece against the top annular face of the mold cylinder for a metallographic mounting press. The face seal cylinder is mounted to a hydraulic fluid column that allows the face seal to rotate away from the mold cylinder for access to the molding cylinder and to rotate into place when a metallographic mount is to be molded.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: July 29, 2008
    Assignee: Leco Corporation
    Inventors: Dwight F. Warren, Robert S. Tate, Matthew D. Cox
  • Patent number: 7309507
    Abstract: Device for manufacturing lollipops, comprising a stationary supply (4, 5a, 5b) for a strand (5) of lollipop material in flat cross-section condition, a series of flat lollipop moulds (3a, 3b) movable past the supply according to a path of movement. The lollipop moulds having a main axis and each consisting of a lower mould (3a) and an upper mould (3b), which can be closed onto the lower mould while cutting off a leading portion of the strand, the supply being positioned for discharge of the strand in a direction transverse to the main axis.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: December 18, 2007
    Assignee: CFS Weert B.V.
    Inventors: Seferinus Jelle Asma, Henricus Antonius Maria Der Kinderen
  • Patent number: 7261533
    Abstract: Embodiments of the invention provide a method and apparatus for manufacturing dental aligners. The system includes a workpiece introduction system having at least one workpiece preparation chamber. The system further has a mold manipulation system, having a mold introduction chamber, where a series of different molds may be introduced one after the other; a mold preparation chamber; a workpiece operation chamber; and a mold manipulator to move the mold between the mold introduction chamber, the mold preparation chamber, and the workpiece operation chamber; and a workpiece manipulator to move the workpiece between the workpiece preparation chamber and the workpiece operation chamber.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: August 28, 2007
    Assignee: Align Technology, Inc.
    Inventors: Roman Wrosz, James C. Culp, Craig E. Farren
  • Patent number: 7217376
    Abstract: A separation wall transfer mold adaptive to form separation walls on a substrate, includes a main body. A separation wall concave section has concaves for separation walls and is formed in a surface of the main body for a material of the separation walls to be spewed into the separation wall concave section when the separation wall transfer mold is pressed to a substrate. A spew preventing concave section is formed in the surface of the main body for an excess portion of the material to be spewed in the spew preventing concave section.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: May 15, 2007
    Assignee: Pioneer Corporation
    Inventor: Yoichi Ikarashi
  • Patent number: 7175406
    Abstract: Apparatus for forming a plastic attachment on an article includes clamping mechanisms which position the article and form a mold surrounding the appropriate section of the article. During the process of molding the plastic attachment, the article may be moved through the mold to facilitate forming the attachment along a length of the article. The apparatus is illustrated by an annular mold for forming mating plastic couplings around the ends of tubes such as corrugated and smooth-walled metal pipes.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: February 13, 2007
    Assignee: PRD Company, Inc.
    Inventors: Daniel D. Freitas, Robert F. Miller
  • Patent number: 6981863
    Abstract: A method and system for molding thermoplastic sandwich material to form a deep-drawn article utilizing a unique clamping technique and mechanism are described. The method includes the steps of positioning a blank of thermoplastic sandwich material having a cellular core over a female die having an article-defining cavity defined by inner surfaces of the female die. Then, an inner portion of the blank is forced into the female die along a substantially vertical axis and against the inner surfaces of the female die to obtain deep-drawn material. During the step of forcing at least one outer portion of the blank immediately adjacent the female die is clamped to guide the at least one outer portion of the blank to travel into the article-defining cavity at an acute angle with respect to the vertical axis. Thickness of at least one side wall of the deep-drawn material is substantially the same as thickness of the blank of thermoplastic sandwich material.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: January 3, 2006
    Assignee: Patent Holding Company
    Inventors: Thierry Renault, Francis Vendangeot, Jacques Heinry
  • Patent number: 6877973
    Abstract: An apparatus for manufacturing a lens sheet comprises an application device, a substrate supply device, a pressing device and an irradiation device. The application device applies ionizing radiation curing type resin in the form of liquid on the upper surface of a forming die for a lens sheet to form an uncured resin body on the upper surface of the forming die. The substrate supply device places a substrate on the uncured resin body. The pressing device presses the substrate against the uncured resin body to flatten the uncured resin body, so as to form a uncured resin layer, while spreading the uncured resin body to an outside periphery of the forming die. The irradiation device irradiates ionizing radiation on the uncured resin layer through the substrate to cure the uncured resin layer.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: April 12, 2005
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuyuki Matsumoto, Hitomu Watanabe
  • Publication number: 20040232595
    Abstract: An apparatus for forming sheet material (2), in particular sheet material based on natural fibers, comprises in sequence deformability promoting means (5) suitable for making said sheet material more easily deformable (2), forming means (9, 10, 11, 16a, 101a101b) suitable for deforming said sheet material (2); said deformability promoting means is deformability promoting material means (5). Forming means for shaping sheet material (2) comprises fluid forming means suitable for shaping portions of said sheet material (2), and a flow-inhibiting means (17, 116; 116a, 116b) suitable for preventing said fluid forming mean flowing through said sheet material (2).
