Abstract: An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi4O9; (B) a filler different from the BaTi4O9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi4O9 (A) is 0.10 to 1.00 ?m, and a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9(A):the filler (B), ranges from 15:85 to 80:20.

Abstract: This electrical steel sheet is an electrical steel sheet in which at least part of either or both surfaces of a base steel sheet is coated with an insulation coating having an adhesive ability, wherein a logarithmic decrement of the insulation coating in a temperature range of 25 to 100° C. is 0.3 or less.

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

Abstract: Disclosed and claimed herein are photoimageable dielectric compositions for dielectric passivation layers, dielectric protection layers as well as dielectric redistribution layers for use in the manufacture of semiconductors, semiconductor packages and circuit board constructions. More specifically it relates to photoimageable polymers containing vinyl groups capable of being crosslinked during processing and post cured at lower temperatures and shorter times than conventional dielectric materials. The processed compositions are characterized by low dielectric constants and low dissipation factors as well as low moisture uptake, chemical and thermal stability, flexibility and excellent HAST (Highly Accelerated Stress Test) and TCT (Thermal Cycling Test) results. The invention also relates to low dk/df dielectric compositions that are not photoimageable.

Abstract: An antioxidant conductive thermal paste and a method of manufacturing the same are provided. The antioxidant conductive thermal paste includes a reactive monomer, a thermosetting resin, a polymerization inhibitor, an electrically conductive filler, and a thixotropic agent. The method consists of the steps of mixing a reactive monomer, a thermosetting resin, and a polymerization inhibitor evenly to get a first polymer mixture, and adding an electrically conductive filler and a thixotropic agent into the first polymer mixture in turn and blending the mixture evenly to obtain an antioxidant conductive thermal paste with good adherence, high electrical conductivity, high thermal conductivity, improved thermal-mechanical fatigue resistance or mechanical fatigue resistance.

Abstract: A cap comprising a cap body including a top plate portion which is disk-shaped, and a skirt portion which is cylindrical and provided at a peripheral edge portion of the top plate portion, the top plate portion including a substrate and a resin coating film provided on a cap inner surface side of the substrate, the resin coating film including a polyester-based resin and a lubricant, and a sealing member provided in the cap body separately from the cap body so as to face the top plate portion, and having an outer diameter smaller than an inner diameter of the skirt portion.

Abstract: An antioxidant conductive thermal paste and a method of manufacturing the same are provided. The antioxidant conductive thermal paste includes a reactive monomer, a thermosetting resin, a polymerization inhibitor, an electrically conductive filler, and a thixotropic agent. The method consists of the steps of mixing a reactive monomer, a thermosetting resin, and a polymerization inhibitor evenly to get a first polymer mixture, and adding an electrically conductive filler and a thixotropic agent into the first polymer mixture in turn and blending the mixture evenly to obtain an antioxidant conductive thermal paste with good adherence, high electrical conductivity, high thermal conductivity, improved thermal-mechanical fatigue resistance or mechanical fatigue resistance.

Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

Abstract: A rotor blade assembly includes a rotor blade defining a pressure side and a suction side extending between a leading edge and a trailing edge. Further, the rotor blade assembly includes at least one structural feature secured within the rotor blade and spaced apart from the trailing edge to define a void between the pressure side, the suction side, and the trailing edge. Moreover, the rotor blade assembly includes an adhesive filling the void between the pressure side, the suction side, and the trailing edge to provide an adhesive connection between the pressure side, the suction side, the trailing edge, and the structural feature(s). In addition, the adhesive contacts the structural feature(s) at an interface and defines a fillet profile.

Abstract: The present disclosure relates to a liquid crystal polyester resin composition comprising a liquid crystal polyester resin with a low dielectric constant and a low dielectric loss containing a naphthoic acid monomer as a main skeleton and a hydroxybenzoic acid; a glass bubble having a pressure resistance of 12,000 psi or more; and an inorganic filler such as mica. The present disclosure provides a liquid crystal polyester resin composition suitable for 5G communication materials, which can achieve low dielectric loss characteristics, and at the same time, the addition of glass bubbles with excellent pressure resistance can achieve a low dielectric constant and a low dielectric loss through the maintenance of the hollow body of the glass bubbles even after melt extrusion.

Abstract: The present disclosure relates to a wood-plastic coated metal composite profile and a production process, and belongs to the technical field of composite profiles. The wood-plastic coated metal composite profile includes a metal core material, a wood-plastic surface layer and an intermediate layer provided between the metal core material and the wood-plastic surface layer. The intermediate layer includes unsaturated carboxylic acid modified polyolefin and thermoplastic polyurethane elastomer, inorganic filler, polyurethane prepolymer. In the present disclosure, an intermediate layer is provided between the wood-plastic surface layer and the metal core material for bonding. The intermediate layer has excellent performance when bonding with the metal, and at the same time, it can blend with the wood-plastic surface layer to a certain extent during co-extrusion.

