Composite Patents (Class 428/607)
  • Patent number: 11101139
    Abstract: An etched nickel plated substrate and related methods is disclosed. Specific implementations may include providing a dielectric layer, coupling a layer of copper with a first side of the dielectric layer, plating a first side of the layer of copper with a layer of nickel; forming a patterned layer on the layer of nickel, and spray etching the layer of nickel using an etchant. The method may include holding the etchant on the dielectric layer for a predetermined period of time, and while holding the etchant, etching substantially only the layer of nickel until the layer of nickel may be substantially coextensive with a perimeter of each of a plurality of traces in the layer of copper.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: August 24, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Sadamichi Takakusaki
  • Patent number: 11040518
    Abstract: Provided is a laminated body of at least one metal foil and resin layers, which is suitable for drawing. The laminated body includes at least one metal foil and at least two resin layers. The laminated body has a thickness of 25 to 500 ?m. In the laminated body, both surfaces of each metal foil are closely laminated to the resin layers, and the relationships: 60??Y?150, and 1.4??b/?Y are satisfied, in which ?Y represents a nominal stress (MPa) at a nominal strain of 5% when a tensile test according to JIS K 7127: 1999 is performed on the laminated body, and ?b represents a nominal stress (MPa) at a nominal strain at which the metal foil in the laminated body is broken when a tensile test according to JIS K 7127: 1999 is performed on the laminated body.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: June 22, 2021
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Koichiro Tanaka
  • Patent number: 11036141
    Abstract: A photoresist and a method of manufacturing photoresist patterns are disclosed. The photoresist includes a plurality of photosensitive units, and each photosensitive unit has magnetism.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: June 15, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming Liu, Yueping Zuo, Qiuhua Meng, Chunyang Wang, Fei Fang
  • Patent number: 10920300
    Abstract: A titanium composite material 1 is provided that includes: an inner layer 5 consisting of a commercially pure titanium or a titanium alloy; an outer layer 3 formed on at least one surface of the inner layer 5 and having a chemical composition that is different from a chemical composition of the inner layer 5; and an intermediate layer formed between the inner layer 5 and the outer layer 3 and having a chemical composition that is different from the chemical composition of the inner layer 5. The thickness of the outer layer 3 is 2 ?m or more, and occupies no more than 40% of the overall thickness per side. The thickness of the intermediate layer is 0.5 ?m or more. Despite being inexpensive, this titanium composite material has desired characteristics.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: February 16, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Yoshitsugu Tatsuzawa, Tomonori Kunieda, Koji Mitsuda, Kenichi Mori, Kazuhiro Takahashi, Hideki Fujii, Tomoyuki Kitaura
  • Patent number: 10887995
    Abstract: A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 5, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Eun Lee, Yee Na Shin, Yul Kyo Chung, Doo Hwan Lee
  • Patent number: 10515898
    Abstract: Disclosed herein is a circuit board that includes a first insulating layer having an upper surface; a first wiring layer embedded in the first insulating layer, the first wiring layer having an upper surface exposed from the upper surface of the first insulating layer such that the upper surface of the first wiring layer is substantially coplanar with the upper surface of the first insulating layer; a semiconductor IC mounted on the upper surface of the first wiring layer with a die attach material interposed therebetween; and a second insulating layer stacked on the upper surface of the first wiring layer so as to embed the semiconductor IC, wherein a bottom surface of the die attach material is in contact with both of the upper surface of the first insulating layer and the upper surface of the first wiring layer.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: December 24, 2019
    Assignee: TDK CORPORATION
    Inventors: Kazutoshi Tsuyutani, Masashi Katsumata
  • Patent number: 10508189
    Abstract: In accordance with an exemplary embodiment, a power inductor includes a body, at least two bases disposed in the body, a plurality of coil patterns disposed on at least one surface of the at least two the base, respectively, and a connection electrode disposed on an outer portion of the body and connecting the at least two coils to each other.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: December 17, 2019
    Assignee: MODA-INNOCHIPS CO., LTD.
