Nickel Coating Patents (Class 427/438)
  • Patent number: 5227332
    Abstract: In the plating of articles, particularly the filling of via-holes (16) in the manufacture of semiconductor devices, a catalyst, for example palladium, is incorporated throughout the body of material (12) to which plating is to be effected, as compared with activating just the surface of the body.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: July 13, 1993
    Assignee: LSI Logic Corporation
    Inventor: Neil Morris
  • Patent number: 5223052
    Abstract: A method treating a surface of rotors in a screw-type rotary fluid machine, with the method comprising the steps of: conducting a non-electrolytic Ni plating on the surface of each rotor so as to form a first layer of non-electrolytic Ni plating layer; heating the rotor having the first layer at a temperature not lower than 500.degree. C.; and forming, at least, a second layer of an organic resin so as to cover the first layer.
    Type: Grant
    Filed: April 3, 1991
    Date of Patent: June 29, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Akihiko Yamamoto, Toshihiro Yamada, Tatsuo Natori, Kotaro Naya, Motohiro Satoo, Mitsuru Fujiwara, Katsumi Matsubara, Kazuaki Shiinoki, Hirotaka Kameya
  • Patent number: 5194295
    Abstract: Nickel or cobalt diffusion is suppressed in ceramic articles having a nickel or cobalt underlayer followed by a gold overlayer, by heat-treating the article in a reducing atmosphere at a temperature of at least about 650.degree. C. and subsequently depositing a final gold layer. By suppressing the diffusion of nickel or cobalt, the adhesion of hermetic lids attached thereto by soldering is improved.
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: March 16, 1993
    Assignee: General Electric Company
    Inventor: Charles D. Iacovangelo
  • Patent number: 5183692
    Abstract: A method for producing a coating composed of an electroless metal plate, such as a copper plate, tightly bonded to a polyimide layer comprises a multi-step cure of the polyimide layer carried out in combination with a palladium-catalyzed electroless deposition process. A solution of a polyamic acid compound that is the precursor for the desired polyimide resin in a vaporizable solvent is applied to a substrate and heated preferably to temperature below 250.degree. C., to form a soft-cured polyimide film. The film is immersed in an aqueous palladium-tin colloidal suspension to deposit the colloidal particles thereon, which particles are then activated to form palladium nuclei dspersed on the surface. The soft-cured film is then heated, preferably above about 250.degree. C., to vaporize residual solvent and form a hard-cured polyimide layer having the palladium nuclei dispersed on the surface.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: February 2, 1993
    Assignee: Motorola, Inc.
    Inventors: Prosanto K. Mukerji, Russell Mallen, George Demet, Harry Fuerhaupter
  • Patent number: 5164225
    Abstract: A method of fabricating a thin-film EL device comprising the steps of sequentially forming and stacking a first electrically conductive layer of first electrodes, a first insulating layer, a luminous layer, a second insulating layer and a second electrically conductive layer of second electrodes; previously forming a pattern of the first conductive layer all over a zone for formation of the first electrodes and a zone for formation of electrode terminals; and immersing it into a plating solution to selectively form a terminal pattern only on the first conductive layer, whereby the need for pattern aligning operation can be eliminated, only immersion of it into the plating solution enables easy formation of the precise terminal pattern without providing any damage to the elements of the EL device, and the obtained device can maintain its stable characteristics for a long period of time.
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: November 17, 1992
    Assignee: Kabushiki Kaisha Komatsu Seisakushi
    Inventors: Takashi Nire, Satoshi Tanda
  • Patent number: 5158604
    Abstract: Viscous aqueous electroless plating solutions comprising ionic depositable metal species such as copper or nickel, metal complexing agent such as EDTA, metal reducing agent such as formaldehyde or hypophosphite and thickener such as xantham gum, silica or carboxymethylcellulose have a viscosity greater than 50 cp, for instance up to 20,000 cp. The viscous solutions are useful for electrolessly depositing metal onto moving or inclined catalytic substrates and as a component of kits for applying electrolessly deposited metal images to such surfaces.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: October 27, 1992
    Assignee: Monsanto Company
    Inventors: Albert W. Morgan, George D. Vaughn, Douglas H. Teramura
  • Patent number: 5147692
    Abstract: Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.
