Abstract: A semiconductor assembly includes a substrate including a metal die attach surface, a semiconductor die that is arranged on the substrate, the semiconductor die being configured as a power semiconductor device and comprising a semiconductor body, a rear side metallization, and a front side layer stack, the front side layer stack comprising a front side metallization and a contaminant protection layer that is between the front side metallization and the semiconductor body, and a diffusion soldered joint between the metal die attach surface and the rear side metallization, the diffusion soldered joint comprising one or more intermetallic phases throughout the diffusion soldered joint, wherein the contaminant protection layer is configured to prevent transmission of contaminants into the semiconductor body.

Abstract: A timepiece component includes a base member, a first layer provided at the base member, and a second layer provided at the first layer. The second layer has lower hardness than the first layer.

Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.

Abstract: A disc cutter for a cutting unit used in an undercutting operation and a method of producing the same. The disc cutter including an annular disc body made of a metal alloy or metal matrix composite having a first side, a second side arranged substantially opposite to the first side and a radially peripheral part. At least one metal alloy, metal matrix composite or cemented carbide cutting part is mounted in and substantially encircling the radially peripheral part of the disc body which protrudes outwardly therefrom to engage with the rock during the mining operation. The at least one cutting part is made from a material having a higher wear resistance than the material used for the disc body, wherein the disc body and the cutting part are joined by diffusion bonds.

Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Abstract: Second member 20 includes a material that is difficult to weld to first member 10. In first member 10, recess 11 is formed by press molding such that a lower surface of first member 10 opposite to second member 20 protrudes. Third member 30 is arc-welded toward at least a bottom of recess 11 via penetrating part 21 of second member 20. Second member 20 is compressed by flange 31 and first member 10 by solidification contraction of third member 30, and second member 20 is therefore fixed between flange 31 of third member 30 and first member 10.

Abstract: Provided is a beryllium copper alloy bonded body including a first member made of a beryllium copper alloy and a second member made of a beryllium copper alloy, wherein the first member and the second member are bonded to each other via the nickel layer having a thickness of 8 ?m or less.

Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Abstract: A coated metallic substrate including at least a first coating of aluminum, such first coating having a thickness below 5 ?m and being directly topped by a second coating including from 0.5 to 5.9% by weight of magnesium, the balance being zinc.

Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

Abstract: A sliding element for an internal combustion engine may include a base material having an annular external surface. The external surface may include a bonding layer, a first layer of coating, and a second layer of coating sequentially disposed thereon. The first layer of coating and the second layer of coating may include hard amorphous carbon (DLC) of a combined matrix having a plurality of sp3/sp2 bonds. The first layer of coating may include 45% sp3 bonds or less and may have a thickness of at least 10 micrometers. The second layer of coating may include at least 55% sp3 bonds and may have a thickness of at least 3 micrometers.

Abstract: A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.

Abstract: A method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of (i) providing a substrate comprising the surface, (ii) providing an aqueous passivation solution comprising trivalent chromium ions, and one or more than one species of carboxylic acid residue anions, (iii) contacting the substrate with the passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto the surface, wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.

Abstract: An electrical conductor, in particular a flat conductor, comprising at least one through opening, and a contact part connected to the conductor at the through opening in a substance-to-substance bond, the contact part having an axially extending first section and a radially extending second section, characterized in that the second section is formed as a flange and a side of the flange facing the conductor has a surface having at least one recess and/or at least one protrusion and a surface welded to the conductor.

Abstract: Provided is a functional building material for a door and a window, comprising a transparent substrate and a low-emissivity coating formed on one surface of the transparent substrate, wherein the low-emissivity coating comprises a first dielectric layer, a second dielectric layer, a third dielectric layer, a first low-emissivity protection layer, a low-emissivity layer, a second low-emissivity protection layer, a fourth dielectric layer, a fifth dielectric layer and a sixth dielectric layer which are stacked sequentially from the transparent substrate, wherein the refractive index of the first dielectric layer and the refractive index of the third dielectric layer are each lower than the refractive index of the second dielectric layer, and the refractive index of the fourth dielectric layer and the refractive index of the sixth dielectric layer are each lower than the refractive index of the fifth dielectric layer.

