Silver, Gold, Platinum, Or Palladium Patents (Class 427/125)
-
Publication number: 20120263870Abstract: A gas sensor includes a substrate and a pair of interdigitated metal electrodes selected from the group consisting of Pt, Pd, Au, Ir, Ag, Ru, Rh, In, and Os. The electrodes each include an upper surface. A first solid electrolyte resides between the interdigitated electrodes and partially engages the upper surfaces of the electrodes. The first solid electrolyte is selected from the group consisting of NASICON, LISICON, KSICON, and ??-Alumina (beta prime-prime alumina in which when prepared as an electrolyte is complexed with a mobile ion selected from the group consisting of Na+, K+, Li+, Ag+, H+, Pb2+, Sr2+ or Ba2+). A second electrolyte partially engages the upper surfaces of the electrodes and engages the first solid electrolyte in at least one point. The second electrolyte is selected from the group of compounds consisting of Na+, K+, Li+, Ag+, H+, Pb2+, Sr2+ or Ba2+ ions or combinations thereof.Type: ApplicationFiled: October 7, 2011Publication date: October 18, 2012Inventors: Gary W. Hunter, Jennifer C. Xu, Chung Chiun Liu, Benjamin C. Ward
-
Patent number: 8287771Abstract: Provided is a method for producing a silver particle powder excellent in the dispersibility in a liquid organic medium having a low polarity, which comprises reducing a silver compound in an alcohol having a boiling point of from 80° C. to 200° C. or in a polyol having a boiling point of from 150 to 300° C., at a temperature of from 80° C. to 200° C. under reflux while maintaining the stream having a Reynolds number of not more than 3.70×104. The stream having a Reynolds number of not more than 3.70×104 can be maintained by stirring with a stirring power of not more than 5.68×108 W. According to the method, a silver particle powder having good low-temperature sinterability and good dispersibility and suitable for use for microwiring formation can be obtained at a high yield.Type: GrantFiled: February 15, 2007Date of Patent: October 16, 2012Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Kimitaka Sato, Yutaka Hisaeda
-
Patent number: 8287943Abstract: The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder.Type: GrantFiled: January 5, 2007Date of Patent: October 16, 2012Assignee: Centre National de la Recherche ScientifiqueInventors: Claude Lucat, Francis Menil, Hélène Debeda-Hickel, Patrick Ginet
-
ANODE ACTIVE MATERIAL, ANODE AND LITHIUM BATTERY CONTAINING THE SAME, AND PREPARATION METHOD THEREOF
Publication number: 20120258361Abstract: An anode active material. The anode active material includes a core including SiOx (0.5?x?1.7), and a coating layer formed on the core at least partially. The coating layer includes metal unreactive toward lithium.Type: ApplicationFiled: January 20, 2012Publication date: October 11, 2012Applicant: SAMSUNG SDI CO., LTD.Inventors: Kyu-Nam Joo, Tae-Sik Kim, Deok-Hyun Kim, Jae-Myung Kim -
Publication number: 20120256150Abstract: Some embodiments include methods of patterning platinum-containing material. An opening may be formed to extend into an oxide. Platinum-containing material may be formed over and directly against an upper surface of the oxide, and within the opening. The platinum-containing material within the opening may be a plug having a lateral periphery. The lateral periphery of the plug may be directly against the oxide. The platinum-containing material may be subjected to polishing to remove the platinum-containing material from over the upper surface of the oxide. The polishing may delaminate the platinum-containing material from the oxide, and may remove the platinum-containing material from over the oxide with an effective selectivity for the platinum-containing material relative to the oxide of at least about 5:1. Some embodiments include methods of forming memory cells. Some embodiments include integrated circuitry having platinum-containing material within an opening in an oxide and directly against the oxide.Type: ApplicationFiled: April 8, 2011Publication date: October 11, 2012Applicant: MICRON TECHNOLOGY, INC.Inventors: Andrey V. Zagrebelny, Chet E. Carter
-