    Type: Grant
    Filed: April 23, 1991
    Date of Patent: September 15, 1992
    Assignee: MacDermid, Incorporated
    Inventor: Jon E. Bengston
  • Patent number: 5145517
    Abstract: A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal salt, an electroless reducing agent, a complexing agent, an electroless plating stabilizer, a quantity of particulate matter which is essentially insoluble or sparingly soluble in the metallizing bath, and a particulate matter stabilizer (PMS), and maintaining said particulate matter in suspension in said metallizing bath during the metallizing of said body for a time sufficient to produce a metallic coating with said particulate matter dispersed therein.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: September 8, 1992
    Assignee: Surface Technology, Inc.
    Inventors: Nathan Feldstein, Deborah J. Lindsay
  • Patent number: 5141778
    Abstract: A method for producing extremely smooth metal coatings on zincated aluminum substrates using a special double zincating procedure and/or a specially formulated electroless metal plating bath employing a unique plating process.
    Type: Grant
    Filed: January 23, 1991
    Date of Patent: August 25, 1992
    Assignee: Enthone, Incorporated
    Inventors: Eugene F. Yarkosky, Patricia A. Cacciatore
  • Patent number: 5079040
    Abstract: To electrolessly depositing nickel on tungsten surfaces or molybdenum surfaces which have been deposited on surfaces of ceramic bodies, the ceramic bodies are nucleated, preferably after thorough cleaning, for example with aqueous hydrofluoric acid, by immersion in an aqueous solution containing palladium ions and then introduced into an electroless nickel-plating bath. Before the nickel-plating, the nucleated ceramic bodies are treated in a bath containing a complexing agent for palladium ions, for example in an aqueous cyanide solution.
    Type: Grant
    Filed: August 15, 1989
    Date of Patent: January 7, 1992
    Assignee: Hoechst CeramTec Aktiengesellschaft
    Inventor: Jurgen Brandenburger
  • Patent number: 5077099
    Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, and an electroless metal depositing apparatus for carrying out the process.
    Type: Grant
    Filed: March 14, 1990
    Date of Patent: December 31, 1991
    Assignee: MacDermid, Incorporated
    Inventors: Peter E. Kukanskis, Edward T. Donlon
  • Patent number: 5045436
    Abstract: The invention relates to compositions containinga) at least one organic polymer andb) a dibenzalacetone palladium complex of formula I ##STR1## which is homogeneously dissolved in said polymer but is not copolymerisable therewith, in which formula IR.sup.1 is hydrogen, C.sub.1 -C.sub.18 alkyl, C.sub.1 -C.sub.18 alkoxy or unsubstituted or substituted phenyl,R.sup.2 has one of the meanings of R.sup.1 or is also an amino, nitro or cyano group, an --O--C.sub.m H.sub.2mn OR.sup.4 or --O--CH.sub.2 --CH.OR.sup.4 --CH.sub.2.OR.sup.5 radical or a halogen atom or a glycidyl ether radical,R.sup.3 is hydrogen or C.sub.1 -C.sub.4 alkyl or the two groups R.sup.3 together form a C.sub.2 -C.sub.4 polymethylene chain,R.sup.4 and R.sup.5 have one of the meanings of R.sup.1,q is a value from 1 to 3.5,m is a value from 2 to 6 andn is a value from 0 to 20, with the proviso that the composition does not contain a polymer with an olefinic double bond.
    Type: Grant
    Filed: March 3, 1989
    Date of Patent: September 3, 1991
    Assignee: Ciba-Geigy Corporation
    Inventors: Bernd Tieke, Sheik A. Zahir
  • Patent number: 5017410
    Abstract: Electroless plating compositions are described which produce a boron containing nickel coating. The compositions comprise a water soluble nickel salt, a chelating agent, an alkali metal hydroxide, a boron containing reducing agent, and thiocarbanilide. The composition is particularly useful for providing such coatings on gas turbine engine parts and results in improved wear resistance.
    Type: Grant
    Filed: May 23, 1988
    Date of Patent: May 21, 1991
    Assignee: United Technologies Corporation
    Inventor: Henry M. Hodgens, II
  • Patent number: 5011708
    Abstract: A method of preventing the growth of microorganisms on the surface of a substrate in contact with the environment, while simultaneously preventing corrosion of these substrates by depositing nickel-63 onto the substrate.
