Next To Co-, Cu-, Or Ni-base Component Patents (Class 428/675)
  • Patent number: 9979004
    Abstract: The clad material comprises outer layers each consisting of Ni or Ni alloy and a base layer consisting of Cu or Cu alloy, and is characterized in that peeling-off at a clad boundary is not recognized in cross section observation made after the clad material has been subjected to a 90° reverse bend test ten times, and the number of reverse bend cycles before rupture is 17 cycles or more. The clad material has with both of excellent corrosion resistance against electrolytic solution and high electric conductivity.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: May 22, 2018
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Kentarou Yoshida, Daisaku Arizono, Syuji Yoshida, Hayato Kita, Kouichi Takeuchi, Masayuki Shibuya, Hideya Kaminaka
  • Patent number: 9508462
    Abstract: A Sn-coated copper alloy strip including a surface coating layer containing a Ni layer, a Cu—Sn intermetallic compound layer, and a Sn layer formed in this order over the surface of a base material containing a copper alloy strip, in which an average thickness of the Ni layer is from 0.1 to 3.0 ?m, an average thickness of the Cu—Sn intermetallic compound layer is from 0.02 to 3.0 ?m, an average thickness of the Sn layer is from 0.01 to 5.0 ?m, and the Cu—Sn intermetallic compound layer contains only an ?-phase or the ?-phase and an ?-phase.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: November 29, 2016
    Assignee: Kobe Steel, Ltd.
    Inventor: Masahiro Tsuru
  • Patent number: 9293849
    Abstract: A canted coil spring made from multi-metallic wire to achieve combinations of desired material characteristics of different metals is discussed. Wire to be used in canted coil springs can have two or more metals oriented co-axially along such wire, such as an outer layer of one metal having one set of properties, and a core of a different metal having a different set of properties, that will achieve a single solid, multi-metallic wire with enhanced performance over a single material canted coil spring. Such features may be found advantageous in electrical applications, such as where both high electrical conductivity and high strength properties are desired.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: March 22, 2016
    Assignee: Bal Seal Engineering, Inc.
    Inventors: Pete Balsells, Rob Sjostedt, Farshid Dilmaghanian
  • Patent number: 9028972
    Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: May 12, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Terumasa Moriyama
  • Patent number: 9018605
    Abstract: A nuclear fusion reactor first wall component includes a copper alloy element, an intermediate metal layer made from niobium and a beryllium element, directly in contact with the intermediate metal layer. The intermediate niobium layer is further advantageously associated with a mechanical stress-reducing layer formed by a metal chosen from copper and nickel. This mechanical stress-reducing layer is in particular arranged between the intermediate niobium layer and the copper alloy element. Furthermore, when the mechanical stress-reducing layer is made from pure copper, a layer of pure nickel can be inserted between the niobium and the pure copper before diffusion welding. Such a component presents the advantage of having an improved thermal fatigue behavior while at the same time preventing the formation of intermetallic compounds at the junction between the beryllium and the copper alloy.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: April 28, 2015
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Pierre-Eric Frayssines, Philippe Bucci, Jean-Marc Leibold, Emmanuel Rigal
  • Patent number: 8993121
    Abstract: There is provided a metal laminated structure in which a first metal layer containing tungsten is provided on a first surface of a second metal layer containing copper and a third metal layer containing tungsten is provided on a second surface of the second metal layer opposite to the first surface, and the first metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the first surface of the second metal layer and the third metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the second surface of the second metal layer, and a method for producing the metal laminated structure.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: March 31, 2015
    Assignees: Sumitomo Electric Industries, Ltd., A.L.M.T. Corp.
    Inventors: Koji Nitta, Shinji Inazawa, Akihisa Hosoe, Masatoshi Majima, Osamu Suwata, Hiroshi Yokoyama, Shinichi Yamagata, Yugaku Abe
  • Patent number: 8980414
    Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 17, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Kazuhiko Sakaguchi
  • Publication number: 20150047884
    Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.
