Abstract: In the composite, an aluminum-plated steel sheet and a resin are securely and integrally joined together. Through chemical etching, the aluminum-plated steel sheet is caused to have a surface configuration, in which three-dimensional protrusions having shapes with a minor diameter of at least 0.3 ?m and a major diameter of at least 3 ?m are scattered over a plain part and a portion covered with shallow fine recesses with a diameter of 20 to 50 nm in a state of being distributed adjacent to each other on the plain part accounts for 30 to 50% of the surface area of the plain part. The surface of the three-dimensional protrusions is mainly ceramic containing silicon and the plain part is mainly ceramic containing aluminum. The resin is joined through injection molding with the aluminum-plated steel sheet having been inserted into a metallic mold.

Abstract: A method and device for reducing sulfidation corrosion and depositional fouling in heat transfer components within a refining or petrochemical facility is disclosed. The heat transfer components are formed from a corrosion and fouling resistant steel composition containing a Cr-enriched layer having a surface roughness of less than 40 micro inches (1.1 ?m) and a protective layer formed thereon.

Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.

Abstract: The present invention relates to a coating composed of a metallic coating material, for a cast-in component composed of a metallic material. It is provided, according to the invention, that the coating consists of galvanically applied nickel. The present invention furthermore relates to a cast-in component composed of a metallic material that is coated on at least part of its surface with a coating composed of a metallic coating material, wherein a coating in the form of a galvanically applied nickel layer is provided.

Abstract: A copper foil for a printed circuit board is provided. The copper foil includes a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to as a “nickel zinc layer”) on a roughened surface of a copper foil and a chromate film layer on the nickel zinc layer. The zinc add-on weight per unit area of the nickel zinc layer is 180 ?g/dm2 or more and 3500 ?g/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.

Abstract: Provided are a metal-resin composite having excellent adhesive strength, a method for producing the same, a busbar, a module case, and a resinous connector part. The metal-resin composite comprises a metallic member 1 including a metal with a high melting point of 500° C. or more, a resin member 2 being integrated with the metallic member 1; and an alloy layer 3 including a metal with a low melting point lower than 500° C. The alloy layer 3 is arranged between the metallic member 1 and the resin member 2, and has average surface roughness thereof in the range from 5 nm or more to less than 1 ?m at the interface between the alloy layer 3 and the resin member 2. Herein, a period of the unevenness formed on the interface of the alloy layer 3 is in the range from 5 nm or more to less than 1 ?m.

Abstract: Provided are a laminate for HDD suspension capable of avoiding data loss and crosstalk caused by higher frequency and coping with reduction in size and increase in capacity of HDD and a method for manufacturing the same. The laminate for HDD suspension comprises a 10-50 ?m-thick stainless steel layer, a 0.1-10 ?m-thick conductor layer (a) of a metal showing an electrical conductivity of 10-100% IACS, a 5-20 ?m-thick insulating layer of a polyimide resin showing a linear expansion coefficient of 1×10?5-3×10?5/° C., and a 5-50 ?m-thick conductor layer (b). The manufacturing method comprises applying a solution of a polyimide precursor in one layer or more to a conductor layer (a) of a laminate consisting of a stainless steel layer and a conductor layer (a), drying the polyimide precursor layer and then heating at 250° C. or above thereby forming a 5-20 ?m-thick insulating layer of polyimide resin with a linear expansion coefficient of 1×10?5-3×10?5/° C.

Abstract: Various embodiments of the invention include products and parts including a frictional damping means and methods of making and using the same.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: A method of producing a metal article intended for at least partially coating with a substance, which includes a metal solder, a plastic, a glass, or a ceramic. The metal article itself may include, in particular, connecting, supporting, or conducting components for an electronic component. The metal article has macroscopically smooth surface portions and a plurality of multiply curved nanopores in the region of at least one surface portion.

Abstract: The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.

