Abstract: An electrostrictive composite includes a flexible polymer matrix and a carbon nanotube film structure. The carbon nanotube film structure is at least partially embedded into the flexible polymer matrix through a first surface. The carbon nanotube film structure includes a plurality of carbon nanotubes combined by van der Waals attractive force therebetween.

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.

Abstract: Disclosed are formaldehyde-free, thermally-curable, alkaline, aqueous binder compositions. The disclosed binder compositions may be cured to substantially water-insoluble thermoset polyester resins, including formaldehyde-free, substantially water-insoluble thermoset polyester resins. Uses of the disclosed binder compositions as binders for non-woven fibers and fiber materials are also disclosed.

Abstract: An object of the present invention is to provide a carbon fibrous structure having good dispersibility and small variations in electrical conductivity, etc., and being capable of improving physical properties such as electrical properties, mechanical properties and thermal properties by a small amount addition thereof without impairing properties of a matrix.

Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

Abstract: Web containing a thermoplastic resin, reinforcing fibers and thermal expandable particles dispersed therein.

Abstract: An electronic device comprising a housing assembly having at least one fiber composite layer molded into a portion of the housing assembly, the at least one fiber composite layer having a warp direction and configured to provide strength to the housing assembly corresponding to the warp direction.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: A method for creating a material sheet with fibers includes the steps of feeding a layer of loose fibers to a conveyor; applying a resin to the loose fibers, the resin being capable of bonding to the loose fibers; conveying the loose fibers and resin to a mold; and allowing the resin applied to the loose fibers to fill the mold and then solidify to harden in a desired thickness.

Abstract: A composite article may include a matrix and a plurality of fibers embedded in the matrix. Each one of the fibers has a fiber length and a fiber geometry. The fiber geometry of at least a portion of the fibers may vary along the fiber length.

Abstract: Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions.

Abstract: A ballistic-resistant molded article having a compressed stack of sheets including reinforcing elongate bodies, where at least some of the elongate bodies are polyethylene elongate bodies that have a weight average molecular weight of at least 100,000 gram/mole. Methods for manufacturing ballistic-resistant molded articles are also provided.

Abstract: A high heat-resistant composite material which comprises a polymerizable composition comprising a bi-functional epoxy compound, a tri- or more-functional epoxy compound and a polymerization initiator, wherein the polymerization initiator comprises a sodium salt or potassium salt of mono- or poly-functional carboxylic acid, and a reinforcing fiber such as a carbon fiber or a glass fiber; and a vehicle member or a construction member comprising the above heat-resistant composite material. Said composite material comprises an epoxy polymer having high heat-resistant physical properties over those of a conventional epoxy polymer as a matrix, and exhibits an extremely high retention factor of storage modulus at high temperature.

Abstract: Composition comprising (A) 50-99.5 wt %, based on the total weight, of A, B and C of a reaction resin or reaction resin mixture that is processed into thermosetting materials, said resin or resin mixture being liquid at temperatures in the range of 15 to 100° C. and having an average molecular weight of 200 to 500,000 and with a sufficient number of suitable reactive groups for a curing process and (B) 0.5-50 wt %, relative to the total weight of A, B and C of one or more dispersed polyorganosiloxanes that are contained in the reaction resin or reaction resin mixture homogeneously in finely distributed form as polyorganosiloxane droplets with a diameter of 0.001 to 4 ?m, wherein the organopolysiloxane particle is a polymer of the general formula (R3SiO1/2)W(R2SiO2/2)X—(RSiO3/2)Y—(SiO4/2)Z, where w=0 to 20 Mol %, x=80 to 99.9 Mol %, y=0.5 to 10 Mol %, z=0 to 10 Mol %, (C) 0.

Abstract: An improved pultrusion process for preparing composite materials having about 10 percent to about 45 percent by volume of reinforcing fibers so as to produce a composite material having enhanced flexibility as compared with composite materials having a higher percent of reinforcing fibers by volume. Articles of manufacture made from composite material produced by the improved pultrusion process, specifically spinal implants, are also provided.

Abstract: An uncured assembly which comprises a fibrous reinforcement. Associated with said reinforcement is a resin material comprising at least one solid amine-terminated epoxy resin, at least one solid epoxy-terminated epoxy resin and optionally at least one cure catalyst.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Articles including expanded fluoropolymer membranes having serpentine fibrils are provided. The fluoropolymer membranes exhibit high elongation while substantially retaining the strength properties of the fluoropolymer membrane. The membrane may include a fluoropolymer and/or elastomer. Additionally, the article has an elongation in at least one direction of at least about 100% and a matrix tensile strength of at least about 50 MPa. The article may be formed by (1) expanding a dried, extruded fluoropolymer tape in at least one direction to produce an expanded fluoropolymer membrane and (2) retracting the expanded fluoropolymer membrane in at least one direction of expansion by applying heat or by adding a solvent. The application of a tensile force at least partially straightens the serpentine fibrils, thereby elongating the article. The expanded fluoropolymer membrane may include a microstructure of substantially only fibrils. The membranes may be imbibed with an elastomeric material to form a composite.

Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.

Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.

Abstract: Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.

Abstract: There is provided a hollow fiber and method of making. The hollow fiber has an inner-volume portion having a first-core portion and one or more hollow second-core portions. The first-core portion has nanostructures and one or more first polymers. The nanostructures act as an orientation template for orientation of the first polymers in a direction parallel to a longitudinal axis of the fiber. The first-core portion is in contact with and encompasses the hollow second-core portions. The hollow fiber further has an outer-volume portion having one or more second polymers. The outer-volume portion is in contact with and completely encompasses the inner-volume portion. The inner-volume portion has at least one of a tensile modulus and a strength that are higher than at least one of a tensile modulus and a strength of the outer-volume portion.

Abstract: There is provided a fiber and method of making a fiber. The fiber has an inner-volume portion having a first outer diameter, a plurality of nanostructures, and one or more first polymers. The nanostructures act as an orientation template for orientation of the one or more first polymers in a direction parallel to a longitudinal axis of the fiber. The fiber has an outer-volume portion having a second outer diameter and one or more second polymers. The outer-volume portion is in contact with and completely encompasses the inner-volume portion. The inner-volume portion has at least one of a tensile modulus and a strength that are higher than at least one of a tensile modulus and a strength of the outer-volume portion.

Abstract: An array of aligned and dispersed carbon nanotubes includes an elongate drawn body including a plurality of channels extending therethrough from a first end to a second end of the body, where the channels have a number density of at least about 100,000 channels/mm2 over a transverse cross-section of the body. A plurality of carbon nanotubes are disposed in each channel, and the carbon nanotubes are sufficiently dispersed and aligned along a length of the channels for the array to comprise an average resistivity per channel of about 9700 ?m or less.

Abstract: The invention relates to prepregs and composite components (molding) produced therefrom at a low temperature, obtainable by using powdery highly reactive polyurethane compositions containing uretdione groups, with specific catalysts.

Abstract: The present disclosure relates to compounds from which nanofibers can be produced, the resulting nanofibers produced from the compounds, and nanofiber reinforced polymers prepared using the nanofibers and a polymer. The compounds used in forming the nanofibers include chemical linkage moieties that are capable of forming non-covalent bonds with portions of the polymer so as to form the nanofiber reinforced polymers. The nanofiber reinforced polymers are useful as biomaterials in medical devices.

Abstract: A preform for the molding of a fiber-reinforced resin beam includes a reinforcing-fiber beam which has been formed from a reinforcing-fiber base made up of many reinforcing fibers and has a cross-sectional shape with at least one linear part and at least one curved part connected to the linear part; and a release sheet bonded and united through an adhesive resin to at least part of a surface of the reinforcing-fiber base along the lengthwise direction for the base. A process for producing a preform includes shaping a continuous flat reinforcing-fiber base having a release sheet bonded and united to a surface thereof so that the cross-sectional shape of the base has a curved part to thereby produce a preshaped object; and bonding and uniting the preshaped object to another preshaped object.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.

Abstract: Fiber reinforced thermoset plastic composites with a glass transition temperature of greater than 500° C. are disclosed. Certain embodiments of the disclosed fiber reinforced thermoset plastic composites are produced using pre-ceramic resin and fibers that are stable under thermal stress. Also disclosed are methods of making these fiber reinforced thermoset plastic composites. These methods include infiltrating thermally stable fibrous material with a pre-ceramic resin and introducing crosslinking. The disclosed methods produce a non-ceramic highly crosslinked thermoset plastic composite that possesses both thermal stability and mechanical strength.

Abstract: A composite material comprising the following components: (a) a first prepreg material with improved resistance to microbuckling and kinkband formation; and (b) a second prepreg material with improved resistance to delamination.

Abstract: Exemplary embodiments provide an intermediate transfer member used for electrophotographic devices, wherein an outermost layer of the intermediate transfer layer can include a plurality of fluoroelastomer-coated carbon nanotubes dispersed in a fluoroplastic matrix to provide desirable surface properties useful for the intermediate transfer member.

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract: A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

Abstract: Disclosed are wax emulsion compositions for curing or sealing concrete and cement formulations, methods for preparing and processes for using the same. The modifiers are applicable to curing or sealing membranes, used in roadways, highways, parking lots and other freshly placed or poured concrete surfaces to retain moisture and achieve high compressive strengths. This invention also relates to materials used to coat, spray, brush, roll etc. on conventional Portland cement concrete mix designs or other applied concrete mixes in formed structural shapes and transport road mix designs, providing an effective layer that controls and minimizes moisture loss from the mix to enable proper curing and achievement of desired compressive strengths. The compositions of the invention further provide for concrete and cement formulations having lower water soluble chloride content.

Abstract: Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.