    Type: Application
    Filed: February 6, 2004
    Publication date: November 25, 2004
    Inventor: Andrea Bartoli
  • Patent number: 6790026
    Abstract: A method and system for co-molding a thermoplastic material with a thermoplastic sandwich material to form a thermoplastic sandwich article having a thermoplastic inner portion are provided. In one embodiment, the thermoplastic material may be a composite material and the article is a deep-drawn article. In this embodiment, the method and system include a female die having an article-defining cavity defined by inner surfaces of the female die and an outer male die for forcing an inner portion of a blank of thermoplastic sandwich material having a cellular core and a predetermined amount of thermoplastic composite material placed on the blank into the female die along a substantially vertical axis and against the inner surfaces of the female die to obtain deep-drawn sandwich material. In a second embodiment in which the article formed is not deep-drawn, the outer male die is not required.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: September 14, 2004
    Assignee: Patent Holding Company
    Inventors: Francis Vandangeot, Emmanuel Boivin, Loic Durual
  • Patent number: 6783347
    Abstract: A peripherally encapsulated product is molded by placing a piece of glass between mold clamping portions of movable closed bodies when the latter are in an open position. The bodies are heated and thermosetting polymeric material is placed upon one of the mold bodies outboard of a peripheral edge of a piece of glass. The glass is clamped and the mold bodies are closed creating compression forces which extrude the polymeric material into the annular cavity and into complete encapsulation of a peripheral edge of the piece of glass. The thermosetting polymeric material is cured, the mold bodies are opened and the product is removed therefrom.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: August 31, 2004
    Assignee: Gemtron Corporation
    Inventors: Craig Bienick, Bob Herrmann, Howard Daley
  • Publication number: 20040113315
    Abstract: A system for producing composite or bonded metal components including: first and second pressure chambers, each pressure chamber having an elastically deformable chamber wall; means for circulating fluid at an elevated temperature and pressure through each said pressure chamber; and at least one mould assembly including at least one separate mould section providing a mould cavity within which a composite or bonded metal lay-up can be located; wherein when the system is in use, the pressure chambers are held together with the elastically deformable chamber walls located in opposing relation, the at least one mould assembly containing a said lay-up being accomodated between the chamber walls while fluid at elevated temperature and pressure is circulated through each pressure chamber such that the lay-up can be compressed and cured or formed.
    Type: Application
    Filed: January 23, 2004
    Publication date: June 17, 2004
    Inventor: Neil Graham
  • Publication number: 20030214074
    Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.
    Type: Application
    Filed: May 20, 2002
    Publication date: November 20, 2003
    Applicant: STMicroelectronics, INC.
    Inventors: Michael J. Hundt, Tiao Zhou
  • Patent number: 6638450
    Abstract: A method for manufacturing a synthetic resin thermoplastic ophthalmic lens by injecting a thermoplastic material immediately adjacent to each side of a light polarizing wafer situated within a mold cavity. The light polarizing wafer includes tab appendages which are positionable into registration notches in the mold cavity in order to maintain the wafer in a desired position in the mold during lens formation. The thermoplastic material is then injected around the light polarizing wafer, whereupon a compression procedure is implemented where the contents of the mold cavity are compressed. The mold cavity is compressed to a predetermined position to achieve a desired shape of the lens. Uniform compression is exerted over the entire surface of lens during the compression procedure, resulting in all stresses being uniformly distributed over the lens surface to significantly negate stress-inducted birefringence in the formed ophthalmic lens.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: October 28, 2003
    Assignee: VTEC Technologies, Inc.
    Inventor: David A. Richard
  • Patent number: 6582213
    Abstract: The bellows (6) of a filter cartridge is inserted into an injection-molding die (3) and provided with the plastic frame (24) by an injection-molding process. The surfaces of the die (3) that lie opposite one another are provided, at least at their edge surfaces (15), with sawtooth-like profiles (1, 2; 30, 31). The sawtooth-like profiles engage with one another and hold the individual folds (22, 23; 35, 36) of the bellows (6) in a defined position relative to one another. The bellows (6) is held by the profiles (1, 2; 30, 31) at its face edges (19) over a narrow region (18), and pressed together, forming a seal, for the injection-molding process.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: June 24, 2003
    Assignee: Firma Carl Freudenberg
    Inventor: Udo Michaelis
  • Publication number: 20030091676
    Abstract: A hydraulic sample mounting press utilizes a face seal against the top face of a molding cylinder. The face seal employs a hydraulic cylinder to press a disk-shaped surface of a cap piece against the top annular face of the mold cylinder for a metallographic mounting press. The face seal cylinder is mounted to a hydraulic fluid column that allows the face seal to rotate away from the mold cylinder for access to the molding cylinder and to rotate into place when a metallographic mount is to be molded.
