Abstract: A furnace roller assembly is provided with a helically shaped shaft-offset and metal product contact surface assembly wound around a furnace roller shaft. A corebuster may be provided within the furnace roller shaft to direct the flow of a coolant within the axial length of the furnace roller shaft and through a cooling element forming a part of the shaft-offset and metal contact surface assembly.

Abstract: In a continuous-feed thermomolding machine a foil is advanced in a transport direction at a constant travel speed through a heat station where it is exposed to a heat source such that each piece of the foil is exposed for a predetermined residence time. When the machine is stopped, a shield is positioned in the station between the foil and the source so that substantially no heat is imparted to the foil from the source. The machine is started by accelerating the foil to the travel speed while simultaneously and synchronously accelerating the shield opposite to the travel direction such that, as the shield fully retracts from the station, the foil reaches the travel speed and, before the shield has fully retracted from the station, every piece of the foil in the station exposed by the retracting shield is exposed to the source for the residence time.

Abstract: The invention relates to a roller hearth furnace (1) for heating and/or temperature equilibration of continuous cast products (2), comprising a first series of rollers (13) running in the longitudinal direction (12) and a second parallel series of rollers (15) on the outlet side (14), wherein a buffer zone (16) with lifting elements (17) for the perpendicular transport of the continuous cast product (2) is arranged between the series of rollers (13, 15). Furthermore, alternative arrangements for a further process route (28) are provided.

Abstract: A method of heat treating stainless steel in the form of blanks, piping, tubing, strip, or wire-like material, after rolling the material, and in a heat treatment furnace at a temperature higher than about 900° C. The material is subjected to a preheating stage and a final heating stage, wherein in the preheating stage flames from burners are directed toward the surface of the material to impinge on the surface. Burners situated in the preheating stage are supplied with a fuel that burns with the aid of an oxidizing gas that contains gaseous oxygen. The material is held in the preheating stage long enough to obtain at least some degree of oxidation on the surface of the material, and the material is heated further in a following, final heating stage by burners situated in a furnace and that are supplied with a fuel and an oxidizing gas.

Abstract: A furnace for heat treating components, especially relatively long components such as main shafts of gas turbine engines, comprises means for mounting a number of components vertically and conveying them repeatedly around a circular path surrounding one or more heating elements, while simultaneously rotating the components about their vertical axes. This allows uniform heat treatment of the components, even when long treatment times are needed. Loading and unloading chambers adjacent to the main chamber permit automated loading and unloading of components without disturbing the environment within the main chamber.

Abstract: There is provided a system and method for heating at least one workpiece in a furnace by which the workpiece is heated by heating facilities. An exemplary method comprises heating a complete workpiece with the heating facilities. The exemplary method also comprises moving the workpiece out of the furnace such that a first portion of the workpiece is still inside the furnace while a second portion of the workpiece is outside the furnace and holding the workpiece at this position for a predetermined time period. Finally, the exemplary method comprises moving the complete workpiece out of the furnace.

Abstract: A paddle for the production of semiconductor wafers is provided. The paddle can be a cantilever paddle made of a ceramic such as silicon carbide and can be used with round or square wafers, such as photovoltaic wafers. The paddle exhibits excellent deflection and strength characteristics.

Abstract: A device for heating objects and a method that has recourse to the device, particularly for heating and/or bending one or more glass panes positioned one on top of the other, covering each other. The device includes a furnace line, plural supports, particularly transport molds that transport and/or bend the objects, the objects being placed on the supports positioned on transport carriages, a drive device that progresses the transport carriages through the furnace line and plural heating elements provided above the objects in the furnace line. In the device the heating elements are positioned on the whole above the entire furnace line and the heating elements can be operated and regulated so as to form heating zones suited to dimensions of the objects.

Abstract: A platform has an opening therein. The platform is adapted to receive a heat source therein. The platform is rotatably disposed about the heat source. A motor is operatively coupled to the platform for rotating the platform about the heat source. A temperature sensor senses the temperature at a predetermined position on the interior surface of a barrel disposed on said platform and provides a temperature output. A central processing unit has a clock for measuring an interval during which a barrel is exposed to the heat source. A database stores toasting recipes, which are a function of time and temperature. The central processing unit receives an input from the sensor and clock and utilizes the recipe stored in the database to provide an output to an alarm if the sensed temperature during the input time interval does not substantially correspond the recipe as stored in the database.

