Abstract: An aluminum alloy article is cleaned to remove oxides and organic matter from a coatable surface, coated with a composition comprising an organic resin and a fluorine compound, and then heated to an elevated temperature to decompose the organic resin and at least a portion of the fluorine compound. After heating the coated surface is left with a protective oxyfluoride film that prevents blistering and hydrogen pickup and promotes hydrogen degassing from the article.

Abstract: The invention relates to a partition (1) or a method for producing a partition (1) for a multilayer pressed packet (3), wherein the partition (1) can be placed as a pressing sheet in the composite of a multilayer pressed packet (3) to be produced, especially between two multilayers (2).

Abstract: An improved method for plating an organic substrate with silver is disclosed. Improved plating is achieved in part through the use of Na4EDTA, which facilitates improved grain formation and recovery of silver from waste material. Articles prepared using the method of the invention are also disclosed.

Abstract: To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than −900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.

Abstract: The aim of the present invention is to provide a phosphate treated zinc coated steel sheet with excellent workability. A steel sheet coated with a zinc based alloy has a phosphate treated coating on the surface thereof. The phosphate treated coating comprises mainly granulated crystals, specifically, crystals in which the average ratio of the major axis to the minor axis is not less than 1.00 and not more than 2.90. Moreover, the method for producing the phosphate treated coating uses a phosphate treatment solution in which the amount of Mg ions is ≧6 g/l and the amount of Zn ions is ≧0.5 g/l, or a phosphate treatment solution in which the amount of Mg ions is ≧10 g/l, the amount of Zn ions is 0≦ and <0.5 g/l, and the amount of nitric acid ions is ≧40 g/l.

Abstract: A circuit board comprising a composite resin and a metal plate, the metal plate forming circuit patterns. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by weight of a resin composition including a thermosetting resin and a hardener. The metal plate is surface treated to reinforce the adhesion at least at one surface contacting with the composite resin. The composite resin fills spaces between the circuit patterns, and the composite resin composition and the metal plate form a plane at a side of the metal plate for mounting components. Since the resin composition including the inorganic filler is also present in the spaces between circuit patterns of a metal plate, heat dissipation characteristic of the circuit board is extremely high, and is suited for electronic apparatus containing heat generating parts such as power circuit.

Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Abstract: Disclosed are an insert of pour-around die casting, which is incorporated by an aluminum alloy die casting and has an organic film formed on the surface of the insert, wherein the organic film contains a higher fatty acid ester, a petroleum sulfonate and a mineral oil and has a thickness of from 0.5 to 2 &mgr;m, a rust preventive oil used therefor, and a method for incorporating the insert with an aluminum alloy die casting.

Abstract: A coating method according to the present invention includes a step of producing plural exterior members which constitute the outside portion of a vehicle body, and a step of forming and joining plural inside members which constitute the inside portion of the vehicle body, thereby producing a chassis. Each of the exterior members is a precoat metal sheet in which a rust-preventing layer and a coat which contains a lubricating component are formed on a surface of a metal sheet. Accordingly, the exterior members joined to the chassis need only intermediate coating and overcoating. The chassis constituent members are made of a precoat metal sheet in which a rust-preventing layer which contains a lubricating component is formed on a surface of a metal sheet. Accordingly, it is not necessary to carry out electrodeposition coating which is considered to be necessary for the chassis.

Abstract: A plated material having a substrate, and a plating formed on the substrate, or on an undercoating formed on the substrate further has a layer formed on the plating from an organic compound capable of combining chemically with a component of the plating, and a lubricating layer formed on the layer of an organic compound. The lubricating layer is substantially a fluid film of a high molecular compound.

Abstract: The invention relates to a coating system for the lubricant coating of components. The system includes an electrodeposited oxidatively pretreated zinc-nickel coating and a dry lubricant layer and offers considerably improved adhesive properties as well as greater corrosion resistance and resistance to chemicals.

Abstract: The present invention relates to a process for coating apparatuses and apparatus parts for chemical plant construction—which are taken to mean, for example, apparatus, tank and reactor walls, discharge devices, valves, pumps, filters, compressors, centrifuges, columns, dryers, comminution machines, internals, packing elements and mixing elements—wherein a metal layer or a metal/polymer dispersion layer is deposited in an electroless manner on the apparatus(es) or apparatus part(s) to be coated by bringing the parts into contact with a metal electrolyte solution which, in addition to the metal electrolyte, comprises a reducing agent and optionally the polymer or polymer mixture to be deposited in dispersed form, where at least one polymer is halogenated.

