Abstract: A method for manufacturing a plate including multiple metal layers is provided. The method includes: disposing a semi-finished plate formed of a first metal in a mold, wherein a surface of the semi-finished plate is roughened; and injecting a second metal in liquid form onto the roughened surface of the semi-finished plate, so as to form a second metal layer on the semi-finished plate, wherein the second metal in liquid form covers and fills the roughened surface of the semi-finished plate. Not only does the multi-layer metal plate manufactured according to the method have the strength and elasticity of a composite metal, but also increase the joining, bonding or engagement strength between the first and second metal layers without laser welding.

Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

Abstract: A process for joining a brass part and a silicon carbide ceramic part comprising: providing a brass part, a SiC ceramic part, a Ti foil and a Ni foil; placing the SiC ceramic part, the Ti foil, the Ni foil, and the brass part into a mold, the Ti foil and the Ni foil located between the SiC ceramic part and the brass part, the Ti foil abutting against the SiC ceramic part, the Ni foil abutting against the brass part and the Ti foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the brass part, the SiC ceramic part, the Ti foil, and the Ni foil at least until the brass part, the SiC ceramic part, the Ti foil and the Ni foil form a integral composite article.

Abstract: A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described.

Abstract: Disclosed herein is an article comprising a plurality of domains fused together; wherein the domains comprise a core comprising a first metal; and a first layer disposed upon the core; the first layer comprising a second metal; the first metal being chemically different the second metal. Disclosed herein too is a method comprising rolling a sheet in a roll mill; the sheet comprising a first metal and having disposed upon each opposing face of the sheet a first layer that comprises a second metal; the second metal being chemically different from the first metal; cutting the sheet into a plurality of sheets; stacking the plurality of sheets; and rolling the stacked sheets in the roll mill to form a blank.

Abstract: A fabricating method of a magnetoresistance sensor is provided with cost effective and process flexibility features. Firstly, a substrate is provided. Then, at least one magnetoresistance structure and at least one bonding pad are formed over the substrate, wherein the bonding pad is electrically connected with the magnetoresistance structure. Then, a passivation layer is formed over the magnetoresistance structure and the bonding pad. Then, a magnetic shielding and concentrator structure is formed over the passivation layer at a location corresponding to the magnetoresistance structure. Finally, bonding pad openings is formed on the passivation layer by patterned polyimide, thereby exposing the bonding pad. After bonding pad was opened, the patterned polyimide can be removed or retained as an additional protection layer.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: A method for making a coated article includes the steps of: providing a substrate; forming a copper-cobalt target by a hot isostatic pressing process using copper powder and cobalt powder; forming a copper-cobalt alloy layer on the substrate by vacuum sputtering using the copper-cobalt target. A coated article is also described.

Abstract: A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

Abstract: A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.

Abstract: The invention relates to a plain bearing composite material with a supporting layer made of a copper alloy, and with a lining applied to the bearing metal layer. The copper alloy can contain 0.5-5% by weight of nickel, 0.2 to 2.5% by weight of silicon and=0.1% by weight of lead. The lining can be a sputtered layer that is applied without an intermediate layer. The invention also relates to methods for producing this composite material.

Abstract: Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

Abstract: The invention describes methods of welding onto laminated devices using a low temperature welding process. Also described are laminated devices with welds that do not disrupt a brazed core block of sheets in the laminated devices. Novel laminated devices with welded features for servicing the devices are also described.

Abstract: A precursor for a Nb3Sn superconductor wire to be manufactured by the internal diffusion method. The precursor includes Nb-based single core wires, Sn-based single core wires, and a cylindrical diffusion barrier made of Ta or Nb. Each Nb-based single core wire includes a Nb-based core coated with a Cu-based coating made of a Cu-based matrix. Each Sn-based single core wire includes a Sn-based core coated with a Cu-based coating made of a Cu-based matrix. The Nb-based single core wires and the Sn-based single core wires are regularly disposed in the diffusion barrier. The Nb-based single core wires includes at least two kinds of Nb-based single core wires having different Cu/Nb ratios and the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core.

