Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

Abstract: A multilayer composite film includes in sequence: a) a biaxially oriented, opaque polyester base layer; b) a non-voided polyester layer on and coextensively in contact with a surface of the base layer; and c) a metal layer on a surface of the non-voided polyester layer opposite the opaque polyester base layer, or on a primer layer on a surface of the non-voided polyester layer opposite the opaque polyester base layer. The film may be prepared by vapor depositing or plasma depositing a metal layer on a surface of a non-voided polyester layer coextensively contacting a biaxially oriented, opaque polyester base layer, or on a primer layer on a surface the non-voided polyester layer.

Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface.

Abstract: A ratchet includes multiple ratchet teeth defined in the outer periphery thereof and a coated layer is coated along the outer periphery of the ratchet. A laser device is used to generate a laser beam to remove a part of the coated layer to defined openings in the coated layer and the ratchet teeth protrude from the openings.

Abstract: The invention relates to a component (4) of a biosensor, comprising at least one first device (6) for receiving a sample liquid, wherein the device (6) is connected via a distributor channel (7) to further receiving devices (8 to 11), into each of which a feed channel (71, 72, 73, 74) branching off from the distributor channel (7) opens, and the feed channels (71, 72, 73, 74) are arranged in succession in flow direction (S) of the sample liquid passed on through the distributor channel (7). In accordance with the invention, it is envisaged that, in the distributor channel (7), in each case between two immediately successive feed channels (71, 72; 72, 73; 73, 74) in flow direction (S), at least one region (K) for at least temporary slowing or stoppage of the capillary flow of the sample liquid has been inserted.

Abstract: A laser absorption layer is first selectively formed in a seal pattern region surrounding an array of electromechanical systems elements, followed by depositing an antistiction layer as a blanket layer over the substrate and the laser absorption layer. The antistiction layer is then selectively removed from the seal pattern using a laser. An epoxy sealing material is provided in the seal pattern where the antistiction layer was removed and a backplate is sealed to the substrate using epoxy.

Abstract: A method of manufacturing a printed circuit board for an optical waveguide includes forming an insulation layer having a through hole on a substrate; forming a lower clad layer on a bottom of the through hole; forming a core part on the lower clad layer; and forming an upper clad layer covering the core part on the lower clad layer and the core part.

Abstract: A method of manufacturing an embedded-trace substrate is provided. First, a core plate is provided. Next, a through hole and a plurality of trenches are formed on the core plate, wherein the through hole passes through the core plate, and the trenches are formed on the upper and the lower surfaces of the core plate. Then, the core plate is subjected to one-plating step for electroplating a conductive material in the through hole and the trenches at the same time. Afterwards, the excess conductive material is removed.

Abstract: To provide a resin composition for laser engraving that can give a film having excellent compositional uniformity and toughness and a relief printing plate having little breakage of small-size halftone dots, a relief printing plate precursor employing the resin composition for laser engraving, a process for making a relief printing plate employing same, and a relief printing plate obtained thereby. A resin composition for laser engraving of the present invention that includes (Component A) a compound having one or more condensable groups and having one or more radical chain transfer groups; (Component B) a radically polymerizable compound; (Component C) a radical polymerization initiator; and (Component D) a binder polymer.

Abstract: The present invention provides a method for manufacturing a color filter substrate, in which the occurrence of color mixing between adjacent sub-pixels is prevented even when an inkjet method is used. A color filter substrate having color filters of a plurality of colors arranged in a matrix with a bank therebetween is manufactured using this method. The method has: a first inkjet step in which an ink is jetted to at least one region among a plurality of regions partitioned by the bank, and the ink is not jetted to any of regions adjacent to the one region in the horizontal direction and the vertical direction; and a second inkjet step in which the ink is jetted to at least one region to which the ink has not been jetted in the first inkjet step, the aforementioned at least one region being among the plurality of regions partitioned by the bank.

Abstract: A housing for a portable electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The decorative layer defines a pattern extending through the decorative layer.