Abstract: To facilitate a trouble-free charging of scrap metal having differing constitutions, such as light and heavy scrap metal, from a lower discharge opening of a shaft-shaped charging device or a charging stock preheater (1) into a melting vessel by a pusher (13), the lateral surfaces of the pusher (13) are formed so as to converge from the upper side to the lower side and the actuating device (2) of the pusher (13) is pivotably supported in a frame structure (3) about a horizontal axis. In addition, the upper boundary of the discharge opening for the charging stock from the shaft (2) is preferably formed by a horizontal, rotatably supported roller (26), more preferably with engaging elements (30) distributed around the circumferential surface. Sections of the charging device that are severely mechanically stressed are preferably formed by steel billet sections connected to form a structural unit.

Abstract: A heat processing apparatus for heating a mask substrate is disclosed. A mask substrate on which a coating solution has been coated is placed on a heating plate that heats the substrate. A frame member is disposed on the heating plate so that the frame member faces a side surface of the mask substrate placed on the heating plate when the frame member is attached to the heating plate and that a clearance is formed between the frame member and the heating plate when the frame member is attached to the heating plate. The frame member suppresses heat radiated from the side surface of the substrate. As a result, the temperature uniformity of the surface of the substrate can be improved. In addition, since the clearance is formed between the frame member and the heating plate, particles do not accumulate in the region. Thus, adhesion of particles to the substrate can be suppressed.

Abstract: When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that holds the first jig and is mounted on a heat treatment boat is adopted as a heat treatment boat of a vertical heat treatment furnace, the stress concentrated during the heat treatment on a particular portion of the semiconductor substrate can be reduced; in the case of a semiconductor substrate large in the tare stress and having an outer shape of 300 mm being heat treated, or even in the case of the heat treatment being carried out under very high temperature conditions, the slips can be suppressed from occurring. The present invention can be widely applied as a stable heat treatment method of semiconductor substrates.

Abstract: A carbon baking furnace comprising a refractory lined kiln defining a baking path, further comprising a means for substantially continuously receiving green carbon articles, means for packing said green carbon articles in a sacrificial medium, a means for substantially continuously displacement of the packed carbon articles through said baking path and a means for substantially continuously removing baked carbon articles from the kiln.

Abstract: A furnace apparatus and method for increasing the productivity and/or quality of reheated products by improving the temperature profile of a furnace for reheating products.

Abstract: A system and method for processing large area substrates is provided. In one embodiment, a processing system includes a transfer chamber having at least one processing chamber and a substrate staging system coupled thereto. The staging system includes a load lock chamber having a first port coupled to the transfer chamber and a heat treating station coupled to a second port of the load lock chamber. A load lock robot is disposed in the load lock chamber to facilitate transfer between the heat treating station and the load lock chamber.

Abstract: A process of manufacturing a sulfoaluminate or ferroaluminate cement, and an apparatus for the manufacture. The cement is manufactured from a mixture containing CaCO3, Al3 and/or Al(OH)3, CaSO4, SiO2 and/or a product containing silica or silicates such as clay, these compounds being present in the anhydrous or hydrated form. In this process, the mixture is treated up to clinkering by movement in a center of a kiln, in a sheet with approximately constant thickness, at approximately constant speed, along a treatment path having a positive temperature gradient, and for a treatment time during which the mixture remains below its melting temperature. The mixture is clinkered to produce a clinkered mixture that is cooled upon exit from the treatment path.

Abstract: The aim of the invention is to develop a hot rolling unit, comprising at least one continuous casting unit (1) with a post-arranged furnace (4), followed by a roughing stand (5) and, over a strip edge guide, a soaking furnace (15) and finishing train, such that downtime is reduced to a minimum level and even during said downtime, as well as in planned cases of withdrawal of pre-strip material, the pre-strip (14), behind the roughing stand in the soaking furnace, can be separated off from the normal rolling cycle.

Abstract: A substrate processing apparatus includes a substrate holder for holding a substrate with a holding angle of 45 degrees to 90 degrees with respect to a horizontal plane, a conveying system to convey the substrate with the substrate holder, a process chamber in which the substrate is processed, a load-lock chamber in which the substrate temporarily stays, and an intermediate chamber provided between the process chamber and the load-lock chamber. The conveying system conveys the substrate along the first direction from the load-lock chamber to the intermediate chamber, and from the intermediate chamber to the process chamber, and also conveys the substrate along the second direction perpendicular to the first direction.

