Abstract: “Corrosion” performance of an optical filter is enhanced when a relatively thick zinc-based film functions as a seed layer for a subsequently formed silver-based film. At least two pairs of dielectric and metallic layers are included within the optical filter, where the zinc-based film is a second film of the dielectric layer and where the silver-based film is the metallic layer. The zinc-based film has a zinc content of at least 80 percent and has a thickness of at least 15 nm. In order to further improve the corrosion performance, gold may be incorporated into the silver-based film.

Abstract: Porous titanium having a low contact resistance includes porous titanium body, Au, and Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au cords (5) of the Au network sticking. The width of an Au cord (5) of the Au network is 0.3 to 10 ?m at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au cords (5) of the Au network is 30 to 150 nm.

Abstract: A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable.

Abstract: Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.

Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.

Abstract: In particular embodiments, the present disclosure provides targets including a metal layer and defining a hollow inner surface. The hollow inner surface has an internal apex. The distance between at least two opposing points of the internal apex is less than about 15 ?m. In particular examples, the distance is less than about lam. Particular implementations of the targets are free standing. The targets have a number of disclosed shaped, including cones, pyramids, hemispheres, and capped structures. The present disclosure also provides arrays of such targets. Also provided are methods of forming targets, such as the disclosed targets, using lithographic techniques, such as photolithographic techniques. In particular examples, a target mold is formed from a silicon wafer and then one or more sides of the mold are coated with a target material, such as one or more metals.

Abstract: A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

Abstract: A flexible thin metal film thermal sensing system is provided. A self-metallized polymeric film has a polymeric film region and a metal surface disposed thereon. A layer of electrically-conductive metal is deposited directly onto the self-metallized polymeric film's metal surface. Coupled to at least one of the metal surface and the layer of electrically-conductive metal is a device/system for measuring an electrical characteristic associated therewith as an indication of temperature.

Abstract: An electrical contact component includes a base defining an external terminal to be mounted on a surface of a wiring board with a solder and a fitting portion having a substantially tubular shaped fitting periphery. The external terminal has a first principal surface opposing the surface of the wiring board, a second principal surface substantially parallel to the first principal surface, and sides substantially perpendicular to the first and second principal surfaces and connecting the first principal surface to the second principal surface. The fitting portion is continuously provided on the second principal surface. The fitting periphery of the fitting portion is electrically connected to the second principal surface and the sides of the external terminal by metal layers formed over their respective surfaces. The metal layer contains Ni as a principal constituent and Co, and the metal layer contains Au as a principal constituent.

Abstract: A method for preparing a catalyst comprising the steps of: providing a gold-silver alloy article, removing the silver from the article by immersing the article in a de-alloying solution to form a nanoporous gold (NPG) article with a plurality of nanopores followed by cleaning the surface of the NPG article and removing the de-alloying solution from the nanopores with deionized water. An electrode is attached to the NPG article and a monoatomic layer/lower layer of copper, silver, or lead, is deposited onto the surface of and within the nanopores of the NPG article by immersing the NPG article in an ion solution to form an M-NPG article. The M-NPG article is removed from the ion solution and the monoatomic/lower layer is replaced with platinum ions by immersing the M-NPG article into a platinum ion solution followed by cleaning the electrode and the NPG-Pt article with deionized water.

Abstract: The present invention provides personal ornaments having as an outermost layer a white ornamental coating film having platinum or a platinum alloy formed by dry-plating, including: an ornament base article made of a metal or ceramic, an underlayer formed on the surface on the base article, an abrasion resistant layer formed on the surface of the underlayer by dry-plating, and an ornamental coating layer having platinum or platinum alloy formed on the surface of the abrasion resistant layer by dry-plating. Also, the present invention provides personal ornaments having a coloring layer including an abrasion-resistant layer, a mixture layer and an outermost layer, the outermost layer being a white hard coating film having a noble metal or a noble metal alloy formed by dry-plating on the surface of the mixture layer.

Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film including at least one hole. The insulating film further includes a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer and a second metal layer that is positioned on the first surface and at least one of the second and third surfaces. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

Abstract: An Au plated film 12 is formed on the surface of a plate-formed metal base 13 composed of a metal less noble than Au, and the product is cut along a planned cutting line 18 reflecting a contour of a desired component, to thereby form a separator 10. Thus-formed separator 10 has the Au plated film 12 formed on the main surface 10a thereof, and has a cutting plane 16 formed as an end face 16 stretched up to the main surface 10a. The metal base 13 exposes in a part of the cutting plane 16, in a width of the exposed region of 1 mm or less. This is successful in providing a metal component for fuel cell which is satisfactory in the corrosion resistance and allows easy fabrication at low costs, a method of manufacturing the same, and also in providing a fuel cell having thus-fabricated metal component for fuel cell.

Abstract: A copper-based deposited alloy strip for a contact material has a maximum value of a difference not larger than 100 MPa among three of tensile strengths, that are a tensile strength in a rolling direction thereof, a tensile strength in a direction crossing the rolling direction with an angle of 45 degrees, and a tensile strength in a direction crossing the rolling direction with an angle of 90 degrees. A process for producing the copper-based deposited alloy strip for a contact material includes the steps of: performing a solution heated treatment on a copper alloy strip; and performing an aging heat treatment on the copper alloy strip.

Abstract: A manufacturing method for a composite metal wire used as semiconductor packaging wire and products thereof. Au, Ag and Cu materials are melted in a vacuum melting furnace, and then trace metal elements are added into the vacuum melting furnace and melted together with Au, Ag and Cu materials to obtain a composite material. The obtained composite material is drawn by a fist thick drawing machine, a second thick drawing machine and a first thin drawing machine to obtain a composite metal wire with a predetermined diameter. An Au layer is electroplated to the surface of the composite metal wire. The composite metal wire with Au layer is then drawn by a thin drawing machine, a very thin drawing machine and an ultra thin drawing machine to obtain an ultra thin composite metal wire with a predetermined diameter. Finally, the surface of the composite metal wire is washed and the composite metal wire is heat treated to ensure a final product with desirable physical properties, e.g. breaking load and elongation.

Abstract: A multi-layered article includes first and second external layers of soft electroplated gold material. An intermediate layer of hard electroplated gold material is arranged between the first and second external layers. Each of the layers has a substantially uniform thickness.

Abstract: A method of forming a structure useful in all forms of deposited metals, elemental metals, metal alloys, metal compounds, metal systems, including refractory metals such as tungsten and tantalum is provided. The structure generally comprises a substrate, a first layer formed atop the substrate, and a second layer formed atop the first layer. The first layer comprises a metal, which can be chromium, gold, platinum, aluminum, nickel, or copper. The second layer comprises a metal, elemental metal, metal alloy, metal compound, or metal system comprising a refractory metal such as tungsten or tantalum. The substrate can be a silicon, quartz or glass, metal, metal oxide or nitride.

Abstract: A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystallite size is selectively exposed by a window (110) in the insulating overcoat. A second copper layer (105) of second thickness covers conformably the exposed first copper layer. The second layer is deposited by an electroless process and consists of a transition zone, adjoining the first layer and having copper crystallites of a second size, and a main zone having crystallites of the first size. The distance a void can migrate from the second layer is smaller than the combined thicknesses of the first and second layers. A nickel layer (106) is on the second copper layer, and a noble metal layer (107) is on the nickel layer.

Abstract: A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected composition and compatibility with stainless steel; heating the stainless steel components and brazing alloy for a controlled time to a liquidus temperature to effect brazing; cooling the stainless steel components and brazing alloy to a quench temperature substantially lower than the liquidus temperature of the brazing alloy to provide a tensile strength of greater than about 20 Ksi in the brazing alloy; and quenching the assembly from the quench temperature to a temperature of less than about 400° F. in a given time to provide a brazed assembly free of distortion and cracks with desired mechanical properties in the stainless steel components by virtue of the thermal treatment.