Abstract: A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 ?m.

Abstract: An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.

Abstract: A housing includes a magnesium or magnesium alloy substrate, a first metal layer formed on the substrate by physical vapor deposition, and a second metal layer formed on the first metal layer by electroplating. The first metal layer is comprised of one or more metals selected from the group consisting of zinc, iron, copper, and nickel.

Abstract: A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 ?m or smaller and Ra is 0.2 ?m or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.

Abstract: A process for joining a brass part and a silicon carbide ceramic part comprising: providing a brass part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the brass part into a mold, the Al foil and the Ni foil located between the SiC ceramic part and the brass part, the Al foil abutting against the SiC ceramic part, the Ni foil abutting against the brass part and the Al foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the brass part, the SiC ceramic part, the Al foil, and the Ni foil at least until the brass part, the SiC ceramic part, the Al foil and the Ni foil form a integral composite article.

Abstract: An alloy, in particular for an anti-friction coating, includes elements which form a matrix and at least a soft phase and/or a hard phase, which soft phase elements and/or hard phase elements form a solid solution or a bond with the matrix element. The soft phase and/or hard phase is dispersed in the matrix and the solid solution or bond is formed only in the region of the phase boundary of the matrix with the soft phase and/or with the hard phase.

Abstract: The present invention relates to a copper-based sintered slide member comprising 0.5 to 20% by weight of tin, 0.1 to 35% by weight of manganese, 2 to 25% by weight of a solid lubricant and the balance essentially consisting of copper; and a multilayer copper-based sintered slide member comprising a copper-based alloy sintered layer and a metal backing plate which are formed into an integral multilayer structure, wherein the copper-based alloy sintered layer comprises 0.5 to 20% by weight of tin, 0.1 to 35% by weight of manganese, 2 to 25% by weight of a solid lubricant and the balance essentially consisting of copper. The above slide members are in the form of a lead-free copper-based sintered slide member.

Abstract: Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 ?g/dm2 or more and 3500 ?g/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.

Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.

Abstract: Cookware having improved uniform heat transfer over the entire cross section thereof, the cookware formed from a multi-layered composite metal having a layer of stainless steel roll bonded at or near the core of the composite to act as a thermal barrier and provide more uniform heat distribution on the cook surface. The stainless layer is roll bonded to layers of aluminum which, in turn, is roll bonded to layers of stainless steel or aluminum or copper. The layer of stainless steel adjacent to the cooking range may be a ferromagnetic grade of stainless steel if induction-type heating is desired. The cookware may include a non-stick surface applied thereto.

Abstract: A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix.

Abstract: A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

Abstract: Disclosed is a refrigeration circuit-forming member which has a metal surface and is used for a refrigeration circuit in which HFO-1234yf that is a refrigerant configured of molecules having a double bond is used. The metal surface, which comes into contact with the HFO-1234yf, is covered with a coating layer that is not reactive with the HFO-1234yf within the range of temperature at which the HFO-1234yf is used. The coating layer is formed of any of a coating film that is firmly fixed to the metal surface, a coating layer that is formed by adhesion of a specific component added into the lubricant oil, and a coating layer that is formed by modification of the metal surface layer itself that forms the metal surface. Consequently, the chemical instability that is caused when the refrigerant HFO-1234yf comes into contact with the metal can be eliminated.

Abstract: An article for protecting an airfoil component includes a sheath having an outer side and an inner side that forms a cavity for receiving a leading edge of the airfoil component. The sheath is made of cobalt and phosphorus to protect the leading edge of the airfoil component from erosion.

Abstract: A multilayered sliding member has a resin composition filled in pores of, and coated on the surface of, a porous sintered metal layer 2 formed on the surface of a metallic backing plate 1. The resin composition is formed by compounding a phosphate, a carbon black, a melt moldable fluororesin, and a PTFE serving as a principal component, and is preferably formed by further containing graphite and/or a low molecular weight PTFE.

