Next To Metal Patents (Class 428/344)
  • Patent number: 7695810
    Abstract: The present invention is drawn to a strip tape which does not undergo lowering of bonding force and which does not cause pollution of the natural environment, working environment, etc. The strip tape includes a center layer containing a polar resin, and at least one polyolefin layer laminated, via a bonding layer, on each face of the center layer. The bonding layer contains an ethylene-methacrylic acid-alkyl acrylate random copolymer. Since the strip tape includes a center layer and at least one polyolefin layer, the interlayer bonding force of the strip tape is high, the bonding strength between the center layer and the polyolefin layer can be increased, and the waterproofing property of the strip tape can be enhanced. Even when a packaging container including the strip tape is heated or cooled sharply during use, the interlayer bonding force of the strip tape is not lowered.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: April 13, 2010
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventors: Peter Frisk, Hiroaki Ogita, Norio Kobayashi
  • Patent number: 7695856
    Abstract: A battery of the present invention is provided with positive and negative terminals led out of the battery and one or more sealing members filled between the positive and negative terminals and the battery. Each of the sealing members is provided with one or more resin layers, each of which is provided with one or more non-molecular-oriented resin layers.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: April 13, 2010
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Kyoichi Watanabe
  • Publication number: 20100086777
    Abstract: A conductive pressure sensitive adhesive tape is provided. The conductive pressure sensitive adhesive tape includes a first metal foil, a polymer film attached to a surface of the first metal foil with a polymer binder interposed therebetween, a second metal foil attached to a surface of the polymer film with a polymer binder interposed therebetween, and a polymer adhesive layer formed on a backside of at least one of the first and second metal foils.
    Type: Application
    Filed: May 18, 2007
    Publication date: April 8, 2010
    Inventor: Sun-Ki Kim
  • Patent number: 7688209
    Abstract: The invention concerns a radio frequency identification device (RFID) featuring an antenna (12) screen-printed on a fibrous support and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to the main characteristic of the invention, a thermoplastic layer (22) and a layer of paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and so that the device is resistant to water and humid environments.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: March 30, 2010
    Assignee: ASK S.A.
    Inventor: Christophe Halope
  • Publication number: 20100055403
    Abstract: A housing element (1) of a product comprises a foil (30) having a decorated side, wherein this side of the foil (30) is covered by a grip layer (20) for realizing a grip effect, and wherein another side of the foil (30) is covered by a supportive layer. Preferably, the grip layer (20) has a rib structure. In a preferred way of manufacturing the housing 5 element (1), each of the supportive layer and the grip layer (20) is applied to the foil (30) in an injection molding process. A processing temperature of the material of the grip layer (20) is significantly lower than an activation temperature of printing ink of a decorative covering of the foil (30), so that washout of the printing ink is prevented, whereas material of an adhesive layer of the foil (30) is adapted to establish adhesion to the material of the grip layer 10 (20) at this relatively low temperature.
    Type: Application
    Filed: November 28, 2007
    Publication date: March 4, 2010
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Hubert Petz, Marinus Arnoldus Martinus Vugts, Michel Bleeker, Johannes Bernardus Valentinus Opzeeland, Geert Mulder, Erwin Bodewits
  • Publication number: 20100040842
    Abstract: An article comprising an adhesive having an acid number of less than about 5 is provided. The adhesive is selected from the group consisting of polyurea, polyamide, polyurethane, polyester, addition cure silicone and combinations thereof. The adhesive is in contact with a corrosion sensitive layer selected from the group of metal and metal alloys. When the article is conditioned for about 21 days at about 60° C and 90% relative humidity, the corrosion sensitive layer exhibits a change from its initial electrical resistance value of 20% or less.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 18, 2010
    Inventors: Albert I. Everaerts, Jianhui Xia
  • Publication number: 20100035494
    Abstract: To provide a thermally conductive acrylic sheet having a high temperature conductivity and also a good adhesion characteristic. A double-sided, thermally conductive acrylic adhesive sheet, which is produced from a raw material mixture comprising (a) a monomer: an acrylate or methacrylate having a C2-12 alkyl group, (b) a monomer: an acrylic monomer which is represented by a formula (1) but which is different from the monomer (a), (c) a polythiol and (d) an inorganic powder, wherein the content of the inorganic powder in the raw material mixture is from 30 to 70 vol %, and the maximum particle diameter of the inorganic powder is from 5 to 70% of the thickness of the sheet.