    Inventors: In Kil Park, Gyeong Tae Kim, Seung Hun Cho, Jun Ho Jung, Ki Joung Nam, Jung Gyu Lee
  • Patent number: 10480090
    Abstract: An electrolytic copper foil, a current collector including the same, an electrode including the same, a secondary battery including the same and a method for manufacturing the same which can secure secondary batteries with high capacity maintenance. The electrolytic copper foil includes a first surface and a second surface opposite to the first surface, wherein each of the first and second surfaces has a peak count roughness Rpc of 10 to 100.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: November 19, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Dae Young Kim, Seung Min Kim
  • Patent number: 10359383
    Abstract: A method of assessing galvanic electronic isolation of two components at a joint of the two components includes measuring a first electrical resistance at a first condition across a joint of two components and comparing the first electrical resistance to a threshold resistance. The comparison of the first electrical resistance to the threshold resistance is indicative of a degree of electrical isolation of the two components. A second electrical resistance is measured at a second condition and the second electrical resistance is compared to the first electrical resistance. The result of the comparison of the second electrical resistance to the first electrical resistance is indicative of a type of electrical connection between the two components.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: July 23, 2019
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Zhongfen Ding, Mark R. Jaworowski
  • Patent number: 10283728
    Abstract: There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time. The electrodeposited copper foil has a fraction of the areas occupied by the {100} plane deviating by 18° or less from the <001> crystal orientation of 10% or more determined by analysis of the surface by electron backscatter diffraction (EBSD) and at least one surface of the electrodeposited copper foil has a glossiness Gs (20°) of 1,500 or more, determined in accordance with JIS Z 8741-1997.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: May 7, 2019
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshinori Matsuura, Toshimi Nakamura, Masaharu Myoi, Hajime Watanabe
  • Patent number: 10251283
    Abstract: Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2?D1 is 0.30 to 3.83 ?m, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm2 at 220° C. for 2 hours.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: April 2, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Nobuaki Miyamoto
  • Patent number: 10128025
    Abstract: An oxide superconducting wire includes: a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer; a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate; a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 ?m to 10 ?m; and a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween, wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 ?m per film formation.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: November 13, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Chihaya Kurihara
  • Patent number: 9894774
    Abstract: A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 ?m.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: February 13, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshito Fujimura, Jun Ishii
  • Patent number: 9788423
    Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: October 10, 2017
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Michiya Kohiki, Terumasa Moriyama
  • Patent number: 9743566
    Abstract: A method for manufacturing a clad type electromagnetic shielding material includes step as follows: a first electrically conductive metallic layer, a magnetically conductive metallic layer, a second electrically conductive metallic layer and a shock-absorbing insulation layer, which are stacked in order, are one-time continuously rolled by a clad type rolling process, so as to finish a clad plate applied to an electromagnetic shielding field, wherein the surface of the shock-absorbing insulation layer provided with a binder faces the second electrically conductive metallic layer.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: August 22, 2017
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chien-Sin Huang, Chung-Chen Huang, Chien-Hung Huang, Chin-Chuan Huang
  • Patent number: 9499895
    Abstract: The present invention relates to reactive materials formed by thermal spray techniques. The thermally sprayed reactive materials have low porosity and high structural integrity. The reactive materials are useful for applications such as shaped charges, thermite welding, near net shaped components and the like.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: November 22, 2016
    Assignee: Surface Treatment Technologies, Inc.
