Abstract: A semiconductor device, disposed on a substrate, includes a first channel layer, a patterned doped layer, a gate insulating layer, a conducting gate electrode, a second channel layer, a first electrode and a second electrode, and a third electrode and a fourth electrode. The first channel layer is disposed on the substrate and in a first region. The patterned doped layer includes a doped gate electrode disposed in a second region, and two contact electrodes electrically connected to two sides of the first channel layer, respectively. The conducting gate electrode is disposed on the gate insulating layer in the first region. The second channel layer is disposed on the gate insulating layer in the second region. The first electrode and the second electrode are electrically connected to the contact electrodes, respectively. The third electrode and the fourth electrode are electrically connected to two sides of the second channel layer, respectively.

Abstract: An apparatus and a method for creating a CMOS with a dual raised source and drain for NMOS and PMOS. The spacers on both stack gates are of equal thickness. In this method, a first insulating layer is formed on the surface. The first region is then masked while the other region has the first layer etched away and has an epitaxial source and drain grown on the region. A second layer is formed to all exposed surfaces. The second region is then masked while the first region is etched away. The epitaxial source and drain is formed on the first region. The second region can also be masked by adding a thin layer of undoped silicon and then oxidize it. Another way to mask the second region is to use a hard mask. Another way to form the second source and drain is to use amorphous material.

Abstract: The invention relates to a semiconductor device and a method for manufacturing such a semiconductor device. A semiconductor device according to an embodiment of the invention comprises: a substrate which comprises a base layer, an insulating layer on the base layer, and a semiconductor layer on the insulating layer; and a first transistor and a second transistor formed on the substrate, the first and second transistors being isolated from each other by a trench isolation structure formed in the substrate. Wherein at least a part of the base layer under at least one of the first and second transistors is strained, and the strained part of the base layer is adjacent to the insulating layer. The semiconductor device according to the invention increases the speed of the device and thus improves the performance of the device.

Abstract: Multiple types of gate stacks are formed on a doped semiconductor well. A high dielectric constant (high-k) gate dielectric is formed on the doped semiconductor well. A metal gate layer is formed in one device area, while the high-k gate dielectric is exposed in other device areas. Threshold voltage adjustment oxide layers having different thicknesses are formed in the other device areas. A conductive gate material layer is then formed over the threshold voltage adjustment oxide layers. One type of field effect transistors includes a gate dielectric including a high-k gate dielectric portion. Other types of field effect transistors include a gate dielectric including a high-k gate dielectric portion and a first threshold voltage adjustment oxide portions having different thicknesses. Field effect transistors having different threshold voltages are provided by employing different gate dielectric stacks and doped semiconductor wells having the same dopant concentration.

Abstract: A memory cell has N?6 transistors, in which two are access transistors, at least one pair [say (N?2)/2] are pull-up transistors, and at least another pair [say (N?2)/2] are pull-down transistors. The pull-up and pull-down transistors are all coupled between the two access transistors. Each of the access transistors and the pull-up transistors are the same type, p-type or n-type. Each of the pull-down transistors is the other type, p-type or n-type. The access transistors are floating body devices. The pull-down transistors are non-floating body devices. The pull-up transistors may be floating or non-floating body devices. Various specific implementations and methods of making the memory cell are also detailed.

Abstract: A method to fabricate a structure includes providing a silicon-on-insulator wafer, implanting through a semiconductor layer and an insulating layer a functional region having a first type of conductivity to be adjacent to a top surface of the substrate; implanting within the functional region through the semiconductor layer and the insulating layer an electrically floating back gate region having a second type of conductivity; forming isolation regions in the semiconductor layer; forming first and second transistor devices to have the same type of conductivity over the semiconductor layer such that one of the transistor devices overlies the implanted back gate region and the other one of the transistor devices overlies only the underlying top surface of the functional region not overlapped by the implanted back gate region; and providing an electrical contact to the functional region for applying a bias voltage.

Abstract: An object of the invention is to provide a semiconductor device having improved performance, high reliability, and a reduced chip size, in particular, to provide a semiconductor device having an MOSFET over an SOI substrate capable of maintaining its reliability while controlling the potential of a well below a gate electrode and preventing generation of parasitic capacitance. Generation of parasitic capacitance is prevented by controlling the potential of a well below a gate electrode by using a well contact plug passing through a hole portion formed in a gate electrode wiring. Generation of defects in a gate insulating film is prevented by making use of a gettering effect produced by causing an element isolation region to extend along the gate electrode.