Abstract: In a process to control the heating of a coating material for a roof covering, the coating material is heated using a heat exchange medium in a continuous process. The heat exchange medium is cooled in response to a slowdown or stoppage of the continuous heating process to maintain the temperature of the coating material below a predetermined level.

Abstract: A method and an apparatus for transporting substrates in all organic light emitting diode (OLED) process is disclosed, which has a transferring chamber provided for transporting substrates between processing modules and the atmosphere condition therein is able to be adjusted to be the same as the processing module by an atmosphere conditioner unit. According to the present invention, the substrates are not contaminated by moisture and the process operation and the factory layout are more flexible. Moreover, the OLED yield is improved.

Abstract: The process is used for tempering preforms made of a thermoplastic material; the preforms are to be blow molded. The preforms are provided with a temperature profile along a circumference. The temperature profile is generated by differentially heating strip-shaped regions, which extend in the direction of a longitudinal axis of the preform. A step-by-step tempering for the purpose of temporally sequential thermal conditioning of different regions of the preform is carried out with movement phases and rest phases. A carrier device is rotated by the interactions of a gear and a matching gear for initiating rotational movements. The preform is moved, motionless with regard to the rotational direction, through the tempering zone at least along a portion of the transport path before the start of the engagement of the gear with the matching gear.

Abstract: In a substrate processing apparatus, processing units are stacked in a multistage manner around a transport robot arranged at the center of a processing area for forming a processing part. In a second hierarchy, rotary coating units are arranged through an indexer and a transport robot. In a fourth hierarchy located above the second hierarchy, rotary developing units are stacked above the rotary coating units respectively. Multistage thermal processing units and an edge exposure unit are horizontally arranged above an interface mechanism part. Thus, a substrate processing apparatus capable of reducing the area for setting the same is provided.

Abstract: A semiconductor wafer is mounted on a susceptor disposed in a processing chamber, the wafer is heated at a temperature on the order of 1000° C. for annealing, and a gas is supplied from a gas supply device disposed opposite to the wafer. When raising the temperature of the wafer and/or when lowering the temperature of the wafer, intra-surface temperature difference is limited to a small value to suppress the occurrence of slips. A gas supply device is divided into sections corresponding to a central part and a peripheral part, respectively, of the wafer to supply the gas at different flow rates onto the central part and the peripheral part, respectively. When raising the temperature of the wafer, for example, a gas of a temperature higher (lower) than that of the wafer is supplied at a flow rate per unit area greater (lower) than that at which the gas is supplied to the peripheral part to the central part.

Abstract: An oven compartment in an oven for subjecting items to a selected heating sequence having a compartment container with a transport opening therein to permit selectively entering such items adjacent to first plenum structure at a perforated surface to allow providing heating fluid thereon. The first plenum structure has a material mass and a specific heat such that a rate of change of temperature of that structure exceeds one degree Centigrade per second for a selected maximum temperature differential between heating fluid and any entered items positioned adjacent to the perforated surface at selected heating fluid pressures at that perforated surface. A method for heating such items with a heating fluid previously heated by a heater, to an extent determined by operating a heater control, directed onto such items is based on obtaining a control representation of a selected set of values for the heater control versus time based on a heating specification for a selected kind of item to be heated.

Abstract: A metal workpiece to which a brazing material and a flux are previously adhered is set into an index type convection furnace, and a heating medium gas is blown to this metal workpiece, so that the temperatures of the workpiece are increased up to the brazing temperature. After that, the temperatures of the heating medium gas are varied between the temperature slightly higher than the brazing temperature and the temperature at least 5% lower than that, in a predetermined period, while brazing. According to this method, a temperature slope of the workpiece is eliminated and uniform brazing is possible.

