Plural Emissive Devices Patents (Class 438/28)
  • Publication number: 20150129910
    Abstract: To connect multiple LED devices, each LED device is placed in a holder. A first wire is connected to a first wire connection point on the holder and a second wire is connected to a second wire connection point on the holder. The first wire is also connected to a first wire connection point on a circuit board The second wire is also connected to a second wire connection point on the circuit board. A connector may be used to connect the wires to the wire connection points on the circuit board. The circuit board includes traces to connect the LED devices to each other or to other components.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: ABL IP Holding LLC
    Inventor: Daniel Vincent Sekowski
  • Publication number: 20150129845
    Abstract: An organic light emitting display device having a display substrate; a display element layer formed on the display substrate and including a plurality of pixels, a thin film encapsulation layer which covers and protects the display substrate and the display element layer; a function film disposed on the thin film encapsulation layer, a first adhesive layer disposed between the thin film encapsulation layer and the functional film, a window attached onto the functional film which protects the display element layer, and a second adhesive layer disposed between the functional film and the window, in which the first adhesive layer and the second adhesive are formed by deposition, a surface processing is performed, and facing surfaces are adhered with each other.
    Type: Application
    Filed: June 25, 2014
    Publication date: May 14, 2015
    Inventors: Seung Hun Kim, Jin Koo Kang, Soo Youn Kim, Hyun Ho Kim, Seung Yong Song, Cheol Jang, Sang Hwan Cho, Chung Sock Choi, Sang Hyun Park
  • Patent number: 9029887
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: May 12, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Kevin Tetz
  • Publication number: 20150125978
    Abstract: There is provided a method for improving heat dissipation in systems that use LEDs with high power density mounted on a printed circuit board, the LEDs each being provided, on a face thereof, with a plurality of electrical contacts for connecting electrically the LEDs to conducting tracks made on the board, and with a heat dissipating element, the board including a substrate made of heat-conducting material, covered by a layer of electrically insulating material, on which the conducting tracks are made, the LEDs being mounted on the board in such a manner that the face with the heat dissipating element faces the layer of electrically insulating material, the method including the steps of removing the material of the electrically insulating layer at a contact zone between the heat dissipating element of each LED and the electrically insulating layer; and making a heat-conducting connection between the heat dissipating element and substrate.
    Type: Application
    Filed: April 29, 2013
    Publication date: May 7, 2015
    Inventor: Massimiliano Dal Pont
  • Publication number: 20150123085
    Abstract: A display apparatus includes a substrate, a display unit on the substrate and including an emission area and a non-emission area, a first blocking layer at the non-emission area on the display unit, the first blocking layer having a thickness that tapers toward an edge of the first blocking layer, and a second blocking layer on the first blocking layer and configured to block external light reflection.
    Type: Application
    Filed: May 5, 2014
    Publication date: May 7, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyun-Ho Kim, Seung-Yong Song, Sang-Hwan Cho, Jin-Koo Kang, Soo-Youn Kim, Seung-Hun Kim, Cheol Jang, Chung-Sock Choi, Sang-Hyun Park
  • Patent number: 9024921
    Abstract: An organic light emitting diode (OLED) display including: a substrate including a pixel area; a peripheral area enclosing the pixel area; a gate line; a data line; corresponding driving lines; a pixel electrode; an organic light emitting layer; a common electrode; and a getter formed at the peripheral area and partially overlapping the common electrode, wherein the driving lines overlapping the getter have a plurality of openings filled with the getter such that the getter amount may be increased, thereby increasing the moisture absorption amount.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: May 5, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ki-Nyeng Kang, Kie Hyun Nam, Young-Hee Nam
  • Patent number: 9024349
    Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: May 5, 2015
    Assignee: Cree, Inc.