Abstract: A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of Ni or a Ni alloy on a base metal layer formed of a metal, forming a Pd plating layer formed of Pd or an Pd alloy on the Ni plating layer, heat-treating the Ni plating layer and the Pd plating layer, and forming a protective plating layer on the heat-treated Pd plating layer.

Abstract: An object of the present invention is to provide a joined structure effective for preventing crack formation after thermal cycles. The joined structure has a ceramic member 1, a metal member 4 to be joined, and a metal fixed member 3 fixed to the ceramic member 1 and having an exposed face 3b exposed along the joining face 1d of the ceramic member 1. A joining layer 7 is provided between the ceramic member 1 and the metal member 4 and between the exposed face 3b of the fixed member 3 and the metal member 4. The joining layer 7 has thicker and thinner portions 7a and 7b. Alternatively, the joining layer 7 has a maximum thickness of 0.15 mm or more.

Abstract: A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a magnetically soft underlayer: (1) a first crystalline layer of a material having a first lattice parameter and a strong preferred growth orientation; (2) a second crystalline layer of a material having a second lattice parameter and the same strong preferred growth orientation as the first crystalline layer; and (3) a third crystalline layer of an hcp material, having a [0002] lattice parameter similar to or different from that of the second lattice parameter of the second crystalline layer and a strong <0002> preferred growth orientation, wherein: the second crystalline layer has a lower interfacial energy with the first crystalline layer and a higher interfacial energy with the third crystalline layer, owing to a lower surface energy of th

Abstract: There is provided a metal member capable of realizing a corrosion resistance and wear resistance, which are equivalent to or better than those when expensive PdNi is used even if PdNi is not used, and of being produced at relatively low costs. A first layer essentially consisting of nickel and unavoidable impurities is formed on the surface of a base metal member. On the first layer, a second layer essentially consisting of nickel, phosphorus and unavoidable impurities is formed. On the second layer, a third layer essentially consisting of a noble metal or an alloy thereof is formed. The second layer contains 10 to 15 wt % of phosphorus. The thickness of the first layer is 3 ?m or more, and the thickness of the second layer is 0.1 ?m or more.

Abstract: A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the crystalline layers of the pair with a stronger out-of-plane preferred growth orientation than if each of the pair of crystalline layers are in overlying contact. Disclosed and preferred embodiments include perpendicular magnetic recording media comprising the multiple layer structure as an intermediate layer structure beneath a perpendicular magnetic recording layer for strengthening a preferred out-of-plane growth orientation of the latter.

Abstract: An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc discharge wherein a voltage between the arc-resistant terminal and a second terminal immediately after separation thereof is DC36V to 60V and a current between terminals during contact is 6A to 30A. In another embodiment, the an electrical contact portion comprising at least 80 mass % of metal having a boiling point of not less than 1000 degrees centigrade. According to the present invention, since the electrical contact portion or the final contact portion of the terminal includes a specific metal-based material, even when the voltage applied between the terminals is increased and an arc discharge is liable to be generated, the arc discharge can be suppressed.

Abstract: The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the Y-type hexagonal ferrite thin film, comprising the steps of preparing a viscous solution containing a metal-organic complex which is formed using a primary component including a Fe+3 ion, and a secondary component including a Ba2+ ion, at least one transition metal ion selected from the group consisting of Fe2+, Co2+, Ni2+, Zn2+, Cu2+ and Mn2+; and optionally at least one metal ion selected from the group consisting of Sr2+, Ca2+ and Pb2+, forming a film having a Y-type ferrite composition on a surface made of noble metal through a coating process using the viscous solution, and burning the film at a temperature of 750° C. or more.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A layer system in particular for tools or machine components operated under insufficient lubrication or under dry operation conditions, is proposed, which system, starting from the base body, comprises a hard substance layer system, subsequently a metallic layer and finally a slide layer system, the last mentioned preferably made of Carbide, in particular of Tungstencarbide or Chromiumcarbide and dispersed Carbon.

