Condenser Or Capacitor Patents (Class 427/79)
  • Patent number: 8821969
    Abstract: A method for making a modified current collector of a lithium ion battery is provided. In the method, the modifier and a metal plate are provided. The modifier is a mixture of a phosphorus source having a phosphate radical, a trivalent aluminum source, and a metallic oxide provided in a liquid phase solvent. The modifier is coated on a surface of the metal plate to form a coating layer. The coated metal plate is heat treated to transform the coating layer into a protective film formed on the surface of the metal plate.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: September 2, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiang-Ming He, Jian-Jun Li, Li-Chun Zhang, Wei-Hua Pu, Jian Gao, Jian-Guo Ren
  • Publication number: 20140240939
    Abstract: The invention concerns a method for producing a microelectronic device comprising a substrate and a stack comprising at least one electrically conductive layer and at least on dielectric layer, wherein it comprises the following steps: formation, from one face of the substrate, of at least one pattern that is in depression with respect to a plane of the face of the substrate, the wall of the pattern comprising a bottom part and a flank part, the flank part being situated between the bottom part and the face of the substrate, the flank part comprising at least one inclined wall as far as the face of the substrate, formation of the stack, the layers of the stack helping to at least partially fill in the pattern, thinning of the stack at least as far as the plane of the face of the substrate so as to completely expose the edge of said at least one electrically conductive layer flush in one plane, formation of at least one electrical connection member (710, 720) on the substrate in contact with the edge of sai
    Type: Application
    Filed: February 28, 2014
    Publication date: August 28, 2014
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventor: Henri SIBUET
  • Publication number: 20140242263
    Abstract: An aluminum compound is represented by following Formula 1. In Formula 1, X is a functional group represented by following Formula 2 or Formula 3.
    Type: Application
    Filed: February 10, 2014
    Publication date: August 28, 2014
    Applicants: ADEKA CORPORATION, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Chul YOUN, Atsushi SAKURAI, Masako HATASE, Youn-Joung CHO, Ji-Na KANG, Naoki YAMADA, Jung-Sik CHOI
  • Publication number: 20140233148
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.
    Type: Application
    Filed: May 24, 2013
    Publication date: August 21, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Jun JEON, Kyu Ha LEE, Hyun Hee GU, Chang Hoon KIM, Myung Jun PARK
  • Publication number: 20140233149
    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T?10 ?m, TA/TC>0.8, and t?5 ?m, so that a multilayer ceramic electronic component having excellent reliability may be realized.
    Type: Application
    Filed: May 24, 2013
    Publication date: August 21, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Jun JEON, Kyu Ha LEE, Hyun Hee GU, Chang Hoon KIM, Myung Jun PARK
  • Publication number: 20140226255
    Abstract: Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.
    Type: Application
    Filed: February 7, 2014
    Publication date: August 14, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Sock CHUNG, Doo Young KIM, Na Rim HA, Chang Hoon KIM, Sang Hyun PARK
  • Publication number: 20140227433
    Abstract: A LaNiO3 thin film having extremely few voids is uniformly formed. Provided is a LaNiO3 thin film-forming composition for forming a LaNiO3 thin film. It includes: a LaNiO3 precursor; a first organic solvent; a stabilizer; and a second organic solvent. The first organic solvent includes carboxylic acids, alcohols, esters, ketones, ethers, cycloalkanes, aromatic compounds, or tetrahydrofuran. The stabilizer includes ?-diketones, ?-ketones, ?-keto esters, oxyacids, diols, triols, carboxylic acids, alkanolamines, or polyvalent amines. The second organic solvent has a boiling point of 150° C. to 300° C. and a surface tension of 20 to 50 dyn/cm. The LaNiO3 precursor content is 1 to 20 mass % with respect to 100 mass % of the composition. The stabilizer content is 0 to 10 mol with respect to 1 mol of a total amount of the LaNiO3 precursors. The second organic solvent content is 5 to 20 mass % with respect to the composition.
    Type: Application
    Filed: February 5, 2014
    Publication date: August 14, 2014
    Applicant: Mitsubishi Materials Corporation
    Inventors: Jun Fujii, Hideaki Sakurai, Nobuyuki Soyama
  • Publication number: 20140216786
    Abstract: A lead electrode and a preparation method thereof are provided. The lead electrode includes an inner terminal, a lead, and an outer terminal, which are sequentially connected. The lead includes: an insulating substrate; an adhesive material coated on the insulating substrate, the adhesive material defining a trenched mesh; and a conductive material filled in the trenched mesh, wherein an angle formed by a grid line of the trenched mesh and a demolding direction is from 0° to 90°. Since the angle formed by the grid line and the demolding direction is very small, little adhesive material will be attached to the mold, such that the residues of the adhesive material are prevented.