Publication number: 20120241192Abstract: An arrangement of elongated nanowires that include titanium silicide or tungsten silicide may be grown on the exterior surfaces of many individual electrically conductive microfibers of much larger diameter. Each of the nanowires is structurally defined by an elongated, centralized titanium silicide or tungsten silicide nanocore that terminates in a distally spaced gold particle and which is co-axially surrounded by a removable amorphous nanoshell. A gold-directed catalytic growth mechanism initiated during a low pressure chemical vapor deposition process is used to grow the nanowires uniformly along the entire length and circumference of the electrically conductive microfibers where growth is intended. The titanium silicide- or tungsten silicide-based nanowires can be used in a variety electrical, electrochemical, and semiconductor applications.Type: ApplicationFiled: March 25, 2011Publication date: September 27, 2012Applicants: THE UNIVERSITY OF WESTERN ONTARIO, GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Mei Cai, Xueliang Sun, Yong Zhang, Mohammad Norouzi Banis, Ruying Li
-
Publication number: 20120236899Abstract: A method of forming a thermocouple (12), including: depositing a first material on a component (10) to form a first leg (14); depositing a second material through a mask (30) to form a pattern (50) on the component (10), the pattern (50) forming a plurality of discrete second leg junction ends (20) and a continuous patch (52) of the second material comprising indiscrete lead ends of the second legs (16), each second leg junction end (20) spanning from a respective junction (18) with the first leg (14) to the continuous patch (52); and laser-ablating the continuous patch (52) to form discrete lead ends (22) of the second legs (16), each lead end (22) electrically connected to a respective junction end (20), thereby forming discrete second legs (16).Type: ApplicationFiled: March 12, 2012Publication date: September 20, 2012Inventors: Ramesh Subramanian, Anand A. Kulkarni, Kevin C. Sheehan
-
Patent number: 8268725Abstract: A modified coffee-stain method for producing self-organized line structures and other very fine features that involves disposing a solution puddle on a target substrate, and then controlling the peripheral boundary shape of the puddle using a control structure that contacts the puddle's upper surface. The solution is made up of a fine particle solute dispersed in a liquid solvent wets and becomes pinned to both the target substrate and the control structure. The solvent is then caused to evaporate at a predetermined rate such that a portion of the solute forms a self-organized “coffee-stain” line structure on the target substrate surface that is contacted by the peripheral puddle boundary. The target structure is optionally periodically raised to generate parallel lines that are subsequently processed to form, e.g., TFTs for large-area electronic devices.Type: GrantFiled: October 7, 2010Date of Patent: September 18, 2012Assignee: Palo Alto Research Center IncorporatedInventors: Sanjiv Sambandan, Robert A. Street, Ana Claudia Arias
-
Publication number: 20120222894Abstract: A wiring substrate includes a wiring layer, an outermost insulating layer laminated to the wiring layer, and a pad electrically connected to the wiring layer and exposed from a surface of the outermost insulating layer. The pad consists essentially of a first metal layer and a second metal layer. The first metal layer includes a first surface, which is exposed from the surface of the outermost insulating layer, and a second surface, which is located opposite to the first surface. The second metal layer includes is formed between the second surface of the first metal layer and the wiring layer. The first metal layer is formed from a metal selected from gold or silver or from an alloy including at least one of gold and silver. The second metal layer is formed from palladium or a palladium alloy.Type: ApplicationFiled: March 1, 2012Publication date: September 6, 2012Applicant: Shinko Electric Industries Co., LTD.Inventors: KENTARO KANEKO, Toshiaki Aoki, Hiromi Denda
-
Publication number: 20120219702Abstract: A film can be patterned with a nanomaterial. Such patterning can, in various embodiments, be performed by applying a uniform mixture of a solute in a solvent to a surface of the film to form a coating of a soluble material on the surface of the film in a pre-defined pattern that defines coated parts of the film and uncoated parts of the film, depositing an aqueous dispersion, including the nanomaterial and a surfactant, on the defined coated and uncoated parts of the film, washing the film to remove the coating of the soluble material and the nanomaterial from the defined coated parts of the film, but not removing the nanomaterial from the defined uncoated parts of the film, along with removing the surfactant from the defined coated and uncoated parts of the film, and leaving a pattern of the nanomaterial on the defined uncoated parts of the film.Type: ApplicationFiled: February 24, 2011Publication date: August 30, 2012Inventors: Graeme Scott, Lorraine Byrne, Richard Coull, Vittorio Scardaci