Abstract: A CMOS chip comprising a high performance device region and a high density device region includes a plurality of high performance devices comprising n-type field effect transistors (NFETs) and p-type field effect transistors (PFETs) in the high performance device region, wherein the high performance devices have a high performance pitch; and a plurality of high density devices comprising NFETs and PFETs in the high density device region, wherein the high density devices have a high density pitch, and wherein the high performance pitch is about 2 to 3 times the high density pitch; wherein the high performance device region comprises doped source and drain regions, NFET gate regions having an elevated stress induced using stress memorization technique (SMT), gate and source/drain silicide regions, and a dual stressed liner, and wherein the high density device region comprises doped source and drain regions, gate silicide regions, and a neutral stressed liner.

Abstract: Disclosed is a method of forming an organic semiconductor layer comprising the steps of preparing a substrate having a groove formed on the surface, applying, to the surface of the substrate, a droplet of an organic semiconductor liquid in which an organic semiconductor material is dissolved or dispersed in a solvent, and drying the droplet to form the organic semiconductor layer, wherein the droplet is applied to a position of the substrate where a part of the circumference of the droplet is introduced into the groove.

Abstract: An island-shaped single crystal semiconductor layer whose top surface has a plane within ±10° from a {211} plane is formed on an insulating surface; a non-single-crystal semiconductor layer is formed in contact with the top surface and a side surface of the single crystal semiconductor layer and on the insulating surface; the non-single-crystal semiconductor layer is irradiated with laser light to melt the non-single-crystal semiconductor layer, and to crystallize the non-single-crystal semiconductor layer formed on the insulating surface with use of the single crystal semiconductor layer as a seed crystal, so that a crystalline semiconductor layer is formed. A semiconductor device having an n-channel transistor and a p-channel transistor formed with use of the crystalline semiconductor layer is provided.

Abstract: A method includes providing a substrate having a first surface, forming an isolation structure disposed partly in the substrate and having an second surface higher than the first surface by a step height, removing a portion of the isolation structure to form a recess therein having a bottom surface spaced from the first surface by less than the step height, forming a gate structure, and forming a contact engaging the gate structure over the recess. A different aspect involves an apparatus that includes a substrate having a first surface, an isolation structure disposed partly in the substrate and having a second surface higher than the first surface by a step height, a recess extending downwardly from the second surface, the recess having a bottom surface spaced from the first surface by less than the step height, a gate structure, and a contact engaging the gate structure over the recess.

Abstract: A semiconductor device of the present invention includes an n-channel first thin film transistor and a p-channel second thin film transistor on one and the same substrate. The first thin film transistor has a first semiconductor layer (27), and the second thin film transistor has a second semiconductor layer (22). The first semiconductor layer (27) and the second semiconductor layer (22) are formed from one and the same film. Each of the first semiconductor layer (27) and the second semiconductor layer (22) has a slope portion (27e, 22e) positioned in the periphery and a main portion (27m, 22m) which is a portion excluding the slope portion. A p-type impurity is introduced into only a part of the slope portion (27e) of the first semiconductor layer with higher density than the main portion (27m) of the first semiconductor layer, the main portion (22m) of the second semiconductor layer, and the slope portion (22e) of the second semiconductor layer.

Abstract: Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits.

Abstract: In a method of manufacturing a display device, a first insulating layer is formed on a semiconductor pattern. Ions of a first concentration are injected into source and drain domains of the semiconductor pattern and a lower electrode of the semiconductor pattern by using a mask pattern that selectively overlaps a channel domain of the semiconductor pattern and is positioned on the top of the first insulating layer. The mask pattern is removed. An ion injection process of injecting ions of a second concentration lower than the first concentration into the semiconductor pattern of the channel domain is directly performed in the first insulating layer. A gate electrode that overlaps the channel domain is formed on the top of the first insulating layer. An upper electrode that overlaps the lower electrode is formed on the top of the first insulating layer.

Abstract: A thin film transistor (TFT) array substrate for an X-ray detector and a method of fabricating the same are provided. The TFT array substrate includes a substrate, a gate line formed on the substrate, a data line crossing the gate line, a thin film transistor including a gate electrode, a source electrode, and a drain electrode, a first electrode connected to the drain electrode, a passivation layer formed over the gate line, the data line, the thin film transistor and the first electrode, a photoconductor formed over the passivation layer and connected to the first electrode, and a second electrode formed on the photoconductor.