    Type: Application
    Filed: September 27, 2007
    Publication date: February 11, 2010
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takuya Okada, Keiji Takano, Masami Yamashita
  • Patent number: 7658994
    Abstract: Articles and methods for the use of such articles are described for use in immobilizing nucleophile-containing materials. In one aspect, the invention provides an article comprising: a substrate having a first surface and a second surface; and a phosphonitrilic tethering group affixed to the first surface of the substrate, the phosphonitrilic tethering group comprising a reaction product of a complementary functional group on the first surface of the substrate with a phosphonitrilic tethering compound.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: February 9, 2010
    Assignee: 3M Innovative Properties Company
    Inventor: Brinda B. Lakshmi
  • Publication number: 20090320987
    Abstract: A flexible covering product is provided comprising a foil layer having first and second major surfaces, a protective membrane adhered to the first major surface of the foil layer, and a pressure sensitive adhesive on at least a portion of the second major surface of the foil layer in a quantity sufficient to adhere a majority of the flexible covering product to a building structure. The adhesive is preferably covered prior to application to a building structure with a release liner. Methods of use of this flexible covering product are also described.
    Type: Application
    Filed: August 21, 2006
    Publication date: December 31, 2009
    Inventors: Michael J. Hubbard, Timothy J. McQuillen
  • Publication number: 20090317617
    Abstract: A bonding film-formed base member includes a base member and a bonding film formed by supplying a liquid material containing a metal complex on a surface of the base member and then drying and burning the liquid material. The bonding film includes a metal atom and a leaving group made of an organic component. In the bonding-film formed base member, energy is applied to at least a partial region of a surface of the bonding film to eliminate the leaving group present near the surface of the bonding film from the bonding film so as to allow the at least a partial region of the surface to have adhesion to an object intended to be bonded to the bonding film-formed base member.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 24, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuru SATO, Takatoshi YAMAMOTO
  • Publication number: 20090301633
    Abstract: A tamper resistant label adapted to indicate whether a device has been opened is disclosed. The label can be flat and flexible, having a first distal end with an adhesive substance on its top side and a second distal end having an adhesive substance on its bottom side. The first distal end can be affixed to a first object, while the second distal end can be affixed to a second object separate from the first object, with the first and second objects then being coupled together to form a single device. The adhesives can render the label difficult to remove. A middle portion between the first and second distal ends can include one or more directional changes therein such that the entire label does not lie in a straight line. A substantial opening of the single device can then tear or damage the label, indicating that an opening has occurred.
    Type: Application
    Filed: August 1, 2008
    Publication date: December 10, 2009
    Applicant: Apple Inc.
    Inventors: Scott Andrew MYERS, Erik WANG
  • Patent number: 7629045
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20090291291
    Abstract: A flame retardant adhesive pressure sensitive adhesive containing a blend of flame retardants is provided. The flame retardant blend comprises (a) at least one metal oxide; (b) at least one metal hydrate; (c) at least one halogenated material; and (d) a liquid phosphorous-bromine containing composition comprising a triaryl phosphate ester having low triphenyl phosphate content.
    Type: Application
    Filed: March 29, 2007
    Publication date: November 26, 2009
    Applicant: AVERY DENNISON CORPORATION
    Inventor: Thomas C. Epple
  • Publication number: 20090270003
    Abstract: The present disclosure provides an adhesive made from a reaction product of (a) polymerizable acrylate derived from one or more alcohols selected from the group consisting of C4 alcohols, C5 alcohols, and combinations thereof wherein at least one of the alcohols is derived from a non-petroleum resource; (b) initiator; (c) stabilizer, wherein the reaction occurs in water to yield a microsphere adhesive. The microsphere adhesive can be formulated into a pressure sensitive adhesive composition that can be applied to various substrates such as paper and polymeric film to produce repositionable adhesive coated articles such as tapes, notes, flags, easels and the like.
    Type: Application
    Filed: April 22, 2009
    Publication date: October 29, 2009
    Inventors: Kelly S. ANDERSON, Ying-Yuh Lu
  • Patent number: 7600269
    Abstract: A vapor permeable retroreflective material for use on protective garments. The material may be formed in a non-continuous pattern that provides a high-level of retroreflective brightness, yet also provides adequate permeability to prevent exposure to trapped thermal energy and heated moisture. The non-continuous retroreflective pattern may include retroreflective regions and non-retroreflective regions arranged such that thermal decay through the protective garment is not substantially decreased in the regions corresponding to the retroreflective material. Rather, vapor permeation and thermal decay through the garment may be substantially the same as if the retroreflective material was not present.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: October 13, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Rino A. Feduzi, Robert L. Jensen, Jr., Jeanine M. Shusta
  • Publication number: 20090235972
    Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.