    Inventors: Timothy Langan, W. Mark Buchta, Michael A. Riley
  • Patent number: 9496071
    Abstract: In a shield wire, a sheet shaped metal foil shield member is provided so as to envelop an inner wire part having a plurality of conductors and insulators. In the shield wire, the inner wire part is enveloped by the metal foil shield member so that the inner wire part is held and an end part of the metal foil shield member is avoided from collapsing or the end is avoided from bounding.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: November 15, 2016
    Assignee: YAZAKI CORPORATION
    Inventor: Mitsuharu Nagahashi
  • Patent number: 9393761
    Abstract: A method for forming a hybrid structure is provided. The method includes applying a sealant to a first component fabricated from a first material, coupling an isolation sheet to the sealant, and coupling a second component to the isolation sheet. The isolation sheet and the second component are fabricated from a second material that is different than the first material to facilitate preventing formation of a galvanic cell within the hybrid structure.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 19, 2016
    Assignee: The Boeing Company
    Inventor: Marcus Alexander Erickson
  • Patent number: 9393645
    Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: July 19, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Takuto Yamaguchi, Masahide Okamoto, Osamu Ikeda, Hiromitsu Kuroda, Kazuma Kuroki, Shohei Hata, Yuichi Oda
  • Patent number: 9396834
    Abstract: A metal foil is provided with a filler-containing resin layer that is thin and has a smooth surface as a metal foil provided with an insulating layer. The filler-containing resin layer having a thickness of 0.1 ?m to 3.0 ?M, the gloss at the surface of the filler-containing resin layer is 200 or more, and the surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 ?m×5 ?M on the filler-containing resin layer is 25 nm or less is stacked on the smooth surface of the metal foil having a gloss exceeding 400 and surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 ?m×5 ?m of 10 nm or less.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: July 19, 2016
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Takashi Syoujiguchi
  • Patent number: 9326432
    Abstract: To protect a space adjacent to a magnetic source from magnetic energy radiated by the source, a device includes one or two sheets of ferromagnetic material. Each sheet extends between the space and the source. The device further includes one or two sheets of a diamagnetic or paramagnetic electrically-conductive material, one of which extends between the sheet and the space being protected, and the other additional sheet extending between the sheet of ferromagnetic material and the magnetic source.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: April 26, 2016
    Assignee: RENAULT s.a.s.
    Inventor: Patrick Staebler
  • Patent number: 9252611
    Abstract: Provided are a magnetic field shield sheet for a wireless charger, which blocks an effect of an alternating-current magnetic field generated when a charger function for a portable mobile terminal device is implemented in a non-contact wireless manner on a main body of the portable mobile terminal device and exhibits excellent electric power transmission efficiency, a method of manufacturing the sheet, and a receiver for the wireless charger by using the sheet.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: February 2, 2016
    Assignee: AMOSENSE CO., LTD.
    Inventors: Dong Hoon Lee, Kil Jae Jang
  • Patent number: 9161460
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: October 13, 2015
    Assignees: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA E & S CO., LTD.
    Inventors: Hyung Gi Ha, Jae Won Jung, Yong Hwan Kim, Jong Jin Lee, Ja Ho Koo, Young Hwan Shin, Dong Kyu Lee
  • Patent number: 9129970
    Abstract: A manufacturing method of a semiconductor device comprises releasing an oxidation source included in an interlayer dielectric film having an opening portion formed on a surface thereof and being present on the surface of the interlayer dielectric film at a first substrate temperature, forming a first layer containing Ti and N to contact with at least a part of the interlayer dielectric film at a second substrate temperature lower than the first substrate temperature, wherein a Ti content in the first layer is more than 50 at % in all components, provided that oxygen and precious metals are excluded from the all components, and forming a Cu metal layer above the first layer.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: September 8, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Atsuko Sakata, Jun-ichi Wada
  • Patent number: 9115441
    Abstract: The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a Zn alloy thermoresistant layer.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: August 25, 2015
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Ming Jen Tzou, Pi Yaung Tsao, Chin Chen Huang
  • Patent number: 9099229
    Abstract: The present invention provides a metal foil provided with an electrical resistance layer, in which peeling between the metal foil and the electrical resistance layer disposed on the metal foil can be prevented and variation in the resistivity of the resistance layer can be reduced, and a method of manufacturing the same. The present invention includes a metal foil with an electrical resistance layer including a metal foil having a surface of a ten-point mean roughness Rz, which is measured by an optical method according to 1 ?m or less and the surface being treated by irradiation with ion beams at an ion beam intensity of 0.70-2.10 sec·W/cm2 and an electrical resistance layer disposed on the surface of the metal foil.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: August 4, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Toshio Kurosawa
  • Patent number: 9028972
    Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: May 12, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Terumasa Moriyama
  • Publication number: 20150104667
    Abstract: A cladding material for stainless steel clad steel plate, includes, by mass %, 0.03% or less carbon, 1.5% or less silicon, 2.0% or less manganese, 0.04% or less phosphorus, 0.03% or less sulfur, 22.0% to 25.0% nickel, 21.0% to 25.0% chromium, 2.0% to 5.0% molybdenum, 0.15% to 0.25% nitrogen, and the balance being iron and incidental impurities, wherein critical pitting temperature (CPT) after normalization as determined in accordance with ASTM G48-03 Method E is 45° C. or higher, and corrosion loss at a welded zone as determined by a corrosion test in accordance with NORSOK Standard M-601 is 1.0 g/m2 or less.