Abstract: A microelectrode for electrochemical analysis having an analysis surface which comprises one or more regions of electrically conductive diamond material surrounded by electrically insulating diamond-like carbon material, the diamond-like carbon material having, (a) a hardness lower than that of the electrically conductive diamond material and (b) a resistivity of at least 1×109 ohm·cm, and the microelectrode being provided with connection means (10) for electrically connecting the one or more regions to an external circuit.

Abstract: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (?m). The interconnect structure comprises a dielectric body element and at least one interconnection array that provides a conductive path between two electronic components. Each interconnection array comprises a plurality of wires that provide both conductivity and compliance to the overall interconnect structure. The versatility and scalability of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures.

Abstract: An adhesive includes an epoxy resin and a hardener. The hardener includes trioxdiamine, diaminodicyclohexylmethane, toluene diamine, and bisphenol-A dianhydride.

Abstract: Provided are a method of heating a composition which is applicable to a substrate provided with a material having low heat resistance and a method of forming a glass pattern which leads to reduction of cracks. A composition formed over a substrate is irradiated with a laser beam to bake the paste through local heating. Scan with the laser beam is, performed so that there can be no difference in the laser beam irradiation period between the middle portion and the perimeter portion of the composition. Specifically, irradiation with the laser beam is performed so that the width of the beam spot overlapping with the composition in the scanning direction is substantially uniform.

Abstract: A first supporting substrate on a front surface of which a reflective layer having an opening is formed and a second supporting substrate on a front surface of which a light absorption layer patterned into island or stripe shapes and a material layer over the light absorption layer are formed are prepared, the first and second supporting substrates are disposed so that the opening of the reflective layer and the light absorption layer overlap with each other and the reflective layer is in contact with a back surface of the second supporting substrate, the second supporting substrate and a deposition target substrate are disposed so that the front surface of the second supporting substrate faces the deposition target substrate, and the material layer is attached to the deposition target substrate by irradiating the back surface of the first supporting substrate with light and by sublimating the material layer.

Abstract: A high-throughput, low cost, patterning platform is provided that is an alternative to conventional photolithography and direct laser ablation patterning techniques. The processing methods are useful for making patterns of microsized and/or nanosized structures having accurately selected physical dimensions and spatial orientation that comprise active and passive components of a range of microelectronic devices. Processing provided by the methods is compatible with large area substrates, such as device substrates for semiconductor integrated circuits, displays, and microelectronic device arrays and systems, and is useful for fabrication applications requiring patterning of layered materials, such as patterning thin film layers in thin film electronic devices.

Abstract: A device for detecting cells and/or molecules on an electrode surface is disclosed. The device detects cells and/or molecules through measurement of impedance changes resulting from the cells and/or molecules. A disclosed embodiment of the device includes a substrate having two opposing ends along a longitudinal axis. A plurality of electrode arrays are positioned on the substrate. Each electrode array includes at least two electrodes, and each electrode is separated from at least one adjacent electrode in the electrode array by an expanse of non-conductive material. The electrode has a width at its widest point of more than about 1.5 and less than about 10 times the width of the expanse of non-conductive material. The device also includes electrically conductive traces extending substantially longitudinally to one of the two opposing ends of the substrate without intersecting another trace. Each trace is in electrical communication with at least one of the electrode arrays.

Abstract: The present invention relates to a solder resist composition including: 1 to 10 parts by weight of a triazene curing agent; 1 to 10 parts by weight of a curing accelerator; and 10 to 50 parts by weight of a diluent, with respect to 100 parts by weight of an epoxy base, a board for a package comprising a solder resist opening using the same, and a method for preparing the board for a package. According to the present invention, it is possible to form a small solder resist opening of less than about 50 ?m through laser ablation and improve laser processability of the thermosetting solder resist composition.

Abstract: Low-loss printed circuit boards, low-loss wide-band antennas, and manufacturing methods thereof are provided by using a resin as a board material. A resin material (101) having a predetermined shape is prepared in a molding step, and the resin material (101) is foamed in a foaming step. As a result, a skin layer (111) and a foamed part (112) are formed. Since the skin layer (111) does not allow close contact of plating, the skin layer (111) is removed in the shape of a conductor pattern in a skin-layer removing step to expose the foamed part (112) in the interior. Electroless plating is carried out in a conductor-layer forming step; and, as a result, plating is brought into close contact with the foamed part (112) having an anchor effect, and a conductor layer (120) is formed.

