Noncircular Aperture (e.g., Slit, Diamond, Rectangular, Etc.) Patents (Class 428/134)
  • Publication number: 20030215603
    Abstract: A crack arrest tape is in the form of a continuous long strip having a plurality of holes densely distributed on a surface thereof. Elastic patching material serving as a bonding agent in repairing a crack on a wall passes through the holes on the crack arrest tape to hold the latter in place above the crack. Portions on the tape surrounded by any four of the holes adjacent to one another are connecting zones that are at least equal to the holes in area to enhance a structural strength of the crack arrest tape and prevent the tape attached to the crack from displacement and/or tearing due to any deformation stress of the cracked wall resulted from expansion and contraction caused by changes in temperature.
    Type: Application
    Filed: May 14, 2002
    Publication date: November 20, 2003
    Inventor: Wen-Wang Lee
  • Patent number: 6641892
    Abstract: Use of a piece of adhesive film for bonding a) a plate (6) to an article (5) to be mounted or hung up in such a way that the bond can be separated again without damage and without leaving a residue, by means of b) a double-sided adhesive film (1) having a tab (2) which projects from the adhesive join and which can be pulled in the direction of the bond plane to separate the bond, where c) the plate (6) has a device (7) via which mounting or hanging can take place in a manner known per se, and where d) the bonding is hidden to the viewer of the mounted or hung article (5), if appropriate by the article (5) itself.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: November 4, 2003
    Assignee: tesa AG
    Inventor: Bernd Lühmann
  • Patent number: 6641895
    Abstract: A decorative magnet has a plastic body with at least one magnet heat staked to the back of the body. The body has at least one opening extending through the body from the front face to the back and a stake extending from the back of the body. An insert has a first portion within the at least one opening and a second portion extending from the first portion. The second portion rests against the back of the body and prevents the insert from completely passing through the opening. A portion of the magnet covers at least a portion of the insert thereby retaining the insert within the opening or openings in the body.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: November 4, 2003
    Assignee: Adams Mfg. Corp.
    Inventor: William E. Adams
  • Patent number: 6635333
    Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When the marking is formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package structure. The marking may be formed as apertures through or recessed areas in one or more stereolithographically fabricated layers of material. Alternatively, the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. The marking may be formed directly on a surface of a packaged or bare semiconductor device component. As an alternative, the marking can be fabricated separately from a semiconductor device component, then secured thereto. Methods of stereolithographically marking semiconductor device components are also disclosed.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: October 21, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Ford B. Grigg, James M. Ocker, Rick A. Leininger
  • Patent number: 6635334
    Abstract: A polymeric film having a plurality of perforations is described. The polymeric film provides a strong, high-tensile strength material that permits hand tearing of the film along one or two axes. In specific implementations, the polymeric film is incorporated into a multi-layer film having cloth-like properties of strength and tear propagation, and is suitable for use various adhesive tape applications. Methods of making the polymeric film are also disclosed.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: October 21, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Jeffery Jackson, Dennis L. Krueger
  • Patent number: 6632504
    Abstract: A nonwoven web is provided which can be readily converted to an apertured web by stretching. In its initial non-apertured state, the web comprises a plurality of multicomponent fibers comprising at least two thermoplastic polymer components arranged in at least first and second separate continuous structured domains. The polymer component of the first domain comprises polyethylene. Prior to stretch aperturing, the web has a peak elongation of at least 100 percent and is characterized by having a plurality of discrete, spaced-apart, frangible bond sites of polymer bonding the fibers to form a coherent extensible nonwoven web. The frangible bond sites are structured and arranged to readily rupture when subjected to tensile stress to form discrete, spaced-apart apertures in the nonwoven fabric. The web has a total energy absorption in at least one of the machine direction or the cross-machine direction of at least 50 gcm/cm2.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: October 14, 2003
    Assignee: BBA Nonwovens Simpsonville, Inc.