Abstract: A process for producing a noble-metal type fine-particle dispersions, having the steps of an agglomeration step of adding a hydrazine solution to a dispersion in which primary particles of noble-metal type fine particles have been made to stand monodisperse in a solvent, to destabilize the dispersibility of the noble-metal type fine particles in the dispersion and cause the plurality of primary particles in the noble-metal type fine particles to agglomerate in the form of chains to obtain a dispersion of chainlike agglomerates; and a stabilization step of adding a hydrogen peroxide solution to the dispersion of the chainlike agglomerates obtained, to decompose and remove the hydrazine to stabilize the dispersibility of the chainlike agglomerates in the dispersion.

Abstract: A separator for a fuel cell includes a gold covering layer formed on the surface of stainless steel plate. A method for producing a separator, prevents exfoliation and fracture of the gold covering layer but obtains corrosion resistance and durability. Voids are formed by intergranular corrosion treatment at a surface of the stainless steel plate, and the gold covering layer is formed so as to be embedded in the voids. Limit value of radius of curvature in bends in which exfoliations or fractures in the gold covering layer is formed can be reduced by satisfying the equation 0.2?4/d/L?80 wherein L(?m) is the average grain size of the surface of stainless steel plate, and d(?m) is the thickness of the gold covering layer.

Abstract: An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting an even plated appearance and also having a thick gold coating film.

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: A method for preventing contamination, oxidation and gas absorption of reactive materials, and articles formed thereby. The method generally entails depositing a first layer of a reactive material and a second layer of a substantially nonreactive material so that the second layer protects the first layer from a surrounding atmosphere. For example, the first and second layers may be deposited to form a film on a surface within a chamber that is desired to be maintained in a vacuum during use of the article. The second layer is sufficiently thin such that appropriately heating the first and second layers causes the reactive material of the first layer to become interdiffused with the nonreactive material of the second layer, to the extent that at least a portion of the reactive material is able to react and getter gases from the surrounding atmosphere.

Abstract: A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the active metal and the soldering material are heated so as to form a precoat layer. The metal member is placed on the surface of the precoat layer via a barrier layer, which is capable of inhibiting diffusion of a metal constituting the metal member, and the precoat layer and the metal member are pressurized heated so as to be solid-phase bonded. The production method of the bonded member is also disclosed.

Abstract: A low cost, durable mask for use in structuring anodically bondable glass materials and other structurable glass materials.

Abstract: There is provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably for any use of contact, sliding, fitting-in or ornament, and a method for manufacturing the same. The surface treatment structure 1 having a plating layer formed on the surface of a substrate 2 comprises a lubrication plating layer 5 made of a plating layer of a metal matrix containing fine particles 4 having lubricating property, and a noble metal plating layer 7 formed on the lubrication plating layer 5. Preferably, an anti-diffusive plating layer 3 made of a metal plating layer is formed under the lubrication plating layer 5, and a joining layer 6 made of a strike plating layer of noble metal is formed between the lubrication plating layer 5 and the noble metal plating layer 7.

Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract: A nickel-gold plating exhibiting high resistance to corrosion, which has a nickel plating layer formed on a base metal (1) and a gold plating layer (3) formed thereon, characterized in that the nickel plating layer (2) has a corrosion potential being brought close to that of the gold plating layer (3) through the reduction of the sulfur content of the nickel plating layer; or which has a first nickel plating layer (6) formed on a base metal, a second nickel plating layer (7) formed on the first nickel plating layer and a gold plating layer formed thereon, characterized in that the first nickel plating layer has a corrosion potential nobler (higher) than that of the second nickel plating layer.