    Type: Application
    Filed: March 26, 2013
    Publication date: February 19, 2015
    Inventors: Tomota Nagaura, Michiya Kohiki, Terumasa Moriyama
  • Patent number: 8957326
    Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: February 17, 2015
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming-Jen Tzou, Kuo-Chao Chen, Pi-Yaun Tsao
  • Publication number: 20150037609
    Abstract: In a high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet, a plurality of high strength and high electrical conductive nano crystalline grain multi-layer sheets manufactured by roll-bonding an oxygen free copper (OFC) alloy sheet and a deoxidized low-phosphorous copper (DLP) alloy sheet are plastically bonded by roll-bonding method so that an OFC alloy layer and a DLP alloy layer are alternated to each other to have electrical conductivity of 85 IACS (%) or more and tensile strength of 500 MPa or more.
    Type: Application
    Filed: December 26, 2011
    Publication date: February 5, 2015
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Hyoung Wook Kim, Cha Yong Lim
  • Patent number: 8940404
    Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: January 27, 2015
    Assignee: Mitsubishi Materials Corporation
    Inventors: Yuki Taninouchi, Naoki Kato, Kenji Kubota
  • Publication number: 20140353030
    Abstract: The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core.
    Type: Application
    Filed: May 15, 2014
    Publication date: December 4, 2014
    Applicant: Feindrahtwerk Adolf Edelhoff GmbH & Co. KG
    Inventors: Gerhard BÜRSTNER, Mathias FIOLKA
  • Publication number: 20140332961
    Abstract: In the present invention, the pure Cu film is deposited on the CuMn film and the Mn atoms are induced to diffuse within the dielectric layer. The barrier properties of this self-forming barrier are sensitive to the thickness, the annealing temperature, the annealing time and the impurity concentration of itself. The bi-layer structure reduces the resistance of the barrier and improves the surface morphology during the electroplating process because the Mn atoms will be more easily corroded and oxidized in sulfuric acid with respect to the Cu. After annealing, the thermal stability and the barrier properties of the Cu/CuMn films is better than either single Cu film or single CuMn film.
    Type: Application
    Filed: November 8, 2013
    Publication date: November 13, 2014
    Applicant: National Cheng Kung University
    Inventors: Wen-His Lee, Chia-Yang WU
  • Patent number: 8883318
    Abstract: An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: November 11, 2014
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Shinji Yamamoto, Masaaki Ishio
  • Publication number: 20140311769
    Abstract: A composite conductor 10, including an internal layer 11 having a conductive material A, the conductive material A having fatigue strength of at least 150 MPa after being subjected to 106 cycles of cyclic loading in a fatigue test, and an external layer 12 having a conductive material B, the external layer coating the internal layer 11, the conductive material B having tensile strength higher than that of the conductive material A, the tensile strength being at least 250 MPa, in which the composite conductor 10 has fracture resistance to a sudden load and impact as well as bending durability.
    Type: Application
    Filed: December 6, 2012
    Publication date: October 23, 2014
    Applicants: DYDEN CORPORATION, FUKUOKA PREFECTURAL GOVERNMENT, NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY
    Inventors: Hiroyuki In, Fumiyo Annou, Daisuke Matsunaga, Hiromoto Kitahara, Shinji Ando, Masayuki Tsushida, Toshifumi Ogawa
  • Patent number: 8865319
    Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: October 21, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Naofumi Maeda
  • Patent number: 8852754
    Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: October 7, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Satoshi Fujisawa, Takeo Uno, Koichi Hattori
  • Publication number: 20140283506
    Abstract: A heat pipe includes a metal cylindrical body including a sealed storage space for storing water, a heat absorbing portion at one end portion of the cylindrical body to absorb heat by means of evaporation of the water, and a heat radiating portion at another end portion of the cylindrical body to radiate heat by means of condensation of steam generated by the evaporation. The cylindrical body includes a base material mainly including a stainless steel, a first metal layer mainly including a nickel and a second metal layer mainly including a copper, the first metal layer being formed on an inner surface of the base material and the second metal layer being formed on an inner surface of the first metal layer. The second metal layer is exposed to the storage space.