    Inventors: Jay Darrell Gillespie, David D. Newkirk, Michael M. Thomason, Gregory W. Farell, Harold E. Thomas
  • Patent number: 6627292
    Abstract: A surface repair patch for closing an opening around a fixture which is adjacent to or protrudes from a surface is provided. The surface repair patch comprises a sheet having a plurality of openings which extend from the first side to the second side of the sheet. The sheet supports, positions, and reinforces a curable repair compound on a surface before the repair compound is cured. The sheet includes a removable first section which has a border defined by a first line of holes. The first line of holes is configured such that the removable first section may be removed from the sheet by applying pressure to the removable first section. The sheet of the repair patch may further include a removable second section having a border defined by a second line of holes which facilitate removal of the removable second section from the sheet. The sheet may also include a third line of holes which extend from the border of the removable first section to the periphery of the sheet.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: September 30, 2003
    Assignee: Pro Patch Systems, Inc.
    Inventor: Dennis Hoffmann, Sr.
  • Patent number: 6617003
    Abstract: An actively cooled TBC bond coat wherein active convection cooling is provided through micro channels inside or adjacent to a bond coat layer applied to a substrate. The micro channels communicate directly with at least one cooling fluid supply contained within a turbine engine component, thereby providing direct and efficient cooling for the bond coat layer. Because the substrate is covered with an actively cooled bond coat layer, it will reduce the cooling requirement for the substrate, thus allowing the engine to run at higher operating temperature without the need for additional cooling air, achieving a better engine performance. In one form, the component includes a substrate having at least one substrate channel with a first and second end. At least one micro channel is in fluid communication with a plenum which in turn is in fluid communication with at least one substrate channel through an exit orifice in the substrate channel which is at a first end of the substrate channel.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: September 9, 2003
    Assignee: General Electric Company
    Inventors: Ching-Pang Lee, Robert Edward Schafrik, Ramgopal Darolia
  • Patent number: 6617002
    Abstract: Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: September 9, 2003
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Kenneth Brian Wood
  • Patent number: 6596370
    Abstract: A method for producing a resin-molded article having openings which is free from a weld at a conjunction portion of synthetic resin flows and which exhibits excellent surface appearance and satisfactory strength provides a resin-molded article. This method includes injection-molding synthetic resin by using a mold, wherein the mold has a cavity which as projections for forming openings, projection-side peripheral portions surrounding the projections and a flow-rate changing means for making the flow rate of the injected synthetic resin different at each sides of each projection, and wherein the synthetic resin is injected into the cavity of the mold through a resin-injection opening.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: July 22, 2003
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Hiromi Hyuga, Yasunobu Teramoto, Daiichiro Kawashima, Tatsuya Oba
  • Patent number: 6592965
    Abstract: A ductile, solid electrolyte composite comprising a continuous, ordered, repeating ductile metallic array surrounded by and supporting an ionically conductive ceramic matrix such as stabilized zirconia, bismuth and/or ceria oxides.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: July 15, 2003
    Assignee: IGR Enterprises, Inc.
    Inventor: Arnold Z. Gordon
  • Publication number: 20030128523
    Abstract: An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
    Type: Application
    Filed: February 25, 2003
    Publication date: July 10, 2003
    Inventors: Walter L. Moden, David J. Corisis, Larry D. Kinsman, Leonard E. Mess
  • Patent number: 6589891
    Abstract: An abrasion resistant garment and method of producing same. A garment that is highly ventilated while providing abrasion protection for a wearer during a slide, as for instance that may occur during a fall from a motorcycle. A material is produced wherein abrasion-resistant, low sliding friction, beads are held within a matrix of high-tensile strength, abrasion-resistant, cords. The beaded matrix within the garment can be augmented with layers to form a lining and exterior layers to enhance visibility. The force of a sliding rider is retained over the beaded matrix, away from the road surface. Under abrasive sliding friction, the beads additionally rotate to an extent which tightens the cord matrix and thereby helps constrain the skin surface of the wearer from making contact with the roadway surface.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: July 8, 2003
    Assignee: Rastar Corporation
    Inventor: Rodger H. Rast
  • Publication number: 20030124305
    Abstract: Mold apparatus for molded wood strand three-dimensionally carved articles of manufacture using at least one hole punch comprised of a base and a funnel shaped hole-defining portion having a funnel angle of 20 degrees or greater to vertical for producing molded holes at angles of 20 degrees or greater to vertical, to facilitate insertion of items such as a T nut within the molded hole in an assembly-line like fashion.
