Abstract: In at least one embodiment, a molding method for producing a molded article is provided. The method may include introducing polymer and fiber separately into an extruder in a first ratio to produce a first extruded material having a first fiber content and in a second ratio to produce a second extruded material having a second fiber content different from the first fiber content. The method may further include filling a first region of a mold with the first extruded material and a second region of the mold with the second extruded material. The extruded material may be formed as blanks for use in compression molding or may be introduced into an injection chamber for use in injection molding. The method may be used to form molded articles having a plurality of regions having different fiber contents.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: The invention relates to a resin curing agent having the formula (I), wherein R1 to R4 are each individually selected from linear or branched C1 to C5 alkyl, a process for its manufacture, blends of the reaction products, and two-component curable resin systems.

Abstract: Epoxy resin compositions that include an epoxy resin component that includes at least one epoxy resin and a solvent blend that includes methyl ethyl ketone and glycol methyl ether acetate are provided. The compositions are well-suited for use in the fabrication of prepregs and composite electrical laminates made therefrom.

Abstract: The present invention provides a method for manufacturing a shaped product constituted by a fiber-reinforced composite material including reinforcing fibers and a thermoplastic resin. The shaped product maintains isotropy of the fibers to the end thereof even if press-molded under conditions in which charge ratio of a prepreg to a die is low. Specifically, the method includes using a specific prepreg obtained by impregnating the reinforcing fibers with thermoplastic resin, and molding-processing the prepreg under specific conditions.

Abstract: A composition suitable for use in a transparent conducting electrode (TCE) is disclosed. The composition comprises a conductive background medium and an incorporated plurality of mesoscale metal wires. The composition is characterized by lower electrical sheet resistance as compared to prior-art compositions for TCEs without a significant degradation in optical transmittance.

Abstract: Transparent conductive films comprising silver nanowires dispersed in polyvinyl alcohol or gelatin can be prepared by coating from aqueous solvent using common aqueous solvent coating techniques. These films have good transparency, conductivity, and stability. Coating on a flexible support allows the manufacture of flexible conductive materials.

Abstract: Surface films, paints, or primers can be used in preparing aircraft structural composites that may be exposed to lightning strikes. Methods for making and using these films, paints or primers are also disclosed. The surface film can include a thermoset resin or polymer, e.g., an epoxy resin and/or a thermoplastic polymer, which can be cured, bonded, or painted on the composite structure. Low-density electrically conductive materials are disclosed, such as carbon nanofiber, copper powder, metal coated microspheres, metal-coated carbon nanotubes, single wall carbon nanotubes, graphite nanoplatelets and the like, that can be uniformly dispersed throughout or on the film. Low density conductive materials can include metal screens, optionally in combination with carbon nanofibers.

Abstract: A filtered smoking article is provided, which includes a tobacco-containing rod surrounded by a wrapping material; a filter element surrounded by a plug wrap adjacent to the tobacco-containing rod; and a tipping material securing the tobacco-containing rod to the filter element, the tipping material overlying the plug wrap of the filter element and a portion of the wrapping material of the tobacco-containing rod, wherein at least one of the plug wrap, the tipping material, and the wrapping material surrounding the tobacco-containing rod are secured by an adhesive composition comprising a thermoplastic starch polymer. The adhesive composition can include a blend of the thermoplastic starch polymer with a second biodegradable polymer, such as polyvinyl alcohol, aliphatic polyesters, aliphatic polyurethanes, cis-polyisoprene, cis-polybutadiene, polyhydroxy alkanoates, polyanhydrides, and copolymers and blends thereof.

Abstract: Certain embodiments described herein are directed to composite materials comprising one or more high melt flow index resins. In some examples, the composites can be used to provide automotive parts such as, for example, vehicle interior parts and vehicle exterior parts. In some configurations, the composite comprises a fiber reinforced polymer core comprising reinforcing fibers and a resin comprising a high melt flow index of greater than 325 g/10 min. as measured by ASTM D1238, condition L.

Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

Abstract: This invention relates to a surface modified silica by an alkyl sulfonated tetrazole compound, a preparation method thereof, and a resin composition containing the same. The silica according to this invention can exhibit superior adhesion to a metal.