    Type: Application
    Filed: July 5, 2013
    Publication date: August 7, 2014
    Applicant: NANCHANG O-FILM TECH. CO., LTD
    Inventors: Fei Zhou, Yulong Gao, Miaoqian Cao, Hongwei Kang
  • Publication number: 20140218841
    Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.
    Type: Application
    Filed: April 26, 2013
    Publication date: August 7, 2014
    Applicant: Apple Inc.
    Inventors: Gang NING, Shawn Xavier ARNOLD, Jeffrey M. THOMA, Henry H. YANG
  • Publication number: 20140220236
    Abstract: Process for producing of a capacitor film comprising the steps of (a) polymerizing propylene in the presence of a catalyst comprising a solid catalyst system obtaining a polypropylene, (b) subjecting said polypropylene to a film forming process obtaining a capacitor film, wherein during the polymerization step (a) said catalyst comprising the solid catalyst system fragments into nanosized catalyst fragments being distributed in said polypropylene, said solid catalyst system comprises a transition metal, a metal which is selected from one of the groups 1 to 3 of the periodic table (IUPAC), and an internal electron donor.
    Type: Application
    Filed: August 29, 2012
    Publication date: August 7, 2014
    Applicant: Borealis AG
    Inventors: Peter Denifl, Pirjo Jaaskelainen, Timo Leinonen, Bo Malm, Anders E. Nymark, Torvald Vestberg
  • Publication number: 20140212576
    Abstract: In a thin film capacitor or the like, a dielectric thin film-forming composition capable of improving leakage current characteristics; and a method of forming a dielectric thin film using this composition are provided. Regarding a dielectric thin film-forming composition for forming a dielectric thin film, the dielectric thin film is formed of a barium strontium titanate (BST)-based complex perovskite film, and the composition is doped with aluminum (Al). In addition, a doping amount of the aluminum (Al) is in a range of 0.1 at % to 15 at % with respect to 100 at % of perovskite A site atoms contained in the composition.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 31, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jun Fujii, Toshiaki Watanabe, Hideaki Sakurai, Nobuyuki Soyama
  • Publication number: 20140205902
    Abstract: Aspects of the invention are directed to a method for forming a hybrid structure. Initially, a wire is received and an encapsulating film is deposited on the wire. Subsequently, the wire is selectively removed to leave a hollow tube formed of the encapsulating film. A plurality of active particles are then placed into the hollow tube by immersing the hollow tube in a suspension comprising the plurality of active particles and a liquid. Lastly, the hollow tube and the plurality of active particles therein are removed from the suspension and allowed to dry so as to form a cluster of active particles at least partially encapsulated by the encapsulating film.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Applicant: BLUESTONE GLOBAL TECH LIMITED
    Inventors: Xin Zhao, Xuesong Li, Yu-Ming Lin
  • Publication number: 20140183020
    Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.
    Type: Application
    Filed: March 4, 2014
    Publication date: July 3, 2014
    Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.
    Inventors: Sheng-Hung YI, Pen-Yi LIAO
  • Publication number: 20140186590
    Abstract: Disclosed herein are a touch panel integrated with a cover glass and a manufacturing method thereof. The manufacturing method of a touch panel integrated with a cover glass includes: providing a sheet shaped glass substrate; forming grooves in cut regions of the glass substrate; forming a chemical tempered layer on a surface of the glass substrate and groove portions through chemical tempering; and cutting the glass substrate along the groove.