Abstract: A protective coating system for metal components includes a superalloy metal substrate, such as a component of a gas turbine. A single layer bond coat is applied to the superalloy metal substrate in a thermal spray process from a homogeneous powder composition having a particle size distribution wherein about 90% of the particles by volume are within a range of about 10 ?m to about 100 ?m. The percentage of particles within any 10 ?m band within the range does not exceed about 20% by volume, and the percentage of particles within any two adjacent 10 ?m bands within the range does not deviate by more than about 8% by volume.

Abstract: A slide member provided with an Al-based alloy layer including Si and having a first contoured surface having first planar surfaces and first convexities consisting of Si particles protruding from the first planar surfaces; an intermediate layer that coats the Al-based alloy layers an overlay that coats the intermediate layer; wherein 90% or more of the Si particles protruding from the first planar surfaces are configured to have a predetermined particle diameter of 2 ?m or less, the Si particles having the predetermined particle diameter being distributed in the Al-based alloy layer with a distance between centers of gravity of the Si particles having the predetermined particle diameter averaging 6 ?m or less, and wherein the overlay has a second contoured surface having second planar surfaces and second convexities conforming with the first planar surfaces and the first convexities of the first contoured surface.

Abstract: A silicon/gold (Si/Au) bilayer seed structure is located in a film stack between an amorphous or crystalline lower layer and an upper layer with a well-defined crystalline structure. The seed structure includes a Si layer on the generally flat surface of the lower layer and a Au layer on the Si layer. The Si/Au interface initiates the growth of the Au layer with a face-centered-cubic (fcc) crystalline structure with the (111) plane oriented in-plane. The upper layer grown on the Au layer has a fcc or hexagonal-close-packed (hcp) crystalline structure. If the upper layer is a fcc material its [111] direction is oriented substantially perpendicular to the (111) plane of the Au layer and if the upper layer is a hcp material, its c-axis is oriented substantially perpendicular to the (111) plane of the Au layer.

Abstract: A foil for producing a metal honeycomb or catalyst carrier body, has an average surface roughness of more than 0.3 ?m (micrometers) on both surfaces in at least one measurement direction. Preferably, the foil is rolled and has an average surface roughness of more than 0.3 or 0.5 ?m, especially approximately 0.6 ?m, in the rolling direction and/or transverse thereto. The foil can have an oxide coating with a thickness between 60 and 80 or between 70 and 75 nm (nanometers) on both surfaces. Despite the roughness, an even thickness of the oxide coating with a tolerance of less than 10% or 5% is advantageous on both surfaces. The foil allows production of durable honeycomb bodies, especially for exhaust systems of internal combustion engines, requiring an exactly defined distribution and quality of compounds in the interior thereof. A honeycomb body and method of production using a foil, are also provided.

Abstract: Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (?? and ??) in the textured metal layer surface and orientation degrees (?? and ??) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved.

Abstract: Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the metal foil with a carrier comprises a structure where the adjoining carrier A has an area which covers the entire surface of the metal foil B, and the edge of the carrier A protrudes partially or entirely from the metal foil B. The copper foil with a carrier is used for producing a single-sided laminated plate or a multilayer laminated plate of two or more layers or an ultrathin coreless substrate for use in a printed wiring board. In particular, this copper foil with a carrier is used for producing a laminated plate, and its objective is to improve the handling performance in the production process of a printed board and reduce costs by increasing the yield.

Abstract: In a throttle body, a passive film and a corrosion-resistant film are stacked in that order on a substrate of aluminum. The passive film has a concave part on its corrosion-resistant film side. A metal layer is provided in the concave part. In shot blasting, upon collision of a blasting material against the corrosion-resistant film, a part of the blasting material is separated and adhered onto the resultant concaves to form the metal layer. For example, aluminum having a purity of not less than 98% is selected as the blasting material.

