Abstract: A method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a display unit displaying an image and a driver positioned near the display unit to drive a light emitting element of the display unit in a lower mother substrate; forming a sealant and a plurality of bumps in an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to combine the lower mother substrate and the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed according to a first cutting line between the sealant and the bumps and a second cutting line corresponding to the bumps.

Abstract: An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element.

Abstract: An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the support structure; connecting the substrate and the first integrated circuit device; and encapsulating the first integrated circuit device and the support structure.

Abstract: A first sealing resin seals a space between a light emitting element and an insulating member, and a second sealing resin seals a space between a light receiving element and the insulating member. The first sealing resin includes a plurality of first particles having a refractive index higher than that of the first sealing resin. The content ratio of the first particles in the first sealing resin changes stepwise or continuously as the particles approach the insulating member from the light-emitting element. The content ratio of the first particles in the first sealing resin in a range up to 10 ?m from the light emitting element is higher than the content ratio of the first particles in the first sealing resin in a range up to 10 ?m from the insulating member.

Abstract: An organic light-emitting display apparatus includes a first substrate including a display unit having a light-emitting region and a non-light-emitting region, a second substrate parallel to the first substrate, and a reflective member on a surface of the second substrate that faces the first substrate, the reflective member corresponding to the non-light-emitting region of the display unit and being configured to sense touch, and the reflective member including a plurality of first pattern parts electrically connected along a first direction and a plurality of second pattern parts electrically connected along a second direction.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: The present invention provides an infrared OLED display device and the manufacturing method thereof. Wherein, the infrared OLED display device comprises multiple infrared OLED units, which are used to display infrared image; a solar cell, which is used to absorb sunlight and then convert it to electrical energy; a transformer, which is used to transform the voltage of the electrical energy generated from the solar cell to the voltage of power for the infrared OLED units; and a rechargeable battery, which is used to store the electrical energy after the transformer converts the voltage and to provide the power for the infrared OLED units; wherein, the solar cell is connected with the transformer, the transformer is connected with the rechargeable battery, and the rechargeable battery is connected with the multiple infrared OLED units.

Abstract: A method of imaging microscopic objects includes determining the relative depths of two or more semiconductor nanocrystals by analyzing images of the semiconductor nanocrystals at varying z-displacements.

Abstract: Disclosed is a light emitting apparatus. The light emitting apparatus includes a package body; first and second electrodes; a light emitting device electrically connected to the first and second electrodes and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second conductive semiconductor layers; and a lens supported on the package body and at least a part of the lens including a reflective structure. The package body includes a first cavity, one ends of the first and second electrodes are exposed in the first cavity and other ends of the first and second electrodes are exposed at lateral sides of the package body, and a second cavity is formed at a predetermined portion of the first electrode exposed in the first cavity.

Abstract: The present invention provides manufacturing methods of an LED and a light emitting device. The manufacturing method of the LED includes: providing a substrate; forming on the substrate an LED chip and a second electrode successively; forming a lens structure covering the second electrode; coating the lens structure with fluorescent powder; forming a plurality of evenly distributed contact holes on a backface of the substrate, the contact holes extending through the substrate and to the LED chip; and filling the contact holes with conducting material till the backface of the substrate is covered by the conducting material. The LED has a high luminous efficiency and the manufacturing method is easy to implement.

Abstract: The present invention relates to a package structure of an optical module. The light emitting chip and the light receiving chip are disposed on the light emitting region and the light receiving region of the substrate, respectively. Two encapsulating gels are coated on the light emitting chip and the light receiving chip to form a first and a second hemispherical lens portions thereon, respectively. A cover is affixed on the substrate and each of the encapsulating gels and has a light emitting hole and a light receiving hole, where the first and second lens portions are accommodated, respectively. In this way, the package structure of an optical module of the present invention can be made with the encapsulating gels of different curvatures according to different needs to improve the luminous efficiency of the light emitting chip effectively and to improve the reception efficiency of the light receiving chip.

Abstract: A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.