    Type: Application
    Filed: October 10, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jin-Mun RYU
  • Publication number: 20140185188
    Abstract: Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon IL KIM, Byoung Hwa LEE, Doo Hwan LEE
  • Publication number: 20140176821
    Abstract: Disclosed herein are a touch panel and a fabricating method thereof. In the touch panel according to an embodiment of the present invention, a noise shielding layer may be separately formed between a transparent substrate and an electrode pattern, thereby shielding noise that occur from a display coupled to the touch panel. In addition, through a bridge electrode pattern formed by patterning the noise shielding layer and a bridge insulating pattern patterned on an insulating layer formed on the noise shielding layer, a first electrode pattern and a second electrode pattern may be formed on the same plane of the transparent substrate so as to intersect with each other, thereby ensuring reliability of electrical connection between each electrode pattern.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Soo Chae, Jung Ryoul Yim, Jang Ho Park, Nam Keun Oh, Yun Ki Hong
  • Publication number: 20140160374
    Abstract: A capacitive touch panel includes a first conductive layer, a second conductive layer and an insulating layer. The first conductive layer includes a plurality of first sensing electrodes, first bridge electrodes and second sensing electrodes. Each of the first sending electrodes and each of the second sending electrodes include a meshed electrode, which has a plurality of openings. The second conductive layer includes a plurality of second bridge electrodes, and each second bridge electrode is electrically connected to two adjacent second sensing electrodes. The insulating layer is disposed between the first conductive layer and the second conductive layer to electrically insulating the first conductive layer from the second conductive layer.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Wen-Chun Wang, Ching-Fu Hsu, Ting-Yu Chang, Chong-Wei Li, Kuo-Chang Su
  • Publication number: 20140162412
    Abstract: A device is disclosed which includes an interposer, at least one capacitor formed at least partially within an opening formed in the interposer and an integrated circuit that is operatively coupled to the interposer. A method is disclosed which includes obtaining an interposer having at least one capacitor formed at least partially within an opening in the interposer and operatively coupling an integrated circuit to the interposer. A method is also disclosed which includes obtaining an interposer comprising a dielectric material, forming an opening in the interposer and forming a capacitor that is positioned at least partially within the opening.
    Type: Application
    Filed: February 14, 2014
    Publication date: June 12, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Chin Hui Chong, David J. Corisis, Choon Kuan Lee
  • Publication number: 20140160628
    Abstract: A charge storage fiber is described. In an embodiment, the charge storage fiber includes a flexible electrically conducting fiber, a dielectric coating on the flexible electrically conducting fiber, and a metal coating on the dielectric coating. In an embodiment, the charge storage fiber is attached to a textile-based product.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 12, 2014
    Inventors: Brian S. Doyle, Sasikanth Manipatruni, Shawna M. Liff, Vivek K. Singh
  • Publication number: 20140160373
    Abstract: A capacitive touch panel includes at least one first conductive series extending along a first direction and at least one second conductive series extending along a second direction on a substrate. The first conductive series includes a plurality of first electrodes disposed along the first direction and a plurality of first connecting electrodes respectively disposed between two adjacent first electrodes. The second conductive series includes a plurality of second electrodes disposed along the second direction and a plurality of second connecting electrodes respectively disposed between two adjacent second electrodes. The first direction intersects the second direction. At least one kind of elements of the first electrodes, the first connecting electrodes, the second electrodes, and the second connecting electrodes are formed from a metal mash layer, and the first conductive series and the second conductive series are electrically isolated from each other.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chang-Hsuan Hsu, Wen-Chun Wang, Cheng-Yi Chou, Chong-Wei Li, Ching-Fu Hsu, Chih-Yuan Wang
  • Patent number: 8741712
    Abstract: A method for forming a DRAM MIM capacitor stack having low leakage current involves the use of a first electrode that serves as a template for promoting the high-k phase of a subsequently deposited dielectric layer. The high-k dielectric layer includes a doped material that can be crystallized after a subsequent annealing treatment. An amorphous blocking is formed on the dielectric layer. The thickness of the blocking layer is chosen such that the blocking layer remains amorphous after a subsequent annealing treatment. A second electrode layer compatible with the blocking layer is formed on the blocking layer.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: June 3, 2014
    Assignees: Intermolecular, Inc., Elpidia Memory, Inc.
    Inventors: Tony P. Chiang, Wim Y. Deweerd, Sandra G Malhotra
  • Publication number: 20140145999
    Abstract: A projected capacitive touch panel, including a substrate, a silver-inclusive transparent conductive coating which forms a plurality of row electrodes, a plurality of column electrodes, and a plurality of conductive traces, and a signal processor which sequentially measures a capacitance between each of row electrodes and an adjacent column electrode. The row electrodes, the plurality of column electrodes, and the plurality of traces are on a plane substantially parallel to the substrate. Each of the row electrodes is electrically connected to the signal processor by one of the plurality of conductive traces. The plurality of traces are at least partially substantially parallel to the column electrodes.