    Type: Grant
    Filed: June 6, 1989
    Date of Patent: April 30, 1991
    Assignee: University of Virginia Alumni Patents Foundation
    Inventors: James L. Kelly, Ralph J. Reda
  • Patent number: 5006367
    Abstract: A method for the electroless coating of ferromagnetic substrates substantially free of microspheres or other unwanted auxillary matter, thereby reducing the roughness of the coated articles. The method and articles produced are subjected to a magnetic field and demagnetized prior to the plating step. The method is of particular utility in the coating of textile machinery parts operating at high rotational speed in the minimizing of dust and yarn damage. The method is also of great utility in the deposition of composite electroless coatings.
    Type: Grant
    Filed: February 13, 1990
    Date of Patent: April 9, 1991
    Assignee: Surface Technology, Inc.
    Inventor: Thomas S. Lancsek
  • Patent number: 4997686
    Abstract: A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal salt, an electroless reducing agent, a complexing agent, an electroless plating stabilizer, a quantity of particulate matter which is essentially insoluble or sparingly soluble in the metallizing bath, and a particulate matter stabilizer (PMS), and maintaining said particulate matter in suspension in said metallizing bath during the metallizing of said body for a time sufficient to produce a metallic coating with said particulate matter dispersed therein.
    Type: Grant
    Filed: April 16, 1990
    Date of Patent: March 5, 1991
    Assignee: Surface Technology, Inc.
    Inventors: Nathan Feldstein, Deborah J. Lindsay
  • Patent number: 4983428
    Abstract: Electroless plating compositions are described which produce a boron containing nickel coating. The compositions comprise a water soluble nickel salt, a chelating agent, an alkali metal hydroxide, a boron containing reducing agent, and ethylenethiourea. The composition is particularly useful for providing such coatings on gas turbine engine parts and results in improved wear resistance.
    Type: Grant
    Filed: June 9, 1988
    Date of Patent: January 8, 1991
    Assignee: United Technologies Corporation
    Inventor: Henry M. Hodgens, II
  • Patent number: 4954370
    Abstract: A novel electroless plating bath composition and method for the use thereof, are described for depositing a layer of nickel on anodized aluminum substrates for facilitating direct attachment of electronic chips thereto; the bath composition being a neutralized solution of nickel sulfate, sodium citrate, lactic acid and dimethylbomine in deionized water.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: September 4, 1990
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4935263
    Abstract: A strain detector which has a driven shaft for receiving a stress; a high magnetostrictive rate magnetic layer made of one of Co--B, Co--P, Co--Ni--B, Ni--Fe--P, and Co--Ni--P formed by electroless plating on the outer periphery of the driven shaft; and a detecting coil disposed through a gap on the periphery of the magnetic layer for detecting a variation in the permeability by a strain responsive to the stress of the magnetic layer, a method for manufacturing the strain detector which has the steps of forming a high magnetostrictive plating layer made of one of Co--B, Co--P, Co--Ni--B, Ni--Fe--P and Co--Ni--P by electroless plating on the periphery of the driven shaft; and selectively removing the plating layer to obtain a magnetic layer made of a plurality of magnetic pieces aligned in parallel at a predetermined angle with respect to the central axis of the driven shaft.
    Type: Grant
    Filed: December 16, 1988
    Date of Patent: June 19, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Satoh, Yoshihiko Utsui, Kuraki Kitazaki, Takashi Taniguchi, Kiyoshi Hayashi
  • Patent number: 4880597
    Abstract: A fuel element for a nuclear reactor having a zirconium tin alloy cladding tube, with a thin coating of enriched boron-containing alloy burnable poison, such as nickel-thallium-boron deposited from a reducing agent by an electroless plating process.
    Type: Grant
    Filed: June 24, 1988
    Date of Patent: November 14, 1989
    Assignee: Combustion Engineering, Inc.
    Inventors: William J. Bryan, Nathan Fuhrman
  • Patent number: 4871582
    Abstract: Disclosed is a method of manufacturing a magnetic recording medium which comprises the steps of: forming a non-magnetic layer on a substrate by using a non-magnetic material which is magnetizable by heat to a predetermined temperature, and then locally heating the non-magnetic layer to magnetize the heated part to thereby form a magnetic layer thereat.