Abstract: A method for plating circuits on a housing by spraying and laser engraving is provided. Before manufacturing the circuit, a first spraying layer is formed. The thickness of the first spraying layer is approximately equal to that of the circuit to be formed thereon. Laser engraving is used to form laser engraving areas for forming the circuit metal layer. Then the circuit metal layer is formed by chemical plating, and the thickness of the metal layer is approximately equal to that of the first spraying layer. Then a second spraying layer is applied on both of the metal layer and the first spraying layer so as to present a flat and aesthetic appearance. As the present invention is applied in 2-shot molding, each time the pattern of the circuit is changed, it is only necessary to change the paths in the laser engraving. No more molds modification is needed for changing the pattern of the circuit.

Abstract: A holographic overlay is formed using casting a diffractive structure upon a first side of a polycarbonate substrate, and providing a reflection-enhancing coating on at least a part of the diffractive structure. A second side of the substrate provides a substantially flat external surface of the overlay capable of fusing to a conforming surface in the presence of heat and pressure without an adhesive. Optionally, the overlay is laser-engraved so as to form ablated voids in the metal coating and carbonize the laser engravable polycarbonate under the ablated voids.

Abstract: A process for producing three-dimensional shaped ceramic bodies by layerwise printing of a suspension comprising the constituents required for formation of the shaped ceramic bodies by means of an inkjet printer in the desired two-dimensional shape onto a support material, drying and hardening of the layer composite formed, which is characterized in that printing is effected using a suspension comprising from 50 to 80% by weight of ceramic particles in a dispersion medium comprising an aqueous boehmite sol, at least one low molecular weight alcohol, at least one drying inhibitor and at least one organic fluidizer, and also an apparatus for carrying out this process are described.

Abstract: It is an object to provide a method of manufacturing a light-emitting device, which improves use efficiency of an evaporation material and increases accuracy in forming an evaporated pattern by using an evaporation donor substrate by which a material layer to be a transfer layer is prevented from being excessively evaporated and a desired evaporated pattern can be formed. In a method of manufacturing an evaporation donor substrate, a first substrate which is an evaporation donor substrate is irradiated with first light (laser light) through a second substrate which is a mask substrate, whereby a material layer over the first substrate is patterned. In addition, in a method of manufacturing a light-emitting device, the first substrate provided with the material layer which is patterned by the above method is irradiated with second light, whereby the material layer can be evaporated onto a third substrate which is a deposition target substrate.

Abstract: A manufacturing method includes forming one or more grooves in a component that comprises a substrate with an outer surface. The substrate has at least one interior space. Each groove extends at least partially along the substrate and has a base and a top. The manufacturing method further includes applying a structural coating on at least a portion of the substrate and processing at least a portion of the surface of the structural coating so as to plastically deform the structural coating at least in the vicinity of the top of a respective groove, such that a gap across the top of the groove is reduced. A component is also disclosed and includes a structural coating disposed on at least a portion of a substrate, where the surface of the structural coating is faceted in the vicinity of the respective groove.

Abstract: The invention relates to a method for labelling a substrate, in which method at least one luminescent dye is deposited as a first identification feature in at least one transparent marker layer or in at least one functional layer on a surface of the substrate or on a layer which is situated on the surface, wherein the transparent marker layer or the functional layer is provided with a structure in a further step for producing a second identification feature by local destruction, in particular thermally. According to the invention, the deposition of the at least one marker layer or functional layer takes place by means of chemical gas-phase deposition using a flame or a plasma, by means of a sol-gel method or electrochemically.