    Type: Application
    Filed: April 18, 2002
    Publication date: May 15, 2003
    Inventors: Dwight F. Warren, Robert S. Tate, Matthew D. Cox
  • Patent number: 6563207
    Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: May 13, 2003
    Assignee: Fujitsu Limited
    Inventor: Yasuhiro Shinma
  • Publication number: 20030006530
    Abstract: According to one embodiment of the present invention, there is provided a method of manufacturing a polymeric bearing component (22) for use in joint arthroplasty for cooperation with a first joint component (12) and a second joint component (16). The method includes the step of providing a non-linear reinforcing support (36) of a durable material having a first end (86) and a second end (94). The method further includes the step providing a molding die (62) adapted for manufacturing the bearing component (22) for use in total joint arthroplasty and having a first mold portion (66) and a second mold portion (76). The first mold portion (66) is adapted to provide a first surface (70) of the bearing component (22) for cooperation with the first joint component (12) and the second mold portion (76) is adapted to provide a second surface (80) of the bearing component (22) for cooperation with the second joint component (16).
    Type: Application
    Filed: May 24, 2002
    Publication date: January 9, 2003
    Inventors: Rama Rao V. Gundlapalli, Mark Heldreth, Albert Burstein
  • Publication number: 20020164391
    Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.
    Type: Application
    Filed: July 2, 2002
    Publication date: November 7, 2002
    Applicant: Fujitsu Limited of Kawasaki
    Inventor: Yasuhiro Shinma
  • Publication number: 20020142058
    Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.
    Type: Application
    Filed: March 11, 2002
    Publication date: October 3, 2002
    Inventors: Yasuo Tanaka, Jiro Matsumoto
  • Patent number: 6428300
    Abstract: A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: August 6, 2002
    Assignee: International Business Machines Corporation
    Inventors: John J. Lajza, Jr., Charles R. Ramsey, Robert M. Smith
  • Publication number: 20010030382
    Abstract: A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.
    Type: Application
    Filed: June 7, 2001
    Publication date: October 18, 2001
    Applicant: International Business Machines Corporation
    Inventors: John J. Lajza, Charles R. Ramsey, Robert M. Smith
  • Publication number: 20010020316
    Abstract: The present invention provides apparatuses and methods for producing molded products such as floor mats, including automotive floor mats. In one embodiment, a molding process is provided for producing a molded product using a mold having a lower plate and an upper plate. The molding process includes steps of filling a first cavity of the lower plate with a liquid molding material of a first color, placing the upper plate on top of the lower plate such that a convex portion of the upper plate extends into the first cavity of the lower plate and contacts the molding material in the lower plate, and curing the liquid molding material.
    Type: Application
    Filed: March 12, 2001
    Publication date: September 13, 2001
    Inventors: Fernando A. Ferreira, Antero Ferreira, Stephen P. Neri
  • Patent number: 5914083
    Abstract: An assembly of a windshield glass and a weather strip having a partly modified cross section is provided. As the weather strip is extruded along the peripheral edge of the windshield glass and fixedly adhered thereto, a movable die 132 of a die assembly is properly moved so as to change the shape of an orifice of the die assembly.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: June 22, 1999
    Assignee: Tokai Kogyo Kabushiki Kaisha
    Inventors: Yukihiko Yada, Toshikazu Ito
  • Patent number: 5599563
    Abstract: A loudspeaker cone assembly having a generally conical cone body and an annular flexible suspension rim. In making the cone assembly, a cone body having an outer free edge is placed within a female mold having an annular channel configured to form the suspension rim with the free outer edge of the cone exposed to the channel. A predetermined quantity of liquid plastic foam is deposited into the channel which is then substantially closed by a male die so as to seal off the cone body adjacent its outer free edge. The foam is then expanded and cured so that the resulting annular rim is integrally impregnated into the free outer edge of the cone body and forms high density closed-cell outer skin surfaces on opposite sides of a low density closed-cell inner core to provide a suspension rim having improved flexibility, strength and durability. A color coating may be applied to selective exposed surface areas of the suspension rim.