-
Patent number: 8252382Abstract: The present invention relates to an aluminum wheel having high gloss and a method for manufacturing the same, and the method for manufacturing an aluminum wheel having high gloss includes the steps of: (i) coating a primary coating powder paints for increasing a flatness of an aluminum wheel having a rough surface and improving an adhesive force to a silver mirror coating surface, (ii) forming of silver coating layer forming a mirror surface having a high gloss and high reflectivity on the powder paints coated surface using a silver coating solution, and (iii) forming at least one transparent top coating for protecting the silver mirror surface and increasing an abrasion resistance and a saltwater resistance after the step (ii). In accordance with the present in an aluminum wheel having high gloss and high reflectivity can be manufactured in a simple processes and relative inexpensive cost.Type: GrantFiled: April 28, 2007Date of Patent: August 28, 2012Assignee: Inktec Co., Ltd.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Seong-Yong Uhm
-
Patent number: 8252385Abstract: Processes for printing conductors, insulators, dielectrics, phosphors, emitters, and other elements containing elongated functional particles aligned along the axis of a spun fiber or film that can be for electronics and display applications are provided. Also provided are viscoelastic compositions used in the processes, and devices made therefrom.Type: GrantFiled: March 23, 2006Date of Patent: August 28, 2012Assignee: E I du Pont de Nemours and CompanyInventors: Steven Dale Ittel, Jennifer Leigh White
-
Publication number: 20120211363Abstract: The present invention relates to a thin-film pseudo-reference electrode and method for the production thereof, wherein the pseudo-reference electrode is made up of a substrate formed by an oxidized silicon wafer on which a single thin film of silver, which has a thickness comprised between 100 nm and 1500 nm, is deposited directly by means of the sputtering technique.Type: ApplicationFiled: October 15, 2010Publication date: August 23, 2012Applicant: CENTRO DE ESTUDIOS E INVESTIGACIUONES TECNICAS (CEIT)Inventors: Larraitz Añorga Gómez, Sergio Arana Alonso
-
Publication number: 20120196114Abstract: A flexible transparent conductive film is provided. The conductive film includes a hydrophilic transparent resin and silver nanowires distributed in the resin. A method for manufacturing the flexible transparent conductive film is also disclosed.Type: ApplicationFiled: March 28, 2011Publication date: August 2, 2012Applicant: BENQ MATERIALS CORPORATIONInventors: Tsung-Ju HSU, An-Ting KUO, Hou-Zen CHIANG
-
Patent number: 8227022Abstract: The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding a chemical reducer to form metal nanoparticles in dispersion. The invention further relates to aqueous-based dispersions of metal nanoparticles, and to compositions such as ink comprising such dispersions.Type: GrantFiled: January 10, 2006Date of Patent: July 24, 2012Assignee: Yissum Research Development Company of The Hebrew University of JerusalemInventors: Shlomo Magdassi, Alexander Kamyshny, Shai Aviezer, Michael Grouchko
-
Publication number: 20120177817Abstract: A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature of 40° C. or higher.Type: ApplicationFiled: July 5, 2011Publication date: July 12, 2012Applicant: FUJIFILM CORPORATIONInventor: Tsukasa TOKUNAGA
-
Publication number: 20120168198Abstract: A method for producing electrical components for electrical contacts, and such a component are provided. To achieve simpler production of a partial surface treatment, which likewise exhibits optimal current carrying capacity, with minimum material use of noble metals, the entirety of the components are provided with an electrically insulating passivation layer, and the passivation is then removed chemically or mechanically at the contact points of the components. The entire components are put into an electrolytic bath, and a noble metal is deposited only on the parts of the components from which the passivation layer has been removed.Type: ApplicationFiled: September 6, 2011Publication date: July 5, 2012Applicant: ABB Technology AGInventor: Dietmar GENTSCH
-
