Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Anti-corrosion coatings comprising electroconductive polymers polymerized in the presence of one or more film forming polymers are provided. These coatings can be used with metal substrates such as cold-rolled steel and other metals to inhibit corrosion.

Abstract: A thermosetting resin composition contains a liquid epoxy resin, a solid epoxy resin having a softening point of 125° C. or lower, an aromatic diamine compound including benzoate group and a main chain including polymethylene group, a solvent soluble polyimide resin having Tg of 200° C. or higher and a weight average molecular weight Mw of 50000 or smaller, and a phenoxy resin having Tg of 130° C. or higher. A total of amounts of the solvent soluble polyamide resin and the phenoxy resin is 15 weight parts or more and 150 weight parts or less, provided that 100 weight parts are assigned to a total of amounts of the liquid epoxy resin, the solid epoxy resin and the aromatic diamine compound.

Abstract: Coatings on a substrate and application methods result in coatings that can withstand different types or groups of bulk cargo and operations. This novel approach includes use of a combination of layers of coating materials at certain thicknesses and applied with certain techniques. In certain embodiments, the coating system includes coatings applied to a pretreated substrate, e.g., blasted steel cargo hold plates of an oceangoing vessel. The coatings include a bond layer and a resistance layer, e.g., an anti-corrosive layer tailored to resist at least one of corrosion, erosion, impact and wear of the substrate.

Abstract: A coating material includes: (A) a compound of formula (I) Ra4-nSiXan??(I), wherein: Xa is a hydrolysable radical; Ra is a non-hydrolysable radical; n is 2, 3 or 4; (B) a compound of formula (II) wherein: Xb is a hydrolysable radical; Rb is a non-hydrolysable radical without an epoxide function, an acryloxy function, a methacryloxy function and an isocyanate function; Yb is a non-hydrolysable radical with a crosslinkable function; p is 2 or 3; q is 1 or 2; the sum of p and q is less than or equal to 4; (C) a crosslinking agent; (D) an organozirconium, organotitanium or organoaluminum compound containing hydrolysable organic radicals; (E) a hydrolysis catalyst; (F) crosslinkable prepolymers of epoxy and epoxysiloxane resins, (G) optional corrosion inhibitors; (H) optional compounds for reducing the reactivity of component (D); wherein n and the sum of p +q are not at the same time each 4.

Abstract: Provided are a resin composition for surface treatment and a surface-treated steel sheet coated therewith. The resin composition for surface treatment includes a dispersing element having excellent thermal conductivity and heat dissipation, thereby maintaining physical properties of the conventional anti-fingerprint steel sheet, for example, high whiteness, fingerprint resistance, workability, electric conductivity and alkali resistance, and providing heat dissipation. In addition, the surface-treated steel sheet coated with the resin composition for surface treatment of the present invention has physical properties such as high heat dissipation, electric conductivity and whiteness, and thus may be replaced with a bottom chassis of a backlight unit, particularly, an edge-type backlight unit.

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A composite of a metal part and a resin composition part that is improved so that the metal and resin are integrally joined to have strong bonding properties, and a method for manufacturing the composite. A magnesium alloy part is inserted into a mold, a resin composition is injected and joined to the part, and a composite is obtained. A part having, formed thereon, a surface layer of a metal oxide, a metal carbonate, or a metal phosphate in use of a usual conversion treatment or a modification method thereof can be used for the magnesium alloy plate 1. The surface that has a larger amount of crystal-like objects of a nanolevel on the surface layer composed of the metal oxide, metal carbonate, or metal phosphate has a higher level of hardness, microscopic roughness, and good injection joining force, and these parameters can be controlled by a conversion treatment method. A resin composition 4, containing PBT or PPS as the main component, is used as the resin composition part.

Abstract: A metallized barrier material comprising a base material, a metallized layer and a protective coating. The base material has a first surface and a second surface. The metallized layer is vapor deposited on the first surface of the base material to a desired optical density. The protective coating is applied to the metallized layer, wherein the protective coating comprises a butyl methacrylate or a combination of an epoxy component and an acrylic component wherein the epoxy component has an EEW of less than 800.

Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.

Abstract: There are provided a resin composition which exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment and a light irradiation treatment, has an excellent peel strength with a metal foil, and can be used suitably for an LED-mounting printed wiring board; a prepreg using the resin composition; and a metal foil-clad laminate using the resin composition, or the like. A resin composition of the present invention comprises at least an epoxy resin (A) having a bisphenol A skeleton, an alicyclic epoxy resin (B), an acid anhydride (C) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (D), and a dispersing agent (E).

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract: A vehicle component formed using a reinforcing mixture that includes a plurality of basalt fibers. According to one embodiment, the reinforced vehicle component could be formed by a method in which a vehicle component is provided for reinforcement, such as a vehicle panel that may be stamped from steel. Basalt fibers are mixed with a carrier that includes one or more of an epoxy or a glue. The mixture of basalt fibers and the carrier are applied to the vehicle panel. In one embodiment, for example, the mixture could be sprayed onto the vehicle panel for purposes of reinforcement.