Abstract: A method for aligning a boundary condition temperature in a thermal processor utilizes an air temperature measurement. During the thermal process, air temperature measured along an interval series forms an air profile and provides a reference to which the boundary condition temperature may be aligned. A method for aligning a part temperature profile to the processor temperature profile uses the measured air temperature to adjust the part temperature profile, so as to be synchronized with the air temperature profile. These procedures may be used in conjunction with setpoint parameter prediction for attaining a target part temperature response.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism. The heating mechanism preferably comprises a heated substrate support adapted to support a substrate and to heat the supported substrate to a predetermined temperature, and the cooling mechanism preferably comprises a cooling plate. The transfer mechanism may comprise, for example, a wafer lift hoop having a plurality of fingers adapted to support a substrate, or a plurality of wafer lift pins. A dry gas source may be coupled to the chamber and adapted to supply a dry gas thereto.

Abstract: Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.

Abstract: A device adapted for attachment to a thermal processing furnace, the device includes a housing having first and second openings with a chamber located therebetween, the second opening is operatively connected to a thermal processing furnace and in communication with the thermal processing furnace for receiving a thermal process generating gas stream containing combustibles from the thermal processing furnace, a gas supply assembly located within the chamber for supplying a heated oxygen-containing gas at a temperature and velocity sufficient to mix the combustibles and the oxygen-containing gas to oxidize the combustibles into harmless byproducts.

Abstract: An apparatus for the heat treatment of workpieces comprising comprising a plurality of evacuable chambers connected through airlocks, a conveyor, preferably a circular chain conveyor for the transport of the workpieces along a path through the chambers, an electric resistance heating device, a cooling blower, and a heat exchanger, a plurality of workpieces of equal size and configuration, in particular backsaw blades, are placed tightly one on top of another and form a stack which is placed into a frame made of profile cuts, whereby the frame is capable of being coupled to a conveyor by means of suspension elements.

Abstract: An apparatus for baking powder coated parts comprises a housing having a top end and a bottom end, a heating element in the housing at the top end, defining an oven, a carrying arrangement in the housing for carrying the parts and a control station for controlling the heating element and the carrying arrangement such that the carrying arrangement carries the parts from the bottom end where the parts are attached to the carrying arrangement to the top end where the parts are heated by the heating element and to lower the carrying arrangement from the top end to the bottom end after the parts have been heated and a second batch of parts can be attached to the carrying arrangement. The control station has a first locator at the top end for indicating when the carrying arrangement is at the top and a second locator at the bottom end for indicating when the carrying arrangement is at the bottom end.

Abstract: A method for producing a lightweight aggregate by treating flyash and sewage sludge. The flyash and sewage sludge are mixed together and agglomerated into pellets. The pelletized agglomerate is fed into a rotary kiln in a direction that is co-current with the flow of fuel and air through the kiln. The rotary kiln includes at least one port air zone near the infeed end of the rotary kiln to introduce port air beneath the bed of pelletized agglomerate feed stock flowing through the rotary kiln. The introduction of port air beneath the material bed causes the volatized combustible matter to burn in the bed of material, which oxidizes the outer shell of the pelletized agglomerate. As the pelletized agglomerate continues to travel through the rotary kiln, bloating occurs within the interior of the material and results in the formation of the lightweight aggregate material.

Abstract: The products (1) pass from a charging end (2) to a discharging end (3); at the discharging end side, the furnace exhibits a heating zone (4) equipped with air/fuel burners (41), possibly doped with oxygen, and, on the charging end side, exhibits a flue-gas recuperation or drainage zone (5) in which the flue gases are removed. At least one fuel body in the gaseous state is incorporated into the flue gases, and oxygen is introduced upstream of that possibly doped air/fuel burner (41) which is situated furthest upstream when referring to the direction of travel of the products (1), so as to burn the gaseous fuel body and thus raise the temperature in the recuperation zone (5). Possible use for heating steel-making products prior to rolling.

Abstract: A method for processing a pulverulent calcium sulphate material in order to obtain a hydraulic binder is described, including combining the following two successive processing steps: (a) heating the pulverulent material in a curing tunnel (1) at a temperature of 220-360° C., under conditions suitable for primarily forming an &agr;-type calcium sulphate, and (b) subjecting the heated material to a thermal quenching step in a cooling apparatus (2), with a cold, dry gas to stabilise the &agr; anhydrite and to prevent its conversion into other crystallographic types. The method provides a novel hydraulic binder with an &agr; anhydrite content of more than 35 wt. %, and with improved strength and behavior in fire resistance properties.