    Type: Application
    Filed: April 19, 2013
    Publication date: April 16, 2015
    Inventors: Keiichiro Kishi, Yoshihiro Yazawa, Shunichi Tachibana, Yota Kuronuma, Toshiyuki Hoshino
  • Publication number: 20150086806
    Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.
    Type: Application
    Filed: December 1, 2014
    Publication date: March 26, 2015
    Inventors: Tomota Nagaura, Kazuhiko Sakaguchi
  • Publication number: 20150064493
    Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1<=33f1/(F×T) wherein f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 ?g/dm2. is formed on a surface of the copper foil on which the resin layer is not laminated.
    Type: Application
    Filed: January 13, 2012
    Publication date: March 5, 2015
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Koichiro Tanaka, Kazuki Kammuri
  • Patent number: 8962152
    Abstract: The present invention relates to a brass-plated steel cord capable of further improving initial adhesiveness and heat-resistant adhesiveness between a coating rubber and a steel cord and also imparting excellent durability to a resulting rubber article, and more particularly to a brass-plated steel cord, wherein an outermost surface thereof contains 0.3 to 1.7 atomic % of phosphorus, 4.93 to 14 atomic % of zinc, and 0.01 to 2.0 atomic % of a metal having an ionization tendency lower than that of zinc and higher than that of copper as measured by XPS (X-ray photoelectron spectroscopy), and an amount of zinc in the outermost surface is 30 to 90 atomic % based on 100 atomic % of a total amount of zinc and copper.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: February 24, 2015
    Assignee: Bridgestone Corporation
    Inventor: Shinichi Toyosawa
  • Patent number: 8940403
    Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: January 27, 2015
    Assignee: Wire Technology Co., Ltd.
    Inventors: Jun-Der Lee, Hsing-Hua Tsai, Tung-Han Chuang
  • Patent number: 8940194
    Abstract: In accordance with various example embodiments, an apparatus includes two or more circuit nodes and a conductive material that is located between and configured to electrically couple the circuit nodes. The conductive material includes a network of elongated portions of at least one electrospun Cu-based nanostructure. Each elongated portion has an aspect ratio of at least 50,000 and a length that is greater than 100 microns, and at least one fused crossing point that joins with a fused crossing point of another of the elongated portions. The network of elongated portions is distributed and aligned in the conductive material to set a conductance level and a transparency level along the network, along at least one direction.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: January 27, 2015
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Yi Cui, Hui Wu, Liangbing Hu
  • Publication number: 20150024943
    Abstract: A compound superconducting wire 10 includes a reinforcement portion 12 and a compound superconductor 11. In the reinforcement portion 12, an assembly of plural reinforcement elements 4 are disposed. The reinforcement elements 4 each include plural reinforcement filaments 1 disposed in a stabilizer 2, and a stabilizing layer 3 at the outer periphery thereof. The reinforcement filaments 1 each mainly contain one or more metals selected from the group consisting of Nb, Ta, V, W, Mo, Fe, and Hf, an alloy consisting of two or more metals selected from the aforementioned group, or an alloy consisting of copper and one or more metals selected from the aforementioned group.