Publication number: 20120171432Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.Type: ApplicationFiled: November 10, 2011Publication date: July 5, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chul Min Lee, Won Hyung Park, Kyung Jin Heo, Dek Gin Yang, Jin Su Yeo, Sung Wook Chun
-
Publication number: 20120171499Abstract: A method of making silver ribbons is disclosed. A silver salt solution and a reducing agent solution are added to an aqueous dispersing polymer solution to precipitate silver ribbons.Type: ApplicationFiled: September 27, 2010Publication date: July 5, 2012Applicant: FERRO CORPORATIONInventor: Jason H. Rouse
-
Publication number: 20120171367Abstract: The present invention provides a displacement gold plating solution and a plating treatment technology capable of realizing a uniform film thickness when forming a connecting portion obtained by sequentially plating a nickel layer, a palladium layer, and a gold layer in layers. The present invention provides a displacement gold plating solution for forming a connecting portion obtained by sequentially plating a nickel layer, a palladium layer, and a gold layer in layers on a conductor layer containing a conductive metal. The displacement gold plating solution contains a gold cyanide salt, a complexing agent, and a copper compound. A molar ratio of the complexing agent and the copper compound in the displacement gold plating solution is in a range of complexing agent/copper ion=1.0 to 500. A compound formed from the complexing agent and the copper compound has a stability constant of 8.5 or higher at a pH of between 4 and 6.Type: ApplicationFiled: April 15, 2011Publication date: July 5, 2012Inventor: Rie Kikuchi
-
Publication number: 20120168201Abstract: There are provided a method of fabricating a thin metal film electrode and a thin metal film electrode fabricated by the same. The method of fabricating a thin metal film electrode according to an embodiment of the present invention includes applying a metal paste including a metal powder and a dispersant to a substrate to form a thin metal film; and subjecting the thin metal film to reduction firing in an atmosphere containing an organic acid and an aqueous solution in a ratio ranging from 10:90 to 90:10.Type: ApplicationFiled: August 31, 2011Publication date: July 5, 2012Inventors: Young Ah SONG, Byoung Jin Chun, Dong Hoon Kim, Sung Il Oh
-
Publication number: 20120171366Abstract: Disclosed herein is a method for forming a metal wiring and an electrode using a metal nano paste, including a sintering process, wherein the sintering includes: placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240° C. under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained at the temperature range; dropping the temperature of the furnace to 100 to 150° C. under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere. According to the present invention, a metal film having high density and a minimized amount of residual metal particles can be formed despite a low-temperature sintering process, like a case where a high-temperature sintering process is employed.Type: ApplicationFiled: December 28, 2011Publication date: July 5, 2012Inventors: Seon Hee Jang, Young II Lee, Dong Hoon Kim, Sung Eun Kim, Hye Jin Cho
-
Publication number: 20120141872Abstract: A rechargeable lithium battery that includes a negative electrode including a silicon-based negative active material; a positive electrode including a positive active material being capable of intercalating and deintercalating lithium; and a non-aqueous electrolyte, wherein the silicon-based negative active material includes a SiOx (0<x<2) core including Si grains and a continuous or discontinuous coating layer including Ag, the coating layer being disposed on the core.Type: ApplicationFiled: August 8, 2011Publication date: June 7, 2012Inventors: Jae-Myung Kim, Kyu-Nam Joo, Tae-Sik Kim, Deok-Hyun Kim
-
Patent number: 8193442Abstract: CIGS absorber layers fabricated using coated semiconducting nanoparticles and/or quantum dots are disclosed. Core nanoparticles and/or quantum dots containing one or more elements from group IB and/or IIIA and/or VIA may be coated with one or more layers containing elements group IB, IIIA or VIA. Using nanoparticles with a defined surface area, a layer thickness could be tuned to give the proper stoichiometric ratio, and/or crystal phase, and/or size, and/or shape. The coated nanoparticles could then be placed in a dispersant for use as an ink, paste, or paint. By appropriate coating of the core nanoparticles, the resulting coated nanoparticles can have the desired elements intermixed within the size scale of the nanoparticle, while the phase can be controlled by tuning the stochiometry, and the stoichiometry of the coated nanoparticle may be tuned by controlling the thickness of the coating(s).Type: GrantFiled: December 11, 2007Date of Patent: June 5, 2012Assignee: Nanosolar, Inc.Inventors: Brian M. Sager, Dong Yu, Matthew R. Robinson