    Type: Grant
    Filed: May 24, 1994
    Date of Patent: February 4, 1997
    Inventor: Fred D. Yocum
  • Patent number: 5551855
    Abstract: In the assembly of a windshield glass and a weather strip having a partly modified cross section the weather strip is extruded along the peripheral edge of the windshield glass and fixedly adhered thereto, a movable die 132 of a die assembly is properly moved so as to change the shape of an orifice of the die assembly.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: September 3, 1996
    Assignee: Tokai Kogyo Kabushiki Kaisha
    Inventors: Yukihiko Yada, Toshikazu Ito
  • Patent number: 5512232
    Abstract: A device for moulding articles of composite material includes a pressurizable gasket and an injection head the end of which is flush with the impression of the mould. After low-pressure filling the mould impression with jets of resin and catalyst so oriented as to secure the mutual mixing thereof, the pressurizable gasket allows the half-moulds to be further approached to each other and obtaining thereby the impregnation of the reinforcer element previously charged into the mould impression.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: April 30, 1996
    Assignee: Centro Sviluppo Settori Impiego S.r.l.
    Inventors: Antonio Addeo, Roberto Bonari, Aurelio Biscotti
  • Patent number: 5364253
    Abstract: A magnetic circuit component molding device for integrally molding a compound a center yoke with a ring-shaped magnet includes top and bottom press vertically arranged at opposed positions. A ring-shaped magnet is place on a bottom die between top and bottom press. The top and bottom press compress the compound against the ring-shaped magnet ring with a vertical pressure. A holder unit, separated in plural segments, having tapered outer circumferences is provided around the ring-shaped. A holder presser having a tapered inner circumference is mounted on the holder unit as tapered portions thereof are engaged together. A portion of the vertical pressure, when the top press compresses the compound, is transferred by springs 10 to the holder presser, and is amplified by the tapered portions and applied to the outer circumference surface of the ring-shaped magnet by the holder unit.
    Type: Grant
    Filed: May 14, 1993
    Date of Patent: November 15, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kiyoshi Kojima, Kazuyoshi Amami, Hiroshi Ueda, Shizuo Furuyama, Yoshihiro Hara, Kyoichi Hasegawa, Tadashi Kawamata
  • Patent number: 5332381
    Abstract: An apparatus for forming liners of thermoplastic material within closure shells contains a movable die having an inner punch member and an annular outer mold member both of which are movable up and down in relatively slidable relation with each other and arranged so that the inner punch takes its lowermost position after the outer mold member has taken its lowermost position. In one embodiment of the present invention, the lower end surface of the outer mold member is beveled and defines a plurality of radial grooves. The lower end wall of the outer mold member is moved downwardly until it is opposite the horizontal wall of the closure shell. As the inner punch moves into its lowermost position, thermoplastic material is forced through the radial grooves so that a thick annular pad portion of the seal liner is formed beneath the lower end wall of the outer mold member.
    Type: Grant
    Filed: February 22, 1993
    Date of Patent: July 26, 1994
    Assignee: ZapatA Technologies, Inc.
    Inventor: Michael Shapcott
  • Patent number: 5326243
    Abstract: A molding apparatus having variable-volume cavities is provided. The apparatus consists of a lower and an upper mold defining a cavity for the lead frame, and having a conduit for forcing fluid plastic from a reservoir to the cavity for encapsulating an integrated circuit bonded to a lead frame. A pressure source is used to force the plastic from the reservoir through the conduit into both the upper and lower portions of the cavity surrounding the lead frame. The cavity of the mold is equipped with at least one piston-like insert slideably mounted in a bore hole in the surface of the cavity. The insert can be compressed or expanded to reduce or increase, respectively, the volume of the cavity. Thus, the final size of the cavity in the mold is determined by the position of the insert at the end of the encapsulation process. By allowing the expansion of the insert during a first phase of the molding operation, excess plastic is forced into the cavity.
    Type: Grant
    Filed: June 25, 1992
    Date of Patent: July 5, 1994
    Inventor: Richard H. J. Fierkens
  • Patent number: 5277865
    Abstract: A hollow molded article is produced by supplying a molten resin between a pair of a fixed mold and a movable mold before the fixed mold and the movable mold are closed, inserting at least one gas-supplying pin which is provided on a surface of the fixed mold to form a hollow part in a part of the resin and supplying pressurized gas through said gas-supplying pin before the mold closing is finished, closing the movable mold to fill the resin in a cavity formed by the molds, slightly opening the molds while pressurizing a gas in the resin to expand the hollow part and opening the movable mold to remove a hollow molded article from the molds.
    Type: Grant
    Filed: February 7, 1992
    Date of Patent: January 11, 1994
    Assignees: Sumitomo Chemical Company, Limited, Nissen Chemitec Corporation
    Inventors: Takahisa Hara, Masahito Matsumoto, Hiromu Fujita, Yuji Kamiji, Hiromasa Nakatsuka