Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.

Abstract: The present invention provides a metal part in which a rubber is adhered to a portion or the whole of a surface thereof, and a surface treating method of the metal part, in order to improve adhesive property between the metal and the rubber, to easily form a surface roughness in a specific portion of a metal part, and to achieve an improvement of working accuracy in the surface roughness, an improvement of mold maintenance property, a reduction of cost and, man hour. A surface roughness is formed in a portion of a surface of the metal part to which the rubber is adhered, and the surface roughness is transcribed from a mold to the metal part by previously providing with a surface roughness in the mold. A magnitude of the surface roughness is preferably set to be 10 ?m or more and less than 60 ?m.

Abstract: A heat dissipation substrate for an electronic device comprises a first metal layer, a second metal layer, and a thermally conductive polymer dielectric insulating layer. A surface of the first metal layer carries the electronic device, e.g., a light-emitting diode (LED) device. The thermally conductive polymer dielectric insulating layer is stacked between the first metal layer and the second metal layer in a physical contact manner, and interfaces therebetween include at least one micro-rough surface with a roughness Rz larger than 7.0. The micro-rough surface includes a plurality of nodular projections, and the grain sizes of the nodular projections mainly are in a range of 0.1-100 ?m. The heat dissipation substrate has a thermal conductivity larger than 1.0 W/m·K, and a thickness smaller than 0.5 mm, and comprises (1) a fluorine-containing polymer with a melting point higher than 150° C.

Abstract: A method of depositing a bond coating to a surface of an article includes the steps of depositing an inner layer of the bond coating consisting of ?-NiAl comprising Fe, Ga, Mo, B, Hf or Zr or ?/?-MCrAlY comprising Fe, Ga, Mo, B, Hf or Zr or ?/??- or ?-MCrAlY, and depositing an outer layer of the bond coating, which is more coarse the in the inner layer, consisting of ?-NiAl comprising Fe, Ga, Mo, B, Hf or Zr or ?/?-MCrAlY comprising Fe, Ga, Mo, B, Hf or Zr or ?/??- or ?-MCrAlY, wherein said elements Fe, Ga, Mo, B, Hf or Zr above mentioned are present individually or in combination. The coating also includes a noble metal selected from the group consisting of platinum, palladium and rhodium in the inner and outer layer or as a separate layer.

Abstract: A system for bonding layers (1) of different chemical compositions, such as bonding a thermal barrier layer to a metal substrate on a surface of a gas turbine component. A substrate (4) made either of a ceramic material or particularly of a metal super-alloy may be bonded to an outer layer (16) such as a ceramic by means of a fine-grained intermediate layer (7) bonded to the substrate (4), and a coarse-grained layer (10) bonded to the intermediate layer (7) to create a studded surface (9). The fine and coarse layers (7, 10) provide a transition between the substrate (4) and the outer layer (16) for improved bonding between them. The studded surface (9) may provide at least a 20% increase in bonding surface area for the outer layer (16). Additionally, a medium-grained layer (13) may be applied to the studded surface (9) before applying the outer layer(16).

Abstract: A tungsten disulfide metal surface treatment in which the substrate material is prepared through impingement of small blast media particle sizes to create formed pockets in the substrate material approximately matched to the size of the tungsten disulfide particles. A sand blast apparatus having a vibratory bowl with a throttled intake pipe enables small blast media particles to be used to prepare the substrate surface with the formed pockets. A method for forming the tungsten disulfide surface treatment through roughening the substrate surface in a controlled manner is disclosed.

Abstract: A multilayer sliding bearing includes a rigid metal backing having a metal bearing liner attached thereto. The metal bearing liner includes a metal bearing liner layer which is attached to the bearing surface of the metal backing layer and at least one metal overplate layer deposited over an outer surface of the metal bearing liner layer. The metal bearing liner layer has a layer of hard particles embedded in an outer surface thereof which is adjacent to the inner surface of the at least one metal overplate layer. The bearing may also include a barrier layer interposed between the metal bearing liner layer and the metal over plate layer to inhibit diffusion therebetween and/or promote adhesion of the metal over plate layer to the metal bearing liner layer. The invention may also include a thin metal protective coating layer over the outer surface of the bearing liner and backing layer.