    Type: Application
    Filed: October 9, 2014
    Publication date: January 22, 2015
    Inventors: Masahiro SUGIMOTO, Hirokazu TSUBOUCHI, Kazuo WATANABE, Satoshi AWAJI, Hidetoshi OGURO
  • Publication number: 20140349133
    Abstract: Provided is a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures as well as fine spangles, and a method of manufacturing the same. According to the present invention, a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures includes a base steel sheet, a composite layer formed on the base steel sheet and including transition metal, an inhibition layer formed on the composite layer and including a iron-aluminum (Fe—Al) based intermetallic compound, and a zinc (Zn)-plated layer formed on the inhibition layer, in which an average diameter of spangles in the zinc-plated layer is 150 ?m or less, and a method of manufacturing the hot-dip galvanized steel sheet is provided.
    Type: Application
    Filed: December 20, 2012
    Publication date: November 27, 2014
    Applicant: POSCO
    Inventors: Ju-Youn Lee, Myung-Soo Kim, Jong-Sang Kim
  • Publication number: 20140342177
    Abstract: A method of synthesis to produce a conductive film including cupronickel nanowires. Cupronickel nanowires can be synthesized from solution, homogeneously dispersed and printed to make conductive films (preferably <1,000 ?/sq) that preferably transmit greater than 60% of visible light.
    Type: Application
    Filed: December 6, 2012
    Publication date: November 20, 2014
    Applicant: DUKE UNIVERSITY
    Inventor: Benjamin Wiley
  • Publication number: 20140308538
    Abstract: The surface of an aluminum substrate is modified to enhance the adhesion of the metal to polymeric materials. Intermediate layers, such as Zn/Sn, Co/Ni, and a Cu strike are applied before depositing a nodular Cu layer for bond enhancement. The surface treated aluminum substrate can be used in printed circuit boards, leadframes, or any electrical/electronic devices where Cu is typically used to reduce the cost and weight of the devices.
    Type: Application
    Filed: March 17, 2014
    Publication date: October 16, 2014
    Applicant: GBC Metals, LLC
    Inventor: Szuchain F. Chen
  • Patent number: 8852754
    Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: October 7, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Satoshi Fujisawa, Takeo Uno, Koichi Hattori
  • Publication number: 20140287259
    Abstract: A steel foil according to an aspect of the present invention includes a rolled steel foil; and a Ni having <111>//RD texture plated on an outermost layer of the rolled steel foil. Regarding the steel foil, a <111> pole density in an inverse pole figure of a rolling direction may be 3.0 or more and 6.0 or less.
    Type: Application
    Filed: April 18, 2013
    Publication date: September 25, 2014
    Inventors: Kiyokazu Ishizuka, Yuji Kubo, Jun Nakatsuka, Shuji Nagasaki
  • Publication number: 20140284589
    Abstract: An electrode foil which has both the functions of a supporting base material and a reflective electrode and also has superior thermal conductivity; and an organic device using the same are provided. The electrode foil comprises a metal foil and a reflective layer provided directly on the metal foil.
    Type: Application
    Filed: June 10, 2014
    Publication date: September 25, 2014
    Inventors: Yoshinori MATSUURA, Nozomu KITAJIMA, Naohiko ABE
  • Publication number: 20140272450
    Abstract: A braze foil (10) formed of a plurality of layers (12, 14, 16) of differing compositions wherein a combined melt of the foil has a desired braze composition, and wherein each layer is sufficiently ductile to be rolled into foil form, even though the desired braze composition is too strong or brittle to be fabricated as a foil Each interface (18,20) between layers may establish a near eutectic composition for initiating melting at the eutectic temperature, with the layer thicknesses selected so that as melting progresses away from the interfaces, the near eutectic composition is maintained within the melt puddles For certain nickel-based superalloy brazing applications, a foil having a layer of pure titanium, hafnium or zirconium may be sandwiched between respective alloy layers of 5-22% chrome-balance nickel
    Type: Application
    Filed: January 29, 2014
    Publication date: September 18, 2014
    Applicant: Siemens Energy, Inc.
    Inventors: Kazim Ozbaysal, Ahmed Kamel
  • Patent number: 8809696
    Abstract: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 ?m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: August 19, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomoaki Yamashita, Sumiko Nakajima, Sadao Itou, Fumio Inoue, Shigeharu Arike
  • Patent number: 8722186
    Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: May 13, 2014
    Assignee: Micrometal Technologies, Inc.