Abstract: A first bonding material layer is formed on a first substrate and a second bonding material layer is formed on a second substrate. The first and second bonding material layers include a metal. Ions are implanted into the first and second bonding material layers to induce structural damages in the in the first and second bonding material layers. The first and second substrates are bonded by forming a physical contact between the first and second bonding material layers. The structural damages in the first and second bonding material layers enhance diffusion of materials across the interface between the first and second bonding material layers to form a bonded material layer in which metal grains are present across the bonding interface, thereby providing a high adhesion strength across the first and second substrates.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 ?m or below; and a method of producing the same.

Abstract: An nickel plating layer (5a) intended for corrosion current distribution is formed over a body (2), and a 0.05 to 2.5 micrometers thick surface chrome plating layer (6) made of trivalent chromium is formed on the surface thereof using basic chromium sulfate as a source of metal. Further on the same, a not less than 7 nm thick chromium compound film (7) is formed by cathode acidic electrolytic chromatin. The corrosion distribution nickel plating layer (5a) has a function of forming a microporous structure, a microcrack structure, or the both of the same in the surface chrome plating layer (6).

Abstract: The invention relates to a component made from a substrate with a coating, whereby that coating forms a surface of the component with reduced wettability. The invention further relates to production of said component. The coating which forms a surface with projections and recesses, brings about a reduction in wettability, in particular, by means of an effect based on the properties of lotus blossom. According to the invention, a metal with antimicrobial properties, in particular silver is provided under the coating, which is not fully covered, in other words, regions remain free of the coating in which the surface of the component is formed by the antimicrobial properties.

Abstract: A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a cross-linking component, the wiring board having a surface-treated layer formed on one or both sides of the copper wiring, and the surface-treated layer having a metal layer (A) containing at least one metallic component selected from the group consisting of tin, zinc, nickel, chromium, cobalt and aluminium, an oxide and/or hydroxide layer (B) of the metallic component on the metal layer (A), an amino-silane coupling agent layer (C) having an amino group in its structure on the oxide and/or hydroxide layer (B), and a vinyl-silane coupling agent layer (D) having a carbon-carbon unsaturated double bond on the amino-silane coupling agent layer (C).

Abstract: The invention is a technique for strongly integrating a galvanized steel sheet and a resin molded article. A hot-dip galvanized steel sheet “Z18” is immersed in an aqueous solution for aluminum degreasing at 75° C. for 7 minutes, to form roughness having an RSm of 0.8 to 2.3 ?m and an Rz of 0.3 to 1.0 ?m on the surface. The surface is covered with convex protrusions having a diameter of about 100 nm, and a chromate treatment layer appears in the surface. In other words, three conditions suitable for bonding are satisfied thereby. A resin composition comprising 70 to 97 wt % of polyphenylene sulfide and 3 to 30 wt % of a polyolefin resin is injected onto the surface. The resin composition penetrates into ultra-fine irregularities and is cured in that state, whereby a composite in which the galvanized steel sheet and the resin molded article are strongly integrated is obtained. The shear rupture strength of the composite is extremely high, in excess of 20 MPa.

Abstract: The present invention relates to a non-adhesive-type flexible laminate including a polyimide film with at least one surface thereof being plasma-treated, a tie-coat layer formed on the plasma-treated surface, and a metal conductor layer formed on the tie-coat layer, wherein a proportion (T/Rz) of the tie-coat layer thickness (T) to 10-point mean roughness (Rz) of the plasma-treated polyimide film surface is 2 or more. An object of the invention is not only to improve initial adhesion which is an indicator of adhesion strength of the non-adhesive-type flexible laminate (in particular, a two-layered, flexible laminate), but also to increase adhesion of the laminate after heat aging (after being allowed to stand for 168 hours at 150° C. for 168 hours in the atmosphere).

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is selected from nickel, or a combination of nickel with cobalt, iron, or combinations thereof. The compositions further comprise ruthenium, rhenium, or a combination thereof, a Group 4 metal (e.g., hafnium, zirconium, titanium), and can further include silicon and/or germanium, where the composition results in improved aluminum diffusion properties. Also disclosed herein are articles comprising the composition.