    Type: Application
    Filed: February 18, 2003
    Publication date: July 3, 2003
    Inventor: Bruce A. Haataja
  • Patent number: 6572950
    Abstract: The present invention relates to a laminate key sheet wherein a key sheet of a resin film having a display section is bent into a same form as the top and side faces of each resin button in order to be integrated with the resin button and where a cut-out is formed between the resin buttons. A rubber elastic sheet and the resin film are connected together through an adhesive interposing between an area between resin buttons of the key sheet and the rubber elastic sheet.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: June 3, 2003
    Assignee: Polymatech Co., Ltd.
    Inventor: Akihiro Tsuji
  • Patent number: 6569290
    Abstract: A bi-component link for making a modular papermaking fabric has a link base component capable of interconnecting to at least one other link and a surface plate component attached to the link base forming a paper support surface. Each component is made through molding techniques to have predetermined characteristics such as open area, permeability, surface finish, etc. The surface plate component is attached to the link base component for combined effect on fabric characteristics. A papermaking fabric is constructed from a plurality of interconnected bi-component links and has predetermined permeability established by the combination of a pattern of open and contact areas on each component of each link.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: May 27, 2003
    Assignee: AstenJohnson, Inc.
    Inventor: C. Barry Johnson
  • Patent number: 6565666
    Abstract: Disclosed is a method of removing liquid from a surface of a semiconductor wafer that comprises the steps of providing a plurality of capillary channels, each said capillary channel having a first opening and a second opening, and then placing said first openings in contact with the liquid in a manner effective in drawing away the liquid by capillary action.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: May 20, 2003
    Assignee: International Business Machines Corporation
    Inventors: Russell H. Arndt, Glenn Walton Gale, Frederick William Kern, Jr., Kenneth T. Settlemyer, Jr., William A. Syverson
  • Publication number: 20030087056
    Abstract: A method for formation of shaped components such as shaped absorbent cores, for disposable absorbent articles, contemplates that a relatively wide web of material be provided from which the components are cut. The web of material is longitudinally slit to form a plurality of subdivided webs each having shaped components arranged in serial relationship. The shaped components of adjacent ones of the subdivided webs are nested with each other, that is, a line extending longitudinally of the web extends through the components of adjacent subdivided webs. Efficient formation is facilitated by collecting the marginal portions of the web of material, and at least partially recycling the collected portions for formation of the wide web.
    Type: Application
    Filed: November 5, 2001
    Publication date: May 8, 2003
    Inventors: Paul Ducker, Krishnakumar Rangachari
  • Patent number: 6555200
    Abstract: A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-defective individual packages to each of mounting portions of a plate; and cutting the plate into separate pieces, each of the separated pieces corresponding to each of the mounting portions on which each of the non-defective individual film packages is mounted.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: April 29, 2003
    Assignee: Seiko Epson Corporation
    Inventor: Nobuaki Hashimoto
  • Publication number: 20030077418
    Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed.
    Type: Application
    Filed: November 21, 2002
    Publication date: April 24, 2003
    Inventors: Ford B. Grigg, James M. Ocker, Rick A. Leininger
  • Patent number: 6544389
    Abstract: A link for making a modular papermaking fabric by interconnecting with other links is made through molding techniques to have predetermined characteristics such as open area, permeability, surface finish, etc. A papermaking fabric is constructed from a plurality of interconnected links and has predetermined permeability established by the combination of open and contact areas on each link.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: April 8, 2003
    Assignee: AstenJohnson, Inc.