    Type: Application
    Filed: January 24, 2014
    Publication date: September 25, 2014
    Applicant: Hitachi Metals, Ltd.
    Inventors: Kazuma KUROKI, Hideyuki SAGAWA, Hiromitsu KURODA, Yukio SUZUKI
  • Publication number: 20140242405
    Abstract: Grain-refined and amorphous metallic material based friction liners for braking devices as used, e.g., in motor vehicles such as cars, trucks, motorcycles, as well as bicycles and other applications requiring, at least at times, means for decelerating rotating parts are disclosed. Friction liners can have isotropic or anisotropic properties and the friction surfaces can optionally be rendered hydrophobic.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: Integran Technologies Inc.
    Inventors: Gino Palumbo, Klaus Tomantschger
  • Publication number: 20140227557
    Abstract: A sputtering target for forming protective film according to the invention is used to form protective film on one surface or both surfaces of a Cu wiring film, and includes 8.0 to 11.0% by mass of Al, 3.0 to 5.0% by mass of Fe, 0.5 to 2.0% by mass of Ni and 0.5 to 2.0% by mass of Mn with a remainder of Cu and inevitable impurities. In addition, a laminated wiring film includes a Cu wiring film and protective film formed on one surface or both surfaces of the Cu wiring film, and the protective film is formed by using the above sputtering target.
    Type: Application
    Filed: November 26, 2013
    Publication date: August 14, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoru Mori, Souhei Nonaka
  • Publication number: 20140141274
    Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.
    Type: Application
    Filed: September 17, 2013
    Publication date: May 22, 2014
    Applicant: Nan Ya Plastics Corporation
    Inventors: MING-JEN TZOU, KUO-CHAO CHEN, YA-MEI LIN
  • Patent number: 8703308
    Abstract: According to one embodiment, a magnetic recording medium includes a substrate, a soft magnetic layer, a multilayered underlayer formed on the soft magnetic layer, and a continuous film type magnetic recording layer formed on the multilayered underlayer. The multilayered underlayer includes a first underlayer made of copper and containing crystal grains having a (100)-oriented, face-centered cubic lattice structure, a second underlayer formed on the first underlayer and made of copper and nitrogen, and a third underlayer formed into islands on the second underlayer. The continuous film type magnetic recording layer contains at least one element selected from Fe and Co and at least one element selected from Pt and Pd, has the L10 structure, and mainly contains (001)-oriented magnetic crystal grains.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: April 22, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tomoyuki Maeda
  • Patent number: 8668994
    Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: March 11, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
  • Patent number: 8652649
    Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: February 18, 2014
    Assignee: Xtalic Corporation
    Inventors: John Cahalen, Alan C. Lund, Christopher A. Schuh
  • Publication number: 20140041910
    Abstract: Metal foil provided with an electrically resistive layer, characterized in that an alloy (in particular, a NiCrAlSi alloy) resistive layer containing 1 to 6 mass % of Si is formed on the metal foil controlled to have a ten-point average roughness Rz, which was measured by an optical method, of 4.0 to 6.0 ?m, and the variation in the resistance value of the electrically resistive layer is within ±10%. Provided is a copper foil that allows embedding of a resistive material in a board by further forming an electrically resistive layer on the copper foil, and further allows improving the adhesiveness and suppressing the variation in resistance value within a certain range. As needed, metal foil provided in advance with a copper-zinc alloy layer formed on the surface thereof and a stabilizing layer composed of at least one component selected from zinc oxide, chromium oxide, and nickel oxide formed on the copper-zinc alloy layer is used.
    Type: Application
    Filed: February 15, 2012
    Publication date: February 13, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventor: Toshio Kurosawa
  • Publication number: 20140037985
    Abstract: The present invention discloses a high-strength tin-plated bronze tire bead steel wire, which comprises a steel wire base body. The surface of the steel wire base body is provided with at least two plating layers, and the tin content of the plating layers decreases layer by layer from inside to outside. The plating layer directly adjoining the surface of the steel wire base body has a high tin content, the adhesive force between the plating layer and the steel wire base body is strong, and the plating layer which has a high tin content can more effectively prevent the steel wire base body from rusting. The plating layers with the tin content gradually decreasing from inside to outside are combined closely with each other, and a strong adhesive force exists between the outermost plating layer with the relatively lowest tin content and tire rubber.