Abstract: A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.

Abstract: A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

Abstract: A portable acoustic device comprising: a device housing that defines an internal cavity, the device housing comprising a speaker housing portion and a stem portion extending away from the speaker housing portion; a first acoustic port formed through a wall of the speaker housing; an audio driver disposed within the speaker housing portion and aligned to emit sound through the acoustic first port; a battery disposed within the speaker housing portion and positioned an opposite side of the audio driver than the acoustic port; an antenna disposed in the stem; a user input region disposed along the stem; and a system in a chip disposed in the stem, the system in a chip comprising: a processor that controls operation of the portable wireless acoustic device, charging circuitry, an accelerometer, a wireless communication controller, support components for the antenna and support components for the user input region.

Abstract: An electrical connector includes at least one base body with at least one contact portion and at least one connection portion. The connection portion is provided for fastening an electrical conductor. The base body is made of a first material, and a layer of a second material is arranged in a surface area of the contact portion. An electrical connector that ensures reliable electrical contacting even under heavy mechanical stresses is realized by applying the layer of the second material by means of roll cladding or an additive manufacturing process.

Abstract: Disclosed is a sensor device. The sensor device includes a sensor configured to be attached between a rear wheel of a vehicle and a rear body cover of the vehicle, configured to detect objects in proximity to the vehicle through the rear body cover. The sensor device also includes a vertical guard configured to be attached to the vehicle, such that the sensor is protected from adhesion of materials directed rearward by the rear wheel, and an angled guard coupled to the vertical guard and extending underneath the sensor and towards the rear body cover, such that a portion of the rear body cover, through which the sensor emits a signal for detecting objects in proximity to the vehicle, is protected from adhesion of materials directed rearward by the rear wheel.

Abstract: A repair patch is for a composite material to repair a part to be repaired which is a repair target of the composite material. The patch includes a patch main body that is formed by laminating a plurality of fiber reinforced preforms in a thickness direction, and has a bonding surface to be bonded to the part to be repaired; and a removal layer that is provided on the bonding surface to be peelable off from the patch main body. The bonding surface includes an inclined surface that is inclined with respect to the thickness direction of the patch main body. The removal layer includes a processed portion that causes the removal layer to have a shape complementary to a shape of the inclined surface of the patch main body.

Abstract: The present disclosure relates to use of a sound and vibration damping system for use in automotive, appliance and other applications. Specifically, the sound and vibration damping system includes an elastomeric layer prepared from a low density butyl based composition and a constraining layer. The low density butyl based composition comprises at least one polybutene, at least one butyl rubber and light weight fillers. The sound and vibration damping system of the present disclosure has a specific gravity less than 1.0 and a loss factor of not more than 0.4 at 20° F., 40° F. and 70° F. for frequencies of 200 Hz, 400 Hz and 800 Hz.

Abstract: A liquid epoxy resin composition is provided. In preferred embodiments, the liquid epoxy resin composition is free of bisphenol A, bisphenol F, and bisphenol S, including epoxides thereof, and is useful in preparing a polyether polymer having utility in coating compositions, including, e.g., coating compositions for use on food or beverage containers.

Abstract: Polyether-epoxide polymer compositions are disclosed. The compositions comprise a reaction product of a polyepoxide compound and a polyol composition comprising a polyether polyol. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.5:1 to 3:1. The polyether-epoxide composition has a Tg within the range of ?40° C. to 60° C. The polyether polyol has a hydroxyl value within the range of 150 to 800 mg KOH/g and an average hydroxyl functionality within the range of 3.5 to 8.0. In some aspects, the polyol composition further comprises a polyester polyol. Low- and elevated-temperature processes catalyzed by bases or Lewis acids for making the polyether-epoxide compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for coatings, elastomers, adhesives, sealants, and other valuable products is assembled from readily available starting materials without reliance on polyamines or polyisocyanates.

Abstract: The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

Abstract: Cathodically depositable electrocoat materials comprising basic bismuth nitrate, further comprising at least one binder having reactive functional groups and at least one crosslinker containing the complementary reactive functional groups which are able to enter into thermal crosslinking reactions.

Abstract: An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound, a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin.

Abstract: The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 ?m or less.

Abstract: A method for applying a RMA crosslinked coating with improved adhesion, comprising the steps of applying on the substrate surface a layer of a modified epoxy primer comprising an epoxy functional polymer binder and a crosslinker, wherein adhesion of the RMA crosslinked coating to the epoxy primer layer is improved by said primer comprising after curing functional groups X reactable with crosslinkable components of the RMA crosslinkable composition or a precursor of functional groups X, preferably a moisture deblockable precursor. The invention also relates to modified epoxy primers, compositions for improving adhesion of epoxy primers and use thereof to improve adhesion of RMA crosslinkable coatings.