    Inventor: C. Barry Johnson
  • Patent number: 6537646
    Abstract: An upholstery tack strip includes a thermoplastic sleeve and a metal ribbon embedded within the sleeve. The sleeve itself includes a plurality of removed material sections forming opposed pairs of sleeve windows, while the metal ribbon integrally includes nail sections which protrude outwardly from the tack strip through respective ones of the sleeve windows. Most preferably, the sleeve is extrusion-coated onto the metal ribbon stock using a cross-head die. The thus-coated metal strip preform may then be transferred to downstream fabrication operations whereby the sleeve windows and nail portions are formed. Since the nail portions protrude outwardly from the tack strip through the sleeve windows, relative lengthwise slippage between the metal ribbon stock and the sleeve is prevented.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: March 25, 2003
    Inventors: David L. Haygood, Gary T. Schwertner
  • Publication number: 20030041956
    Abstract: The present invention relates to hot gas welding of thermoplastic and hot melt spraying, and in particular, to producing anti-skid surfaces on plastic products such as pallets and top frames used for material handling.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Maurice J. Pigott, Brandon L. Pigott, Schuyler F. Pigott, Peter S. Pigott, Jerry J. Fan
  • Publication number: 20020182371
    Abstract: An apertured elastic member having a first direction, a second direction perpendicular to the first direction and a substantially constant thickness dimension. The apertures are aligned in a pattern of rows substantially parallel to the first direction. A nonapertured region extends uninterrupted between adjacent rows of apertures parallel to the first direction. The member has a plurality of repeating units, each having substantially the same amount of material everywhere along the repeating unit in a direction parallel to the second direction.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 5, 2002
    Inventors: See Aun Soon, Jorg Muller
  • Patent number: 6489007
    Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographicaily formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: December 3, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Ford B. Grigg, James M. Ocker, Rick A. Leininger
  • Patent number: 6485594
    Abstract: A method for producing sections in sandwich structures of fiber composites is provided, as well as the structures. The method involves shaping sectional cores around a cut-out, applying bands circumferentially along the perimeter of the cut-out, and covering the sectional cores and to circumferential bands, with layers. The sandwich structure is then impregnated with resin.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: November 26, 2002
    Assignee: Deutsches Zentrum fur Luft und Raumfahrt e.V.
    Inventors: Arno Pabsch, Wilm Felix Unckenbold, Axel Herrmann
  • Patent number: 6475932
    Abstract: The fabrication of multi-layered laminated structures involves a high strength through-bonding technique. In its preferred embodiment, the structure is a nonwoven trilaminate structure which has outer layers of nonwoven material, and an inner elastomeric layer which has a plurality of openings therethrough, (e.g., an elastomeric mesh). During fabrication, beads of through-bonding adhesive (e.g., oil resistant, polybutylene-based hot melt adhesive) is applied to at least one of the nonwoven webs. The inner elastomeric mesh web and the two outer nonwoven webs are then aligned and fed into a compression nip. The compression nip compresses the webs together to obtain intimate contact of the two outer nonwoven webs through the openings in the inner elastomeric mesh web.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: November 5, 2002
    Assignee: Ato Findley, Inc.
    Inventors: Russell P. Stuczynski, Diane M. Strelow, James D. Carper
  • Patent number: 6468626
    Abstract: A flexible sheet 1 includes a plastic sheet and a fibrous assembly bonded to the lower surface of the sheet. The sheet is formed with projections, ribbon-shaped regions, fine slits defined between each pair of adjacent ribbon-shaped regions, bridge-like regions connecting each pair of adjacent ribbon-shaped regions and rising regions extending upward from edges of the ribbon-shaped regions. The fibrous assembly are partially exposed within the respective fine slits.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: October 22, 2002
    Assignee: Uni-Charm Corporation
    Inventors: Hisashi Takai, Miou Suzuki
  • Patent number: 6452063
    Abstract: The present invention pertains to a porous, macroscopically-expanded, three-dimensional, elastomeric web suitable for use in disposable absorbent articles such as bandages, diapers and pull-up diaper training pants, as well as a method for making the web. In a preferred embodiment the web has a continuous first surface and a discontinuous second surface remote front first surface. In a preferred embodiment the elastomeric web exhibits a multiplicity of primary apertures in the first surface of the web, the primary apertures being defined in the plane of the first surface by a continuous network of interconnecting members. Each interconnecting member exhibits an upwardly concave-shaped cross-section along its length. The interconnecting members terminate substantially concurrently with one another to form a secondary aperture in the plane of the second surface of the web.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: September 17, 2002
    Assignee: The Procter & Gamble Company
    Inventors: John Joseph Curro, Anneka M. Kaminski, Michele Ann Mansfield, George Christopher Dobrin, Jianbin Zhang
  • Patent number: 6444309
    Abstract: The present invention relates to a cloth adhesive tape for binding a wire harness used for binding the insulated conductors of wire harness. An adhesive layer 12 is put on the one surface of substrate 11 made of a non-woven fabric and having small through holes 15 throughout the area thereof, and a resin layer 13 is put on the other surface of the substrate 11, and a release agent layer 14 is put on the resin layer 13. This can prevent the delamination of the substrate 11 and can improve a sound-damping property, a hand-tearing property, and a fire resistance.