Abstract: An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 ?m, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 ?m by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

Abstract: A method for patterning self-assembled colloidal photonic crystals and a method for fabricating three-dimensional photonic crystal waveguides having an inverted-opal structure using the patterning method. The patterning method includes depositing first and second conductive films separate from each other, on an area corresponding to a pattern of the self-assembled colloidal photonic crystals that are to be formed on a substrate and on another area except for the area corresponding to the pattern, respectively, and growing the photonic crystals on the substrate on which the first and second conductive films are deposited by dip-coating in a fluid containing colloidal particles while applying a DC voltage to the respective first and second conductive films. Various types of colloidal photonic crystals can be fabricated depending on the electrode pattern defined on the substrate.

Abstract: A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.

Abstract: A Pb-free hot-dip Sn—Zn coated steel sheet comprising a hot-dip coating layer comprised of 1 to 8.8 wt % of Zn and the balance of Sn in an amount of 91.2 to 99.0 wt % and unavoidable impurities and/or ancillary ingredients on the surface of steel sheet, the coating surface having Sn dendrite crystals and Sn dendrite arm spacings buried by an Sn—Zn two-way eutectic structure, an area ratio of Sn dendrites in the coating surface being 5 to 90%, and the arm spacing of the Sn dendrites being not more than 0.1 mm, preferably having a discontinuous FeSn2 alloy phase at the surface of the steel sheet.

Abstract: A chemical leadframe roughening process includes cleaning and chemically micro-etching a raw copper leadframe to remove organic material and oxide material from the surface. The surface of the leadframe is then roughened using an organic and peroxide solution, resulting in a finely pitted surface morphology. The roughened leadframe is cleaned to remove organic material, and then is plated with a lead-free plating material (such as a layered plating of nickel-palladium-gold (NiPdAu)) having a reflow temperature higher than the reflow temperature of lead-based solder. The plated leadframe exhibits the desired finely pitted morphology that is believed to provide for greater bonding with the mold compound used to make a finished integrated circuit package, thereby improving the moisture sensitivity level (MSL) performance of the package.

Abstract: A coated steel sheet composed of a steel sheet and at least two types of coating layers formed thereon is provided with an electrodeposition painting having a superior appearance. The coated steel sheet has an arithmetic mean roughness Ra, which is defined by JIS B 0601-1994, of from about 0.7 to about 1.5 ?m and a peak per inch PPI of from about 180 to about 250.

Abstract: A method for producing a coated carbon composite material is provided. The resulting coated composite is useful for applications such as rocket nozzles and valve bodies that encounter the high temperature and high flow rates in rocket propulsion and control. A carbon substrate such as graphite is first coated with rhenium. A layer of ruthenium is then deposited on the rhenium. The materials are heated at high temperature so as to melt the ruthenium. The ruthenium melts and penetrates through the rhenium layer and into pores of the carbon substrate. The rhenium and ruthenium are mutually soluble and further form a rhenium/ruthenium alloy. Upon solidification of the rhenium/ruthenium alloy interlayer, a further rhenium coating may be deposited thereon. The rhenium/ruthenium interlayer provides a high strength bond between the carbon substrate and the rhenium coating.

Abstract: A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 ?m or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.

Abstract: The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.