Abstract: The present invention is an input/output for a device and it method of fabrication. The input/output of the present invention comprises a bond pad having a ball limiting metallurgy (BLM) formed thereon and a bump formed on the ball limiting metallurgy (BLM). In an embodiment of the present invention the ball limiting metallurgy comprises a first film comprising nickel, vanadium, and nitrogen. In the second embodiment of the present invention the bump limiting metallurgy includes a first alloy film comprising a nickel-niobium alloy.

Abstract: Provided are a Zn—Mg electroplated metal sheet excellent in corrosion resistance, formability and productivity, and a fabrication process therefor. The Zn—Mg electroplated metal sheet comprises a Zn—Mg electroplated layer including Mg and Zn, the Zn being a main component, formed on at least one surface of a metal substrate material. The Zn—Mg electroplated layer shows more excellent corrosion resistance by including a C component therein. The Zn—Mg electroplated metal sheet can be fabricated by performing electroplating with an acidic aqueous solution including metal salts of Zn and Mg, and in addition, a surface active agent.

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an energy enhanced process to deposit a silicate containing coating or film upon a metallic or conductive surface.

Abstract: A color effect material is composed of a plurality of encapsulated substrate platelets in which each platelet is encapsulated with a first layer which acts as a reflector to light directed thereon, a visibly transparent second organic layer encapsulating the first layer in which the second layer provides an optically variable reflection of light impinging thereon and a third layer encapsulating the second layer and being selectively transparent to light directed thereon.

Abstract: An aluminum alloy brake disc body for a disc brake device is provided with a metal layer of a high wear-resistance. The high wear-resistance metal layer is configured to reduce thermal stresses within the aluminum alloy brake disc body so as to inhibit warping, bending or flexing of the brake disc when heated during braking. The high wear-resistant metal layer also is applied to the aluminum alloy brake disc body in a manner reducing manufacturing costs. In one mode, a plating layer made of a metal having a high wear-resistance is formed on a frictional surface of an aluminum alloy brake disc body. Cracks in the form of a fine network are formed in the whole area of the plating layer. The cracks can be formed by a plating process, by nitrosulphurization, by heating, by burnishing or by use of the plated component. The cracks advantageously provide for expansion between the individual metal fragments and, thus, create an expandable plated wear surface.

Abstract: A color effect material is composed of a plurality of encapsulated substrate platelets in which each platelet is encapsulated with a first layer which acts as a reflector to light directed thereon, a visibly transparent second organic layer encapsulating the first layer in which the second layer provides an optically variable reflection of light impinging thereon and a third layer encapsulating the second layer and being selectively transparent to light directed thereon.

Abstract: A method of making cookware and bakeware having a stick resistant and mar resistant cook surface comprising the steps of providing a cooking utensil having a cook surface, and cryogenically treating the cooking utensil at one or more selected temperatures comprising −100° F. to −300° F. or lower to harden said cook surface. The cooking utensil may have a bare metal cook surface, or it may be coated with a stick resistant coating such as one of a PTFE, metal nitride or sulfide coating or combinations thereof prior to the cryogenic hardening treatment.

Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Abstract: A lacquer-coated wire having a noncircular cross-section with a long cross-sectional axis and a short cross-sectional axis, wherein the long cross-sectional axis and the short cross-sectional axis extend perpendicularly to each other. The lacquer-coated wire includes a metal wire and a lacquer coating having insulating and baked lacquer properties and is intended particularly for manufacturing electrical coils. The lacquer coating has on sides to be assigned to the longer cross-sectional axis a smaller thickness than on the sides to be assigned to the shorter cross-sectional axis. A method of manufacturing a wire includes pressing a lacquer-coated wire having a round cross-section into a wire having a long cross-sectional axis and a short cross-sectional axis, wherein the ratio of the axes is at most 3:1.

Abstract: A metallic object, having a metallic substrate of a valve metal or a valve metal alloy inclusive of intermetallic phases, and a thin polyphase oxide coating, is disclosed. The polyphase oxide coating has a metal oxide phase and at least one other organic and/or inorganic phase. The polyphase oxide coating is produced by bringing the metallic substrate into contact with an organic and/or inorganic component to be integrated into the polyphase oxide coating such that the inorganic and/or organic phases are present at or in the direct vicinity of the substrate surface and by simultaneously or subsequently anodically polarizing the substrate material in an electrolytic solution.

Abstract: An electromagnetic wave absorbing sheet S is disclosed. The absorbing sheet S includes a laminated-structural layer of a nonwoven fabric sheet 10 and a metallic layer 22 such as iron, aluminums, copper or their alloy which is disposed on a bottom surface of the metallic layer 22. The nonwoven fabric sheet 10 includes non-metallic fibers 16 having no binding faculty, non-metallic binding fibers 14 having binding faculty which are melted by heat to bind neighboring fibers, and metallic fibers 12 having an irregular cross-section and being produced by shaving a metallic wire or rod, that are dispersed uniformly in the nonwoven fiber layer or layers.