Abstract: A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

Abstract: The present invention enables magnetic domain control by the method of forming a magnetic coating layer of an Ni—Fe alloy comprised of Fe: 10 to 50 mass % and Ni: 90 to 50 mass % on the surface of grain-oriented electrical steel sheet having mainly {110}<001> orientation texture so that even if annealing after core formation, the iron loss improving effect will not be lost and the magnetic flux density will not be greatly reduced.

Abstract: Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 ?g/dm2 or more and 3500 ?g/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: In one aspect, a copper foil for lamination to a dielectric substrate includes a layer deposited on a surface of the copper foil. The layer is formed from chromium and zinc ions or oxides and is treated with an aqueous solution containing at least 0.5% silane. In another aspect, a peel strength enhancement coating is disposed between a copper foil laminate and a dielectric substrate. The peel strength enhancement coating comprises a metal and metal oxide mixture containing a metal selected from groups 5B, 6B, and 7B of the periodic table of the elements. The effective thickness of the peel strength enhancement coating is that thickness capable of providing less than or equal to 10% loss of peel strength, when measured in accordance with IPC-TM-650 Method 2.4.8.5 using a ? inch wide test specimen, after being immersed in 4N HCl at about 60° C. for 6 hours.

Abstract: Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 ?m on a metal whose surface has a ten-point average roughness Rz of 2.0 ?m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Abstract: A method of coating a metallic article having an at least part-metallic surface comprising a first metal, with a surface having a pre-determined wettability, the method at least comprising the steps of: (a) coating at least a part of the metallic article with a layer of a second metal to provide a metal-metal bonded surface, said surface being rough either prior to or because of step (a); and (b) contacting the metal-metal bonded surface of step (a) with a material to provide the surface having the pre-determined wettability. The first metal may be one or more of the group comprising: iron, zinc, copper, tin, nickel and aluminium, and alloys thereof including steel, brass, bronze and nitinol for example. Preferably, the second metal is coated onto the first metal using electroless Galvanic deposition.

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is selected from nickel, or a combination of nickel with cobalt, iron, or combinations thereof. The compositions further comprise palladium, platinum, rhodium, or combinations thereof, hafnium, titanium, zirconium, or combinations thereof; and can further include silicon, germanium, or combinations thereof, wherein the composition results in improved Al retention properties. Also disclosed herein are articles comprising the coatings.

Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film including at least one hole. The insulating film further includes a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer and a second metal layer that is positioned on the first surface and at least one of the second and third surfaces. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: A composition for metal surface treatment can form a chemical conversion coating film which achieves sufficient foundation surface concealment, coating adhesion and corrosion resistance. A method for treating the surface of a metal material with such a composition for metal surface treatment is used. Specifically a metal surface treatment composition used for a treatment of a metal surface, contains a zirconium compound and/or a titanium compound, and a polyamine compound having a number average molecular weight of not less than 150 but not more than 500,000. The polyamine compound contains not less than 0.1 millimole but not more than 17 millimoles of a primary and/or secondary amino group per 1 g of the solid content, and the content of the zirconium compound and/or titanium compound in the metal surface treatment composition is not less than 10 ppm but not more than 10,000 ppm in terms of metal elements.

Abstract: A laminate comprising: an insulated substrate, an insulating resin layer having an imide bond and/or amide bond superimposed on the insulated substrate, and a metal thin film layer involving a structure having metal particles fusion bonded to each other, superimposed on the insulating resin layer, wherein the insulating resin layer sticks fast to the metal thin film layer in such a fashion that some of the fusion bonded metal particles are buried in the insulating resin layer, and wherein a metal oxide is present at a contact interface of the insulating resin layer with the metal thin film layer.