    Type: Grant
    Filed: January 21, 2000
    Date of Patent: September 3, 2002
    Assignee: Sliontec Corporation
    Inventors: Katsumi Hashimoto, Hiroyuki Iwamura, Noriyoshi Bitoh
  • Patent number: 6423394
    Abstract: In order to provide wider biaxially-stretched geogrids having high primary direction (PD) strength, crotch-forming zones of a starting material which is at least 2.0 mm thick have protuberances (6). On strectching, PD orientation passes right through the junction (27) but the protuberance (6) causes the orientation ratio of the crotch edge to decrease significiantly as orientation enters the central part of the crotch edge. After a secondary direction stretch of at least about 1.5:1, the thickness of the central part of the crotch edge is not reduced by more than about 20%. The stretching does not reduce the thickness of any point along notional ridge lines (31) to such an extent that the ratio of finished thickness to starting thickness at that point mid-point. In the biax geogrid (25), the junction mid-point is significantly thicker than the PD is less than about 80% of the ratio of finished thickness to starting thickness of the junction strand mid-point.
    Type: Grant
    Filed: July 28, 1997
    Date of Patent: July 23, 2002
    Assignee: Netlon Limited
    Inventors: Frank Brian Mercer, Keith Fraser Martin, Stuart Green, Nigel Edwin Wrigley
  • Publication number: 20020071935
    Abstract: A passive element solder pad structure free of solder balls includes a substrate which has an upper surface disposed with a plurality of solder pads and a layer of solder mask. The solder mask has a radial-shaped opening which has a relatively large space in the center and a plurality of grooves extended outward from the center. The opening enables the surface of the solder pads partly or totally exposed. When printing the solder pad for reflow process to solder passive elements on the substrate, solder paste contact area between the passive element and solder pad will be increased for enhancing adhering force whereby to prevent the passive element from separating from the substrate. The opening space also may prevent excess molten solder paste from spilling to the surface of the solder mask and prevent solder balls from forming on the solder mask surface.
    Type: Application
    Filed: January 11, 2001
    Publication date: June 13, 2002
    Inventor: Chi-Chuan Wu
  • Publication number: 20020071982
    Abstract: A dielectric member having a reduced electrolyte creepage characteristic is realized by forming the dielectric member to have a surface roughness of Ra 10 or less.
    Type: Application
    Filed: December 13, 2000
    Publication date: June 13, 2002
    Inventors: Jian Li, Hansraj C. Maru
  • Patent number: 6391420
    Abstract: The invention is an extruded bicomponent elastomeric netting having unidirectional elasticity. Such a netting product is a non-woven article employing a non-elastic material such as polypropylene (10) in the machine direction strands and an elastic material such as a styrenic block copolymer (12) in the cross machine direction strands. The reverse arrangement, a product with “reverse strand distribution”, is also possible.
    Type: Grant
    Filed: August 26, 1994
    Date of Patent: May 21, 2002
    Assignee: Leucadia, Inc.
    Inventors: Hans O. Cederblad, Jan D. Seppala
  • Patent number: 6354130
    Abstract: A method for bending a corrugated product, such as composite decking, building panels, or the like. With the method being easily performed by any workman on the job site, and the only tools needed are a saw and a hammer. Also this method allows the workman to easily bend the product into any desired angle of their choice, and forms a weather proof bend which is extremely strong.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: March 12, 2002
    Inventors: Cathy D. Santa Cruz, Wayne R. Sandstrom
  • Publication number: 20020024798
    Abstract: An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
    Type: Application
    Filed: August 29, 2001
    Publication date: February 28, 2002
    Inventors: Walter L. Moden, David J. Corisis, Larry D. Kinsman, Leonard E. Mess
  • Publication number: 20010050197
    Abstract: Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.