Abstract: The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 ?m or less, and the object of the present invention is to secure good voltage resistant proprieties. For the double-sided copper-clad laminate of the present invention uses an electrodeposited copper foil provided with a matte side to be joined to the dielectric layer prepared by physically polishing the rough surface of an untreated electrodeposited copper foil obtained by an electrolysis method to a surface roughness (Rz) of 0.5 ?m to 3.0 ?m, and nodular treatment, and as required, passivation, silane coupling agent treatment, or the like are performed thereon. As the manufacturing method thereof, a manufacturing method wherein the surfaces of the resin layers of two electrodeposited copper foils having resin layers facing to each other are adhered, or the like.

Abstract: There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 ?m, and the specular gloss was made to be 250 or more when the incident angle is 60°.

Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 ?m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: A process for the production of thin walled parts of steel, wherein there are layers that are at least partly differently treatable relating to their strength and hardness qualities. This process can include creating a composite material from a plurality of different layers by connecting at least one core layer and at least one surface layer together. At least one layer of the core or surface layer is cast adjacent to another layer to form a composite material having an alloy gradient that is flat at each interface between any of the core layer or the surface layer. Next, the process can include deforming the composite material along a length of these layers. Finally the process can include heat treating the layers to transform the strength and hardness qualities of at least one of these layers.

Abstract: A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.

Abstract: A resin sheet containing dispersed particles which is thin and lightweight, and has excellent mechanical strength and light-diffusing properties. The resin sheets may be used in liquid crystal displays. A resin sheet having a hard coat layer, an epoxy resin layer containing 100 parts by weight of the resin to 200 parts by weight of a diffuser having a refractive index different from that of the epoxy resin and having an average particle diameter from 0.2 to 100 ?m, and a thin metal layer as a reflecting layer, wherein the diffuser localizes so as to have a concentration distribution in the direction of the thickness of the epoxy resin layer. A resin sheet having dispersed particles which is obtained by superposing a reflecting layer, an inorganic gas barrier layer, or a color filter layer thereon. A process for producing the resin sheet having a color filter layer.

Abstract: A copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns in the resin, free from a drop in bond strength between the copper foil and resin substrate due to the processing for formation of solder balls, excellent in visibility, and excellent in mounting of ICs on fine patterns, comprising a copper foil on at least one surface of which is provided an alloy fine roughening particle layer comprised of a copper-cobalt-nickel alloy with contents of cobalt and nickel equal to or greater than that of copper, specifically a copper foil on the surface of the copper foil for bonding with the resin substrate of which is provided an alloy fine roughening particle layer comprised of 5 to 12 mg/dm2 copper, 6 to 13 mg/dm2 cobalt, and 5 to 12 mg/dm2 nickel, wherein the alloy fine roughening particle layer provided on the copper foil surface may be treated for stainproof or

Abstract: An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided.

Abstract: A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

Abstract: Enhancing wear and corrosion resistance of an industrial component by depositing a Ni-based alloy coating having a thickness of at least about 50 microns onto a surface of the industrial component by high velocity oxyfuel propulsion of a Ni-based alloy powder containing a) Cr, b) from about 15 to about 25 wt % Mo, c) no more than about 1 wt % Fe, and d) no more than about 1 wt % elements having an atomic number greater than 42. A Ni-based alloy powder for HVOF deposition containing a) Cr, b) from about 15 to about 25 wt % Mo, c) no more than about 1 wt % Fe, and d) no more than about 1 wt % elements having an atomic number greater than 42. A Ni-based coating on an industrial component having enhanced corrosion and wear resistance.

Abstract: The invention is a formable, bright metallized laminate that has superior optical and deformation properties. The metallized laminate is made from a plurality of discontinuous metal island layers deposited on a formable clear coat film. The invention is also a method that includes depositing a first discontinuous layer of metal islands upon a formable clear coat film and then depositing a second discontinuous layer of metal islands onto the first discontinuous layer of metal islands.

Abstract: The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, titanium ions, manganese ions, vanadium ions, iron ions, tin ions, indium ions, silver ions, and combinations thereof; and optionally, an electrolyte that does not contain potassium or sodium ions; wherein the treatment composition is substantially free of chromium, and wherein the treatment composition forms a coating on a substrate or material that enhances adhesion of a polymer to the material. The present invention is also directed to materials coated with the above treatment composition, and methods of coating materials using the above composition.