Abstract: A coating material used in the fabrication of electronic components such as a metallized paste is provided comprising a material to be coated on the electronic component substrate and an identifying component which identifying component can be identified and which identifying component identifies the coating material. Optical dyes visible to the eye can be used as the identifying component with a preferred dye being a UV fluorescent dye which is colorless under visible light and visible under UV light. A process for making an electronic component using the coating materials of the invention and electronic components made using the coating material are also provided.

Abstract: The present invention is an input/output for a device and it method of fabrication. The input/output of the present invention comprises a bond pad having a ball limiting metallurgy (BLM) formed thereon and a bump formed on the ball limiting metallurgy (BLM). In an embodiment of the present invention the ball limiting metallurgy comprises a first film comprising nickel, vanadium, and nitrogen. In the second embodiment of the present invention the bump limiting metallurgy includes a first alloy film comprising a nickel-niobium alloy.

Abstract: The object of the invention is to provide a reflector in which a reduction in high reflection factor of Ag is restricted, a stable wheatherability can be attained in a continuous manner even if it is exposed in a severe environment of high temperature and high humidity and further a high practical effect with the connecting characteristic being effectively enforced can be attained and also a high reliability is provided. The alloy reflective film made of AgPdCu alloy or AgPdTi alloy with Ag being applied as major component, with Pd being added in a range of 0.5 to 3.0 wt %, with either Cu or Ti, for example, in Al, Au, Pt, Cu, Ta, Cr, Ti, Ni, Co, Si as the third element being added in a range of 0.1 to 3.0 wt % is formed on the substrate in a predetermined film thickness (nm). As its pre-treatment, the organic ground film is applied on the substrate and the reflective film is formed on the film to enforce effectively the connecting characteristic.

Abstract: A process for coating a reactor, which comprises depositing a metal layer or a metal/polymer dispersion layer on the internal surface of the reactor in an electroless manner by bringing the surfaces into contact with a metal electrolyte solution which, besides the metal electrolyte, comprises a reducing agent and optionally a halogenated polymer to be deposited in dispersed form.

Abstract: The present invention relates to a coating composition containing 8 to 130 parts by weight of (B) silica fine particles having an oil absorption in the range of 30 to 200 ml/100 g and a pore volume in the range of 0.05 to 1.2 ml/g per 100 parts by weight of (A) a coating film-forming resin, a cured coating film formed from the coating composition having a glass transition temperature in the range of 40 to 125° C.; and a coated metal plate having a coating film formed from the above coating composition on the surface of a metal plate.

Abstract: After forming a first insulating film with a relatively low dielectric constant and low mechanical strength on a semiconductor substrate, a mask pattern is formed on a desired region of the first insulating film. Then, the first insulating film is patterned by conducting selective etching using the mask pattern. After forming a second insulating film with a relatively high dielectric constant and high mechanical strength on the semiconductor substrate, the second insulating film is planarized by polishing, so as to expose a face of the patterned first insulating film. An interconnect groove is formed in the patterned first insulating film, and a buried interconnect is formed in the interconnect groove.

Abstract: An electrostatic self-assembly method of fabricating electrostrictive and piezoelectric thin film assemblies not only provides a thinner film than is attainable by conventional methods, but provides excellent molecular-level uniformity and precise structural control, and thus large, effective piezoelectric coefficients. The method produces a thin film assembly including (a) a substrate, and (b) a film having one or a plurality of layers disposed upon the substrate, wherein at least one of the layers includes a dipolar material, and this layer of dipolar material has a uniform thickness of at most 500 nm.

Abstract: Identification markers and identification methods for solid objects, including metallic objects, are disclosed, the marker integrated with the object so that it is neither optically visible nor removable without destruction or impairment of the object. The marker is more radio opaque than the base material forming the object in the region of marker location and includes an identifying indicia thereon.

Abstract: A chromium-free agent for treating metallic surface comprising the following (i)-(iv):

Abstract: A base member made of a metal in which aluminum is included, ceramics in which an aluminum element is included, or a composition member constructed by a metal in which aluminum and ceramics are included, is provided in a container in which a solid fluorine compound such as NaHF2 is filled. Then, the container is heated at a temperature higher than a decomposition temperature of the solid fluorine compound. After that, the base member is subjected to a heat treatment with the decomposed gas of the solid fluorine compound to form a fluoride layer on a surface of the base member. In this manner, it is possible to obtain an anti-corrosion member which shows a high corrosion property with respect to the corrosion gas of halogen series and its plasma, particularly with respect to chlorine gas and its plasma.