    Type: Application
    Filed: July 24, 1998
    Publication date: December 13, 2001
    Inventor: KENNETH BRIAN WOOD
  • Patent number: 6306485
    Abstract: A decorative pop-up sticker is formed of a decorative design element bendable along an intermediate line to form design sections at least one of which has adhesive on its back side, whereby to enable securing said design sections to a surface with the bent design section extending outwardly of said surface in a pop-up, three dimensional configuration.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: October 23, 2001
    Inventor: Sheila K. Keller
  • Patent number: 6291037
    Abstract: A packaging film which shrinks to form at least part of a package when exposed to heat. The packaging film includes a thin film substrate that contracts or shrinks when heated and which is substantially transparent to radiant energy. The film also includes a susceptor material carried by the film that is sufficiently opaque to radiant energy to absorb and transfer to the substrate enough heat energy to cause the substrate to shrink, when the film is exposed to a source of radiant energy. In one embodiment the packaging film takes the form of lids of beverage containers.
    Type: Grant
    Filed: September 15, 1999
    Date of Patent: September 18, 2001
    Inventors: William J. Bakker, N. A. Williams
  • Publication number: 20010019754
    Abstract: A top side member 4 is attached to the side of one die 2 of a cavity 6 between a pair of dies 2 and 3, and a back side member 5 is attached to the side of the other die 3. A charge space is provided between these top and back side members 4 and 5. Raw material beads each made of a foam resin are supplied between the charge space, air is discharged from a plurality of work piece nozzles provided at the side of the die 3, and raw material beads are charged. At this time, air discharging is started from a work piece nozzle a41 set at the most distant position from a charger 61 for supplying raw material beads. Air is charged while the air is discharged sequentially up to the work piece nozzle a21 set at the most proximal position as the raw material beads are charged. Then, the raw material beads are heated to be foamed and fused, and the top and back side members 4 and 5 are integrated with each. other via the foam member 8.
    Type: Application
    Filed: January 18, 2001
    Publication date: September 6, 2001
    Inventors: Iwao Nohara, Shigeki Yoshimura, Kiyotaka Ida
  • Patent number: 6277464
    Abstract: The present invention provides an integral net having a lattice of polymeric material defined by holes traversing the integral net from one surface to the other. The present invention also provides a method for producing an embossed sheet of polymeric material by first contacting a billet of polymeric material with an embossing tool having a plurality of protrusions whereby the embossing tool impresses indentations into the billet to a given depth. Subsequently, the method involves skiving the embossed billet. By this method, an embossed sheet of the polymeric material is removed from the billet, which embossed sheet can be an integral net.
    Type: Grant
    Filed: May 16, 1997
    Date of Patent: August 21, 2001
    Assignee: Pall Corporation
    Inventors: John B. Ronan, David E. Newman, Scott Hopkins, Jeffrey B. Burns
  • Publication number: 20010014379
    Abstract: A mold for making a plastic product according to the present invention comprises a tapered mold and a mold base. The tapered mold having a tapered portion with an outside surface formed in a truncated cone shape and a fixture portion formed at an end on a wide side of the tapered portion. The mold base having at least one hole made therein. The fixture portion is inserted into the hole made in the mold base so that the tapered mold is affixed to the mold base.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 16, 2001
    Inventors: Takeji Shiokawa, Mitsuya Mikawa, Hideo Kaminaga
  • Patent number: 6258439
    Abstract: A covering material which can be plastically deformed by band and extended in at least one direction. The covering material has a substrate with openings, at least the top side of which substrate has a top coating which covers the openings. To create an economical covering material for covering the gap between a planar surface and a structured surface, in particular a highly structured roof surface, the covering material can be extended in at least one direction more than 30%, can be bent perpendicular to the direction of extension, and the entire surface of which covering material can be permanently and plastically deformed in three dimensions. The top coating is of a thin flat stock and that the coated substrate is, at least in the direction opposite the direction of extension, compressed, crepe-like, by at least 25% of its original length so that the surface of the covering material exhibits irregular little corrugations.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: July 10, 2001