Abstract: Method of synthesis of confined colloidal crystals using electrodeposition. The present invention provides a method of growing confined colloidal crystal structures using electrodeposition of monodispersed charged colloid spheres onto a substrate patterned with an array of electroconductive surface relief features on a surface of a substrate. In this approach, control over large-scale ordering is achieved via a planar pattern whose scale is on the order of tens of microns, a regime readily accessed through coarse lithography, laser micromachining, and holography.

Abstract: A joined structure has high strength, which is used for manufacturing a joint made from different metal materials. In the joined structure in which the different metal materials are joined, a reaction product layer to be generated on the joined interface is set to have a thickness of 0.5 &mgr;m or less. Moreover, the reaction product layer is allowed to intermittently exist on the joined interface. Furthermore, the reaction product layer contains a base material crystal consisting of base material atoms of 90 atom % or more on the joined interface.

Abstract: There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.

Abstract: A transmittable light-scattering sheet (a transmitting type light-scattering sheet) of the present invention comprises a plurality of layers, each having a bicontinuous structure composed of a plurality of polymers. The layers differ from each other in average period size of the bicontinuous structure. The sheet may comprise, for example, a first layer having a bicontinuous structure (e.g., the average period size of the bicontinuous structure of 1.5 to 4 &mgr;m) and a second layer each having a bicontinuous structure (e.g., the larger average period size of the bicontinuous structure than that of the first layer by 0.5 to 8 &mgr;m). In the sheet, the first layer may be next to the second layer. The ratio of the period size of the first layer to that of the second layer may be the first layer/the second layer=1.3/1 to 4/1. Such a sheet can impart a directionality to a reflected light.

Abstract: A method is provided for refurbishing a service operated metallic coating on a substrate alloy, the coating including at least within a coating outer surface at least one oxide chemically grown from at least one coating element, for example Al, and chemically bonded with the coating outer surface as a result of thermal exposure during service operation. Growth of the oxide has depleted at least a portion of the coating element from the coating. The method comprises removing the oxide from the coating outer surface while substantially retaining the metallic coating, thereby exposing in the coating outer surface at least one surface void that had been occupied by the oxide. The retained metallic coating is mechanically worked, substantially without removal of the retained coating, to close the void, providing a treated metallic coating surface over which a refurbishing coating is applied.

Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 &mgr;m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.

Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.

Abstract: The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 &mgr;m or less, and the object of the present invention is to secure good voltage resistant proprieties.

Abstract: Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in heat resistance and electrical characteristics, comprising untreated copper foil roughening treated on its surface, wherein the untreated copper foil before roughening treatment is an electrodeposited copper foil having a surface roughness in terms of 10-point average roughness Rz not more than 2.5 &mgr;m and a minimum distance between peaks of rough pyramid of at least 5 &mgr;m or having further crystal grains of an average particle size of not more than 2 &mgr;m exposed at the surface thereof, and a method of production of the same.

Abstract: A cast slab has a negative segregation zone composed of a multilayer structure of negative segregation layers disposed between dendrite or crystalline layers. The dendrite or crystalline layers are a deflection structure caused by vibration during formation of the cast slab. The negative segregation layers have a distance between them of not more than 2 mm and the number of negative segregation layers is not less than 3. The cast slab has an equi-axed crystal ratio of not less than 50% inside the multilayer negative segregation zone.

Abstract: A metallized polyimide film of the present invention comprises a polyimide film 1 which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate layer 2 formed from one, or two or more elements selected from a group consisting of molybdenum, silicon and silicon monoxide, which is formed on top of the surface which has undergone surface roughening treatment with an average thickness of 5 to 50% of the aforementioned Ra value, and a conductive metal layer 4 which is formed on top of the intermediate layer 2. This construction improves the bonding strength between the polyimide film and the metal layer.