    Type: Application
    Filed: November 27, 2012
    Publication date: May 29, 2014
    Applicant: GUARDIAN INDUSTRIES CORP.
    Inventors: Willem DEN BOER, Alexey KRASNOV
  • Publication number: 20140147579
    Abstract: The present invention is directed to a process for manufacturing a capacitor for an RFID device. The process utilizes stencils to spray-coat capacitor electrodes about a substrate, and in other embodiments, the process spray coats a first capacitor on a substrate, then an insulator on the first capacitor, and then a second capacitor on the insulator.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Inventors: Jacob Conner, Ryan Giedd
  • Patent number: 8734656
    Abstract: A capacitor forming method includes forming an electrically conductive support material over a substrate, forming an opening through at least the support material to the substrate, and, after forming the opening, forming a capacitor structure contacting the substrate and the support material in the opening. The support material contains at least 25 at % carbon. Another capacitor forming method includes forming a support material over a substrate, forming an opening through at least the support material to the substrate, and, after forming the opening, forming a capacitor structure contacting the substrate and the support material in the opening. The support material contains at least 20 at % carbon. The support material has a thickness and the opening has an aspect ratio 20:1 or greater within the thickness of the support material.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: May 27, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Mark Kiehlbauch
  • Publication number: 20140141355
    Abstract: The disclosure provides a graphene electrode, an energy storage device employing the same, and a method for fabricating the same. The graphene electrode includes a metal foil, a non-doped graphene layer, and a hetero-atom doped graphene layer. Particularly, the hetero-atom doped graphene layer is separated from the metal foil by the non-doped graphene layer.
    Type: Application
    Filed: July 24, 2013
    Publication date: May 22, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiao-Feng HUANG, Ping-Chen CHEN, Chun-Hsiang WEN, Wei-Jen LIU
  • Publication number: 20140110239
    Abstract: A touch screen panel for a display device includes layers of polymer formed on both sides of a substrate for forming driving electrodes and sensing electrodes. The substrate may be made of materials such as polyethylene terephthalate (PET). Instead of bonding a window cover made of a heavy material, layers or polymer are formed on both sides of the substrate to afford rigidity to the touch screen panel. By removing the window cover, the weight and thickness of the touch screen panel can be reduced.
    Type: Application
    Filed: December 26, 2012
    Publication date: April 24, 2014
    Applicant: LG DISPLAY CO., LTD.
    Inventors: Namseok LEE, Soonsung YOO, Chulho KIM, Yunho KOOK
  • Publication number: 20140102619
    Abstract: The present invention provides a nano complex oxide doped dielectric ceramic material used for a multilayer ceramic capacitor using a base metal as a material of internal electrodes. The doped dielectric ceramic material comprises barium titanate and a nano complex oxide dopant, wherein the molar ratio of the barium titanate to the nano complex oxide dopant is in the range of (90˜98):(2˜10), the average particle size of the barium titanate is 50˜300 nm and the nano complex oxide dopant has the following formula (1): w A+x B+y C+z D. The present invention also provides processes for preparing the nano complex oxide doped dielectric ceramic material and ultrafine-grained and temperature-stable multilayer ceramic capacitors using the nano complex oxide doped dielectric ceramic material as the material of dielectric layers.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 17, 2014
    Applicant: Tsinghua University
    Inventors: Xiaohui Wang, Zhibin Tian, Tian Wang, Longtu Li
  • Publication number: 20140106257
    Abstract: Cohesive carbon assemblies are prepared by obtaining a carbon starting material in the form of powder, particles, flakes, or loose agglomerates, dispersing the carbon in a selected organic solvent by mechanical mixing and/or sonication, and substantially removing the organic solvent, typically by evaporation, whereby the cohesive assembly of carbon is formed. The method is suitable for preparing free-standing, monolithic assemblies of carbon nanotubes in the form of films, wafers, or discs, having high carbon packing density and low electrical resistivity. The method is suitable for preparing adherent cohesive carbon assemblies on substrates comprising various materials. The assemblies have various potential applications, such as electrodes or current collectors in electrochemical capacitors, fuel cells, and batteries, or as electromagnetic interference shielding materials.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 17, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Satyabrata RAYCHAUDHURI, Yongan YAN, Leonid GRIGORIAN