    Assignee: Lafarge Braas GmbH
    Inventor: Karl-Heinz Hofmann
  • Patent number: 6248412
    Abstract: A method of manufacturing a luster resin molding such as an automobile side molding or the like is disclosed. The luster resin molding has a molding body formed of luster synthetic resin and is elongated in a specific direction, and a positioning boss is formed integrally with the back surface of the molding body and erected substantially perpendicularly to the back surface of the molding body. A slide core for molding the positioning boss is moved to mold the positioning boss integrally with the molding body after synthetic resin injected in the longitudinal direction of the molding body has passed through a boss position where the positioning boss will be formed.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: June 19, 2001
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Daiichiro Kawashima, Hiromi Hyuga, Hiroshi Mukai, Koichi Ogiso
  • Patent number: 6248411
    Abstract: A hollow decorative rock protects and provides an aesthetically pleasing appearance by covering utility implements or access covers. Hidden slots in the hollow rock provide for an air flow through the rock, when combined with the uneven bottom edge of the molded hollow rock.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: June 19, 2001
    Inventor: Robert C. Warfel
  • Patent number: 6245410
    Abstract: Absorber elements are described of at least one composite material having absorbent elements on a support, in which a plurality of elements of a superabsorbent foam are arranged on at least one support in a grid pattern at distances such that the elements in the swollen state touch at their peripheries.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: June 12, 2001
    Assignee: BASF Aktiengesellschaft
    Inventors: Hans-Joachim Hähnle, Manfred Walter, Jürgen Tropsch, Jens Kremeskötter, Gunnar Schornick, Thomas Anstock
  • Patent number: 6231949
    Abstract: An improved surface repair assembly for repairing a damaged portion of an exposed surface of is provided. The surface repair assembly includes a surface repair patch and a curable surface repair compound. The surface repair patch comprises a sheet which is formed from a plastically deformable inelastic polymeric material. The sheet has a plurality of openings which extend from the first side to the second side of the sheet. The openings are arranged about the sheet so that a network of strips of polymeric material is formed. Each of the strips is capable of being plastically deformed in any direction so that the sheet may be shaped to correspond to the contour of the surface being repaired. The sheet supports, positions, and reinforces the curable repair compound on the surface before the repair compound is cured. In one version of the invention, the second side of the repair patch includes an adhesive for affixing the patch to the surface to be repaired.
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: May 15, 2001
    Assignee: Pro Patch Systems, Inc.
    Inventor: Dennis Hoffmann, Sr.
  • Patent number: 6210490
    Abstract: A cleaning card for cleaning the magnetic heads of magnetic card readers is disclosed. As the card is pushed through the reader, the magnetic head protrudes through the card and then as the card continues to move the sides of the hole in the card scrub both sides of the head effectively removing dirt.
    Type: Grant
    Filed: March 2, 1999
    Date of Patent: April 3, 2001
    Assignee: elk Technologies
    Inventors: David A. Michael, Larry W. Ditty
  • Patent number: 6202250
    Abstract: A rectangular wiping sheet adapted to be attached to a plate-like head of a cleaner device used to clean a surface of house floor or the similar surfaces is provided adjacent a pair of sides thereof extending in parallel to each other with a plurality of slits extending through a thickness of the sheet, and each of these slits has a length of 5˜30 mm as measured in a direction along the parallel sides.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: March 20, 2001
    Assignee: Uni-Charm Corporation
    Inventors: Yasuhiko Kenmochi, Hiroki Ishikawa
  • Patent number: RE37186
    Abstract: A panel which comprises a substrate of transparent or translucent material having applied to one or both sides a design superimposed on, or forming part of, an opaque pattern so that the design on one side of the panel cannot be seen from the other side. This is a Reissue of a Patent which was the subject of a Reexamination Certificate No. B1 4,673,609, dated Jul. 25, 1995, Request No. 90/003,201, Sep. 21, 1993.
    Type: Grant
    Filed: December 31, 1996
    Date of Patent: May 22, 2001
    Assignee: Contra Vision Limited
    Inventor: George Roland Hill