Abstract: An impact resistant composite article has two or more layers of ballistic fabric and ionomer layers disposed between the fabric layers. The ionomer is highly neutralized so that it has essentially no melt flow. A process also for making such a composite article that involves deposition of an aqueous colloid of the ionomer onto the fabric, followed by drying.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

Abstract: A steel filament adapted for the reinforcement of elastomer or for thermoplastic products has a carbon content ranging up to 0.20 per cent by weight. The steel filament is provided with a coating promoting the adhesion with elastomer or thermoplastic products. The steel filament is drawn until a final diameter of less than 0.60 mm and a final tensile strength of more than 1200 MPa. Intermediate heat treatments are avoided so that the carbon footprint of the steel filament is substantially reduced.

Abstract: Methods for using a reusable quick release fastener system include engaging and disengaging fastening devices composed of elastomers or shape memory polymers and their composites wherein the fastening devices may be of any number of geometrical shapes such that the mating geometries of each device are compatible with one another. The fastening devices provide an easy and near silent closure mechanism for a container, for example. Thus, the methods for using reusable quick release fastener systems including the fastening devices made of elastomers or shape memory polymers can be used to attach one part to another or to quietly close a pocket, box, or other container, for example.

Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

Abstract: An aqueous binder composition is provided that includes a carbohydrate and a crosslinking agent. In exemplary embodiments, the carbohydrate-based binder composition may also include a catalyst, a coupling agent, a process aid, a crosslinking density enhancer, an extender, a moisture resistant agent, a dedusting oil, a colorant, a corrosion inhibitor, a surfactant, a pH adjuster, and combinations thereof. The carbohydrate may be natural in origin and derived from renewable resources. Additionally, the carbohydrate polymer may have a dextrose equivalent (DE) number from 2 to 20. In at least one exemplary embodiment, the carbohydrate is a water-soluble polysaccharide such as dextrin or maltodextrin and the crosslinking agent is citric acid. Advantageously, the carbohydrates have a low viscosity and cure at moderate temperatures. The environmentally friendly, formaldehyde-free binder may be used in the formation of insulation materials and non-woven chopped strand mats.

Abstract: A hollow lineal profile (16) formed from a continuous fiber reinforced ribbon (“CFRT”) that contains a plurality of continuous fibers embedded within a first thermoplastic polymer matrix (6). To enhance the tensile strength of the profile, the continuous fibers are aligned within the ribbon in a substantially longitudinal direction (e.g., the direction of pultrusion). In addition to continuous fibers, the hollow profile of the present invention also contains a plurality of long fibers that may be optionally embedded within a second thermoplastic matrix to form a long fiber reinforced thermoplastic (“LFRT”) (4). The long fibers may be incorporated into the continuous fiber ribbon or formed as a separate layer of the profile. Regardless, at least a portion of the long fibers are oriented at an angle (e.g., 90°) to the longitudinal direction to provide increased transverse strength to the profile.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: Aeroshells and methods for manufacturing aeroshells are provided. In this regard, a representative aeroshell for a missile formed of a long fiber thermoplastic composite exhibits a wall thickness of no greater than approximately 0.070?.

Abstract: Organic-inorganic hybrid fibers and methods for the preparation of such fibers are disclosed.

Abstract: A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, R1 and R2 each represents a divalent aromatic diamine residue; R3 and R4 each represents a tetravalent aromatic tetracarboxylic acid residue; R5 and R6 each represents a hydrogen atom or a phenyl group, with R5 or R6 being a phenyl group; m and n satisfy the following relations: m?1, n?0, 1?m+n?20 and 0.

Abstract: An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material comprising at least one adhesive polymeric resin, and one of either; a) low aspect ratio metal-coated additives present in the range 0.2 wt. % to 30 wt. % of the adhesive material; or b) discrete high aspect ratio metal-coated additives present in the range 0.2 wt. % to 25 wt. % of the adhesive material.

Abstract: A fiber preform for producing fiber composite structures, a wall thereof including a first zone made from reinforcing fiber bundles having a first resin composition and a second zone made from at least one fiber tape comprising at least one unidirectionally directed reinforcing yarn strand having a second resin composition. The reinforcing fiber bundles in the first zone are oriented in different spatial directions to each other when viewed in a direction parallel to the extension of the thickness. Each reinforcing fiber has a length of from 3 to 50 mm, and contains the first resin composition in a concentration of from 1 to 10 wt % of the fiber weight. The wall of the fiber preform has a proportion of reinforcing fibers of more than 35 vol %, and the second zone forms a discrete region when viewed in a direction perpendicular to the thickness extension of the wall.