Abstract: High-surface-area carbon nanostructures coated with a smooth and conformal submonolayer-to-multilayer thin metal films and their method of manufacture are described. The preferred manufacturing process involves the initial oxidation of the carbon nanostructures followed by immersion in a solution with the desired pH to create negative surface dipoles. The nanostructures are subsequently immersed in an alkaline solution containing non-noble metal ions which adsorb at surface reaction sites. The metal ions are then reduced via chemical or electrical means and the nanostructures are exposed to a solution containing a salt of one or more noble metals which replace adsorbed non-noble surface metal atoms by galvanic displacement. Subsequent film growth may be performed via the initial quasi-underpotential deposition of a non-noble metal followed by immersion in a solution comprising a more noble metal.

Abstract: A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole.

Abstract: A method of forming an electrochemical test sensor includes providing a base. Electrochemically-active material is placed on the base. Dielectric material is applied over the electrochemically-active material. A first selected area of the dielectric material is laser-ablated to expose the electrochemically-active material. A second selected area of the dielectric material and the electrochemically-active material are laser-ablated to expose the base. The first selected area is different from the second selected area. A second layer is applied to assist in forming a channel in the test sensor. The channel assists in allowing a fluid sample to contact a reagent located therein. The dielectric material is located between the base and the second layer.

Abstract: A substrate having a pattern of magnetic properties may be formed by forming a magnetically inactive layer on the substrate, forming a magnetic precursor on the magnetically inactive layer, and forming magnetically active domains separated by magnetically inactive domains in the magnetic precursor by applying thermal energy to the magnetic precursor. The thermal energy may be applied using a laser, which may be pulsed. Forming the magnetically active domains may include crystallizing portions of the magnetic precursor.

Abstract: A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.

Abstract: A method for making a microelectronic substrate includes forming a pattern of a selected metallic layer of an in-process unit using laser ablation such that the pattern corresponds to desired locations for conductive features. Conductive material is than added to the in-process unit by a process that uses the pattern to concentrate application of the conductive material to the in-process unit such that the conductive material forms conductive features of the substrate according to the pattern. The step forming a pattern of a selected metallic layer of an in-process unit using laser ablation can includes the use of a UV laser, a CO2 or an excimer laser.

Abstract: A method for manufacturing a substrate for alignment of a liquid crystal may include: forming a vertical alignment layer on a substrate; performing an alignment process on the vertical alignment layer in a first direction; forming a protective layer at a partial region of the vertical alignment layer; performing an alignment process on other regions of the vertical alignment layer in a second direction; and removing the protective layer. A liquid crystal display device manufactured using the substrate for alignment of a liquid crystal ensures wide viewing angle and alignment stability with relatively simple processes as compared with the conventional vertically aligned (VA) mode liquid crystal display device.

Abstract: Described herein are methods of creating markings on a golf club ferrule, some of which comprising providing a polymeric ferrule body having a first color; painting at least a portion of the ferrule body with a paint material, the paint material having a second color that is different than the first color, such as with a high contrast; and removing one or more portions of the paint material from the ferrule body, such as by laser engraving, to reveal respective portions of the first color, thereby forming one or more markings on the ferrule.

Abstract: A composite epoxy resin consisting in a SU-8 epoxy resin, a solvent, with or without photoinitiator and carbon nanotubes in powder. When the resin is combined with the carbon nanotubes, the mechanical, thermal and electrical properties of the nanocomposite are enhanced. That offers a wide range of composites which can be used with different micro-fabrication techniques, such as: lamination, spin-coating, spraying and screening for assembly, interconnect and packaging applications.

Abstract: A method of making a metal electrode on the surface of a hydrophobic material (7), the method comprising the steps of: [1] bringing one end of a capillary (5) containing a fluid that includes particles of metal dissolved in a solvent close to a zone of the surface of the material (7); and [2] illuminating said zone by means of laser radiation (3) so as to have the effects of causing a drop of fluid to flow from the capillary, of depositing the drop on the zone, of evaporating the solvent contained in the drop, and of annealing the metal particles on the surface of the material in order to form the electrode.