Abstract: A forced convection furnace (20) and method for heating glass sheets includes a forced convection heater (42) having lower hot gas distributors (44) located below alternate conveyor rolls (38) to provide upward gas flow both upstream and downstream thereof along a direction of conveyance to provide heating from below of the glass sheets being conveyed within a heating chamber (32) of a housing (22) of the furnace. The forced convection heater (42) also includes upper hot gas distributors (52) for providing heating from above of the glass sheets being conveyed within the heating chamber (32).

Abstract: An apparatus for the heat treatment of work pieces comprising comprising a plurality of evacuable chambers connected through airlocks, a conveyor, preferably a circular chain conveyor for the transport of the workpieces along a path through the chambers, an electric resistance heating device, a cooling blower, and a heat exchanger, a plurality of workpieces of equal size and configuration, in particular hacksaw blades, are placed tightly one on top of another and form a stack which is placed into a frame made of profile cuts, whereby the frame is capable of being coupled to a conveyor by means of suspension elements.

Abstract: An apparatus for manufacturing a semiconductor material includes a load-lock chamber which can contain a cassette for holding at least one wafer for taking the wafer into or out of the apparatus, a process furnace for conducting a treatment to the wafer, and a transfer chamber for transferring the wafer between the load-lock chamber and the process furnace, wherein the apparatus further includes a pressure detector for detecting a pressure difference between in the process furnace and in the transfer chamber, and a gas flow controller for controlling a flow rate of a gas flow supplied to the transfer chamber in accordance with results of detection by the pressure detector.

Abstract: The present invention relates to a chained thermal processing installation under rarefied atmosphere including several processing cells linked in a horizontal plane to a common air-tight chamber provided with handling means for transferring a load from one cell to another. The common chamber is a cylinder with a horizontal axis, at least one end of which is arranged to receive a module in the form of a cylindrical extension to which additional cells are connected.

Abstract: When the processed body holding member is moved upward or downward, the pressure in the reaction pipe and the shift and mount chamber is reduced down to several to several tens Torr, to reduce wind pressure applied to the processed body and thereby to suppress pressure fluctuations in the reaction pipe. Further, when the processed body holding member is moved upward or downward, the processing gas is passed in the same direction as the movement direction of the processed body holding member at a speed higher than the movement speed of the processed body holding member, to prevent the processing gas from being opposed to the processed body, so that the resistance received by the processed body is reduced and thereby the pressure fluctuations can be suppressed in the reaction pipe.

Abstract: The vertical heat treatment apparatus for semiconductor wafers (W) includes a heat treatment furnace (19). In the heat treatment furnace (19), the wafers (W) are subjected to a batch treatment in a state mounted on a boat (16). To the lower side of the heat treatment furnace (19), a preparatory vacuum chamber (102) is airtightly connected through a manifold (33). The manifold (33) has first and second parts (33a and 33b) separably coupled to each other, which are connected to the heat treatment furnace (19) and the preparatory vacuum chamber (102), respectively. The second part (33b) defines a valve seat on which a lid (22) is seated to cut off the communication between the heat treatment furnace (19) and the preparatory vacuum chamber (102).

Abstract: A vertical semiconductor wafer processing furnace that includes a single housing having first and second vertical furnaces each having a heating chamber for heat treating a semiconductor wafer. The first and second vertical furnaces are asymmetrically disposed relative to each other to reduce the overall footprint of the processing furnace. Each vertical furnace includes a wafer support assembly that includes support structure, such as a wafer boat, boat elevator, motor and guide rod, for axially mounting a selected number of semiconductor wafers. A translation element selectively moves one of the support elements along the vertical axis into and out of the process tube, and a wafer transfer element selectively transfers semiconductor wafers to or from one of the support elements. The furnace further includes a heating sleeve or envelope that is adapted to control the ambient fluid environment surrounding the support structure and which is independently movable relative to support structure.

Abstract: A heating furnace and a method for uniformly thermo-setting a paste applied onto the surface of a substrate, and for manufacturing a high quality substrate. The heating furnace can be installed in a small area. A plurality of up-and-down moving pins are provided in a furnace body. The plurality of up-and-down moving pins are penetrating a hot plate having a heater and are vertically movable. A substrate loaded through an opening port in an isolation wall is mounted onto the up-and-down moving pins moved in their upper position. The substrate moved down near the hot plate using the up-and-down moving pins is preheated by the heated hot plate. Then, the substrate is further moved down and vacuum attracted to the hot plate to be heated by the hot plate. After that, the substrate is moved up to the original position and nitrogen gas from nozzles of a gas supply pipe is blown on the surface of the substrate to accelerate cooling of the substrate.