    Inventors: Thomas F. Burke, James E. Haller
  • Publication number: 20140057123
    Abstract: Provided is a copper foil with surface treated layers, wherein a copper foil or a copper alloy foil includes a plurality of surface treated layers configured from a roughened layer formed on the copper foil or the copper alloy foil by roughening treatment, a heat-resistant layer made from a Ni—Co layer formed on the roughened layer, and a weathering layer and a rust-preventive layer which contain Zn, Ni, and Cr and is formed on the heat-resistant layer, and the surface treated layers having a (total Zn)/[(total Zn)+(total Ni)] ratio of 0.13 or more and 0.23 or less.
    Type: Application
    Filed: February 10, 2012
    Publication date: February 27, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Hideta Arai, Atsushi Miki
  • Publication number: 20140048791
    Abstract: There are provided an electrode foil which has all the functions of a supporting base material, an electrode and a reflective layer and also has a superior thermal conductivity; and an organic device using the same. The electrode foil comprises a metal foil, wherein the electrode foil has at least one outermost surface which is an ultra-smooth surface having an arithmetic average roughness Ra of 10.0 nm or less as measured in accordance with JIS B 0601-2001.
    Type: Application
    Filed: October 25, 2013
    Publication date: February 20, 2014
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshinori MATSUURA, Nozomu KITAJIMA, Naohiko ABE
  • Publication number: 20130330567
    Abstract: The invention relates to reactive metallic systems and to methods of producing reactive metallic systems. Such systems consist of metallic particles in the form of powders or pastes, or of metallic multilayer structures. To prevent the reaction product of the described self-propagating reactions from being a brittle material, it is suggested in the invention that the reactive metallic system be designed as a multilayer structure made up of thin layers of ruthenium and aluminium deposited sequentially one upon the other, or as a powder consisting of ruthenium and aluminium particles. The object is established according to the invention by selecting Ru/Al as the basic system. The strongest exothermic reaction and thus the greatest amount of liberated heat are to be expected from stoichiometrically constructed reactive systems. The heat of formation is highest here.
    Type: Application
    Filed: December 1, 2011
    Publication date: December 12, 2013
    Applicant: UNIVERSITAET DES SAARLANDES
    Inventors: Karsten Woll, Frank Muecklich
  • Publication number: 20130295407
    Abstract: An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
    Type: Application
    Filed: November 22, 2011
    Publication date: November 7, 2013
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Shinichi Obata, Shinya Hiraoka, Fumiaki Hosokoshi, Ayumu Tateoka, Hideaki Matsushima, Koichi Miyake, Sakiko Tomonaga, Tomoyuki Maeda
  • Patent number: 8563142
    Abstract: A dual brazing alloy element for a materially integral connection of a ceramic surface to a metallic surface includes a first layer having a Ni-based brazing alloy with a Ni content of at least 50% by weight and having at least one component configured to lower a melting point of the Ni-based brazing alloy selected from the group consisting of Si, B, Mn, Sn and Ge. A second layer includes an active brazing alloy material having a total content of 1-15% by weight of at least one active element selected from the group consisting of Ti, Hf, Zr and V.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: October 22, 2013
    Assignee: Alstom Technology Ltd
    Inventors: Hans-Peter Bossmann, Alexander Schnell
  • Publication number: 20130270218
    Abstract: A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. The following can be achieved upon forming a circuit by etching a copper foil of a copper clad laminate: sagging caused by the etching is prevented; a uniform circuit of the intended circuit width is formed; the time required to form a circuit by etching is reduced; etching properties in pattern etching are improved; and the occurrence of short circuits and defects in the circuit width are prevented.
    Type: Application
    Filed: June 7, 2013
    Publication date: October 17, 2013
    Inventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
  • Patent number: 8557392
    Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: October 15, 2013
    Assignees: Furukawa Electric Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno, Koichi Hattori, Naoya Kuwasaki