Abstract: Described examples include a process that includes forming a diffusion barrier layer on a backside of a semiconductor wafer. The process also includes forming a seed copper layer on the diffusion barrier layer. The process also includes forming a copper layer on the seed copper layer. The process also includes immersion plating a silver layer on the copper layer.

Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

Abstract: A vacuum heat-insulating material includes: an outer cover material; and a core material which is sealed in a tightly closed and decompressed state on the inside of the outer cover material. Outer cover material has gas barrier properties and satisfies at least one of a condition that a linear expansion coefficient is 80×10?5/° C. or lower when a static load is 0.05 N within a temperature range of ?130° C. to 80° C., inclusive, a condition that an average value of a linear expansion coefficient is 65×10?5/° C. or higher when a static load is 0.4 N within a temperature range of ?140° C. to ?130° C., inclusive, a condition that an average value of a linear expansion coefficient is 20×10?5/° C. or higher when a static load is 0.4 N within a temperature range of ?140° C. to ?110° C., inclusive, and a condition that an average value of a linear expansion coefficient is 13×10?5/° C. or higher when a static load is 0.4 N within a temperature range of +50° C. to +65° C., inclusive.

Abstract: An object of the present invention is to create, from a titanium alloy and an FRP prepreg, a composite of a titanium alloy and an FRP material that is suitable for bolt fastening. The composite can bring out excellent characteristics in CFRP members in mobile electronic-electric devices, mobile equipment, medical instruments, marine devices and the like. It has been found that titanium alloy having a special constant surface shape adheres strongly with an epoxy adhesive. In a composite obtained using this technique to integrate a titanium alloy member as a cover material and a CFRP material, the metal alloy portion deforms and disperses locally strong forces so that the CFRP material is not damaged, even when the composite is assembled to another metal member through bolt-fastening. As a result, the composite is expected to be effective for applications in mobile equipment or mobile device casings, where lightweightness, corrosion resistance, toughness and ease of assembly are required.

Abstract: In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within the gap between the first surface and the second surface. The method may also include dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface. The method may also include curing the bulk epoxy to bond the first surface to the second surface.

Abstract: Compositions comprising surface-modified calcite nanoparticles dispersed in a curable resin and to coatings and fibrous composites incorporating such compositions are described. The nanocalcite particles have a high magnesium to calcium surface concentration ratio. The surface-modifying agents include a binding group ionically associated with the nanoparticles, and a compatiblizing segment compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites, and coatings and fibrous composites prepared from such nanocalcite composites are also described.

Abstract: A vacuum heat-insulating material includes: an outer cover material; and a core material which is sealed in a tightly closed and decompressed state on the inside of the outer cover material. Outer cover material has gas barrier properties and satisfies at least one of a condition that a linear expansion coefficient is 80×10?5/° C. or lower when a static load is 0.05 N within a temperature range of ?130° C. to 80° C., inclusive, a condition that an average value of a linear expansion coefficient is 65×10?5/° C. or higher when a static load is 0.4 N within a temperature range of ?140° C. to ?130° C., inclusive, a condition that an average value of a linear expansion coefficient is 20×10?5/° C. or higher when a static load is 0.4 N within a temperature range of ?140° C. to ?110° C., inclusive, and a condition that an average value of a linear expansion coefficient is 13×10?5/° C. or higher when a static load is 0.4 N within a temperature range of +50° C. to +65° C., inclusive.

Abstract: A cylinder block for an engine includes a cylinder liner and a water jacket through which a coolant flows, the water jacket being formed along a circumference of the cylinder liner, where an insulation coating layer made of a polyamideimide resin and an aerogel dispersed in the polyamideimide resin may be formed at an external circumferential surface of the cylinder liner.

Abstract: Curable compositions comprising an epoxy mixture comprising a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy component and having an epoxide equivalent weight in the range of 170 to 200; and ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 and b) a hardener, are disclosed. The curable compositions can be used to prepare prepregs for hot-melt applications.

Abstract: Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

Abstract: A coated electronic device that is fire resistant includes an electronic component and an intumescent layer disposed over the electronic component. The intumescent layer includes sodium silicate having formula Na2SiO3, pentaerythitol, a resin that is cross-linked by melamine, boron nitride particles, and triammonium phosphate.

Abstract: A P-type metal oxide semiconductor material is provided. The P-type metal oxide semiconductor material has a formula of In(1?3)Ga(1?b)Zn(1+a+b)O4, wherein 0?a?0.1, 0?b?0.1, and 0<a+b?0.16. In particular, the P-type metal oxide semiconductor material has a hole carrier concentration of between 1×1011 cm?3 and 5×1018 cm?3.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.