Abstract: A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed. The activating insulation layer includes a plurality of catalyst particles, and covers a first wiring layer. An intaglio pattern and at least one blind via partially exposing the first wiring layer are formed on the activating insulation layer, in which some of the catalyst particles are activated and exposed in the intaglio pattern and the blind via. The activating insulation layer is dipped in a first chemical plating solution, and a solid conductive pillar is formed in the blind via through electroless plating. The activating insulation layer is dipped in a second chemical plating solution after the solid conductive pillar is formed, and a second wiring layer is formed in the intaglio pattern through the electroless plating. Components of the first chemical plating solution and the second chemical plating solution are different.

Abstract: The present invention relates to the sealing of inscriptions on plastics which have been produced by means of lasers on the plastic surface.

Abstract: A laser markable security laser transfer film includes a carrier web formed from a laser light-transmissive material and a taggant-containing film disposed on the carrier web. The taggant-containing film is formulated from an energy sensitive taggant capable of withstanding temperatures of at least about 1800° F. to about 2200° F. The taggant absorbs energy at a first predetermined wavelength and, in response, emits energy at a second predetermined wavelength that is different from the first wavelength. The taggant-containing film further includes a polymeric resin. The taggant-containing film is disposed on the object to be marked with the taggant-containing film adjacent the object, and laser light is directed through the film to fuse the taggant-containing film onto the object to form a taggant-containing marking on the object.

Abstract: Certain example embodiments relate to substrates or assemblies having two-colored laser-fused frits, and/or methods of making the same. In certain example embodiments, a first pattern is formed or written on a glass sheet by laser fusing a first frit material to the glass sheet. A second pattern is formed by laser fusing a second frit material disposed on the first frit material. An optional thin film coating is supported by the glass sheet. The glass sheet with the first and second patterns and optional coating is cut prior to heat treatment. A YAG or other type of laser may be used to directly or indirectly heat the frit materials, at the same or different times, and the frit materials may be wet-applied to the substrate. In certain instances, the laser firing raises the temperature of the glass substrate to no more than 100 degrees C. or preferably even lower.

Abstract: The invention relates to a device for heating flowing fluids, in particular intravenous fluids, comprising a fluid housing containing at least one fluid channel, through which the fluid can be conducted from an inlet of the fluid housing to an outlet of the fluid housing, a heating unit containing at least one electric flat heating element for heating the fluid flowing through the fluid channel, and a temperature control unit containing at least one temperature sensor arranged on the flat heating element, wherein the flat heating element is arranged inside the fluid housing, wherein the flat heating element at least partially forms a wall of the fluid channel, wherein at least one linear fluid channel extends between the inlet of the fluid housing and the outlet of the fluid housing.

Abstract: A manufacturing method of a circuit board is provided. A circuit substrate having a first surface and at least a first circuit is provided. A dielectric layer having a second surface and covering the first surface and the first circuit is formed on the circuit substrate. The dielectric layer is irradiated by a laser beam to form a first intaglio pattern, a second intaglio pattern and at least a blind via. A first conductive layer is formed in the first intaglio pattern, the second intaglio pattern and the blind via. A barrier layer and a second conductive layer are formed in the second intaglio pattern and the blind via. Parts of the second conductive layer, parts of the barrier layer and parts of the first conductive layer are removed until the second surface of the dielectric layer is exposed, so as to form a patterned circuit structure.

Abstract: A method of fabricating a thin film battery may include a blanket deposition of an electrolyte layer followed by selective laser patterning of the electrolyte layer. Some or all of the other device layers may be in situ patterned layers—formed using shadow masks.

Abstract: A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.

Abstract: A control element is provided, in particular for a motor vehicle, including a material through which light can be passed and whish is provided with at least one opaque coating provided with symbols, and having a transparent enamel layer on the coating, wherein nanoparticles are introduced into the enamel layer and the coating and the enamel layer are removed by means of a laser.

Abstract: The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer.

Abstract: A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.

Abstract: A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

Abstract: A method of bonding a metal to a substrate involves forming a plurality of nano-features in a surface of the substrate, where each nano-feature is chosen from a nano-pore and/or a nano-crevice. In a molten state, the metal is over-cast onto the substrate surface, and penetrates the nano-features. Upon cooling, the metal is solidified inside the nano-features, where the solidification of the metal forms a mechanical interlock between the over-cast metal and the substrate.