Abstract: The present invention relates to a heat treatment machine for laboratory use which has a cooling chamber incorporated with a heating chamber of a furnace, both chambers are formed with a vacuum tube of simple construction, in which heating and cooling of a test piece are performed in vacuum atmosphere. The cooling process can be effected following the heating process with maintaining the same vacuum atmosphere, whereby a rapid cooling of the test piece is allowed and physical characteristics of the treated metal can be improved.

Abstract: The invention relates to a method and a plant for manufacturing mineralized portland cement clinker. The method and plant provides for preheating, calcining, burning and finally cooling the clinker. The mineralizer may e.g. be gypsum, fluorine, or a waste product containing these or other mineralizers. The mineralizer is added to the feedstock after the feedstock has been fed to the process, preferably after the cyclone which handles the feed to the calciner, i.e. the last cyclone in the preheater, or the lowermost preheater stage in a plant which does not incorporate a calciner.

Abstract: The present invention relates to a thermal processing method wherein a cylindrical process tube that has at one end an entrance/exit is provided at the other end thereof with a heat source, and thermal processing is performed on a workpiece which has been brought in from the entrance/exit of the process tube to a prescribed position therein. This thermal processing method and an apparatus therefor is characterized in that, when the workpiece is moved to the prescribed position, it is first moved to a proximity position that is closer to the heat source than the prescribed position, then it is returned therefrom to the prescribed position.

Abstract: The present invention relates to a thermal processing method wherein a cylindrical process tube that has at one end an entrance/exit is provided at the other end thereof with a heat source, and thermal processing is performed on a workpiece which has been brought in from the entrance/exit of the process tube to a prescribed position therein. This thermal processing method and an apparatus therefor is characterized in that, when the workpiece is moved to the prescribed position, it is first moved to a proximity position that is closer to the heat source than the prescribed position, then it is returned therefrom to the prescribed position.

Abstract: An alignment assembly for aligning heating lamps in a heating lamp assembly intended for use in an oven of a blow molding machine, the heating lamp assembly having a chassis removably positionable in at least one preselected location in the machine and including a vertical array of generally horizontally disposed lamps held in position by a lamp holder coupled to each end of each lamp. The alignment assembly has a baseplate including a coupling for coupling the chassis to the baseplate. A pair of standards are coupled to another plate movable relative to the baseplate projecting upward therefrom for holding a vertical scale and a plurality of vertically positionable and horizontally reciprocable gages indicate the relative position of the lamp holders.

Abstract: A forced cooling apparatus for a heat treatment apparatus comprising a heat treatment furnace having a process tube with one end open at an furnace opening and another end closed at an furnace top portion; and a heater portion which covers the process tube, and wherein cooling of the heat treatment furnace is performed by forced cooling by flowing air into a gap formed between the heater portion and the process tube and which extends to the furnace top portion.

Abstract: A heat treatment device comprises a table of a thermal conductor located in a housing carrying an object of treatment thereon, and a treatment heat source located in the housing and by the table so that a bottom face of the table is opposite to a top face of the heat source, whereby the object of treatment in heat-treated through the table. An annular groove is formed in the top face of the heat source and evacuated so that the substrate and heat source are securely attached thereby increasing the heat conduction between them.

Abstract: A heat-treatment apparatus comprises a heat-treatment section for subjecting a heat-treatment to a wafer and a loading section for loading a wafer boat into and unloading it from the heat-treatment section. The loading section is connected to the heat-treatment section and includes in it a movable support member, a drive mechanism and a vertical base board as well as a load-lock chamber for maintaining the inside in vacuum. The movable support member supports a wafer boat. The movable support member is attached to a vertical base board so that it can move up and down. The drive mechanism is attached on the major surface of the vertical base board opposite to the surface facing the wafer boat. The drive mechanism drives the movable support to move up and down. The heat-treatment apparatus further comprises a wafer transfer section that includes an orientation flat alignment mechanism and a buffer stage disposed near the orientation flat alignment mechanism.