  • Publication number: 20140098458
    Abstract: Disclosed herein is a composite material comprising a relaxor ferroelectric material and a hydrazine-reduced graphene oxide, wherein the weight ratio of the composite material to the hydrazine-reduced graphene oxide is 9:1 to 200:1. The composite materials have high dielectric permittivity and low dielectric losses and can be used to manufacture various high dielectric permittivity components.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 10, 2014
    Applicant: SAUDI BASIC INDUSTRIES CORPORATION
    Inventors: Mahmoud N. Almadhoun, Husam N. Alshareef, Unnat S. Bhansali, Prince Xavier, Ihab N. Odeh
  • Patent number: 8691327
    Abstract: Provided is a method of manufacturing a solid electrolytic capacitor, including the steps of: forming a capacitor element including an anode body having a dielectric coating film on a surface thereof; impregnating the capacitor element with a polymerization liquid containing a precursor monomer of a conductive polymer and an oxidant; impregnating the capacitor element impregnated with the polymerization liquid with a silane compound or a silane compound containing solution; and forming a conductive polymer layer by polymerizing the precursor monomer after impregnating the capacitor element with the silane compound or the silane compound containing solution.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 8, 2014
    Assignees: SANYO ELECTRIC Co., Ltd., SAGA SANYO INDUSTRIES Co., Ltd
    Inventors: Takeshi Furukawa, Yuichiro Inutsuka
  • Publication number: 20140092523
    Abstract: An orthogonal finger capacitor includes a layer having an anode bone frame adjacent a cathode bone frame, the anode bone frame having a first portion extending along an axis and a second portion extending perpendicular to the axis. A set of anode fingers extends from the first portion. A set of cathode fingers extends from the cathode bone frame, interdigitated with the set of anode fingers. An overlaying layer has another anode bone frame having a first portion parallel to the axis and a perpendicular second portion. A via couples the overlaying anode bone frame to the underlying anode bone frame. The via is located where the first portion of the overlaying anode bone frame overlaps the second portion of the underlying anode bone frame or, optionally, where the second portion of the overlying anode bone frame overlaps the first portion of the underlying anode bone frame.
    Type: Application
    Filed: March 13, 2013
    Publication date: April 3, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: John J. Zhu, PR Chidambaram, Lixin Ge, Bin Yang, Jihong Choi
  • Publication number: 20140085770
    Abstract: Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 27, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Tae Park, Seung Heon Han, Young Jun Choi, Ji Hee Moon, Ki Won Kim, Joon Hwan Kwag
  • Patent number: 8673390
    Abstract: There is disclosed a method of forming crystalline tantalum pentoxide on a ruthenium-containing material having an oxygen-containing surface wherein the oxygen-containing surface is contacted with a treating composition, such as water, to remove at least some oxygen. Crystalline tantalum pentoxide is formed on at least a portion of the surface having reduced oxygen content.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: March 18, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Vishwanath Bhat, Rishikesh Krishnan, Daniel F. Gealy
  • Patent number: 8667654
    Abstract: A method manufactures a capacitor having polycrystalline dielectric layer between two metallic electrodes. The dielectric layer is formed by a polycrystalline growth of a dielectric metallic oxide on one of the metallic electrodes. At least one polycrystalline growth condition of the dielectric oxide is modified during the formation of the polycrystalline dielectric layer, which results in a variation of the polycrystalline properties of the dielectric oxide within the thickness of said layer.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: March 11, 2014
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventor: Mickael Gros-Jean
  • Publication number: 20140063683
    Abstract: There are provided a conductive paste for an external electrode including: 100 parts by weight of a conductive metal particle; 5 to 30 parts by weight of a base resin; and 0.5 to 10 parts by weight of a spherical cross-linked polymer.
    Type: Application
    Filed: December 6, 2012
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Hee GU, Sung Koo KANG, Kyung Pyo HONG, Byung Jun JEON
  • Publication number: 20140061549
    Abstract: Disclosed is a process to reduce mixtures of at least one metal halide by molten metal reduction of the liquid phase metal halide in an alkali or alkaline earth metal to form a reaction product comprising at least one metal mixture and a halide salt coating, in which the at least one metal halide is in stoichiometric excess to the molten metal reductant and wherein the reductant is consumed in the reaction and does not need to be removed at the end of the reaction.