Abstract: Disclosed are quaternary ammonium salts containing non-halogen anions (e.g., quaternary ammonium carbonates, bicarbonates, and mixtures thereof) as anti-corrosive agents. The invention relates to a method for inhibiting the corrosion of metal surfaces by applying a composition containing one or more quaternary ammonium carbonate or bicarbonate. The disclosure is also directed to anti-corrosive coatings for metal substrates containing these compounds, to metal substrates having these anticorrosive coatings, and to aqueous cleaning solutions containing these compounds.

Abstract: A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 ?m to about 50 ?m, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating composition comprising a substantially non-zinc containing primer and a topcoat. The primer includes an epoxy resin having an epoxy equivalent weight of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a hydroxyl equivalent weight of about 200 to about 500, and a filler material. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 520 to about 930, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a carboxyl functional polyester with an acid number of about 45 to about 75 mg KOH/g, a foaming agent and a reinforcing fiber.

Abstract: The subject of the present invention is the use of at least one element chosen from among yttrium, zirconium, lanthanum, cerium, praseodymium and neodymium, in the form of oxides or salts, as reinforcing agent for the anticorrosion properties of an anticorrosion coating composition containing a particulate metal, in aqueous or organic phase, for metal parts.

Abstract: First and second aircraft structures are bonded together with an adhesive including strain-sensitive magnetostrictive material. The magnetostrictive material has a magnetomechanical coefficient greater than e?5.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract: There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mounting printed wiring board; a prepreg containing the resin composition; and a metal foil-clad laminate containing the resin composition, or the like. The resin composition of the present invention contains a fluorene-containing epoxy resin (A) having a specific structure, an acid anhydride (B) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (C), and a wet dispersing agent (D).

Abstract: It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.

Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.

Abstract: Disclosed is a chromium-free rust-inhibitive surface treatment agent to form a siliceous film that rarely cracks or peels off and yields an excellent rust-inhibitive performance on zinc surfaces of a metal part. The chromium-free rust-inhibitive surface treatment agent is an alcoholic solution of alkoxysilane oligomer having weight-averaged molecular weight of 1,000 to 10,000, and 2.5 to 15% of silicon in molecules of the alkoxysilane oligomer has been replaced with titanium. To prepare partly titanium-replaced alkoxysilane oligomer, titanium compound, in which about a half of alkoxy groups in titanium tetraalkoxide has been chelated, is reacted with tetraalkoxysilane monomer or alkoxysilane oligomer in the alcoholic solution.

Abstract: A roughened cured material allows reduction of surface roughness and increase in adhesive strength between a cured object and a metal layer. A roughened cured material is obtained by advancing curing of an epoxy resin material to obtain a preliminary-cured material and conducting roughening treatment on a surface of the preliminary-cured material. The epoxy resin material contains an epoxy resin, a curing agent, and a silica whose mean particle diameter is not smaller than 0.2 ?m but not larger than 1.2 ?m. When a roughening-treated surface of the roughened cured material is photographed with a scanning electron microscope, in a 5 ?m×5 ?m sized area of the roughening-treated surface in a photographed image, the number of particles of the silica that are exposed from the roughening-treated surface and whose exposed portions have a maximum length of 0.3 ?M or longer in the image is not greater than 15.

Abstract: A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

Abstract: A coated article comprising a metal surface, a first layer of an uncured autodeposition coating and a second uncured paint layer deposited sequentially on the surface without intermediate curing of the autodeposition coating, a process of co-curing said autodeposition coating and paint layer or layers, and a cured coated article having chemical bonds between the cured autodeposition coating layer and at least the cured paint layer immediately adjacent to the cured autodeposition coating layer.

Abstract: The present invention provides chip-resistant powder topcoats for corrosion resistant powder coated steel substrates, such as, for example, automotive suspension coil springs, comprising powder coatings formed from one or more wax and a resin component of one or more toughened epoxy resin. The present invention provides dual coatings of toughened epoxy powder basecoats and topcoats, which may be foamed and/or fiber reinforced. The powder used to form the chip resistant topcoat can further comprise up to 200 phr or, preferably, up to 75 phr of one or more extender, or 0.5 or more phr of one or more extender, such as barium sulfate, while fully retaining its chip resistant properties. In addition, the powder used to form the chip resistant topcoat can be a low temperature curing powder comprising one or more low temperature curing agent.

Abstract: A method for coating of a metallic article is provided. According to the method, the metal surface is coated with a composition which comprises a polymer or comprises a two-component system that reacts to form a polymer following application to the metal surface. The composition comprises 70-2700 meq/kg olefinic double bonds which leads to stronger adhesion and to increased corrosion resistance.

Abstract: The invention provides an improved appearance, glossy, autodepositing coating composition that maintains its desirable properties such as moisture barrier properties, although it is still able to deliver a glossy finish. No additional coatings are necessary over the instant coating to achieve a gloss. The glossy composition is accomplished by narrowing the molecular weight distribution and the molecular weight of an autodepositing epoxy dispersion coating by adding a chain transfer agent. The chain transfer agent is a thiol-containing compound made from an epoxy resin mixed with at least one ethylenically unsaturated monomer polymerized through a polymerization process, a curing agent, and a starter composition of peroxide, FeF3, and hydrofluoric acid. By eliminating the starter composition, a bath concentrate suitable for selling is manufactured.