Abstract: Disclosed is a steel sheet for dissimilar materials weldbonding to an aluminum material, the steel sheet containing, in mass, C: 0.02 to 0.3%, Si: 0.2 to 5.0%, Mn: 0.2 to 2.0%, and Al: 0.002 to 0.1%, further one or more of Ti: 0.005 to 0.10%, Nb: 0.005 to 0.10%, Cr: 0.05 to 1.0%, and Mo: 0.01 to 1.0%, and the balance consisting of Fe and unavoidable impurities. In the steel sheet, (i) the proportion of the oxide containing Mn and Si by 1 at.

Abstract: The invention relates to a process for producing a sliding body made up of a base body and a slide plate with a running surface arranged on the base body, wherein the slide plate and the base body are joined to one another by capacitor discharge welding. It is preferable for sliding bodies of this type to be used as a sliding shoe for hydrostatic piston engines. The running surface of the slide plate is made of a nonferrous-metal sliding bearing material produced by spray-compacting and, in particular, is made of a copper-tin-titanium alloy produced by spray-compacting and contains 13.5 to 20% by weight of tin, 0.05 to 0.5% by weight of titanium, remainder copper and optionally one or more of the elements selected from silicon, chromium and zirconium up to a total amount of 1.0% by weight, plus inevitable impurities.

Abstract: An outwardly grown diffusion aluminide bondcoat is formed on a superalloy substrate and has higher concentrations of Al and Pt and lower concentrations of harmful impurities (e.g. Mo, W, Cr, Ta, S, etc.) at an outermost region of the bondcoat than at an innermost region thereof adjacent the substrate. The bondcoat is pretreated prior to deposition of a ceramic thermal insulative layer in a manner that reduces grain boundary ridges on the outermost bondcoat surface without adversely affecting the outermost region thereof, and then is heat treated to thermally grow a stable alpha alumina layer on the bondcoat prior to deposition of a ceramic layer.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: An item made of wear resistant material, the item, in certain aspects, made by a method including forming a mass of wear resistant material, the wear resistant material comprising at least one element from the group consisting of arsenic, antimony, cerium and bismuth, wherein the at least one element is present by weight as between 0.01% to 0.0001% of a total weight of the wear resistant material, wherein the wear resistant material includes by weight percent chromium 29.10-30.00%; nickel 5.00-6.00%; titanium 1.00-2.10%; boron 3.00-3.90%; silicon 1.00-2.10%; manganese 1.10-2.00%; iron-balance.

Abstract: A reflective Ag alloy film for reflectors, which has excellent surface flatness and shows high reflectivity even under a heating environment and a reflector. The reflective Ag alloy film for reflectors has an average surface roughness of 2.0 nm or less and contains a rare earth element (such as Nd) in a content in the range of 0.1 to 3.0 at %, or further at least one selected from Au, Pd, Cu and Pt in a content in the range of 0.5 to 5.0 at %. The reflector comprises the above reflective Ag alloy film formed on a substrate.

Abstract: Metallic workpieces of diverse shapes having work surfaces which are deformed at the surface and adjacent sub-surface layers by surface impact from ultrasonic transducers employing freely axially moving impacting elements propelled and energized by a transducer oscillating surface vibrating periodically at an ultrasonic frequency. The impacting elements are propelled in a random aperiodic and controlled impact mode at different phases of the periodic oscillation cycles. The transducer may be portable and provides a series of mechanically interconnected stages having mechanical resonances harmonically related as a multiple of the primary ultrasonic frequency and have matched stage resistances under instantaneous loading when the impact elements are driven by the transducer oscillating surface into the surface of the workpiece.

Abstract: Prefilter improves efficiency of cleaning process by preventing clogging of filter with dirt or other particles. The polished surface allows easy removal of dirt with one shake. Prefilter extends life of filter.

Abstract: A metal article intended for at least partially coating with a substance, which includes a metal solder, a plastic, a glass, or a ceramic. The metal article itself may include, in particular, connecting, supporting, or conducting components for an electronic component. The metal article has macroscopically smooth surface portions and a multiplicity of multiply curved nanopores in the region of at least one surface portion.