Abstract: This invention relates to an optical module package structure. A substrate is defined with a light receiving region and a light emitting region. A light receiving chip and a light emitting chip are disposed on the light receiving region and the light emitting region of the substrate, respectively. An electronic unit is disposed on the substrate and electrically connected to the light emitting chip. Two encapsulating gels are coated on each of the chips and the electronic unit. A cover is disposed on the substrate and has a light emitting hole and a light receiving hole, located above the light emitting chip and the light receiving chip, respectively. In this way, the package structure of the optical module of the present invention integrates passive components, functional ICs or dies into a module, and the optical module provides the functions of current limiting or function adjustment.

Abstract: This invention relates to a package structure of an optical module. A light emitting and light receiving chips are disposed on a light emitting and light receiving region of the substrate, respectively. Two encapsulating gels cover the light emitting chip and the light receiving chip, respectively, and form a first and a second hemispherical lens portions on the light emitting chip and the light receiving chip, respectively. A cover is affixed on the substrate and each of the encapsulating gels and has a light emitting hole and a light receiving hole, wherein the first and the second lens portions are accommodated, respectively. An engaging means is formed on an adjacent surface between each encapsulating gels and the cover in a horizontal direction. Thereby, the package structure of the optical module of the present invention increases the connection region between each encapsulating gels and the cover to enhance the engagement.

Abstract: An organic optoelectronic device has a first substrate, on which a functional layer stack having at least one first electrode, thereabove an organic functional layer and thereabove a second electrode is arranged. A encapsulating arrangement includes a second substrate, on which a connecting material and at least one spacer facing the functional layer stack are applied. The connecting material is arranged between the first and second substrate and mechanically connects the first and second substrate together. The functional layer stack is enclosed by the connecting material in a frame-like manner. At least one of the first and second electrode includes at least one opening, above which the at least one spacer is arranged and which has a larger lateral dimension that the spacer.

Abstract: This invention discloses methods and apparatus to form organic semiconductor transistors upon three-dimensionally formed insert devices. In some embodiments, the present invention includes incorporating the three-dimensional surfaces with organic semiconductor-based thin film transistors, electrical interconnects, and energization elements into an insert for incorporation into ophthalmic lenses. In some embodiments, the formed insert may be directly used as an ophthalmic device or incorporated into an ophthalmic device.

Abstract: A method for manufacturing a compound semiconductor device, the method includes: forming a compound semiconductor laminated structure; removing a part of the compound semiconductor laminated structure, so as to form a concave portion; and cleaning the inside of the concave portion by using a detergent, wherein the detergent contains a base resin compatible with residues present in the concave portion and a solvent.

Abstract: An object is to provide a manufacturing method of a semiconductor device in which a defect in characteristics due to a crack occurring in a semiconductor device is reduced. Provision of a crack suppression layer formed of a metal film in the periphery of a semiconductor element makes it possible to suppress a crack occurring from the outer periphery of a substrate and reduce damage to the semiconductor element. In addition, even if the semiconductor device is subjected to physical forces from the outer periphery in separation and transposition steps, progression (growth) of a crack to the semiconductor device can be suppressed by the crack suppression layer.

Abstract: A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.

Abstract: A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

Abstract: A method of applying a conversion means to an optoelectronic semiconductor chip includes preparing the optoelectronic semiconductor chip having a main radiation face, preparing the conversion means, the conversion means being applied to a main carrier face of a carrier, arranging the conversion means such that it faces the main radiation face and has a spacing relative to the main radiation face, and releasing the conversion means from the carrier and applying the conversion means to the main radiation face by irradiation and heating of an absorber constituent of the conversion means and/or of a release layer located between the conversion means and the carrier with a pulsed laser radiation which passes through the carrier.

Abstract: Disclosed are an organic light emitting display that enables realization of a thin film shape and flexibility, and exhibits superior contact properties in touch pads based on an improved structure, and a method for manufacturing the same, wherein a distance between the outermost surface of the touch pad portion and the outermost surface of the dummy pad portion in the touch pad portion is smaller than the distance in a neighboring portion adjacent to the touch pad portion.