    Type: Application
    Filed: November 13, 2013
    Publication date: March 6, 2014
    Applicant: Boston Electronic Materials, LLC
    Inventor: Andrew Matheson
  • Patent number: 8663752
    Abstract: A method of manufacturing carbon coated aluminum foil as a cathode of solid aluminum electrolytic capacitors Comprising the steps of: preparing an aluminum foil by setting the aluminum foil into a chamber; roughening at least one surface of the aluminum foil by introducing gas into the chamber and activating an electric field so that the gas is ionized and turned into a plasma; and depositing carbon atoms by introducing gas mixed with carbon atoms and turning on the electric field again so as to make the carbon atoms have positive charge thereby impacting into and attaching firmly to the rough surface of the aluminum foil to form a carbon film.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: March 4, 2014
    Inventor: Hung-Wen Tsai
  • Patent number: 8663730
    Abstract: Methods to manufacture a three-dimensional battery are disclosed and claimed. A structural layer may be provided. A plurality of electrodes may be fabricated, each electrode protruding from the structural layer. A porous dielectric material may be deposited on the plurality of electrodes.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: March 4, 2014
    Assignee: Enovix Corporation
    Inventors: Ashok Lahiri, Murali Ramasubramanian, Robert Spotnitz
  • Publication number: 20140054076
    Abstract: A conductive component is disclosed in the present invention, which includes an insulating layer and a metal mesh arranged on the insulating layer, the metal mesh defines a plurality of voids arranged in array, the aperture ratio K of the voids of the metal mesh and the optical transmittance T1 of the conductive component and the optical transmittance T2 of the insulating layer being described as formula: T1=T2*K. The metal mesh is arranged on the insulating layer in the conductive component, a patterned sensing layer on the insulating layer by the metal mesh treated by exposure and development as needed when in use, and then applied to touch screen, the use of indium tin oxide is avoided in the conductive component, thus the cost of the conductive component is low. A method of preparing the conductive component is also provided.
    Type: Application
    Filed: December 21, 2012
    Publication date: February 27, 2014
    Applicant: SHENZHEN O-FILM TECH CO., LTD.
    Inventors: Zhizheng Cheng, Rongjun Cai
  • Publication number: 20140041904
    Abstract: A method of fabricating a two-layer capacitive touch sensor panel comprising the following steps: a) depositing a first transparent electrically conductive layer on a transparent cover sheet; b) forming a pattern in the transparent electrically conductive layer to create a first set of discrete electrode structures; c) depositing a transparent dielectric layer over the discrete electrode structures; d) depositing a second transparent electrically conductive layer onto the transparent dielectric layer; e) forming a pattern in the transparent electrically conductive layer to create further discrete electrode structures by laser ablation, this pattern either not penetrating or penetrating only part way through the dielectric layer so as to avoid damaging the first set of discrete electrode structures; f) forming electrical connections or vias between the two transparent electrically conductive layers through the dielectric layer; and g) forming electrical connections between the transparent electrically conducti
    Type: Application
    Filed: February 10, 2012
    Publication date: February 13, 2014
    Applicant: M-SOLV LIMITED
    Inventor: James Pedder
  • Patent number: 8647737
    Abstract: The invention provides a process for forming crack-free dielectric films on a substrate. The process comprise the application of a dielectric precursor layer of a thickness from about 0.3 ?m to about 1.0 ?m to a substrate. The deposition is followed by low temperature heat pretreatment, prepyrolysis, pyrolysis and crystallization step for each layer. The deposition, heat pretreatment, prepyrolysis, pyrolysis and crystallization are repeated until the dielectric film forms an overall thickness of from about 1.5 ?m to about 20.0 ?m and providing a final crystallization treatment to form a thick dielectric film. Also provided was a thick crack-free dielectric film on a substrate, the dielectric forming a dense thick crack-free dielectric having an overall dielectric thickness of from about 1.5 ?m to about 20.0 ?m.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: February 11, 2014
    Assignee: UChicago Argonne, LLC
    Inventors: Beihai Ma, Uthamalingam Balachandran, Sheng Chao, Shanshan Liu, Manoj Narayanan
  • Publication number: 20140037835
    Abstract: In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).