    Inventors: Ashay Chitnis, James Ibbetson, Arpan Chakraborty, Eric J. Tarsa, Bernd Keller, James Seruto, Yankun Fu
  • Patent number: 9023672
    Abstract: A light emitting system and related method are disclosed.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: May 5, 2015
    Inventors: Todd Hodrinsky, Donald T. Wesson, Jr., Deborah D. Cebry, Matthew D. Gidman, Robert M. Sarazin
  • Publication number: 20150115293
    Abstract: A light emitting diode (LED) display panel and fabrication method thereof are provided. The LED display panel includes a plurality of dielectric patterns and LED devices, and the dielectric patterns are formed on a substrate subsequent to formation of the LED devices. The dielectric pattern surrounds sidewalls of the corresponding LED device, and exposes an electrode of the LED device. The upper surface of the dielectric pattern and the electrode of the LED device are located at the same level approximately, and a connection electrode is disposed on the dielectric pattern, and electrically connected to the electrode of the LED device and a signal line.
    Type: Application
    Filed: June 12, 2014
    Publication date: April 30, 2015
    Inventors: Tsung-Tien Wu, Kang-Hung Liu, Jiun-Jye Chang, Min-Feng Chiang
  • Publication number: 20150115248
    Abstract: A display device includes a display panel configured to display an image, and a protection film coupled to a lower portion of the display panel. The protection film includes a support film contacting the display panel and a stress control layer below the support film, and the stress control layer includes a plurality of nanobeads.
    Type: Application
    Filed: July 29, 2014
    Publication date: April 30, 2015
    Inventors: Yong Hoon Chun, Soon Ryong Park, Seok Gi Baek, Jung Ho So, Chul Woo Jeong
  • Publication number: 20150115234
    Abstract: An organic light emitting display apparatus includes a first substrate, a second substrate, an organic light emitting device, a thin film transistor, a wiring pattern and a seal. The first substrate includes a first region, a second region and a third region. The third region surrounds the first region. The second region is between the first region and the third region, and is partially overlapped with the third region. The second substrate faces the first substrate. The organic light emitting device is disposed on the first substrate in the first region. The thin film transistor is disposed on the first substrate in a region where the second region and the third region overlap. The wiring pattern is disposed on the first substrate in the second region. The seal is disposed in the third region, between the first substrate and the second substrate in the third region.
    Type: Application
    Filed: June 6, 2014
    Publication date: April 30, 2015
    Inventor: Sang-Min Hong
  • Publication number: 20150115290
    Abstract: The invention disclosure relates to a manufacturing method comprising the formation of elemental LED or photovoltaic structures on a first substrate, each comprising at least one p-type layer, an active zone and an n-type layer, formation of a first planar metal layer on the elemental structures, provision of a transfer substrate comprising a second planar metal layer, assembly of the elemental structures with the transfer substrate by bonding of the first and second metal layers by molecular adhesion at room temperature, and removal of the first substrate.
    Type: Application
    Filed: June 14, 2013
    Publication date: April 30, 2015
    Inventor: Pascal Guenard
  • Publication number: 20150115233
    Abstract: Disclosed is an organic light-emitting device. The organic light-emitting device includes a first pixel electrode that is disposed on a substrate, a first conductive film that is formed on the substrate to cover the first pixel electrode, a second conductive pattern and an insulating layer that are sequentially formed on the first conductive film and include an opening which exposes a portion of a top of the first conductive film, a hole injection layer that is formed on the opening and the insulating layer to cover the exposed first conductive film, a hole transport layer that is formed in a partial region of the hole injection layer and the opening, and an emissive layer that is formed on the hole transport layer.
    Type: Application
    Filed: May 15, 2014
    Publication date: April 30, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventor: Young-Il Kim
  • Publication number: 20150115310
    Abstract: Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 30, 2015
    Inventors: Ki Myung Nam, Seung Ho Park, Young Chul Jun
  • Patent number: 9018653
    Abstract: A light emitting device includes a light emitting element and a package. The package is made up of a molded article and a lead that is embedded in the molded article. The lead includes a mounting part on which the light emitting element is mounted, a terminal part that is linked to the mounting part, and an exposed part. The package has a front face that is a light emitting face, a rear face opposite the front face, and a bottom face contiguous with the front face and the rear face. The light emitting element is mounted on the front face side of the mounting part. The exposed part is linked to the rear face side of the mounting part, and is exposed from the molded article at the bottom face and the rear face. The terminal part is exposed from the molded article at the bottom face.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: April 28, 2015
    Assignee: Nichia Corporation
    Inventor: Ryohei Yamashita
  • Patent number: 9018648
    Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 28, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Kuo-Ming Chiu, Tsung-Chi Lee, Chia-Hao Wu, Meng-Sung Chou
  • Patent number: 9018618
    Abstract: There is provided a semiconductor light emitting device including: an n-type semiconductor layer; a p-type semiconductor layer; and an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer, and including a plurality of alternately stacked quantum barrier layers and quantum well layers, wherein at least a portion of the plurality of quantum well layers has different thicknesses, wherein a thickness of a first quantum well layer most adjacent to the p-type semiconductor layer is less than a thickness of a second quantum well layer adjacent thereto and greater than a thickness of a third quantum well layer, other than the first and second quantum well layers.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: April 28, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong Hyun Lee, Ki Ho Park, Suk Ho Yoon, Sang Heon Han, Jae Sung Hyun
  • Publication number: 20150111329
    Abstract: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.