Abstract: The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.

Abstract: A MEMS sensor has at least a movable element designed to oscillate at an oscillation frequency, and an integrated measuring system coupled to the movable element to provide a measure of the oscillation frequency. The measuring system has a light source to emit a light beam towards the movable element and a light detector to receive the light beam reflected back from the movable element, including a semiconductor photodiode array. In particular, the light detector is an integrated photomultiplier having an array of single photon avalanche diodes.

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.

Abstract: The present disclosure describes cavity enhanced spectroscopy (CES) apparatuses, and systems, and methods of forming the same. An example of a CES apparatus includes a first partial reflector, an optical cavity to expose a sample to electromagnetic radiation below the first partial reflector, and a semiconductor wafer with the first partial reflector and the optical cavity formed thereon.

Abstract: The opto-electronic module comprises a substrate member (P); at least one emission member (E1; E2) mounted on said substrate (P); at least one detecting member (D) mounted on said substrate (P); at least one optics member (O) comprising at least one passive optical component (L); at least one spacer member (S) arranged between said substrate member (P) and said optics member (O). The opto-electronic modules can be very small and can be produced in high quality in high volumes. In particular, at least two emission members (E1, E2), e.g., two LEDs, are provided, for emitting light of variable color. This can improve illumination of a scene.

Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.

Abstract: The present invention discloses an OLED panel, a manufacturing method and related testing method. The OLED panel includes a substrate (20), a cover (40) positioned oppositely to the substrate (20), an OLED device positioned on the substrate (20), a humidity sensing film (42) positioned on the cover (40), a sealed frame (60) for adhering the substrate (20) and the cover (40), a plurality of testing wires between the humidity sensing film (42) and the cover (40), wherein one end of each of the testing wires is electrically connected to the humidity sensing film (42); wherein the substrate (20), the cover (40), and the sealed frame (246) form a sealed space, the OLED device and the humidity sensing film (42) are inside the sealed space, and another end of each of the testing wires stretches to an outside of the sealed space (246).

Abstract: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process. In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.

Abstract: An apparatus for use in optoelectronics includes a first alignment element and a first wafer comprising a through optical via. The first alignment element is bonded to the first wafer, such that the through optical via is uncovered by the first alignment element. In addition, the first wafer further comprises a plurality of bond pads upon which an optoelectronic component having an optical element is to be attached, in which the first alignment element is to mate with a mating alignment element on an optical transmission medium, and wherein the optical transmission medium is to be passively aligned with the optical element through the through optical via when the first alignment element is mated with the mating alignment element on the optical transmission medium.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.

Abstract: According to one embodiment, a display device includes a first substrate, a second substrate, a display layer, a seal unit, a protrusion and a spacing adjustment layer. The display layer is provided between the first substrate and the second substrate. The seal unit surrounds the display layer between the first substrate and the second substrate. The protrusion is provided along an outer edge of the seal unit at an outside of the seal unit on a first major surface of the first substrate facing the display layer. The spacing adjustment layer is provided along the outer edge at the outside of the seal unit, includes a portion overlaying the protrusion as viewed along a direction from the first substrate toward the second substrate, and is in contact with the protrusion.

Abstract: A motion sensor includes: a substrate, which includes a plurality of lead frame layers and a plurality of ceramic layers; a light source, disposed on the substrate, for emitting light; a sensing device, disposed on the substrate, for receiving the light to perform motion sensing; a cover, for fixing and protecting the light source and the sensing device; and an adhesive, for gluing the cover to the substrate, the adhesive including a component capable of blocking the light; wherein the light is infrared light, visible light or ultraviolet light.