    Type: Application
    Filed: September 24, 2013
    Publication date: February 6, 2014
    Applicant: BlackBerry Limited
    Inventors: Ivoyl P. Koutsaroff, Mark Vandermeulen, Andrew Vladimir Claude Cervin, Atin J. Patel
  • Patent number: 8642116
    Abstract: A cartridge block for screening a multilayer ceramic with a conductive paste includes a threaded paste cartridge attachment located at a top of the cartridge block, the threaded paste cartridge attachment being configured to receive a paste cartridge containing the conductive paste; a paste routing section, the paste routing section located underneath the threaded paste cartridge attachment, the paste routing section comprising a flared section located at a bottom of the cartridge block, the paste routing section being configured to receive the conductive paste from the threaded paste cartridge attachment and route the paste through the flared section.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: February 4, 2014
    Assignee: International Business Machines Corporation
    Inventors: William W. Harkins, Christos T. Kapogiannis, Gerald H. Leino, Robert Weiss
  • Publication number: 20140029159
    Abstract: In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 30, 2014
    Inventors: Yasuyuki SHIMADA, Takashi SAWADA
  • Patent number: 8637846
    Abstract: Semiconductor structures including a zirconium oxide material and methods of forming the same are described herein. As an example, a semiconductor structure can include a zirconium oxide material, a perovskite structure material, and a noble metal material formed between the zirconium oxide material and the perovskite structure material.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: January 28, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Dale W. Collins, D. V. Nirmal Ramaswamy, Matthew N. Rocklein, Swapnil A. Lengade
  • Publication number: 20140022693
    Abstract: There is provided a ceramic electronic component, including: a ceramic body including a plurality of internal electrodes; a first external electrode layer electrically connected to the internal electrodes and formed on external surfaces of the ceramic body; a second external electrode layer including nickel (Ni), formed on the first external electrode layer; a metal coating layer including tin (Sn), formed on external surfaces of the first external electrode layer and the second external electrode layer; and a diffusion layer formed between the first and second external electrode layers and the metal coating layer.
    Type: Application
    Filed: May 3, 2013
    Publication date: January 23, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyu Ree KIM, Hyun Tae KIM, Jong Woo CHOI, Sang Hoon KWON, Dae Bok OH
  • Publication number: 20140021161
    Abstract: A systematic packaging method, comprises providing a package, said package operable for packaging an object; and spreading and plating one or more conductive structures on said package; wherein said spreading and plating steps are performed by the methods selected from the group consisting of physically, chemistry deposit and selectively etching.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 23, 2014
    Inventors: Jux WIN, Wei-Leun FANG
  • Publication number: 20140011034
    Abstract: A process for conversion of conventional sand granules (or other particulates) to a ‘core-shell’ adsorbent granules in which GO (or GO-f) coating imparts nano structural features on the surface of the sand granules (or other particulates). Such materials are useful in a variety of engineering applications such as water purification, catalysis, capacitors, proppants, casting, and magnetic shielding.
    Type: Application
    Filed: March 18, 2011
    Publication date: January 9, 2014
    Applicants: William Marsh Rice University, NanoHoldings LLC
    Inventors: Mainak Majumder, Wei Gao, Pulickel Madhavapanicker Ajayan, Tharangattu Narayanan, Bhabendra K. Pradhan
  • Publication number: 20130344393
    Abstract: A composite material of carbon-coated graphene oxide, its preparation method and application are provided. The method for preparing the composite material comprises the following steps: obtaining graphene oxide; mixing the said graphene oxide and the source of organic carbon according to the mass ratio of 1-10:1 in water to form a mixed solution; making the mixed solution react hydrothermally under the condition of 100˜250° C., cooling, solid-liquid separating, washing, and drying to attain the composite material. The advantages of the preparation method are simple process, low energy consumption, low cost, no pollution and suitable for industrial production. The advantages of composite material are stable structural performance, high electric conductivity. Lithium ion battery and/or capacitor have/has high power density while the composite material is used to prepare the anode material of lithium ion battery and/or capacitor.
    Type: Application
    Filed: December 31, 2010
    Publication date: December 26, 2013
    Applicant: OCEAN'S KING LIGHTING SCIENCE & TECHNOLOGY CO., LT
    Inventors: Mingjie Zhou, Jun Pan, Yaobing Wang
  • Publication number: 20130344232
    Abstract: A method of forming a conductive feature on a three-dimensional object may include depositing a composition comprising nanoparticles onto a portion of the three-dimensional object, and annealing the composition to form the conductive feature. In another embodiment, a method of forming a conductive feature on a three-dimensional object may include printing a composition comprising nanoparticles to produce a contiguous line over a non-planar portion of the three-dimensional object, and heating the composition to form a conductive feature that has conductivity throughout.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 26, 2013
    Applicant: XEROX CORPORATION
    Inventors: Naveen CHOPRA, Yiliang WU, Ping LIU, Barkev KEOSHKERIAN, Michelle CHRETIEN