    Type: Application
    Filed: April 27, 2007
    Publication date: September 24, 2009
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Fukushima, Takehiro Shimizu, Takahiro Fukutomi
  • Patent number: 7572503
    Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: August 11, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shin Takanezawa, Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita
  • Publication number: 20090169879
    Abstract: A multi-layer transparent window film comprises a polymeric backing layer having opposed major surfaces, a layer of metal coated on at least one of the backing layer opposed major surfaces, and a layer of adhesive coated on the metal layer, wherein the adhesive comprises a corrosion inhibiting material.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Inventor: Raghunath Padiyath
  • Publication number: 20090156074
    Abstract: The present invention provides an adhesive made from a reaction product of: (a) a polymerizable monomer derived at least in part from non-petroleum resources; (b) an initiator; (c) a polymeric stabilizer, wherein the reaction occurs in water to yield a microsphere adhesive. The microsphere adhesive can be formulated into a pressure sensitive adhesive composition that can be applied to various substrates such as paper and polymeric film to produce repositionable adhesive coated articles such as tapes, notes, flags, easels and the like.
    Type: Application
    Filed: December 17, 2008
    Publication date: June 18, 2009
    Inventors: Ying-Yuh Lu, Kelly S. Anderson
  • Publication number: 20090130440
    Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.
    Type: Application
    Filed: November 11, 2005
    Publication date: May 21, 2009
    Inventors: Christian Ring, Thorsten Krawinkel
  • Patent number: 7534478
    Abstract: The release liner includes a release layer constituted of at least one polyolefin resin, wherein the release layer has surface irregularities. The surface irregularities of the release layer may be constituted of recesses and protrusions which are irregularly different in shape and have been disposed in irregular arrangement. The release layer preferably has a surface roughness Ra of 1-3 ?m. As the polyolefin resin constituting the release layer can be used at least one polyolefin resin selected from the group consisting of polyethylenes, polypropylene, polybutenes, poly(4-methyl-1-pentene), and copolymers of ethylene with one or more ?-olefins having 3-10 carbon atoms.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: May 19, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Takahiro Nonaka, Shinji Inokuchi, Masahiro Oura
  • Publication number: 20090123743
    Abstract: A method of manufacture of wire-embedded inlays, the method including providing a substrate, applying a coating to the substrate, which coating melts at an elevated temperature characteristic of wire-embedding, thereby producing an inlay substrate and when the coating is solid, employing wire embedding techniques for embedding a wire into the inlay substrate.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 14, 2009
    Inventors: Guy Shafran, Oded Bashan
  • Patent number: 7514142
    Abstract: The invention relates to a pressure-sensitive adhesive tape, particularly for producing LCD displays, comprising two surfaces while also being provided with at least one support having two supporting surfaces and a pressure-sensitive layer on each of the two supporting surfaces. The invention is characterized in that at least one of the two surfaces of the pressure-sensitive adhesive tape has silvery reflective properties.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: April 7, 2009
    Assignee: tesa Ag
    Inventors: Marc Husemann, Reinhard Storbeck
  • Publication number: 20090068819
    Abstract: Example embodiments provide tape structures including a base layer, a neutralizing layer and an adhesive layer. The base layer may support an object. The neutralizing layer may be arranged on the base layer. The neutralizing layer may be grounded to neutralize charges between the base layer and the object. The adhesive layer may be arranged on the neutralizing layer. The object may be attached to the adhesive layer. Example embodiments also provide methods of manufacturing the tape structures, methods of separating a wafer, and apparatuses for separating a wafer.