Abstract: A structure has a functional region having a first type of conductivity and a top surface. The functional region is connected to a bias contact. The structure further includes an insulating layer; a semiconductor layer and first and second transistor devices having the same type of conductivity disposed upon the semiconductor layer. The structure further includes a first back gate region adjacent to the top surface and underlying one of the transistor devices, the first back gate region having a second type of conductivity; and a second back gate region adjacent to the top surface and underlying the other one of the transistor devices, the second back gate region having the first type of conductivity. The first transistor device has a first characteristic threshold voltage and the second transistor device has a second characteristic threshold voltage that differs from the first characteristic threshold voltage.

Abstract: A structure includes a semiconductor substrate having a first type of conductivity and a top surface; an insulating layer disposed over the top surface; a semiconductor layer disposed over the insulating layer and a plurality of transistor devices disposed upon the semiconductor layer. Each transistor device includes a source, a drain and a gate stack defining a channel between the source and the drain, where some transistor devices have a first type of channel conductivity and the remaining transistor devices have a second type of channel conductivity. The structure further includes a well region formed adjacent to the top surface of the substrate and underlying the plurality of transistor devices, the well region having a second type of conductivity and extending to a first depth within the substrate.

Abstract: In forming a thin film transistor, to form a film superior in quality to a film formed by a conventional CVD method and to form a film equal or superior in quality to a film formed by a thermal oxidation method at a temperature which does not affect a substrate. Plasma oxidation or plasma nitridation with a low electron temperature and a high electron density is performed to at least one of a glass substrate, a semiconductor film containing amorphous silicon formed into a predetermined pattern, a gate electrode and a wire pulled from the gate electrode, an insulating film to be a gate insulating film, and a protective film with a temperature of the glass substrate set at a temperature 100° C. or more lower than a strain point of the glass substrate.

Abstract: A method includes forming at least one shallow trench isolation structure in a substrate to isolate adjacent different type devices. The method further includes forming a barrier trench structure in the substrate to isolate diffusions of adjacent same type devices. The method further includes spanning the barrier trench structure with material to connect the diffusions of the adjacent same type device, on a same level as the adjacent same type devices.

Abstract: A method includes forming isolation regions in a semiconductor substrate to define a first field effect transistor (FET) region, a second FET region, and a diode region, forming a first gate stack in the first FET region and a second gate stack in the second FET region, forming a layer of spacer material over the second FET region and the second gate stack, forming a first source region and a first drain region in the first FET region and a first diode layer in the diode region using a first epitaxial growth process, forming a hardmask layer over the first source region, the first drain region, the first gate stack and a portion of the first diode layer, and forming a second source region and a second drain region in the first FET region and a second diode layer on the first diode layer using a second epitaxial growth process.

Abstract: A method is disclosed which is characterized as being process integration of raised source/drain and strained body for ultra thin planar and FinFET CMOS devices. NFET and PFET devices have their source/drain raised by selective epitaxy with in-situ p-type doped SiGe for the PFET device, and in-situ n-type doped Si:C for the NFET device. Such raised source/drains offer low parasitic resistance and they impart a strain onto the device bodies of the correct sign for respective carrier, electron or hole, mobility enhancement.

Abstract: Fabricating of semiconductor devices includes: depositing epitaxially a SiGe layer onto both NFET and PFET portions of a Si surface; blanket disposing a first sequence of layers over the SiGe layer including a high-k dielectric and a metal, incorporating the first sequence of layers into the gatestacks and gate insulators of both NFET devices and PFET devices; the first sequence of layers is selected to yield desired device parameter values for the PFET devices; removing the gatestack, the gate dielectric, and the SiGe layer for the NFET devices, re-forming the NFET devices by deploying a second sequence of layers that include a second high-k dielectric and a second metal; the second sequence of layers is selected to yield desired device parameter values for the NFET devices.

Abstract: A semiconductor structure and method for forming dielectric spacers and epitaxial layers for a complementary metal-oxide-semiconductor field effect transistor (CMOS transistor) are disclosed. Specifically, the structure and method involves forming dielectric spacers that are disposed in trenches and are adjacent to the silicon substrate, which minimizes leakage current. Furthermore, epitaxial layers are deposited to form source and drain regions, wherein the source region and drain regions are spaced at a distance from each other. The epitaxial layers are disposed adjacent to the dielectric spacers and the transistor body regions (i.e., portion of substrate below the gates), which can minimize transistor junction capacitance. Minimizing transistor junction capacitance can enhance the switching speed of the CMOS transistor.