-
Publication number: 20120134880Abstract: The present invention relates to an apparatus for detecting one or more analytes, for example analytes selected from the group comprising nucleic acids, metabolites, peptides, proteins, hormones, pesticides, neurotransmitters, ions in blood, electrolytes, toxic gases, pH and biological warfare agents, the apparatus comprising an insulating substrate, at least one first electrode on the substrate at least one elongate nanostructure extending from and electrically connected to the or each said electrode and extending over the surface of the wafer away from the respective electrode, a passivating layer covering the or each electrode, but not all of said at least one elongate nanostructure, a well crossing the at least one elongate nanostructure extending from the or each electrode and forming a static reservoir for a liquid being investigated for the presence of at least one analyte, a reference electrode provided on said substrate within said well or insertable into said well and respective readout pads electriType: ApplicationFiled: February 23, 2011Publication date: May 31, 2012Applicant: Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.Inventors: Tetiana Kurkina, Alexis Vlandas, Nassim Rafiefard, Ashraf Ahmad, Klaus Kern, Kannan Balasubramanian
-
Publication number: 20120121983Abstract: The present invention relates to a lithium deposited anode for a lithium secondary battery and a method for preparing the same, and more particularly, to an anode suitable for a lithium secondary battery which limits dendrite growth only inside the concave portion of the silicon substrate during a battery is charged/discharged by depositing lithium as an active material only on the deeply caved concave portion of an anode current collector of which a micro-size patterned silicon substrate has conductivity provided by a metal, and its manufacturing method.Type: ApplicationFiled: April 11, 2011Publication date: May 17, 2012Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATIONInventors: Woo-Young Yoon, Heon Lee, Dae-Gun Jin
-
Publication number: 20120107717Abstract: The method for fabrication of the electrochemical energy converter characterised in that, cermet composition (2A)1 (2B) is applied on both sides of the central ceramic plate (1), wherein on both sides of the plate in the cermet composition (2A), (2B), channels (3A), (3B) are made, then the channels (3A), (3B) on both sides of the plate are covered with cermet composition layers (4A), (4B). Afterwards, both sides of the ceramic structure made in such a way are overlaid with conductive structures (5A), (5B) and then with subsequent layers of the cermet composition (6A). (6B) containing nickel, then both sides of the ceramic structure prepared in a such way are subsequently overlaid with: layers constituting the solid electrolyte (7A), (7B), layers constituting electrodes (8A), (8B) and contact layers (9A), (9B). The electrochemical energy converter has a flat layered ceramic base whose core is constituted by the central ceramic plate (D, permanently bonded with porous cermet layers (AN1).Type: ApplicationFiled: July 12, 2010Publication date: May 3, 2012Applicant: AKADEMIA GORNICZO-HUTNICZA IM. STANISLAWA STASZICAInventors: Zbigniew Magonski, Barbara Dziurdzia
-
Publication number: 20120104374Abstract: Described herein are coating compositions comprising metal nanostructures and one or more conductive polymers, and nanocomposite films formed thereof.Type: ApplicationFiled: November 1, 2011Publication date: May 3, 2012Applicant: CAMBRIOS TECHNOLOGIES CORPORATIONInventor: Pierre-Marc Allemand
-
Publication number: 20120107639Abstract: An electrical component is provided by a method comprising forming a middle plated layer made of palladium or a palladium alloy on a substrate and forming a surface plated layer made of tin or a tin alloy containing a metal other than palladium on the middle plated layer. Thus, there can be provided an electrical component having a surface layer consisting primarily of tin in which whisker formation can be prevented for a long period under stress.Type: ApplicationFiled: April 30, 2010Publication date: May 3, 2012Applicant: OM SANGYO CO., LTD.Inventors: Masao Takamizawa, Toshihide Naka, Hitoshi Kemmotsu, Yoshiyuki Nishimura