Abstract: A method for fabricating a hyperbolic metamaterial coating having a near-zero refractive index is disclosed. The direction of propagating light changes by means of generating subwavelength structures that alter the coatings permittivity and permeability. The coating can be deposited on lenses or incorporated into optical devices. This type of metamaterial can be utilized to direct light towards sensors or to collect light efficiently.

Abstract: A terminal includes a connection part electrically connectable to a mating terminal, and a crimp part capable of crimping a cable. The connection part includes a first base having electrical conductivity, and a first plating layer that covers the first base, has a Vickers hardness of 250 Hv or more, and contains silver alloy containing silver. The crimp part includes a second base having electrical conductivity, and a second plating layer that covers the second base, has a Vickers hardness of less than 225 Hv, and contains either silver or silver alloy containing silver.

Abstract: A silver-plated product, wherein the preferred orientation plane of a surface layer of silver is {111} plane and wherein the ratio of the full-width at half maximum of an X-ray diffraction peak on {111} plane after heating the silver-plated product at 50° C. for 168 hours to the full-width at half maximum of an X-ray diffraction peak on {111} plane before the heating of the silver-plated product is not less than 0.5, is produced by forming the surface layer on a base material by electroplating at a liquid temperature of 12 to 24° C. and a current density of 3 to 8 A/dm2 in a silver plating solution which contains 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium, so as to cause the product of the concentration of potassium cyanide and the current density to be 840 g·A/L·dm2 or less.

Abstract: A multifunctional coating method involves cleaning a surface, applying a layer of corrosion-resistant alloy coating to the surface, and applying an oleo-hydrophobic composite coating over the corrosion-resistant alloy coating. An oil and gas pipe has an inner surface with a multifunctional coating applied using the multifunctional coating method, and has an inner oleo-hydrophobic composite coating, beneath the inner oleo-hydrophobic composite coating a corrosion-resistant alloy coating, and beneath the corrosion-resistant alloy coating untreated pipe or any other metallic substrate.

Abstract: A nickel-free white CuZn alloy. The alloy includes the following alloying elements: from 63.0 to 67.0% of Cu, from 0.01 to 0.15% of Pb, from 0.01 to 0.2% of Fe, from 1.3 to 2.5% of Al, from 12.0 to 15.0% of Mn, a balance of Zn, and unavoidable impurities.

Abstract: It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

Abstract: There is provided a silver-plated product wherein a silver plating film having a thickness of not greater than 10 micrometers is formed on a base material of copper or a copper alloy and wherein the surface of the silver plating film has an arithmetic average roughness Ra of not greater than 0.1 micrometers, and the silver plating film has a {111} orientation ratio of not less than 35%.

Abstract: The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness.

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core.

Abstract: The present invention relates to a novel method for producing metallic semifinished products by extrusion, to the thus obtainable semifinished products and to contact pieces that can be produced therefrom.

Abstract: A cold spray barrier coated component of a semiconductor plasma processing chamber comprises a substrate having at least one metal surface wherein a portion of the metal surface is configured to form an electrical contact. A cold spray barrier coating is formed from a thermally and electrically conductive material on at least the metal surface configured to form the electrical contact of the substrate. Further, the cold spray barrier coating may also be located on a plasma exposed and/or process gas exposed surface of the component.

Abstract: The subject of the invention is a process for obtaining a material comprising a substrate coated on at least one portion of at least one of its faces with a stack of thin layers comprising at least one silver layer, said process comprising a step of depositing said stack then a heat treatment step, said heat treatment being carried out by irradiating at least one portion of the surface of said stack using at least one incoherent light source for an irradiation time ranging from 0.1 millisecond to 100 seconds, so that the sheet resistance and/or the emissivity of said stack is reduced by at least 5% in relative terms, the or each silver layer remaining continuous at the end of the treatment.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating light-stabilizers and/or oxygen barriers.

Abstract: An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.

Abstract: The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.