Abstract: A replacement gate structure and method of fabrication are disclosed. The method provides for fabrication of both high performance FET and low leakage FET devices within the same integrated circuit. Low leakage FET devices are fabricated with a hybrid gate dielectric comprised of a low-K dielectric layer and a high-K dielectric layer. High performance FET devices are fabricated with a low-K gate dielectric.

Abstract: An integrated circuit device and method for manufacturing the integrated circuit device are disclosed. An exemplary method includes providing a substrate; forming a first gate over the substrate for a first device having a first threshold voltage characteristic, the first gate including a first material having a first-type work function; forming a second gate over the substrate for a second device having a second threshold voltage characteristic that is greater than the first threshold voltage characteristic, the second gate including a second material having a second-type work function that is opposite the first-type work function; and configuring the first device and the second device as a same channel type device.

Abstract: A negative differential resistance (NDR) device is designed and a possible compact device implementation is presented. The NDR device includes a voltage blocker and a current blocker and exhibits high peak-to-valley current ratio (PVCR) as well as high switching speed. The corresponding process and design are completely compatible with contemporary Si CMOS technology and area efficient. A single-NDR element SRAM cell prototype with a compact size and high speed is also proposed as its application suitable for embedded memory.

Abstract: A complementary metal-oxide semiconductor (CMOS) structure includes a substrate and a P-type field effect transistor (FET) and an N-type FET disposed adjacent to one another on the substrate. Each FET includes a silicon-on-insulator (SOI) region, a gate electrode disposed on the SOI region, a source stressor, and a drain stressor disposed across from the source stressor relative to the gate electrode, wherein proximities of the source stressor and the drain stressor to a channel of a respective FET are substantially equal.

Abstract: The present invention relates to a method for fabricating thin film transistors (TFTs), which includes the following steps: forming a semi-conductive layer on a substrate; forming a patterned photoresist layer with a first thickness and a second thickness on the semi-conductive layer; pattering the semi-conductive layer by using the patterned photoresist layer as a mask to form a patterned semi-conductive layer; removing the second thickness of the patterned photoresist layer; performing a first ion doping process on the patterned semi-conductive layer by using the first thickness of the patterned photoresist layer as a mask; removing the first thickness of the patterned photoresist layer; and forming a dielectric layer and a gate on the patterned semi-conductive layer. The present invention also discloses a method for fabricating an array substrate including aforementioned TFTs.

Abstract: A semiconductor device having a FIN type transistor including a FIN-shape semiconductor portion improved for reliability by suppressing scattering of the characteristics of the FIN-shape transistor by decreasing a difference between impurity concentration at an upper surface and impurity concentration on a lateral side of the FIN-shape semiconductor portion, in which a pad insulating film at a thickness of about 2 to 5 nm is formed to the upper surface of the FIN-shape semiconductor portion, cluster ions are implanted to one lateral side of the FIN-shape semiconductor portion from an oblique direction at a first implantation angle ?1 and then cluster ions are implanted to another lateral side of the FIN-shape semiconductor portion from an oblique direction at a second implantation angle ?2 in symmetrical with the first implantation angle ?1 and, subsequently, the cluster ions implanted to the FIN-shape semiconductor portion 10 are activated to form a diffusion region that forms a portion of a source region an

Abstract: The purpose of the present invention is to provide a reliable semiconductor device comprising TFTs having a large area integrated circuit with low wiring resistance. One of the features of the present invention is that an LDD region including a region which overlaps with a gate electrode and a region which does not overlap with the gate electrode is provided in one TFT. Another feature of the present invention is that gate electrode comprises a first conductive layer and a second conductive layer and portion of the gate wiring has a clad structure comprising the first conductive layer and the second conductive layer with a low resistance layer interposed therebetween.

Abstract: Epitaxially grown extension regions are disclosed for scaled CMOS devices. Semiconductor devices are provided that comprise a field effect transistor (FET) structure having a gate stack on a silicon substrate, wherein the field effect transistor structure comprises at least a channel layer formed below the gate stack. One or more etched extension regions containing an epitaxially grown dopant are provided in the channel layer.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. A complimentary metal oxide semiconductor (CMOS) device includes a PMOS transistor having at least two first gate electrodes comprising a first parameter, and an NMOS transistor having at least two second gate electrodes comprising a second parameter, wherein the second parameter is different than the first parameter. The first parameter and the second parameter may comprise the thickness or the dopant profile of the gate electrode materials of the PMOS and NMOS transistors. The first and second parameter of the at least two first gate electrodes and the at least two second gate electrodes establish the work function of the PMOS and NMOS transistors, respectively.