    Type: Application
    Filed: December 27, 2014
    Publication date: April 23, 2015
    Inventors: Ming-Hsien Wu, Ying-Chien Chu, Shih-Hao Wang, Yen-Hsiang Fang, Mu-Tao Chu
  • Publication number: 20150108513
    Abstract: A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.
    Type: Application
    Filed: December 22, 2014
    Publication date: April 23, 2015
    Inventors: Arun Virupaksha Gowda, Donald Paul Cunningham, Shakti Singh Chauhan
  • Publication number: 20150108436
    Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.
    Type: Application
    Filed: April 30, 2014
    Publication date: April 23, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Jin Sic Min, Dae Geun Lee, Sang Urn Lim, Eu Tteum Kim
  • Publication number: 20150108461
    Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.
    Type: Application
    Filed: December 24, 2014
    Publication date: April 23, 2015
    Inventors: Prashant MANDLIK, Ruiqing MA, Jeffrey SILVERNAIL, Julia J. BROWN, Lin HAN, Sigurd WAGNER, Luke WALSKI
  • Patent number: 9012249
    Abstract: An organic light emitting diode display comprises a display substrate including an organic light emitting element, an encapsulation substrate disposed to face the display substrate, a sealant disposed between edges of the display substrate and the encapsulation substrate for bonding and sealing the display substrate and the encapsulation substrate together, a filler filling in a space between the display substrate and the encapsulation substrate, first spacers formed on one surface of the display substrate contacting the filler, and second spacers formed on one surface of the encapsulation substrate contacting the filler. The display substrate and the encapsulation substrate are divided into a dropping area and a spreading area surrounding the dropping area and positioned relatively close to the sealant, and either or both of the first spacers and the second spacers have different shapes in the dropping area and in the spreading area.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: April 21, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventor: Kyung-Jun Lee
  • Publication number: 20150102318
    Abstract: An organic light emitting display device includes a substrate, a display element on the substrate, and an encapsulation member on the substrate. The encapsulation member encapsulates the display element. The encapsulation member includes a plurality of organic layers and a plurality of inorganic layers. Each inorganic layer includes a plurality of inorganic blocks that are separate from each other. The inorganic layers are between the organic layers.
    Type: Application
    Filed: August 21, 2014
    Publication date: April 16, 2015
    Inventor: Kun-Won LEE
  • Publication number: 20150102292
    Abstract: An exemplary embodiment of the present invention discloses an organic light-emitting display apparatus including: a display substrate including pixel areas and a non-pixel area; a sealing substrate disposed facing the display substrate; a spacer disposed in the non-pixel area of the display substrate, between the display substrate and the sealing substrate, and configured to maintain an interval between the display substrate and the sealing substrate; and a metal layer disposed under the spacer.