    Type: Application
    Filed: September 10, 2008
    Publication date: March 12, 2009
    Inventors: Chang-Hoon Lee, Jong-Keun Jeon, Yong-Jin Lee, Soon-Ju Choi
  • Publication number: 20090053406
    Abstract: Systems and methods for providing a structural adhesive film that includes a conductive scrim layer are disclosed. In one embodiment, a method for producing a structural adhesive film includes providing a first resin adhesive layer. The first resin adhesive layer is configured to bind to a first carbon fiber ply. The method also includes providing a second resin adhesive layer. The second adhesive layer is configured to bind to a second carbon fiber ply. The method also includes providing a conductive scrim that is embedded between the first resin adhesive layer and the second resin adhesive layer. In some embodiments, the conductive scrim is infused with resin adhesive.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 26, 2009
    Applicant: THE BOEING COMPANY
    Inventor: Patrice K. Ackerman
  • Publication number: 20090029156
    Abstract: A surface cover having a polarized adhesive material bonded or operably connected to at least a portion of a substrate. The polarized adhesive material may be a hot melt adhesive material. The substrate may have little or no electret capabilities. The electrostatic charge of the polarized adhesive material may allow the surface cover to be removed from a mounting surface for positional adjustment during the application of the surface cover to the mounting surface. Once at its desired location, and/or aligned with the patterns, characters, or images on an adjacent surface cover, the polarized adhesive material may be activated. The adhesive force provided by the activated polarized adhesive material may provide a sufficient force for adhering surface cover along the mounting surface, thereby malting the dissipation or loss of electrostatic charge inconsequential to the ability of the surface cover to remain at its desired position along the mounting surface.
    Type: Application
    Filed: February 15, 2008
    Publication date: January 29, 2009
    Inventor: Steven N. Kruchko
  • Publication number: 20080305325
    Abstract: A flexible plastic molding for use in building interiors, especially in kitchens and bathrooms around sinks and bathtubs, and between glass window panes and window frames. Embedded within the molding, and extending along its length, is a ductile metal wire which maintains the shape of a bend introduced into the molding along its length, and resists the natural tendency of the plastic molding to spring back to its original condition. The molding may have a flexible central region flanked by two elongated flat surfaces each carrying an adhesive coating. In cross section, the flat surfaces are spaced apart and arranged at an obtuse angle, so that when the molding is installed between two planes at a right angle to each other, the central region of the molding will be compressed and serve to press the flat surfaces against their respective planes.
    Type: Application
    Filed: July 26, 2007
    Publication date: December 11, 2008
    Inventor: Soung Rea Lee
  • Publication number: 20080251201
    Abstract: An adhesive tape for bonding components such as, for example, in a motor vehicle. The adhesive tape comprises a non-perforated or perforated metal layer having opposite first and second major sides, each of the first and second major sides having an adhesive layer defining an adhesive surface on the first and second major sides. The adhesive layer on the first and second major sides comprises domains of pressure sensitive adhesive and domains of an activatable adhesive composition. Each of the domains define a part of the surface of the adhesive layer. A method of adhering components of motor vehicles together.
    Type: Application
    Filed: January 21, 2005
    Publication date: October 16, 2008
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Bernardus J. Sikkel, Frank A. Brandys, Pei-Jung Chen
  • Publication number: 20080246392
    Abstract: Provided is a donor substrate, which has high transfer efficiency and increases the reliability of a device, a method of fabricating the same, and an organic light emitting diode (OLED) display device. The donor substrate includes: a base layer; a light-to-heat conversion (LTHC) layer disposed on the base layer; a transfer layer disposed on the LTHC layer and including a color filter layer; and an adhesive layer disposed on the transfer layer.
    Type: Application
    Filed: March 5, 2008
    Publication date: October 9, 2008
    Inventors: Sam-Il Kho, Jae-Young Cho
  • Publication number: 20080241452
    Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.
    Type: Application
    Filed: October 1, 2007
    Publication date: October 2, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori KONDO, Shigehiro Hoshida, Tadashi Amano
  • Publication number: 20080193741
    Abstract: The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, “M”) represented by R3SiO1/2 (R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, “Q”) represented by Si4/2 in a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.