Abstract: A method for applying a bond coat on a metal-based substrate is described. A slurry which contains braze material and a volatile component is deposited on the substrate. The slurry can also include bond coat material. Alternatively, the bond coat material can be applied afterward, in solid form or in the form of a second slurry. The slurry and bond coat are then dried and fused to the substrate. A repair technique using this slurry is also described, along with related compositions and articles.

Abstract: An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided.

Abstract: A metallic foil and a transparent substrate film are laminated with an adhesive layer. The roughness of the adhesive-layer-side surface (lower surface) of the metallic foil is such that the maximum height Rmax is more than 0 and less than 4 &mgr;m. As long as the maximum height Rmax falls in the range, the adhesive layer never contains air bubbles in such sizes that reflectance is adversely affected. The roughness of the surface (upper surface) of the metallic foil, opposite the adhesive-layer-side surface, is preferably such that the arithmetic mean roughness Ra is between 0.02 &mgr;m and 1 &mgr;m. As long as the arithmetic mean roughness Ra is in this range, it is possible to efficiently conduct vacuuming to bring, into close contact, a photosensitive resin layer and a photomask in sheet form placed on the photosensitive resin layer, before effecting the pattern-wise exposure of the photosensitive resin layer.

Abstract: A tungsten disulfide metal surface treatment in which the substrate material is prepared through impingement of small blast media particle sizes to create formed pockets in the substrate material approximately matched to the size of the tungsten disulfide particles. A sand blast apparatus having a vibratory bowl with a throttled intake pipe enables small blast media particles to be used to prepare the substrate surface with the formed pockets. A method for forming the tungsten disulfide surface treatment through roughening the substrate surface in a controlled manner is disclosed.

Abstract: A multilayer film formed body comprises an outermost layer comprising a diamondlike carbon film, a substrate comprising an iron material, and an intermediate layer comprising a first layer on the substrate side, and a second layer on the outermost layer side. The first layer comprises at least either metal of Cr and Al, and a second layer comprises an amorphous layer including carbon and at least either metal of Cr and Al. The second layer has a gradient structure where the metal decreases as the position becomes closer to the outermost layer. The hardness of the second layer increases stepwise or continuously as the position becomes closer to the outermost layer. The hardness of the second layer close to the first layer is close to the hardness of the first layer. The hardness of the second layer close to the outermost layer is close to the hardness of the outermost layer.

Abstract: A method for producing a turbine airfoil that is coated with a beta phase, high aluminum content coating, such as substantially stoichiometric NiAl, and which has a surface finish suitable for application of a ceramic topcoat. The method involves impacting the coating with preselected particles of a preselected size so that the brittle coating is not adversely affected by chipping or breakage. The impacting produces a surface finish of 120 micro-inches or better so that a ceramic thermal barrier layer can be applied over the coating. The preferred method of improving the surface finish utilizes steel balls having a diameter of about 0.033″ and a peening intensity of no greater than about 6A.

Abstract: The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit portion bonded to at least one main surface of the ceramic substrate; wherein each of ratios of Ra1/Ra2 and Ra2/Ra1 is 1.5 or less in which a surface roughness in terms of arithmetical average surface roughness Ra in arbitral one direction of the ceramic substrate is Ra1 while a surface roughness Ra in a direction normal to the one direction of the ceramic substrate is Ra2, and a breakdown voltage of the ceramic substrate is 20 kV/mm or more. According to the above structure of the present invention, there can be provided a ceramic circuit board having an excellent heat-cycle resistance and bending strength characteristics without impairing a heat radiating property, and capable of increasing an operating reliability as electronic device.

Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a release force for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. The metal foil layer may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent coating a side of the metal foil layer. The enhanced surface is subsequently bonded to a dielectric and the carrier layer then removed.