-
Publication number: 20120103660Abstract: Transparent conductors and methods of forming same are provided. A transparent conductor can include a nanostructure layer and a low sheet resistance grid disposed on a transfer film surface having an acceptable level of surface roughness. The presence of the low sheet resistance grid lowers the sheet resistance of the transparent conductor to an acceptable level. After release of the transparent conductor from the transfer film, the surface roughness of the transparent conductor will be at least comparable to the surface roughness of the transfer film.Type: ApplicationFiled: November 2, 2011Publication date: May 3, 2012Applicant: Cambrios Technologies CorporationInventors: Rahul Gupta, Forian Pschenitzka, Karl Pichler
-
Publication number: 20120100286Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: ApplicationFiled: December 30, 2011Publication date: April 26, 2012Applicant: SRI INTERNATIONALInventors: Sunity Sharma, Jaspreet Singh Dhau
-
Publication number: 20120082921Abstract: Implementations and techniques for metal air batteries including a composite anode are generally disclosed.Type: ApplicationFiled: September 30, 2010Publication date: April 5, 2012Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLCInventors: Ezekiel Kruglick, Thomas A. Yager, Seth Adrian Miller
-
Patent number: 8147908Abstract: Process for producing organoamine-stabilized silver nanoparticles with a molar ratio of silver salt to organoamine of about 1:4 to about 1:10 are disclosed. The process includes: forming a solution including an organic solvent and a first amount of organoamine; adding silver salt particles to the solution; adding a second amount of organoamine to the solution; adding a hydrazine to the solution; and reacting the solution to form an organoamine-stabilized silver nanoparticles.Type: GrantFiled: June 9, 2010Date of Patent: April 3, 2012Assignee: Xerox CorporationInventors: Mahya Mokhtari, Roger E. Gaynor, Marko D. Saban
-
Patent number: 8138415Abstract: Disclosed is a method for producing a solar cell electrode, comprising the steps of: (1) applying a paste comprising (a) electrically conductive particles containing silver particle having a particle size of 0.1 to 10 microns and an added particle comprising particles loaded with metal particles selected from the group consisting of Mo, Tc, Ru, Rh, Pd, W, Re, Os, Ir and Pt particles onto the opposite side from the light receiving side of a back contact-type solar cell substrate, wherein content of the silver particle is 40 to 90 wt %, and content of the added particle is 0.01 to 10 wt % based on the weight of the paste; and (2) firing the applied paste.Type: GrantFiled: April 27, 2011Date of Patent: March 20, 2012Assignee: E. I. du Pont de Nemours and CompanyInventor: Hideki Akimoto
-
Publication number: 20120061710Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.Type: ApplicationFiled: September 10, 2010Publication date: March 15, 2012Inventors: Lenora M. Toscano, Ernest Long, Witold Paw, Donna M. Kologe, Katsutsugu Koyasu, Keisuke Nishu
-
Patent number: 8134068Abstract: Disclosed is a method for producing a solar cell electrode, comprising the steps of: (1) applying a paste comprising (a) electrically conductive particles containing silver particle having a particle size of 0.1 to 10 microns and an added particle comprising a metal alloy comprising metal particles selected from the group consisting of Mo, Tc, Ru, Rh, Pd, W, Re, Os, Ir and Pt particles onto the opposite side from the light receiving side of a back contact-type solar cell substrate, wherein content of the silver particle is 40 to 90 wt %, and content of the added particle is 0.01 to 10 wt % based on the weight of the paste; and (2) firing the applied paste.Type: GrantFiled: April 27, 2011Date of Patent: March 13, 2012Assignee: E.I. du Pont de Nemours and CompanyInventor: Hideki Akimoto
-
Patent number: 8124174Abstract: Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a complexing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R1—NH—C2H4—NH—R2 or R3—(CH2—NH—C2H4—NH—CH2)n—R4. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath.Type: GrantFiled: April 14, 2008Date of Patent: February 28, 2012Assignee: C. Uyemura & Co., Ltd.Inventors: Seigo Kurosaka, Yukinori Oda, Akira Okada, Ayumi Okubo, Masayuki Kiso
-