    Type: Grant
    Filed: August 20, 1987
    Date of Patent: October 3, 1989
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Takeshi Miyabayashi
  • Patent number: 4844739
    Abstract: The bath uses nickel-II-tri(ethylenediamine) hydroxide and/or cobalt-II-tri(ethylenediamine) hydroxide having the formula M(NH.sub.2 --C.sub.2 H.sub.4 --NH.sub.2).sub.3 (OH).sub.2 as a source of the metal to be deposited, where M represents nickel and/or cobalt, and where the ethylenediamine acts as the complexing agent.
    Type: Grant
    Filed: November 19, 1986
    Date of Patent: July 4, 1989
    Assignee: Office National d'Etudes et de Recherches Aerospatiales
    Inventors: Pierre J. Josso, Isabelle V. Gossart, Claude Duret-Thual
  • Patent number: 4842961
    Abstract: A lid or cover for a ceramic enclosure is formed of a substrate of an iron-based alloy, e.g., Kovar, alternately plated and coated with electrolytic nickel and electroless nickel, with an outer gold electroplate. The alternate electroplate and electroless nickel layers render the lid highly corrosion resistant without the need for an expensive, unrecoverable buried gold layer.
    Type: Grant
    Filed: March 4, 1988
    Date of Patent: June 27, 1989
    Assignee: Advanced Materials Technology Corp.
    Inventors: Thomas J. Basile, Jean LaPlante
  • Patent number: 4840820
    Abstract: A process is provided for improving the electroless nickel plating of aluminum which has been pretreated with a barrier coating such as zinc by employing multiple plating baths under controlled operating conditions.
    Type: Grant
    Filed: October 15, 1985
    Date of Patent: June 20, 1989
    Assignee: Enthone, Incorporated
    Inventors: Paul B. Schultz, Eugene F. Yarkosky
  • Patent number: 4830889
    Abstract: A process for co-depositing fluorinated carbon with electroless nickel which provides a uniformly dispersed co-deposit. The process includes the use of a non-ionic, wetting agent in combination with a cationic wetting agent for the suspension of fluoronated carbon in the electroless nickel solution.
    Type: Grant
    Filed: September 21, 1987
    Date of Patent: May 16, 1989
    Assignee: Wear-Cote International, Inc.
    Inventors: James R. Henry, Ernest M. Summers
  • Patent number: 4816119
    Abstract: This invention comprises the use, during the plating processing of thin-film magnetic recording media, of an oxidizing treatment immediately preceding the electroplating of the magnetic layer. This oxidizing treatment can be controlled to produce desired high levels of coercive force and low levels of media noise.
    Type: Grant
    Filed: September 4, 1987
    Date of Patent: March 28, 1989
    Assignee: Digital Equipment Corp.
    Inventors: Gary C. Rauch, Young David J., Earl R. C. Johns, Robert L. Stone, Carolyn A. Messinger
  • Patent number: 4793201
    Abstract: A static pressure lead screw includes a porous ceramic body having fluid flow paths as part of a flank. The porous ceramic body is fixed by a tubular base member through which the fluid does not flow. Fluid guide holes for supplying the fluid to the porous body extend through the tubular base member and are connected to the porous body. In a preferred embodiment, an electroless-plated layer is formed in a surface layer of the flank or an inner portion continuous with the surface layer, thereby obtaining various high-accuracy static pressure guides with high statical stiffness.
    Type: Grant
    Filed: September 9, 1987
    Date of Patent: December 27, 1988
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Munenori Kanai, Sunao Ishihara, Hiroo Kinoshita
  • Patent number: 4751110
    Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.
    Type: Grant
    Filed: July 14, 1986
    Date of Patent: June 14, 1988
    Assignee: Shipley Company Inc.
    Inventors: Michael Gulla, Terrell A. Benjamin, Mark Farsi
  • Patent number: 4737418
    Abstract: A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.
    Type: Grant
    Filed: December 22, 1986
    Date of Patent: April 12, 1988
    Assignee: Advanced Materials Technology Corp.