    Type: Application
    Filed: February 5, 2008
    Publication date: August 14, 2008
    Applicants: NGK Insulators, Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoyuki FUJII, Akio Suzuki
  • Patent number: 7410551
    Abstract: The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in: supplying a multilayer structure comprising a layer of varnish that hardens under the effect of radiation, a backing layer, and a layer of decoration, the varnish layer being situated between the backing layer and the decoration layer; bringing said multilayer structure into contact with the article; applying pressure and heat to the backing layer at the location where it is desired to transfer the decoration layer onto the article, the varnish layer being such as to be transferred locally onto the article together with the decoration layer; withdrawing the backing layer; and causing the layer of varnish that has been transferred onto the article to harden by exposing it to said radiation.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: August 12, 2008
    Assignee: L'Oreal
    Inventor: Alain Bethune
  • Patent number: 7404994
    Abstract: A lidstock material suitable for sealing plastic containers that are retorted at elevated temperatures to sterilize their contents. The lidstock material comprises a substrate joined to a film comprising a mixture of a butene-1 polymer; high density polyethylene; polypropylene; and a powdered filler. The lidstock material is heat sealable, peelable, and retains high burst strength both during and after retorting at elevated temperatures.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: July 29, 2008
    Assignee: Reynolds Packaging LLC
    Inventor: James A. Stevenson
  • Patent number: 7399526
    Abstract: A printing blanket and method of reducing corrosion and abrasion of printing blankets and printing blanket cylinders is provided. The printing blanket includes a metal base ply having first and second surfaces, a surface layer on the first surface of the base ply, and a polymer on the second surface of the base ply. The polymer functions to protect the metal base ply as well as a blanket cylinder surface from abrasion and exposure to moisture and corrosive agents used during a printing process. The polymer preferably comprises ethylene vinyl acetate copolymers, nylon, polyester, polyurethane, or polyethylene. The polymer may be applied to the in the form of an emulsion which is coated or sprayed onto the base ply, or the polymer may be provided in the form of a film or sheet which is adhered to the base ply with an adhesive. Preferably, the polymer includes corrosion inhibiting additives which are released when the blanket is compressed during a printing operation, further reducing corrosion.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: July 15, 2008
    Assignee: Day International, Inc.
    Inventors: Frederic Dalmais, Jean Boret, Thomas Hower
  • Publication number: 20080149254
    Abstract: A corrosion resistant seaming tape includes a metal layer capable of blocking selected frequencies of electromagnetic radiation arranged on a polymeric substrate and covered with adhesive that protects the metal layer and prevents it from corroding. Also disclosed is a method of sealing a seam between adjacent edges of two adjacent pieces of window film including an internal metal layer by applying a polymeric film to the seam.
    Type: Application
    Filed: December 21, 2006
    Publication date: June 26, 2008
    Inventors: Raghunath Padiyath, Josh D. Tibbits
  • Publication number: 20080131639
    Abstract: An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings: (a) a dimer acid modified epoxy resin (b) a phosphorus containing epoxy resin having an epoxy equivalent of 2000 to 6000. Said adhesive composition has satisfactory flexural properties even in a high-temperature environment while retaining an excellent toughness of the adhesive and is excellent in soldering heat resistance, adhesive property, flame retardancy and electrical properties. The adhesive composition can suitable be used for cover lay films, adhesive sheets and copper-clad polyimide films.
    Type: Application
    Filed: June 23, 2004
    Publication date: June 5, 2008
    Inventors: Tetsuya Yamamoto, Tomohiro Kitamura, Sachio Suzuki
  • Publication number: 20080121605
    Abstract: A two-piece induction seal for use in creating clean, safe, and secure inner seals on containers having a monolayer plastic formed from synthetic fibers with stable pore dimensions for fluid permeability while retaining dimensional stability for compression. An inductive innerseal membrane is provided having a first side and a second side thereof, with an adhesive layer at the first side of the membrane. The second side of the membrane is detachably bound to the synthetic material with a wax layer. The synthetic material is further suitable for absorbing substantially all of said wax layer when said wax layer is in liquid form.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 29, 2008
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventor: Robert William THORSTENSEN-WOLL
  • Publication number: 20080124494
    Abstract: The invention relates to a pressure-sensitive adhesive tape, particularly for producing or sticking together optical liquid crystal data displays (LCD's), comprising a top side and an underside, with light-reflective properties on the top side and light-absorbing properties on the underside. The pressure-sensitive adhesive tape also comprises a carrier film (a) with a top side and an underside, and the pressure-sensitive adhesive tape is provided with a pressure-sensitive adhesive layer (b, b?) on both sides. The pressure-sensitive adhesive tape is characterized in that the carrier film (a) is brightly colored, and the pressure-sensitive adhesive layer (b?) on the underside of the pressure-sensitive adhesive tape is colored black.
    Type: Application
    Filed: December 2, 2005
    Publication date: May 29, 2008
    Inventors: Marc Husemann, Reinhard Storbeck
  • Publication number: 20080096016
    Abstract: The present invention provides a laminated body for producing a printed wiring board, which includes an adhesive layer that is provided between an insulating film for a printed wiring board and a metal film for forming wiring. The adhesive layer includes an active species generating composition that is capable of generating an active species having reactivity by energy application, and a polymer precursor composition that includes a compound capable of forming a polymer compound by reaction with the active species generating composition. The invention also provides a method of producing a printed wiring board.