Abstract: The present invention provides a method for manufacturing a semiconductor device, by which a transistor including an active layer, a gate insulating film in contact with the active layer, and a gate electrode overlapping the active layer with the gate insulating film therebetween is provided; an impurity is added to a part of a first region overlapped with the gate electrode with the gate insulating film therebetween in the active layer and a second region but the first region in the active layer by adding the impurity to the active layer from one oblique direction; and the second region is situated in the one direction relative to the first region.

Abstract: An electrical device is provided with a p-type semiconductor device having a first gate structure that includes a gate dielectric on top of a semiconductor substrate, a p-type work function metal layer, a metal layer composed of titanium and aluminum, and a metal fill composed of aluminum. An n-type semiconductor device is also present on the semiconductor substrate that includes a second gate structure that includes a gate dielectric, a metal layer composed of titanium and aluminum, and a metal fill composed of aluminum. An interlevel dielectric is present over the semiconductor substrate. The interlevel dielectric includes interconnects to the source and drain regions of the p-type and n-type semiconductor devices. The interconnects are composed of a metal layer composed of titanium and aluminum, and a metal fill composed of aluminum. The present disclosure also provides a method of forming the aforementioned structure.

Abstract: A semiconductor structure includes an n-channel field effect transistor (NFET) nanowire, the NFET nanowire comprising a film wrapping around a core of the NFET nanowire, the film wrapping configured to provide tensile stress in the NFET nanowire. A method of making a semiconductor structure includes growing a film wrapping around a core of an n-channel field effect transistor (NFET) nanowire of the semiconductor structure, the film wrapping being configured to provide tensile stress in the NFET nanowire.

Abstract: A semiconductor circuit includes a plurality of semiconductor devices, each including a semiconductor islands having at least one electrical dopant atom and located on an insulator layer. Each semiconductor island is encapsulated by dielectric materials including at least one dielectric material portion. Conductive material portions, at least one of which abut two dielectric material portions that abut two distinct semiconductor islands, are located directly on the at least one dielectric material layer. At least one gate conductor is provided which overlies at least two semiconductor islands. Conduction across a dielectric material portion between a semiconductor island and a conductive material portion is effected by quantum tunneling. The conductive material portions and the at least one gate conductor are employed to form a semiconductor circuit having a low leakage current. A design structure for the semiconductor circuit is also provided.

Abstract: The present invention relates to a method for the manufacture of a semiconductor device by providing a first substrate; providing a doped layer in a surface region of the first substrate; providing a buried oxide layer on the doped layer; providing a semiconductor layer on the buried oxide layer to obtain a semiconductor-on-insulator (SeOI) wafer; removing the buried oxide layer and the semiconductor layer from a first region of the SeOI wafer while maintaining the buried oxide layer and the semiconductor layer in a second region of the SeOI water; providing an upper transistor in the second region by forming a back gate in or by the doped layer; and providing a lower transistor in the first region by forming source and drain regions in or by the doped layer.

Abstract: In one embodiment, a method of forming a semiconductor device includes forming a well region within a substrate. A plurality of transistors is formed within and/or over the well region. The method further includes forming a first discharge device within the substrate. The first discharge device is coupled to the well region and a low voltage node. During subsequent processing, the first discharge device discharges charge from the well region.

Abstract: A structure, method and system for complementary strain fill for integrated circuit chips. The structure includes a first region of an integrated circuit having multiplicity of n-channel and p-channel field effect transistors (FETs); a first stressed layer over n-channel field effect transistors (NFETs) of the first region, the first stressed layer of a first stress type; a second stressed layer over p-channel field effect transistors (PFETs) of the first region, the second stressed layer of a second stress type, the second stress type opposite from the first stress type; and a second region of the integrated circuit, the second region not containing FETs, the second region containing first sub-regions of the first stressed layer and second sub-regions of the second stressed layer.

Abstract: Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.

Abstract: The present invention relates to a process of making a zinc-oxide-based thin film semiconductor, for use in a transistor, comprising thin film deposition onto a substrate comprising providing a plurality of gaseous materials comprising at least first, second, and third gaseous materials, wherein the first gaseous material is a zinc-containing volatile material and the second gaseous material is reactive therewith such that when one of the first or second gaseous materials are on the surface of the substrate the other of the first or second gaseous materials will react to deposit a layer of material on the substrate and wherein the third gaseous material is inert with respect to reacting with the first or second gaseous materials.