Abstract: The present invention provides a multi-component multi-phase type polymeric shaped material in which a plurality of hole- or electron-conducting phases constitute a three-dimensional bicontinuous nano phase separation structure, and a functional device using the same. Such a functional device is quick in response and good in durability. The present invention also relates to a functional device comprising a laminated structure composed of a plurality of layers laminated, and at least one pair of electrodes that penetrate the interface between two layers laminated.

Abstract: An improved via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred.

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.

Abstract: A welding wire of the type consists of a plated or uncovered solid wire and a flux-cored wire for carbon steel or stainless steel, wherein one or more of hydrocarbon compounds selected from the group consisting of saturated or unsaturated hydrocarbon compounds, which have from 5 to 12 carbon atoms and a linear or branched structure, and hydrocarbon compounds having a cyclic structure are deposited on a wire surface. A lubricating oil and/or lubricating particles are chemically combined with a wire surface through the one or more hydrocarbon compounds. The total amount of the hydrocarbon compounds, and a lubricating oil and/or lubricating particles deposited on the wire surface is in the range of 0.1 to 5 g per 10 kg of the wire.

Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.

Abstract: A copper foil having improved resistance to abrasion damage during the manufacture of printed circuit boards has a uniform deposit of benzotriazole (BTA) or BTA derivative, optionally a mixture thereof, of at least about 5 mg/m2.

Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Abstract: One embodiment of the invention involves a refractory layer formed over a substrate during rapid thermal processing in which ambient hydrogen is used in a thermal processing chamber. Rapid thermal processing may occur at a temperature approximately in the range of 350° C. to approximately 550° C.

Abstract: A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C14H30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning. An excellent electrical joint which is moisture-resistant as well as highly reliable is attained.

Abstract: A method for forming a sol-gel on a metal surface to provide an interface for promoting adhesion between the metal surface and an organic resin involves application of at least one metal alkoxide compound having at least one labile sulfur atom, and at least one metal alkoxide compound having at least one reactive moiety which is capable of bonding with an organic resin. The metal alkoxide compound having at least one labile sulfur atom is capable of bonding to various metal surfaces, including surfaces of noble metals, such as gold, by a sulfur-metal linkage with the metal surface. The metal alkoxide compound having at least one labile sulfur atom reacts with the metal alkoxide compound having at least one reactive moiety which is capable of bonding with the organic resin to form a sol-gel which bonds to the surface of the metal, and which includes reactive moieties which are capable of bonding with an organic resin.

Abstract: A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.

Abstract: A protective coat formed by thermal spraying, and having an outstanding durability against corrosion by a molten light alloy. A thermal spraying composite material used to form such a coat contains from about 30 to about 70% by weight of molybdenum boride, from about 20 to about 40% by weight of nickel or cobalt, from about 5 to about 20% by weight of chromium, and from about 5 to about 10% by weight of at least one metal boride selected from the borides of Cr, W, Zr, Ni and Nb.

Abstract: A soldered product having secure reliable joints, without the use of flux, is disclosed. The soldered product includes a first member having a connected portion and a second member, also having a connected portion, facing the first member. The connected portions of the first and second members are electrically connected by a connecting material. A layer of hydrocarbon, including alkane, alkene or alkyne, is disposed around the periphery of the connecting material.

Abstract: A coating material used in the fabrication of electronic components such as a metallized paste is provided comprising a material to be coated on the electronic component substrate and an identifying component which identifying component can be identified and which identifying component identifies the coating material. Optical dyes visible to the eye can be used as the identifying component with a preferred dye being a UV fluorescent dye which is colorless under visible light and visible under UV light. A process for making an electronic component using the coating materials of the invention and electronic components made using the coating material are also provided.

Abstract: Disclosed is a method for the formation of a silica coating film having a remarkably high crack-forming thickness limit on the surface of a substrate which may be highly heat resistant, for example, having a circuit wiring layer of polycrystalline silicon to withstand a temperature higher than 500° C. without excessive diffusion of dopant through the source layer or drain layer of the semiconductor device. The method comprises the steps of: coating the substrate surface with a coating solution containing a modified polysilazane which is a reaction product of a polysilazane and a dialkyl alkanol amine, drying the coating layer, subjecting the coating layer to a first baking treatment at 350-450° C. for 10-60 minutes and subjecting the layer to a second baking treatment at 550-800° C. for 0.5-60 minutes.

Abstract: This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

Abstract: A tagging material comprises a pressure sensitive adhesive tape incorporating electromagnetic sensor material whose presence can be detected. Tags are cut from the tagging material as the tagging material and articles are conveyed along converging paths and are adhered to the articles by the adhesive of the tape by means of apparatus comprising a tagging material feeding means and an applicator head.