    Type: Application
    Filed: February 20, 2014
    Publication date: April 16, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventor: Do-Hoon Kim
  • Publication number: 20150102326
    Abstract: A flexible organic light emitting diode (OLED) display according to an exemplary embodiment includes: a substrate; an organic light emitting diode (OLED) layer provided on the substrate; and a thin film encapsulation layer provided on the OLED layer. The thin film encapsulation layer includes a plurality of laminated inorganic layers, at least one inorganic layer of the plurality of inorganic layers includes a plurality of inorganic layer patterns that are disposed to be spaced apart from each other on a plane, and an organic layer is formed between the plurality of inorganic layer patterns.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 16, 2015
    Inventor: Chi Wook An
  • Publication number: 20150102300
    Abstract: An organic light-emitting display apparatus and a method of manufacturing the organic light-emitting display apparatus is provided. The organic light-emitting display apparatus may include a first substrate including a display portion, a second substrate disposed opposite the first substrate, a sealing line that encloses the display portion and binds the first substrate to the second substrate; and a plurality of sealing branches binding the first substrate to the second substrate in which one end of each of the plurality of sealing branches contacts the sealing line and another end of each of the plurality of sealing branches does not contact the sealing line.
    Type: Application
    Filed: June 3, 2014
    Publication date: April 16, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventor: Su-Cheol GONG
  • Patent number: 9006759
    Abstract: A light-emitting device is provided that aims not to affect a service life and characteristics of light emission and includes two electrodes formed on the upper surface of a substrate with a gap at a central portion of the upper surface of the substrate between the two electrodes, a first light-emitting diode element mounted on the first electrode, and a second light-emitting diode element mounted on the second electrode. The first light-emitting diode element includes a pair of element electrodes on an upper surface of the first light-emitting diode element and the second light-emitting diode element includes a pair of element electrodes on an upper surface of the second light-emitting diode element. The first light-emitting diode element is connected by a wire to the first electrode and/or the second electrode. The second light-emitting diode element is connected by a wire to the first electrode and/or the second electrode.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: April 14, 2015
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.
    Inventors: Junji Miyashita, Kosuke Tsuchiya, Nodoka Oyamada
  • Publication number: 20150097206
    Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.
    Type: Application
    Filed: October 9, 2014
    Publication date: April 9, 2015
    Inventors: Cheng-Yen CHEN, Chun-Chieh CHIN, Yun-Li LI
  • Publication number: 20150097201
    Abstract: [Problem] To provide a chip-on-board light emitting device and a method for manufacturing the same such that even though the light emitting device is a chip-on-board light emitting device, it is possible to improve color rendering thereof without excessively reducing the amount of light emission and without installing special circuit patterns or performing current control. [Solution] A chip-on-board light emitting device in which a plurality of LED elements are mounted directly on a package substrate includes a circuit pattern formed on the package substrate, the circuit pattern including a plurality of mounting sections on which the plurality of LED elements are mounted and an anode electrode and cathode electrode pair.
    Type: Application
    Filed: May 17, 2013
    Publication date: April 9, 2015
    Inventor: Yuji Imai
  • Publication number: 20150099320
    Abstract: Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Inventor: Tzu-Chi CHENG
  • Publication number: 20150098209
    Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.
    Type: Application
    Filed: May 9, 2013
    Publication date: April 9, 2015
    Inventors: Bum Mo Ahn, Seung Ho Park, Ki Myung Nam
  • Publication number: 20150091025
    Abstract: A light-emitting device includes a sheet-shaped die bonding material on a substrate including a wiring, and a plurality of light-emitting elements fixed onto the die bonding material. A method of manufacturing the light-emitting device includes applying the die bonding material in a paste form to the substrate such that the die bonding material is shared by the plurality of light-emitting elements, placing the plurality of light-emitting elements on the die bonding material in the paste form, and curing the die bonding material after placing the plurality of light-emitting elements so as to fix the plurality of light-emitting elements onto the bonding material.
    Type: Application
    Filed: May 29, 2014
    Publication date: April 2, 2015
    Applicant: TOYODA GOSEI CO., LTD.
    Inventors: Yosuke TSUCHIYA, Hiroyuki TAJIMA, Shota SHIMONISHI, Shigeo TAKEDA, Tomohiro MIWA
  • Publication number: 20150090995
    Abstract: Discussed are an organic light emitting diode (OLED) display device and a method of manufacturing the same, which can simplify a manufacturing process and decrease an error. The OLED display device includes a substrate on which an organic light emitting diode (OLED) is formed, a first inorganic thin layer configured to cover the OLED, an organic deposition layer configured to have an organic layer characteristic covering the first inorganic thin layer, and a second inorganic thin layer configured to cover the organic deposition layer.