Abstract: A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

Abstract: The present disclosure provides an organic light emitting device and a manufacturing method thereof. When the photovoltaic units are the integrated above the OLED unit, the photovoltaic units are transparent solar panels; when the photovoltaic units are integrated under the OLED unit, the photovoltaic units are gallium arsenide solar panels. By means of integrating a plurality of photovoltaic units are integrated into the organic light emitting devices, the present disclosure possesses functions of the transformation of electrical energy from luminous energy and the storage of the electrical energy in the photovoltaic units, i.e., the present disclosure is self powdered without any external power supply. Therefore, the present disclosure can achieve the environmental protection and the energy saving, as well as small volume, light weight and high integration level.

Abstract: An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a sensor region formed in the semiconductor substrate; a light emitting device disposed on the second surface of the semiconductor substrate; at least one first conducting bump disposed on the first surface of the semiconductor substrate and electrically connected to the sensor region; at least one second conducting bump disposed on the first surface of the semiconductor substrate and electrically connected to the light emitting device; and an insulating layer located on the semiconductor substrate to electrically insulate the semiconductor substrate from the at least one first conducting bump and the at least one second conducting bump.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer d an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.

Abstract: A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.

Abstract: A method for manufacturing an LED module includes following steps: providing a SMT (Surface Mount Technology) apparatus having a CCD (Charge-Coupled Device) image sensor and a nozzle, and providing a PCB and fixing the PCB in the SMT apparatus; providing a plurality of LEDs and mounting the LEDs on the PCB by the SMT apparatus; providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens, and the CCD image sensor imaging the lens and identifying the patterned portions, and then the SMT apparatus obtaining a location of the lens relative to the LED; positioning the lens on the PCB to cover the LED by the SMT apparatus; and fixing the lens on the PCB.

Abstract: A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

Abstract: An optoelectronic packaging assembly having an optical interposer and a method of same. The assembly includes a photonic and/or optoelectronic device; a planar optical interposer coupled to the photonic and/or optoelectronic device on a first side of the optical interposer and including an optical transmission element on a second side opposite to the first side; a deflecting element; and at least one optical waveguide on the first side, in-plane with the optical interposer. The waveguide is coupled at one end to the photonic and/or optoelectronic device and at another end to the deflecting element. The deflecting element is configured to enable optical transmission between the waveguide and the optical transmission element through the optical interposer. The optical interposer includes a material allowing for optical transmission between the deflecting element and the optical transmission element.

Abstract: A manufacturing method of an electronic component package, includes: forming electrode pads on a main surface of a first electronic component; forming first bonding wires shaped in loop so as to be electrically connected with the electrode pads and elongated upward from the electrode pads and such that both ends of the first bonding wires are on the electrode pad, respectively; forming a resin layer over the main surface of the first electronic component so as to embed the first bonding wires; removing the resin layer so as to expose ends of the first bonding wires from the resin layer and removing the end of each of the first bonding wires so that two wires are elongated from on each of the electrode pads; and forming a metallic layer on the surface of the resin layer after removing so that the first bonding wires are electrically connected with the metallic layer.

Abstract: A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

Abstract: A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.

Abstract: A light-emitting device includes a circuit substrate including at least a pair of electrodes, an LED element electrically mounted on the circuit substrate, a phosphor plate disposed on an upper surface of the LED element, a diffuser plate disposed on an upper surface of the phosphor plate, and a white resin disposed on an upper surface of the circuit substrate and covering a peripheral side surface of the LED element, a peripheral side surface of the phosphor plate, and a peripheral side surface of the diffuser plate. The present invention makes it possible to obtain a planar light-emitting surface even with a plurality of LEDs, and also, a problem of color-ring occurrence caused by a phosphor may be less represented.

Abstract: The subject matter disclosed herein relates to a photonic module comprising: a silicon-on-insulator (SOI) wafer; one or more photonic components on the SOI wafer; a plurality of metal pads to receive integrated circuit (IC) chips to be mounted on the SOI wafer; silicon optical waveguides to transfer optical signals among terminals of individual the IC chips, wherein the silicon optical waveguides comprise portions of the SOI wafer; and silica optical waveguides to transfer optical signals among terminals of different the IC chips.

Abstract: A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.