    Type: Application
    Filed: December 26, 2011
    Publication date: February 6, 2014
    Applicant: SHANDONG DAYE CO., LTD.
    Inventor: Yong Dou
  • Patent number: 8637164
    Abstract: A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 ?m, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 ?m.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: January 28, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yoshiaki Kobayashi, Satoru Zama, Satoshi Suzuki, Masato Ohno
  • Patent number: 8637165
    Abstract: A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: January 28, 2014
    Assignee: Apple Inc.
    Inventors: Edward Siahaan, John B. Ardisana, II, Mathias Schmidt, Jason Sloey, Albert J. Golko, Eric Jol
  • Patent number: 8580390
    Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: November 12, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
  • Patent number: 8568899
    Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: October 29, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Patent number: 8557392
    Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: October 15, 2013
    Assignees: Furukawa Electric Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno, Koichi Hattori, Naoya Kuwasaki
  • Patent number: 8545994
    Abstract: An article includes an electrodeposited metallic material including Co with a minimum content of 75% by weight. The metallic material has a microstructure which is fine-grained with an average grain size between 2 and 5,000 nm and/or an amorphous microstructure. The metallic material forms at least part of an exposed surface of the article. The metallic material has an inherent contact angle for water of less than 90 degrees at room temperature when measured on a smooth exposed surface portion of the metallic material which has a maximum surface roughness Ra of 0.25 microns. The metallic material has an exposed patterned surface portion having surface structures having a height of between at least 5 microns to about 100 microns incorporated therein to increase the contact angle for water at room temperature of the exposed patterned surface portion to over 100 degrees.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: October 1, 2013
    Assignee: Integran Technologies Inc.
    Inventors: Diana Facchini, Francisco Gonzalez, Jonathan McCrea, Mike Uetz, Gino Palumbo, Klaus Tomantschger, Nandakumar Nagarajan, Jared J. Victor, Uwe Erb
  • Publication number: 20130240257
    Abstract: Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 ?g/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 ?g/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.
    Type: Application
    Filed: November 17, 2010
    Publication date: September 19, 2013
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Koichiro Tanaka, Misato Chuganji
  • Publication number: 20130230740
    Abstract: After a microcrystalline layer having a grain size that is finer than that of a base member is formed on the surface of at least one of a first bonding portion and a second bonding portion, the gap between the first bonding portion and the second bonding portion is filled with a solution into which copper oxide can be eluted, so as to deposit copper oxide contained in the surface oxide film into the solution. By applying pressure and by heating at a temperature of at most the copper recrystallization temperature, the components contained in the solution are removed except for copper, so as to elute copper oxide, thereby bonding the first bonding portion and the second bonding portion via the copper thus deposited. Subsequently, the copper is solid-phase diffused into the first bonding portion and the second bonding portion.
    Type: Application
    Filed: February 19, 2013
    Publication date: September 5, 2013
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Yasuyuki YANASE, Koichi SAITO
  • Patent number: 8524376
    Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: September 3, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Takaaki Hatano
  • Patent number: 8524378
    Abstract: Provided is a copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil, wherein the electrodeposited layer comprises dendritic particles grown on the copper foil surface, and the entire surface of the copper foil is covered with particles having an area as seen from above the copper foil surface of 0.1 to 0.5 ?m2 at a density of 1000 particles/10000 ?m2 or less, particles exceeding 0.5 ?m2 at a density of 100 particles/10000 ?m2 or less, and particles less than 0.1 ?m2 as the remainder. Roughening particles formed dendritically in a roughening treatment based on copper-cobalt-nickel alloy plating are inhibited from shedding from the copper foil surface, and the phenomenon known as powder falling and uneven treatment are thereby inhibited.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: September 3, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Naoki Higuchi
  • Patent number: 8512873
    Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: August 20, 2013
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno
  • Publication number: 20130189540
    Abstract: Alloys of copper and manganese and copper, manganese and zinc can be used for the production of coins, such as the U.S. five cent piece or “nickel.” With appropriate platings, these alloys can match the electromagnetic signatures or electrical conductivity of currently circulated coins. This is important as modern vending machines include sensors which measure the conductivity of coins to ensure they are genuine.