    Inventor: James A. Slattery
  • Patent number: 4728560
    Abstract: Electrical printed circuit boards are obtained in an elegant manner without the usual etching methods and without using bonding agent layers in a wet chemical manner on the basis of the principles of the semi or fully additive technique by using precious metal compounds for activation and base material of a type which has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2, (b) a mean pore diameter of 0.05-5.0 .mu.m and (c) a mean pore depth of 0.05-4.0 .mu.m.
    Type: Grant
    Filed: March 4, 1986
    Date of Patent: March 1, 1988
    Assignee: Bayer Aktiengesellschaft
    Inventors: Kirkor Sirinyan, Gerhard D. Wolf, Ulrich von Gizycki, Rudolf Merten
  • Patent number: 4717587
    Abstract: A method of producing electrically conductive structures on non-conductors, in which the deposition of metallic films on non-conductive substrates is carried out by disintegration of metallo-organic compositions in a glow discharge zone of a plasma reactor.
    Type: Grant
    Filed: March 17, 1986
    Date of Patent: January 5, 1988
    Assignee: Schering Aktiengesellschaft
    Inventors: Harald Suhr, Christian Oehr, Ernst Feurer
  • Patent number: 4699811
    Abstract: Chromium is employed as the mask in selective electroless plating of nickel or copper on a substrate. The chromium is applied conveniently by electroplating in the case of conductive substrates or by sputtering in the case of non-conductive substrates.
    Type: Grant
    Filed: September 16, 1986
    Date of Patent: October 13, 1987
    Assignee: MacDermid, Incorporated
    Inventor: David J. Kunces
  • Patent number: 4696724
    Abstract: High nickel/iron alloy steel plate for LNG or LPG tanks having 35-37% nickel content is plated with nickel in an amount of 1 to 10 g/m.sup.2, and then chromated, except electro-chromating treatment, to obtain thereon a chromate film having a chromium content of 5 to 100 mg/m.sup.2.
    Type: Grant
    Filed: March 27, 1986
    Date of Patent: September 29, 1987
    Assignee: Nisshin Steel Co., Ltd.
    Inventors: Takenori Deguchi, Kazuko Uchida, Takao Ikita, Shigeaki Maruhaski, Kazuo Hoshino, Keiji Oosaki
  • Patent number: 4695489
    Abstract: A method of applying nickel directly to a non-activated tungsten surface is disclosed, in which the tungsten surface is immersed in an aqueous electroless nickel plating bath containing a water-soluble nickel salt; ethylenediaminetetraacetic acid; hydrazine; and monoethanolamine for a period of time sufficient to deposit a layer of nickel on the tungsten surface.
    Type: Grant
    Filed: July 28, 1986
    Date of Patent: September 22, 1987
    Assignee: General Electric Company
    Inventors: Kenneth P. Zarnoch, Charles D. Iacovangelo
  • Patent number: 4670312
    Abstract: Method for preparing aluminum, especially large aluminum pieces or articles having a surface layer of aluminum oxide for subsequent metal plating wherein the aluminum or aluminum alloy substrate is immersed in a bath containing metal salts and acid such that the acid content relative to the metal salt is sufficient to remove the surface aluminum oxide layer without substantial attack on the underlying aluminum while enabling the permanent deposit thereon of a continuous, smooth, adherent metal or metal alloy coating directly onto the aluminum, thereby replacing the aluminum oxide layer. Subsequent, essentially blister-free electroless or electrolytic plating of nickel or a nickel alloy, copper or a copper alloy onto the metal or metal alloy coated aluminum are made possible thereby.
    Type: Grant
    Filed: February 7, 1985
    Date of Patent: June 2, 1987
    Assignee: John Raymond
    Inventor: Robert Ehrsam
  • Patent number: 4666786
    Abstract: A composite nickel plated sliding surface is obtained by the formation of a composite nickel plating film on a sliding surface of an automobile part such as an engine cylinder or piston by electroless nickel plating. The plating film contains at least one member of wear resistant particles having an average particle size of 0.1 to 1.0.mu. selected from SiC, TiC, WC, BC.sub.4, TiN, Al.sub.2 O.sub.3 or the like, and also at least one member of lubricating particles having an average particle size of 1 to 10.mu. selected from BN, MoS.sub.2, and Teflon. The nickel plating bath is adjusted to have a phosphorus concentration of 0.5 to 12%. When the matrix of the nickel plating film has a phosphorus concentration of 0.5 to 5%, the film hardness is improved.