Abstract: A thin film based nanoporous alumina template has been developed which allows the in situ removal of an electrically insulating alumina barrier layer at the pore bases. This barrier free nanoporous system has great utility for electrodeposition of a wide variety of nanowire materials. An exemplary multilayer thin film precursor is provided comprising Al (anodization layer), Ti (diffusion barrier) and Pt (active electrode) on a Si substrate. Aluminum anodization in sulfuric acid with a subsequent applied voltage ramping program produces a Pt electrode at the base of the nanopores without the additional steps of alumina removal, barrier layer dissolution, and metal deposition onto the pore bottoms.

Abstract: An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

Abstract: A method for using a novel ternary nickel-gold-phosphorus brazing alloy for joining nickel-based components together and the assembly so formed.

Abstract: A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (3) a molecular layer comprising at least one molecule having a hydrophilic region and a hydrophobic region, wherein the hydrophilic region at least partially extends into the partially-filled aperture. Also, provided are coated metallic meshes having bilayers and a method of providing a molecular layer to a coated mesh.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: Gold is coated on a surface of a stainless steel plate containing an intermetallic compound forming element which forms an intermetallic compound by reacting with gold, and then the entirety is heated to form an intermetallic compound layer comprising the intermetallic compound at the interface between the stainless steel plate and the gold coated layer. In this way, exfoliation of the gold coated layer which is arranged on the surface of the stainless steel plate to obtain extremely high corrosion resistance can be prevented for a long time, and thus great durability can be maintained.

Abstract: An electrically conductive metal element comprises an electrically conductive metal substrate having a layer of Ni—Sn alloy overlying an electrically conductive surface of the substrate and at least one layer of Ag or of Ag containing Sn overlying the Ni—Sn alloy layer. The Ni—Sn alloy(s) has a Sn-content not greater than for Ni3Sn2 for high temperature uses. In a convenient method of forming the element the Sn is applied to one or more layers of Ni in a Ag+Sn mixture and diffused into the Ni layer(s) to form the Ni—Sn alloy layer and at least one layer of Ag or of Ag containing Sn. The element may have a surface layer of SnO2 which can be formed by oxidizing residual Sn which migrates to the outer surface of the at least one layer of Ag containing Sn.

Abstract: A multicolored piece of jewelry is formed by producing a core made of precious metal having a first shade or color and adding a first layer having a different shade or color. The first layer is either applied only partially to the core, or, more preferably, it is added over the whole surface of the core and then is partially removed using a known abrasion technique. Next, a second layer is deposited on the core, preferably over the second layer. The core and the two layers can be made of gold alloys of different shades, or the third layer could be highly reflective metal such as rhodium.

Abstract: A nickel base single crystal compliant layer on a ceramic blade has the capability to sustain high stresses and high operating temperature. Layers of nickel and platinum bonded on a single crystal superalloy over a sputtered gold-chromium layer support the high stress levels at elevated temperature without extrusion of the soft platinum or nickel layer and without destruction of an NiO compliant surface. The compliant layers have survived stress and temperature conditions without failure to the ceramic blade and the system can be stressed/heated and unloaded/cooled repeatedly without damage to the ceramic blades. A single crystal nickel base superalloy (i.e., SC180) has high strength properties at elevated temperature. Thin layers of chromium followed by gold are e-beam evaporated on one side of a polished surface of the alloy. Pure nickel is electroplated over this e-beam gold-chromium layer. Platinum is either electroplated or plated electrolessly over the nickel layer.

Abstract: A surface structure of a metallic body capable of properly maintaining the surface state of a gold layer by preventing diffusion of nickel under conditions of high temperature is provided. In the surface structure of a metallic body of a metal substrate plated with gold, the surface structure includes a nickel layer formed on the surface of the substrate, a barrier layer formed from one or more elements selected from Group 8A of the periodic table formed on the surface of the nickel layer, and a gold layer formed on the surface of the barrier layer.

Abstract: An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au5Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.

Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.