Abstract: Process for the continuous preparation of prepolymers based on phenolic resin, an oxazoline component and an epoxide in the presence of a catalyst, including supplying the phenolic resin and the oxazoline component to an extruder in a stream A; a Lewis adduct of boron trifluoride or of aluminum trichloride, or arylsulphonic acids or alkylsulphonic acids, or latent arylsulphonic acids or latent alkylsulphonic acids, in a stream B, and the epoxide in a stream C, the infeed of stream A being situated, as seen in extrusion direction, before the infeed of stream C, these reactants are mixed at a reaction temperature of 120 to 200° C. with a residence time in the extruder of 3 seconds to 15 minutes, and then the product discharge of the extruder is cooled to a temperature of less than 45° C. within from 30 to 60 seconds.

Abstract: A trim element for the passenger compartment of a motor vehicle, comprising a substrate and a film bonded to it, the film consisting of polypropylene (PP) or a polypropylene copolymer.

Abstract: Web containing a thermoplastic resin, reinforcing fibers and thermal expandable particles dispersed therein. The thermoplastic resin and the reinforcing fibers are uniformly dispersed in a thickness direction and the thermal expandable particles are eccentrically located toward one-side surface of the web, wherein opposite sides of the web have substantially different specific gravity and density.

Abstract: A composite sheet and a method of making a composite sheet. A core having end walls is provided. Continuous fibers or a continuous fiber mat is secured to the core such that the continuous fibers align with the end walls of the core.

Abstract: The invention relates to a protective device (1) for the laser machining of holes (3) in at least one component (2) by means of a laser beam (5), wherein the protective device (1) is positionable in the beam direction downstream of the beam-exit-side end (8) of a hole (3) to be machined in the component wall (10), in order to protect an adjoining rear space having a component wall (11), opposite the hole (3), of the component (2) from the incident laser beam. The protective device (1) according to the invention is formed from a composite made of a matrix composed of polyether ether ketone plastics material and fibres embedded therein, wherein the fibres are embedded such that, with respect to their particular fibre extending direction, they extend in a criss-cross manner in the plastics material and are distributed at approximately the same density in the volume of the plastics material of the protective device (1).

Abstract: A composite article may include a matrix and a plurality of fibers embedded in the matrix. Each one of the fibers has a fiber length and a fiber geometry. The fiber geometry of at least a portion of the fibers may vary along the fiber length.

Abstract: A tape that can be used to detect cracks in a structure to which it is attached is disclosed herein. The tape includes a plurality of structural fibers. The tape also includes an electrically-insulating binder at least partially encapsulating the plurality of structural fibers. The tape also includes quantities of electrically conductive particles, each quantity of electrically conductive particles connected with one of the plurality of structural fibers.

Abstract: A pre-form and a method of preparing pre-forms are provided. The pre-forms comprise a resin and at least two layers of oriented fiber tows. The pre-forms comprise fiber tows instead of the traditional prepregs to enhance rearranging of resin and/or fibers during subsequent processing as well as provide greater freedom, a price reduction and/or a reduction of waste. The pre-forms may be formed three-dimensionally to enhance coupling to further pre-forms or other structures and/or to enhance shaping of the pre-form to a final three-dimensional shape. The method of preparation of pre-forms involves providing an adhesive between layers of fibers and providing a resin in contact with at least one of the layers of fibers. The resin is preferably provided in a non-continuous layer to allow for removal of gas at least partially in a direction orthogonal to the layers of resin. The pre-forms are suitable for preparation of composite structures like for example spars for wind turbine blades.

Abstract: Biocomposite compositions and compositions, which include dried distillers solubles, and which can be used in making biocomposite compositions are described. Methods for preparing the compositions are also described.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: Fibers in a fiber reinforced resin laminate are exposed by placing a gel in contact with the resin laminate, forcing the fibers of the resin laminate into the gel, and using the gel to displace the resin surrounding the fibers being forced into the gel. The gel is removed to expose the fibers.