Abstract: A copper-manganese bonding structure adopted for use on Under Bump Metallurgy (UBM) at solder joints in packaging technology includes an electronic element, at least one soldering material and at least one manganese bonding material. The electronic element has at least one copper conductive portion. The soldering material corresponds to the copper conductive portion. The manganese bonding material is arranged in the copper conductive portion and the soldering material to form bonding between them. The manganese bonding material can reduce the generation of a brittle intermetallic compound Cu3Sn and suppress the generation of voids. The copper conductive portion is not consumed by the generation of the intermetallic compound. Thus the total structure can be protected and improved.

Abstract: Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (?? and ??) in the textured metal layer surface and orientation degrees (?? and ??) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved.

Abstract: The invention relates to a cooling element to be used in the structure of a pyromettalurgical reactor used in the manufacturing of metals, which cooling element comprises a housing element mainly made of copper, provided with a channel system for the cooling medium circulation, made of pipe that is mainly made of copper; on the outer surface of the pipes forming the channel system, there is arranged a coating that has a lower melting point than the material of the housing element and the pipe. The invention also relates to a method for manufacturing the cooling element.

Abstract: Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the metal foil with a carrier comprises a structure where the adjoining carrier A has an area which covers the entire surface of the metal foil B, and the edge of the carrier A protrudes partially or entirely from the metal foil B. The copper foil with a carrier is used for producing a single-sided laminated plate or a multilayer laminated plate of two or more layers or an ultrathin coreless substrate for use in a printed wiring board. In particular, this copper foil with a carrier is used for producing a laminated plate, and its objective is to improve the handling performance in the production process of a printed board and reduce costs by increasing the yield.

Abstract: The invention relates to a slide bearing composite material which comprises a support layer from a copper alloy and a bearing coating applied to said support layer. The copper alloy may comprise 0.5 to 5% by weight of nickel, 0.2 to 2.5% by weight of silicon, ?0.1% by weight of lead. The bearing coating can be a galvanic layer, a sputter layer or a plastic layer. The invention also relates to methods of producing such a composite material.

Abstract: A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Abstract: An object of the present invention is to provide a plated object having a thin seed layer of uniform thickness that enables the fabrication of ultrafine wiring thereon in which, when the seed layer is formed by electroless copper plating, the uniformity and adherence thereof are improved over the aforementioned case in which electroless copper plating is performed on an elemental metal such as tungsten, molybdenum, etc., and the aforementioned complexity of forming two layers of a barrier layer and a catalyst metal layer before forming the copper seed layer is eliminated.

Abstract: Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.

Abstract: A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 ?m or below; and a method of producing the same.

Abstract: A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100}<001> cube texture in which a deviating angle ?? of crystal axes satisfies ???6 degree. The clad textured metal substrate has an intermediate layer on the surface of the copper layer to form the epitaxial thin film thereon. The intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming intermolecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.

Abstract: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.

Abstract: An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.

Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.

Abstract: The invention relates to an alloy, in particular for an anti-friction coating, comprising elements which form a matrix (2) and at least a soft phase (3) and/or a hard phase (5), which soft phase elements and/or hard phase elements form a solid solution or a bond with the matrix element. The soft phase (3) and/or hard phase (5) is dispersed in the matrix (2) and the solid solution or bond is formed only in the region of the phase boundary (4) of the matrix (2) with the soft phase (3) and/or with the hard phase (5).

Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes gold, nickel, silver, aluminum, and copper present in respective amounts to provide a post-braze hardness of between 450 and 600 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures less than about 1800° F. (982° C.).

Abstract: The invention describes a multi-layered bearing with a supporting metal layer, optionally a bearing metal layer disposed on top of it, an anti-friction layer on top of the latter as well as a wearing layer on top of it. The wearing layer is made from bismuth or a bismuth alloy and the anti-friction layer is made from a copper-bismuth or silver-bismuth alloy or silver.