    Type: Application
    Filed: October 7, 2011
    Publication date: July 25, 2013
    Applicant: JARDEN ZINC PRODUCTS, LLC
    Inventors: Paul McDaniel, Jon Headrick, Randy Beets
  • Patent number: 8470450
    Abstract: Provided is a method of producing a two-layered copper-clad laminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100° C. or more but not exceeding 175° C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement in folding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: June 25, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Mikio Hanafusa
  • Patent number: 8449987
    Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: May 28, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
  • Patent number: 8445116
    Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.
    Type: Grant
    Filed: November 27, 2011
    Date of Patent: May 21, 2013
    Assignee: Xtalic Corporation
    Inventors: Nazila Dadvand, Christopher A. Schuh, Alan C. Lund, Jonathan C. Trenkle, John Cahalen
  • Publication number: 20130115478
    Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.
    Type: Application
    Filed: November 9, 2012
    Publication date: May 9, 2013
    Applicant: INTEGRAN TECHNOLOGIES, INC.
    Inventor: INTEGRAN TECHNOLOGIES, INC.
  • Patent number: 8415027
    Abstract: A laser welding structure includes a lead, a conductive member, and a welding part. The lead has a nickel plating layer and is made of copper or copper alloy. The conductive member is joined with the lead and is made of copper or copper alloy. The welding part is formed by a laser welding so as to join the lead and the conductive member. An end portion of the welding part has a rounded convex shape.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: April 9, 2013
    Assignee: DENSO CORPORATION
    Inventors: Hiromasa Hayashi, Masayuki Takenaka, Hiroshi Kasugai, Masaji Imada
  • Patent number: 8409726
    Abstract: Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: April 2, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
  • Patent number: 8409724
    Abstract: A coated article is described. The coated article includes a substrate, a bonding layer formed on the substrate, a plurality of nickel-chromium-nitrogen layers and a plurality of copper-zinc alloy layers formed on the bonding layer. The bonding layer is a nickel-chromium layer. Each nickel-chromium-nitrogen layer interleaves with one copper-zinc alloy layer. One of the nickel-chromium-nitrogen layers is directly formed on the bonding layer. A method for making the coated article is also described.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: April 2, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li
  • Patent number: 8410409
    Abstract: An apparatus may have a tool die for forming a component. The tool die may have a die susceptor having a forming surface for forming the component, and at least one flexible induction coil segment for heating the die susceptor. The at least one flexible induction coil segment may be configured to conform to a contour of the forming surface of the die susceptor.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: April 2, 2013
    Assignee: The Boeing Company
    Inventors: Marc R. Matsen, Mark A. Negley, William C. Dykstra
  • Patent number: 8394508
    Abstract: A plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 ??·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: March 12, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
  • Patent number: 8391011
    Abstract: A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: March 5, 2013
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Shogo Mori, Eiji Kono
  • Patent number: 8383248
    Abstract: A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of titanium dioxide layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a titanium layer. Each titanium dioxide layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: February 26, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZehen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li
  • Patent number: 8377569
    Abstract: A coated article is described. The coated article includes a substrate, a bonding layer formed on the substrate, a plurality of nickel-chromium-nitrogen layers and a plurality of copper-silver-cerium alloy layers formed on the bonding layer. The bonding layer is a nickel-chromium layer. Each nickel-chromium-nitrogen layer interleaves with one copper-silver-cerium alloy layer. One of the nickel-chromium-nitrogen layers is directly formed on the bonding layer. A method for making the coated article is also described.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: February 19, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li