Publication number: 20120045573Abstract: Provided is a silver conductive film, a thin film of silver comprising a sintered layer of silver particles having a mean particle size DTEM of at most 100 nm. Its specific resistance is at most 5 ??·cm, the ratio of the voids in the sintered layer is at most 3/?m2, and the film has a texture structure with a surface roughness Ra of from 10 to 100 nm. The silver conductive film having such a texture structure may be produced according to a production process comprising a step of applying a silver particle dispersion of silver particles having a mean particle size DTEM of at most 100 nm dispersed in a non-polar or poorly-polar liquid organic medium having a boiling point of from 60 to 300° C., onto a substrate to form a coating film thereon, and thereafter baking the coating film.Type: ApplicationFiled: October 14, 2011Publication date: February 23, 2012Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Kimitaka SATO, Yutaka HISAEDA, Taku OKANO, Kozo Ogi
-
Publication number: 20120043512Abstract: A conductive ink composition comprising organic-stabilized silver nanoparticles and a solvent, and a polyvinyl alcohol derivative resin of Formula (1) wherein R1 is a chemical bond or a divalent hydrocarbon linkage having from about 1 to about 20 carbons; R2 and R3 are independently an alkyl, an aromatic or substituted aromatic group having from about 1 to about 20 carbon atoms; x, y and z represent the proportion of the corresponding repeat units respectively expressed as a weight percent, wherein each repeat unit is randomly distributed along polymer chain, and the sum of x, y and z is about 100 weight percent, and wherein the polyvinyl alcohol derivative resin is present in an amount of from 0.1 to about 5 weight percent of the ink composition.Type: ApplicationFiled: August 20, 2010Publication date: February 23, 2012Applicant: XEROX CORPORATIONInventors: Ping Liu, Yiliang Wu, Nan-Xing Hu
-
Publication number: 20120037399Abstract: A method of fabricating anisotropic conductive film comprises the steps of: mixing conductive particles, a resin material and a solvent to form slurry; and providing a separate means for progressively distributing the conductive particles on one side of the resin material when forming the anisotropic conductive film from slurry. The method disclosed in the present invention is easy to use, and the anisotropic conductive film fabricated by the method has high conductive particles capturing rate.Type: ApplicationFiled: August 16, 2010Publication date: February 16, 2012Inventors: Chien-Chih HSIAO, Chin-Hsin CHIANG
-
Publication number: 20120028028Abstract: A manufacturing method of conductive thin film includes: (A) preparing tetraethyl orthosilicate (TEOS), 3-methacryloxypropyl-trimethoxysilane and one of or a mixture of vinyl-triethoxysilane (VTEO) and vinyl-trimethoxysilane (VTMO) in a mole ratio of 1:1:1, so as to obtain a silicon-containing reactant; (B) mixing the silicon-containing reactant with a solvent containing water and alcohol, wherein the total quantity of moles of the solvent is two times of that of the silicon-containing reactant; and evenly stirring for at least 12 hours, so as to obtain a semi-finished paint; (C) adding a conductive material in an amount of 3-50 wt % based on a final total weight into the semi-finished paint and evenly stirring, so as to obtain a finished paint; and (D) applying the finished paint to a substrate by coating means, and heating at a temperature of 70-250° C. for 5-60 minutes, so as to form a conductive thin film with continuous pores.Type: ApplicationFiled: July 31, 2010Publication date: February 2, 2012Applicant: Cheng Uei Precision Industry Co., LTD.Inventor: CHIH-HAO HUANG
-
Publication number: 20120014073Abstract: A device comprising a substrate with first and second layers is prepared by applying a cellulosic base layer on the substrate followed by a silver nanoparticle coating. The nanoparticle coating is durable and highly electrically conductive. This conductive substrate maybe used for the application of integrated circuitry components, and does not outgas upon application of reflow solder.Type: ApplicationFiled: September 23, 2011Publication date: January 19, 2012Applicant: QUANTUMSPHERE, INC.Inventors: R. Douglas CARPENTER, Christopher William Winn
-