    Type: Application
    Filed: October 19, 2007
    Publication date: April 24, 2008
    Applicant: FUJIFILM CORPORATION
    Inventor: Mitsuyuki TSURUMI
  • Publication number: 20080057250
    Abstract: A decoration panel comprised of a metal base layer, a layer that is flame retard, and water and oil stains proof disposed on the front of the metal base layer, and an adhesion layer disposed on the back of the metal base layer for the panel to be attached to the surface of a dinning table, surface of kitchenware or kitchen wall to achieve results of flame retard, and fending off water and oil stains.
    Type: Application
    Filed: September 1, 2006
    Publication date: March 6, 2008
    Inventor: Chen-Fu Peng
  • Publication number: 20080038528
    Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
    Type: Application
    Filed: July 27, 2007
    Publication date: February 14, 2008
    Applicant: WORLD PROPERTIES, INC.
    Inventor: Sankar K. Paul
  • Patent number: 7329446
    Abstract: The present invention provides a structure. The structure includes a stack of sheets. Successive sheets in each pair of successive sheets of the stack are coupled to each other by a removable adhesive. The removable adhesive is also disposed on top and bottom surfaces of the stack so as to respectively couple first and second layers to the cop and bottom surfaces of the stack.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: February 12, 2008
    Assignee: International Business Machines Corporation
    Inventors: Robert M. Japp, Gregory A. Kevern, Francis S. Poch
  • Patent number: 7326460
    Abstract: A first conductive film is formed on a wiring pattern area on a plate by dropping liquid drops. A second conductive film which is electrically separated from the first conductive film is formed by discharging liquid drops outside of the wiring pattern area on the plate.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: February 5, 2008
    Assignee: Seiko Epson Corporation
    Inventor: Toshimitsu Hirai
  • Patent number: 7323075
    Abstract: A device for shaping and contouring a fabric or the like in sewing and handicraft projects. In one configuration, the device includes a strip of solid and ductile metal that is configured to be directly adhered to a fabric surface. At lease one layer of acrylic pressure-sensitive adhesive is formed on a bonding of the metal. The shaping device can be bent into various contours and is strong enough to cause material such as tapestry or balsa wood to assume the contours of the shaping device.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: January 29, 2008
    Assignee: Jo Dee's, Inc.
    Inventors: Mary Jo Sagan, Dee Waddell, Todd M. Greer, Franklin Mitchell Keller
  • Publication number: 20070275237
    Abstract: An electromagnetic shielding (EMS) tape is provided. The EMS tape comprises a conductive backing film; and a thermosetting resin layer coated on the conductive backing film. The conductive backing film comprises aluminum foil. The thermosetting resin layer comprises modified carboxylated NBR, dimer acid-modified thermosetting epoxy resins and heat-resistive acrylic resins.
    Type: Application
    Filed: May 24, 2006
    Publication date: November 29, 2007
    Inventors: Syh-Tau Yeh, Yao-Ming Chen
  • Patent number: 7291380
    Abstract: A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: November 6, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter S. Nyholm, Curt Lee Nelson, Niranjan Thirukkovalur, Paul McClelland
  • Patent number: 7267870
    Abstract: A pressure-sensitive adhesive sheet for steel plates, which comprises a backing and a resin layer, wherein the backing comprises a resin-coated glass cloth obtainable by coating a glass cloth with a resin emulsion (A) followed by coating with a resin emulsion (B) which is different from the resin emulsion (A).
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: September 11, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Mitsuo Matsumoto, Katsuhiko Tachibana, Manabu Matsunaga, Takio Itou
  • Patent number: 7252881
    Abstract: A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: August 7, 2007
    Assignee: Kaneka Corporation
    Inventors: Takashi Itoh, Shoji Hara, Hirosaku Nagano, Masaru Nishinaka
  • Patent number: 7252891
    Abstract: A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: August 7, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Hideki Higashitani
  • Patent number: 7183007
    Abstract: A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 ?m and the adhesive layer has an sticking temperature such that the adhesion measured when 180° peeling at 23° C. of the dicing sheet is conducted (the peeling rate is 300 mm/min) after it is applied to a silicon mirror wafer is 10 N/25 mm or more. In a dicing method using such a dicing adhesive sheet, the production yield of a diced body such as a semiconductor wafer is high, and chipping the dicing is prevented.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: February 27, 2007
    Assignee: Nitto Denko Corporation
    Inventor: Syouji Yamamoto