Abstract: A hydroxyphenyl or alkoxyphenyl phosphine oxide composition comprising (i) a first mixture of mono-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, (ii) a second mixture of bis-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, (iii) a third mixture of tris-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, and optionally iv) a minority amount of non-hydroxy or non-alkoxy tris-phenyl phosphine oxides is provided. Also provided are epoxy resins compositions with excellent flame retardancy and physical properties, which resins comprise the phosphine oxide composition.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A sandwich panel includes a middle material (2) and a surface material (3) that are laminated with a hollow columnar core (1). The middle material (2) is composed of a set of unidirectional fiber bodies (4, 5) each of whose fibers are aligned in one direction, and bonding layers formed by woven fiber bodies (6, 7). The woven fiber body (7) includes a warp yarn and a woof yarn that is orthogonal to the warp yarn, and the yarns are woven, and the woven fiber body (7) is formed so that any one of the warp yarn and the woof yarn is substantially parallel to the edge of the sandwich panel, and the other of the warp yarn and the woof yarn is substantially orthogonal to the edge of the sandwich panel.

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

Abstract: A reinforced rubber article containing a rubber article and a fibrous layer embedded into the rubber article. The fibrous layer contains monoaxially drawn tape elements having a rectangular cross-section and at least a first layer having a draw ratio of at least about 5, a modulus of at least about 2 GPa, a density of at least 0.85 g/cm3. The first layer contains a polymer selected from the group consisting of polyamide, polyester, and co-polymers thereof. Methods of forming the reinforced rubber article are also disclosed.

Abstract: A method for fabricating and processing a flexible substrate is provided, which mainly includes: providing at least one first medium of a flexible material; providing at least one second medium of a thermoplastic plastic material; binding the first medium and the second medium to form a sheet; and curing the sheet into a plate of a predetermined shape by hot pressing. In addition, the plate is subjected to secondary processing to form a secondary composite medium of another predetermined shape. Thereby, a predetermined shape of the plate is achieved by primary processing, and is in turn changed by secondary processing.

Abstract: The present invention relates to a plastics composite encompassing at least one hard component whose modulus of elasticity is greater than or equal to 1000 MPa and one soft component whose modulus of elasticity is less than or equal to 500 MPa, where the hard and the soft component have electrical conductivity, and where the bond strength of the composite is at least 0.5 N/mm2.

Abstract: A composite structure comprising: a first stack comprising a plurality of plies of composite material and at least one ply of self-healing material, the ply of self-healing material comprising a plurality of containers each containing a curable healing liquid; and a second stack comprising a plurality of plies of composite material, the stacks being joined together at a bond line. By placing a ply of self-healing material in one of the stacks (preferably relatively close to the bond line) the ply of self-healing material can resist the propagation of cracks between the first stack and the second stack. Preferably the global strength of the first stack is greater than the global strength of the second stack.

Abstract: An electroconductive film for an actuator is formed from a gel composition including carbon nanofibers, an ionic liquid, and a polymer. The carbon nanofibers are produced with an aromatic mesophase pitch by melt spinning.

Abstract: A production method for producing molded articles from fiber composites, superparamagnetic particles are selected which become coupled to an external alternating magnetic field. These superparamagnetic particles are added to a resin portion of a strip-shaped starting material further comprising reinforcing fibers. The strip-shaped starting material is then continuously advanced, and, while being advanced, heated by coupling-in an external alternating magnetic field to which the superparamagnetic particles in the resin portion become coupled. Next, the heated starting material is continuously molded into a molded article; and the resin portion in the molded particle is cured.

Abstract: The present invention provides methods for uniform growth of nanostructures such as nanotubes (e.g., carbon nanotubes) on the surface of a substrate, wherein the long axes of the nanostructures may be substantially aligned. The nanostructures may be further processed for use in various applications, such as composite materials. For example, a set of aligned nanostructures may be formed and transferred, either in bulk or to another surface, to another material to enhance the properties of the material. In some cases, the nanostructures may enhance the mechanical properties of a material, for example, providing mechanical reinforcement at an interface between two materials or plies. In some cases, the nanostructures may enhance thermal and/or electronic properties of a material. The present invention also provides systems and methods for growth of nanostructures, including batch processes and continuous processes.

Abstract: The present invention relates to an epoxy resin composition comprising the following [A], [A?], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50° C. or higher; [A?] an epoxy resin which is in a liquid state at 25° C.; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20° C.

Abstract: The present invention relates to the field of overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise a first component having a surface, which surface has at least a portion made of a surface polyamide resin composition, and having a fibrous material impregnated with a matrix resin composition, and comprise a second component comprising an overmolding resin composition. The second component is adhered to the first component over at least a portion of the surface of said first component. One of the overmolding resin composition and the surface polyamide resin composition is made of a polyamide composition comprising a blend of one or more semi-aromatic polyamides (A) and one or more fully aliphatic polyamides (B) and the other of the overmolding resin composition and the surface polyamide resin composition is made of one or more polyamides.