    Type: Grant
    Filed: February 27, 1985
    Date of Patent: May 19, 1987
    Assignees: Aisin Seiki Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha
    Inventors: Hideo Yano, Keiichi Kano, Hitoshi Ozawa, Shinji Kato, Yoshio Takagi
  • Patent number: 4617204
    Abstract: Processes for (1) depositing main group metals on inorganic and metallic substrates, (2) depositing transition metals on organic, inorganic and metallic substrates, and (3) depositing combinations of main group metals and transition metals on organic, inorganic and metallic substrates. The resulting products have useful electrical, optical and/or decorative properties.
    Type: Grant
    Filed: June 28, 1985
    Date of Patent: October 14, 1986
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Robert C. Haushalter
  • Patent number: 4613518
    Abstract: Edge termination of monolithic capacitors having thin electrode layers bonded in dielectric resin is accomplished by ashing away some resin to expose electrode edge surfaces, plating the edge surfaces by vapor deposition, and depositing a conductive layer on the coating by electroless plating, schooping or applying conductive epoxy.
    Type: Grant
    Filed: January 14, 1985
    Date of Patent: September 23, 1986
    Assignee: SFE Technologies
    Inventors: Mooyoung Ham, John W. Duffy
  • Patent number: 4600609
    Abstract: An electroless nickel plating method and composition is disclosed wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath. The method and compositions of the invention are useful in producing mirror-bright electroless nickel coatings free of haze.
    Type: Grant
    Filed: May 3, 1985
    Date of Patent: July 15, 1986
    Assignee: MacDermid, Incorporated
    Inventors: Harold Leever, Leo J. Slominski
  • Patent number: 4594273
    Abstract: The rate of deposition of metallic film on a substrate in an electroless plating process is substantially increased without affecting film properties or causing adverse consequences to the plating bath. The boiling point of the plating bath is elevated either by adding to the bath a substance, such as ethylene glycol, which does not alter the reactivity of the bath, or by providing a sealed enclosure over the bath to increase the ambient pressure. The bath is then heated to a substantially higher temperature but below the temperature at which localized boiling occurs. Excellent metal film qualities are obtained on the substrate at a substantially higher rate than in conventional electroless plating and no nucleation sites are created in the bath to cause spontaneous decomposition of the bath.
    Type: Grant
    Filed: November 19, 1984
    Date of Patent: June 10, 1986
    Assignee: International Business Machines Corporation
    Inventors: Saad K. Doss, Peter B. P. Phipps
  • Patent number: 4594263
    Abstract: Laser marking of metal surfaces, particularly semiconductor device packages, is accomplished by depositing an electroless nickel layer on the surface, converting the nickel surface to a form in which it is highly absorptive of radiant energy and exposing the converted nickel surface to laser energy through a mask. The resulting mark is highly resistant to abrasion and corrosion. In addition, the method is highly suitable for use with automated laser marking equipment. Furthermore, it appears that the presence of the converted electroless nickel surface in the region of welds increases the hermeticity of the welds. This is particularly useful in packages of the TO-3 type and similar types.
    Type: Grant
    Filed: December 17, 1984
    Date of Patent: June 10, 1986
    Assignee: Motorola, Inc.
    Inventors: Lee E. Folk, Reginald K. Asher
  • Patent number: 4588480
    Abstract: A method of producing a wear protection coating on a surface of a structural part of titanium or a titanium base alloy comprising applying a metallic nickel layer which adheres to the surface of the structural part and thereafter subjecting the thus coated structural part to a heat treatment to form diffusion layers of Ti.sub.2 Ni and TiNi.sub.3 between the titanium and the nickel. Thereafter, the layer of nickel alone or with the layer of TiNi.sub.3 is removed to leave the titanium part covered by a protection layer of the remaining diffusion layer.