Abstract: The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Abstract: The invention discloses a semi-finished product for making plug-in contacts in plug-in connectors for electric DC power systems in motor vehicles which are operated at a nominal voltage at which electric arcing may occur, having an electrically conductive main body made of a non-precious metallic material that carries, at least in part, a contact-making coating of a material more precious than the material of the main body. It is provided according to the invention that the coating has thickness of at least 0.3 ?m and consists of silver or of a silver-based alloy with an addition that will not form an alloy with silver or with the silver-based alloy, or will at best form a precipitation alloy, and which has a higher melting point than silver.

Abstract: The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

Abstract: Method for producing coated assembly parts for chemical device elements including the following steps: (a) the formation of an initial assembly including a steel support part, a zirconium or zirconium alloy coating, and at least one brazing material between the support part and the coating; (b) the insertion of the initial assembly into a brazing chamber with a controlled atmosphere; (c) the formation of a controlled atmosphere in said chamber; and (d) the reheating of said assembly to a temperature at least equal to the melting temperature of said brazing material.

Abstract: An electromagnetic radiation shielding device includes a first ply having a No. 1 surface and a No. 2 surface and a second ply having a No. 3 surface and a No. 4 surface. The No. 2 surface of the first ply faces the No. 3 surface of the second ply. A first coating having three or more metallic layers is provided over at least a portion of one of the surfaces, such as over at least a portion of the No. 2 surface. A second coating having three or more metallic layers is provided over at least a portion of one or more of the other surfaces, such as over at least a portion of the No. 3 surface.

Abstract: A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 ?m, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 ?m.

Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.

Abstract: A slide member is provided with a base material and an overlay provided over the base material. The overlay includes a plurality of regions in a thickness direction including a region located in sliding-surface side that slides with the counter element and a region located in a base-material side. A material forming the overlay includes a plurality of crystal planes. Orientation index of at least one of the crystal planes differs in the region located in the sliding-surface side and the region located in the base-material side of the overlay.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.

Abstract: A ceramic-metal composite includes a ceramic substrate, an active metal brazing alloy layer, and a metal plate bonded to the ceramic substrate through the active metal brazing alloy layer disposed therebetween. The active metal brazing alloy layer contains a transition metal that is at least one element selected from Group-8 elements specified in the periodic table. According to the above configuration, the following composite and device can be provided: the ceramic-metal composite that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module and a semiconductor device including the ceramic-metal composite.

Abstract: A new substrate makes it possible to modify surface properties relating to biocompatibility. Said substrate has an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal chosen from gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 ?g/cm2. The substrate is suggested for different uses, such as for modifying the hydrophobicity, protein adsorption; tissue ingrowth, complement activation, inflammatory response, thrombogenicity, friction coefficient, and surface hardness.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: To avoid a phenomenon of deterioration which is characteristic to an organic EL display device, such as a dark spot, without forming a pin hole in an organic material used for forming an organic EL layer. A reflective anode for an organic EL display device includes: an Ag-based alloy film (6) containing 0.01 to 1.5 atomic % of Nd and formed on a substrate (1); and an oxide conductive film (7) formed on the Ag-based alloy film (6) and in direct contact with the film (6).

Abstract: A brazing alloy for bonding in air, in which the melting point is reduced so as to perform brazing at a low temperature without using flux even in air, is provided. In addition, a bonded article and a current collecting material, each of which is bonded with the brazing alloy and has preferable gas sealing characteristics and superior bonding strength, are provided. The brazing alloy for bonding in air includes Ag and B as essential components. The amount of Ag is not less than 50 vol. % and less than 92 vol. %, and the amount of B is greater than 8 vol. % and not more than 50% vol. %. The amounts of Ag and B are adjusted so that the total of the amounts of Ag and B is 100% including inevitable impurities.

Abstract: The present invention provides metal nanowires including at least silver, and a metal other than silver, wherein the metal other than silver has a standard electrode potential more positive than the standard electrode potential of silver, and the metal nanowires have a long-axis length of 1 ?m or more and a short-axis length of 300 nm or less.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.