Abstract: An exemplary embodiment discloses a structural adhesive including a structural adhesive; and, a hydrophobic material additive comprising a material selected from the group consisting of oil and carbon black.

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Abstract: A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.

Abstract: A resin composition having high Tg (high heat resistance), low thermal expansion, and excellent flame retardancy, and being advantageous for promoting halogen-free, and having excellent adhesiveness with Cu, a prepreg obtained by impregnating it into substrate, and a composite and a laminate obtained from them. Specifically provided are a modified polyimide resin composition containing (A) a polymaleimide compound of formula [1], (B) epoxy resin having at least two glycidyl groups in the molecule of formula [2], and (c) phenolic compound having at least two OH groups in the molecule, and a prepreg obtained by impregnating the composition into the substrate, and a composite and a laminate obtained from the prepreg.

Abstract: Thermosetting epoxy-terminated oxazolidinone ring containing polymers which are obtainable by reacting at least one polyisocyanate compound with at least one hydroxy group containing epoxy resin and/or a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups. The polymers have an onset glass transition temperature of at least about 45° C. and are capable of showing an onset glass transition temperature in the cured state at least about 160° C. Powder coating compositions comprising these polymers are also disclosed.

Abstract: A polymerizable composite composition comprising a) a hydrolysate and/or condensate of at least one hydrolysable alkylsilane having at least one alkyl group, at least one hydrolysable arylsilane having at least one aryl group or at least one hydrolysable alkylarylsilane having at least one alkylaryl group, and at least one hydrolysable silane containing an epoxy group, b) at least one organic compound having at least 2 epoxy groups, and c) a cationic initiator, is suitable to provide, upon curing, substrates with a patterned coating or patterned molded articles. The patterned coatings and molded articles obtained show high relaxation ability, high chemical resistance and mechanical stability. Micropatterns can be obtained with high stability of shape.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: A process for producing powder green compacts includes centrifugally compacting a slip containing a material powder, a binder resin and a dispersion medium in a mold, into a compact containing the material powder and the binder resin. A process for producing sintered compacts includes sintering the green compact. A powder green compact contains a material powder and a binder resin, the binder resin being present between particles of the material powder and binding the material particles. A sintered compact is obtained by sintering the green compact.

Abstract: The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc.

Abstract: The present invention provides curing agent compositions comprising alkylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.

Abstract: Phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.

Abstract: The present invention provides an alkyl sulfonated tetrazole compound, a method of preparing the same, an epoxy resin containing the same and a substrate produced therefrom. The epoxy resin is usefully used as a raw material of printed circuit boards, and has high adhesion to metal.

Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: Nonpolymeric compounds, compositions, and methods for forming microelectronic structures, and the structures formed therefrom are provided. The nonpolymeric compounds are ring-opened, epoxide-adamantane derivatives that comprise at least two epoxy moieties and at least one adamantyl group, along with at least one chemical modification group, such as a chromophore, bonded to a respective epoxy moiety. Anti-reflective and/or planarization compositions can be formed using these compounds and used in lithographic processes, including fabrication of microelectronic structures.

Abstract: An apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. A conformal coating overlies the metal conductors and comprises a polymer into which a phosphine compound is impregnated and/or covalently bonded. Accordingly, the conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the phosphine compound in the polymer reacts with any corrosion inducing sulfur component in the air and prevents the sulfur component from reacting with the underlying metal conductors. Preferably, the phosphine compound in the polymer does not react with other components in the air (e.g., carbon dioxide) which would otherwise deplete its availability for the target reaction. The phosphine compound may be rendered completely non-volatile by covalently bonding it directly into the polymer backbone.

Abstract: An adhesive composition or a coating composition of the present invention contains (a) 10 to 30% by mass of an epoxy resin; (b) 25 to 55% by mass of an oxetane compound; (c) 25 to 55% by mass of a vinyl ether compound; (d) 1 to 15% by mass of a modifier (wherein the total amount of the components (a) to (d) is 100% by mass); and (e) 3 to 15 parts by mass of a photocationic polymerization initiator with respect to 100 parts by mass of the total amount of the components (a) to (d).

Abstract: There is disclosed a composite comprising a first substrate comprising a formed resin body containing a silicone-modified resin, and a second substrate having a to-be-joined surface joined'to a to-be-joined surface of the first substrate, wherein the to-be-joined surface of the first substrate, or the to-be-joined surfaces of the first and second substrates has/have been subjected to application of one or more of an ultraviolet light irradiating treatment, a corona treatment, and a plasma treatment. As a result, there is provided a composite and an expedient production method of such a composite, which composite comprises a substrate comprising a formed resin body containing a silicone-modified resin, and another substrate joined to the firstly mentioned substrate in a strong manner with excellent durability therebetween.