    Type: Grant
    Filed: May 22, 1984
    Date of Patent: May 13, 1986
    Assignee: MTU Motoren-und Turbinen-Union Munchen GmbH
    Inventor: Martin Thoma
  • Patent number: 4581260
    Abstract: An electroless plating bath tank with air sparging and bath heating attachments is provided with a workpiece rack on which multiple horizontal spindles bearing workpieces are rotated about their own axes while also being rotated eccentrically about a horizontal axis, so as to expose the workpiece more uniformly to the action of the bath.
    Type: Grant
    Filed: September 25, 1984
    Date of Patent: April 8, 1986
    Assignee: Ampex Corporation
    Inventor: Shamil A. Mawla
  • Patent number: 4567066
    Abstract: A process is provided for improving the electroless nickel plating of aluminum which has been pretreated with a barrier coating such as zinc by employing multiple plating baths under controlled operating conditions.
    Type: Grant
    Filed: October 23, 1984
    Date of Patent: January 28, 1986
    Assignee: Enthone, Incorporated
    Inventors: Paul B. Schultz, Eugene F. Yarkosky
  • Patent number: 4563371
    Abstract: The metallization of porous solid bodies, such as, for example, ion exchange materials, by loading the surfaces of the metal-free substrates with transition metal ions and subsequently treating them with reducing agents can be improved by activating the substrates, before or after the loading with metal ions, with elements of group 1 or 8 of the periodic table or compounds thereof and sensitizing any activating ions still present. The metallization products are useful hydrogenation catalysts.
    Type: Grant
    Filed: December 23, 1983
    Date of Patent: January 7, 1986
    Assignee: Bayer Aktiengesellschaft
    Inventors: Kirkor Sirinyan, Peter M. Lange, Rudolf Merten, Alfred Mitschker
  • Patent number: 4554184
    Abstract: A method for plating a metal from an electroless plating bath onto a substrate is provided which includes providing a source of an electroless plating bath at a non-plating temperature in a master mixing tank; transferring at least a portion of the plating bath to at least one plating cell, changing the bath temperature to a plating temperature, and contacting the substrate to be plated with the bath at a plating temperature.
    Type: Grant
    Filed: July 2, 1984
    Date of Patent: November 19, 1985
    Assignee: International Business Machines Corporation
    Inventors: Michael J. Canestaro, Ronald A. Kaschak, Donald G. McBride, Donald P. Seraphim
  • Patent number: 4552787
    Abstract: A metal is deposited onto a substrate from an electroless plating solution by plating an initial layer of metal onto the substrate, then contacting the metal-plated substrate with a solution of an acid; and plating an additional layer of metal onto the plated, acid-treated substrate. The process reduces the plating void defects.
    Type: Grant
    Filed: February 29, 1984
    Date of Patent: November 12, 1985
    Assignee: International Business Machines Corporation
    Inventors: Paul Chebiniak, Ronald A. Kaschak, Lois J. Root
  • Patent number: 4528245
    Abstract: This invention relates to a process for conditioning the surfaces of natural and synthetic plastic materials for electroless plating of a metal coating thereon by exposing such materials to an atmosphere comprising ozone, contacting said exposed materials with a conditioning solvent, such as an aqueous solution of sodium, potassium or lithium hydroxide, and thereafter rinsing said contacted materials with an aqueous solution of one or more surfactants.
    Type: Grant
    Filed: February 27, 1984
    Date of Patent: July 9, 1985
    Assignee: Allied Corporation
    Inventor: Jill M. Jobbins
  • Patent number: 4510183
    Abstract: A method for applying a wear-resistant coating to a working surface of an object, which working surface is to be exposed to wear. To coat the object, it is dipped in a bath of molten metal containing unmolten hard metal carbide particles dispersed therein, whereby a coating is formed on the object.
    Type: Grant
    Filed: September 14, 1983
    Date of Patent: April 9, 1985
    Assignee: Rabewerk Heinrich Clausing
    Inventor: Atilla Akyol
  • Patent number: 4504529
    Abstract: Disclosed is a method for the xerographic, pattern-wise deposition of a dielectric powder that is sensitized with a metal compound to enable the electroless plating of a pattern formed by said powder.
    Type: Grant
    Filed: June 18, 1982
    Date of Patent: March 12, 1985
    Assignee: A/S Neselco
    Inventors: Gunnar Sorensen, Leo G. Svendsen