Abstract: The invention relates to a transistor, a semiconductor device comprising the transistor and manufacturing methods for the transistor and the semiconductor device. The transistor according to the invention comprises: a substrate comprising at least a base layer, a first semiconductor layer, an insulating layer and a second semiconductor layer stacked sequentially; a gate stack formed on the second semiconductor layer; a source region and a drain region located on both sides of the gate stack respectively; a back gate comprising a back gate dielectric and a back gate electrode formed by the insulating layer and the first semiconductor layer, respectively; and a back gate contact formed on a portion of the back gate electrode. The back gate contact comprises an epitaxial part raised from the surface of the back gate electrode, and each of the source region and the drain region comprises an epitaxial part raised from the surface of the second semiconductor layer.

Abstract: A PMOS transistor is disclosed which includes a nitrogen containing barrier to oxygen diffusion between a gate dielectric layer and a metal gate in the PMOS transistor, in combination with a low oxygen region of the metal gate in direct contact with the nitrogen containing barrier and an oxygen rich region of the metal gate above the low oxygen content metal region. The nitrogen containing barrier may be formed by depositing nitrogen containing barrier material on the gate dielectric layer or by nitridating a top region of the gate dielectric layer. The oxygen rich region of the metal gate may be formed by depositing oxidized metal on the low oxygen region of the metal gate or by oxidizing a top region of the low oxygen region of the metal gate.

Abstract: Butted p-n junctions interconnecting back gates in an SOI process, methods for making butted p-n junctions, and design structures. The butted junction includes an overlapping region formed in the bulk substrate by overlapping the mask windows of the ion-implantation masks used to form the back gates. A damaged region may be selectively formed to introduce mid-gap energy levels in the semiconductor material of the overlapping region employing one of the implantation masks used to form the back gates. The damage region causes the butted junction to be leaky and conductively couples the overlapped back gates to each other and to the substrate. Other back gates may be formed that are floating and not coupled to the substrate.

Abstract: The present invention discloses a structure and process of basic complementary logic gate made by junctionless transistors. Junctionless N-channel transistor(s) and junctionless P-channel transistor(s) are formed on a semiconductor wafer, a conducting contact structure is used to connect the transistors to form a basic complementary logic gate(s) such as inverter, NAND, NOR, etc.

Abstract: Disclosed are process enhancements to fully integrate the processing of a photonics device into a CMOS manufacturing process flow. A CMOS wafer may be divided into different portions. One of the portions is for the CMOS devices and one or more other portions are for the photonics devices. The photonics devices include a ridged waveguide and a germanium photodetector. The germanium photodetector may utilize a seeded crystallization from melt process so there is more flexibility in the processing of the germanium photodetector.

Abstract: In sophisticated semiconductor devices, a strain-inducing semiconductor alloy may be positioned close to the channel region by forming cavities on the basis of a wet chemical etch process, which may have an anisotropic etch behavior with respect to different crystallographic orientations. In one embodiment, TMAH may be used which exhibits, in addition to the anisotropic etch behavior, a high etch selectivity with respect to silicon dioxide, thereby enabling extremely thin etch stop layers which additionally provide the possibility of further reducing the offset from the channel region while not unduly contributing to overall process variability.

Abstract: A semiconductor-on-insulator (SOI) substrate complementary metal oxide semiconductor (CMOS) device and fabrication methods include a p-type field effect transistor (PFET) and an n-type field effect transistor (NFET). Each of the PFET and the NFET include a transistor body of a first type of material and source and drain regions. The source and drain regions have a second type of material such that an injection charge into the source and drain region is greater than a parasitic charge into the transistor body to decrease parasitic bipolar current gain, increase critical charge (Qcrit) and reduce sensitivity to soft errors.

Abstract: A structure and method of fabricating the structure. The structure includes a first region of a semiconductor substrate separated from a second region of the semiconductor substrate by trench isolation formed in the substrate; a first stressed layer over the first region; a second stressed layer over second region; the first stressed layer and second stressed layer separated by a gap; and a passivation layer on the first and second stressed layers, the passivation layer extending over and sealing the gap.

Abstract: A semiconductor device having a cell region and a peripheral region includes an silicon on insulator (SOI) substrate having a stack structure of a silicon substrate, a buried insulation layer, and a silicon layer. An epi-silicon layer is formed in the buried insulation layer of the peripheral region and connects a peripheral portion of a channel area of the silicon layer to the silicon substrate. A gate is formed on the silicon layer and junction areas are formed in the silicon layer on both sides of the gate.