Publication number: 20120015304Abstract: Method for fabricating an interposer is provided. A substrate is provided having thereon at least a conductive via and at least a flange. The flange is bonded on the substrate and shades a portion of the via. A photoresist layer is formed on the interior surface of the via, on a contact surface of the flange and on an inner surface of the flange opposite to the contact surface. An opening is formed in the photoresist layer to expose a portion of the contact surface of the flange, while the photoresist layer still covers the interior surface of the via and the inner surface of the flange. A plating layer is formed on the exposed contact surface of the flange. The photoresist layer is then removed.Type: ApplicationFiled: July 15, 2010Publication date: January 19, 2012Inventors: Chang-Ming Lee, Wen-Fang Liu, Shih-Jung Huang, Ling-Kai Su
-
Patent number: 8097295Abstract: A plurality of gold nanoparticles disposed on a surface of a substrate includes nanoparticles having an average particle density greater than 1.8×1011 particles per squared centimeter of the surface. The gold nanoparticles include a monomodal diameter distribution and an average diameter capable of being arbitrarily controlled between about 5 nm to about 300 nm. The surface may be a three-dimensional surface or an internal surface.Type: GrantFiled: February 27, 2008Date of Patent: January 17, 2012Assignee: The University of Utah Research FoundationInventors: Donald Keith Roper, Wonmi Ahn, Benjamin Jeppson Taylor, Analía G. Dall'Asén
-
Publication number: 20110318600Abstract: A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.Type: ApplicationFiled: June 25, 2010Publication date: December 29, 2011Applicant: Mitsui Mining & Smelting Co., Ltd.Inventors: Tetsuhiro Matsunaga, Hajime Watanabe, Joe Nishikawa, Tetsuro Sato
-
Publication number: 20110305826Abstract: Process for producing organoamine-stabilized silver nanoparticles with a molar ratio of silver salt to organoamine of about 1:4 to about 1:10 are disclosed. The process includes: forming a solution including an organic solvent and a first amount of organoamine; adding silver salt particles to the solution; adding a second amount of organoamine to the solution; adding a hydrazine to the solution; and reacting the solution to form an organoamine-stabilized silver nanoparticles.Type: ApplicationFiled: June 9, 2010Publication date: December 15, 2011Applicant: XEROX CORPORATIONInventors: Mahya MOKHTARI, Roger E. Gaynor, Marko D. Saban
-
Publication number: 20110303458Abstract: Terminal pins comprising a core of a first electrically conductive material selectively coated with a layer of a second electrically conductive material for incorporated into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.Type: ApplicationFiled: June 15, 2011Publication date: December 15, 2011Applicant: Greatbatch Ltd.Inventors: Todd C. Sutay, Keith Seitz, Haytham Hussein, Sachin Thanawala, Thomas Marzano
-
Patent number: 8071161Abstract: A method for fabricating an electrode for electrochemical reactor is provided, wherein the electrode includes a porous carbon diffusion layer and a catalyst layer. The method includes a step of depositing the catalyst layer on the diffusion layer by a DLI-MOCVD process.Type: GrantFiled: July 25, 2008Date of Patent: December 6, 2011Assignee: Commissariat a l'Energie AtomiqueInventors: Sophie Mailley, Philippe Capron, Stéphanie Thollon, Thierry Krebs
-
Publication number: 20110294672Abstract: The invention relates to platinum complexes, to a method for preparing the same and to the use thereof for the chemical vapour deposition of metal platinum. The chemical vapour deposition of platinum onto a substrate is made from a platinum organometallic compound that includes a ligand with a cyclic structure including at least two non-adjacent C?C double bonds, and the platinum organometallic compound has a square-plane structure in which the platinum is bonded to each of the C?C double bonds of the ligand, thereby forming a (C?C)—Pt—(C?C) of 60° to 70°.Type: ApplicationFiled: January 8, 2010Publication date: December 1, 2011Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUEInventors: Pascal Doppelt, Cyril Thurier
-
Patent number: 8062694Abstract: A method for producing a solid electrolyte material region for a memory element of a solid electrolyte memory cell. A first material is formed in substantially pure form. A thermal treatment is carried out in the presence of at least one second material, and the chalcogenide material of the solid electrolyte material region thereby being produced.Type: GrantFiled: October 27, 2010Date of Patent: November 22, 2011Assignee: Adesto Technology CorporationInventors: Cay-Uwe Pinnow, Klaus-Dieter Ufert