Abstract: An acid-modified polyolefin-based resin for glass fiber treatment having: (1) an amount of components extractable with boiling methyl ethyl ketone of 8 mass % or less; (2) a number average molecular weight (Mn), measured by gel permeation chromatography (GPC), of 6,000 to 48,000; and (3) an amount of an acid which has been added, measured by Fourier transform infrared spectroscopy, of 0.1 to 12 mass %.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A resin-soluble thermoplastic polymer veil toughening element for a curable composition wherein the polymer element is a non-woven veil in solid phase adapted to undergo at least partial phase transition to fluid phase on contact with a component of the curable resin matrix composition in which it is soluble at a temperature which is less than the temperature for substantial onset of gelling and/or curing of the curable composition and which temperature is less than the polymer elements melt temperature; a method for the preparation thereof, a preform support structure for a curable composition comprising the at least one thermoplastic veil element together with structural reinforcement fibers, methods for preparation thereof, a curable composition comprising the at least one thermoplastic veil element or the support structure and a curable resin matrix composition, a method for preparation and curing thereof, and a cured composite or resin body obtained thereby, and known and novel uses thereof.

Abstract: Disclosed are formaldehyde-free, thermally-curable, alkaline, aqueous binder compositions, curable to formaldehyde-free, water-insoluble thermoset polyester resins, and uses thereof as binders for non-woven fibers and fiber materials.

Abstract: A toughening agent for use in making composites comprises an epoxy curing agent and a thermoplastic. Compositions, composites that comprise the toughening agent and associated methods of making and using the toughening agent are also disclosed.

Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.

Abstract: A method to produce building panels is disclosed which method includes the step of applying a layer (5) comprising a mix of fibers (14), binder (12), and wear resistant particles (12) on a carrier (6), pressing the layer (5) with an embossed matrix (2a, 2b) and providing embossed portions (4) and filling the embossed portions with decorative a substance (3).

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.

Abstract: An objective of this invention is to provide an interlayer dielectric film with a carrier material used in a multilayer printed circuit board, which exhibits sufficient rigidity for a thin multilayer printed circuit board. According to the present invention, there is provided an interlayer dielectric film with a carrier material comprising a carrier material comprised of a metal foil or resin film and an interlayer dielectric film formed on one side of the carrier material, wherein the interlayer dielectric film is comprised of a base material impregnated with a resin; the base material has a thickness of 8 ?m to 20 ?m; and when the resin is cured at 170° C. for one hour under a pressure of 30 kgf/cm2, an elongation percentage of the interlayer dielectric film in a planar direction is 0.05% or less as determined by a TMA method.

Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.

Abstract: Devices, systems and techniques are described for producing and implementing articles and materials having nano-scale and microscale structures that exhibit superhydrophobic, superoleophobic or omniphobic surface properties and other enhanced properties. In one aspect, a surface nanostructure can be formed by adding a silicon-containing buffer layer such as silicon, silicon oxide or silicon nitride layer, followed by metal film deposition and heating to convert the metal film into balled-up, discrete islands to form an etch mask. The buffer layer can be etched using the etch mask to create an array of pillar structures underneath the etch mask, in which the pillar structures have a shape that includes cylinders, negatively tapered rods, or cones and are vertically aligned. In another aspect, a method of fabricating microscale or nanoscale polymer or metal structures on a substrate is made by photolithography and/or nano imprinting lithography.

Abstract: A load-pulling system includes a least one belt to which a tensile load is applied. The belt is formed of a matrix and a load-bearing fiber structure embedded in the matrix and having a plurality of fibers. The belt is guided around a least one deflection device in such a way that it forms a curved section in the region of the deflection device. A dimensioning of the belt and the applied tensile load are matched to each other in such a way that, in the curved section of the belt, a zero stress line of the belt is displaced radially inward in the direction of curvature with respect to a center line of the load-bearing fiber structure by an amount of at least 25% of the thickness of the load-bearing fiber structure.

Abstract: Recycling of laminate flooring based on a separation of the panels (1) into particles which are connected with a binder and formed to a new sheet shaped material. A building panel includes a surface layer and a wood fiber based core, and the wood fiber based core includes aluminum oxide particles.