Abstract: The present disclosure relates to an amorphous aluminum alloy coating. The aluminum alloy coating may specifically include one of cerium, cobalt and/or molybdenum as alloying elements and be applied by a physical vapor deposition process to a desired thickness. The coating may supply improved corrosion resistance to a given environmental condition.

Abstract: This invention discloses a new process of preparing highly reflective coatings with thermal resistance on substrates of metals. The thermal resistant coating layers include a minor-like coating with high reflectivity and a transparent protective coating, which are coated on metallic substrates with surfaces pre-treated by anodizing or thermal resistant primers (base coating layers).

Abstract: A method for producing an adjustment shim includes preparing a liquid solution of a non-polymerized resin and a solvent; coating sheets of metal with the liquid solution so as to form a film of resin on at least one face of each of the sheets of metal; stacking the metal sheets so that two adjacent sheets of metal are separated by the film of resin; and curing the resin films in the stack of metal sheets, for a predefined time period, at a temperature higher than a degradation or burning temperature of the resin.

Abstract: An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

Abstract: Provided is an entry sheet for drilling that, compared with a conventional entry sheet for drilling, has better hole position accuracy, can suppress drill bit breakage, and exhibits less processing chips wrapping around the drill bit. This entry sheet for drilling includes a metallic support foil and a layer comprising a resin composition that is formed on at least one surface of the metallic support foil, wherein the resin composition contains a cellulose derivative (A) and a water-soluble resin (B), the cellulose derivative (A) includes a hydroxyalkyl cellulose and/or a carboxyalkyl cellulose having a weight average molecular weight of 20,000 to 350,000, and based on 100 parts by mass of the resin composition, the content of the cellulose derivative (A) is 5 to 40 parts by mass and the content of the water-soluble resin (B) is 60 to 95 parts by mass.

Abstract: An object with a coating comprising: a) covalent bonds formed by reaction of a thiol group and a carbon-carbon double bond, b) covalent bonds formed by reaction of a thiol group and epoxide group, c) covalent bonds formed by a reaction of a carbon-carbon double bond and an epoxide group, said coating comprising a first primer coating and a second coating, said coating comprising covalent bonds between said first and second coatings, said first primer coating comprising covalent cross links between compounds, in the first coating the fraction (r3=ta/tc) of unreacted thiol groups (ta) to thiol groups which have reacted to form a covalent bond (tc) does not exceed 0.11, wherein the half height peak width of tan delta does not exceed 30° C. Advantages of the dual cure composition is that excellent strength is obtained and that the second curing is slow compared to the first initial curing.

Abstract: There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: A metal-clad phenolic resin laminate obtained by heating and pressing a lamination which comprises: (i) a central layered portion comprising one paper base prepreg which is made of a paper base impregnated with a first phenolic resin composition containing a resol-based resin, or a predetermined number of the paper base prepregs laid on each other; (ii) outer layered portions laid on an upper and a lower sides of the central layered portion, in which each of the outer layered portions comprises one glass fiber substrate prepreg which is made of a glass fiber substrate impregnated with a second phenolic resin composition containing a resol-based resin, or a predetermined number of the glass fiber substrate prepregs laid on each other; and (iii) a metal foil laid at least on one of the outer layered portions laid on the upper and lower sides of the central layered portion.

Abstract: A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1): (In the formula (1), R1 represents a C4-20 hydrocarbyl group; R2 represents a C1-20 saturated hydrocarbylene group; R3 represents a C2-3 saturated hydrocarbylene group; R4 represents a C1-8 hydrocarbylene group; k represents an integer of 0 to 20; l represents an integer of 0 to 20; m represents an integer of 0 to 20; and n represents an integer of 1 or 2, wherein where a plurality of Ri (i is 1 to 4) exist, the plurality of Ri may be the same as or different from each other; k —COR2O— groups, l —R3O— groups, and m —COR4COO— groups may be in any order; and where n is 2, two R1O(COR2O)k(R3O)l(COR4COO)m groups may be the same as or different from each other.

Abstract: A plasma etch resist material modified by an inorganic protective component via sequential infiltration synthesis (SIS) and methods of preparing the modified resist material. The modified resist material is characterized by an improved resistance to a plasma etching or related process relative to the unmodified resist material, thereby allowing formation of patterned features into a substrate material, which may be high-aspect ratio features. The SIS process forms the protective component within the bulk resist material through a plurality of alternating exposures to gas phase precursors which infiltrate the resist material. The plasma etch resist material may be initially patterned using photolithography, electron-beam lithography or a block copolymer self-assembly process.