    Type: Application
    Filed: October 1, 2014
    Publication date: April 2, 2015
    Applicant: LG DISPLAY CO., LTD.
    Inventors: SangChul JUNG, MinJu KIM
  • Patent number: 8993358
    Abstract: A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes disposing a stencil over the template and the plurality of LED dies. The stencil has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the stencil and the template.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: March 31, 2015
    Assignee: LedEngin, Inc.
    Inventors: Zequn Mei, Xiantao Yan
  • Patent number: 8994040
    Abstract: A method of producing an optoelectronic component including providing an epitaxially grown layer sequence on a growth substrate, which comprises a suitable layer for light emission; applying a metal layer to the epitaxially grown layer sequence; applying a molding support to the metal layer, the molding support including a support material with a first coefficient of thermal expansion and a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; and detaching the growth substrate.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: March 31, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Gudrun Lindberg
  • Patent number: 8994048
    Abstract: A semiconductor device has a substrate with a first and second recess formed in a surface of the substrate using a wet etch process. The second recess can have a size different from a size of the first recess. A plurality of conductive vias are formed in a surface of the first and second recesses using a dry etch process. A first conductive layer is formed over the surface of the substrate, over curved side walls of the first and second recesses, and electrically connected to the plurality of conductive vias. A first and second semiconductor die are mounted into the first and second recesses respectively. The second semiconductor die can have a size different from a size of the first semiconductor die. The first and second semiconductor die are electrically connected to the first conductive layer. An interconnect structure is electrically connected to the plurality of conductive vias.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: March 31, 2015
    Assignee: STATS ChipPAC, Ltd.
    Inventors: JoonYoung Choi, YongHee Kang
  • Publication number: 20150084027
    Abstract: An organic light emitting display device may include a first cover, a protection member disposed on the first cover, a display panel disposed on the protection member, and a second cover disposed on the protection member. The protection member may include a plurality of layers having a plurality of pores, respectively. The protection member may reduce or remove a tolerance generated in manufacturing processes, and also may absorb or remove an external impact.
    Type: Application
    Filed: September 25, 2014
    Publication date: March 26, 2015
    Inventors: Min-Seop Kim, Hwan-Jin Kim
  • Patent number: 8987750
    Abstract: A LED chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without welding a gold wire for the conductive channel as in a traditional LED. Thus, the method is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: March 24, 2015
    Assignees: Boe Technology Group Co., Ltd., Beijing Boe Chatani Electronics Co., Ltd.
    Inventors: Weixin Zheng, Guoheng Ma, Dongsheng Yang, Zhonglian Qiao
  • Patent number: 8987711
    Abstract: Provided is an organic electroluminescence element containing a light transmissive base material laminated thereon a transparent electrode, a light emitting layer and a counter electrode in this order, wherein the light transmissive base material contains a light transmissive resin substrate (resin substrate B) provided with a hard coat layer on both surfaces of the light transmissive resin substrate, the hard coat layers containing metal oxide nano particles; and the transparent electrode is formed on one hard coat layer (H1); and a rugged structure is formed on one surface of the other hard coat layer (H2), the one surface being opposite to another surface of the other hard coat layer (H2) which is contacted with the light transmissive resin substrate (resin substrate B).
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: March 24, 2015
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Kunimasa Hiyama, Toshiya Kondo, Takeshi Ono
  • Patent number: 8987021
    Abstract: A manufacturing method of a light-emitting device includes: a die-bonding process in which a semiconductor light emitting element is placed on a bonding target member via an adhesive containing a silicone resin so that a surface opposite to an exposure surface faces the bonding target member, and the adhesive is heated to bond the semiconductor light emitting element to the bonding target member; and a wire-bonding process in which a wire is connected to the exposure surface. The semiconductor light emitting element includes a laminated semiconductor layer having a light emitting layer and an electrode including a metal layer containing Au and provided on the laminated semiconductor layer and a covering layer containing Ni or Ta and covering the metal layer, the thickness of the covering layer being set smaller than 100 nm and the exposure surface to expose the covering layer to the outside being formed.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: March 24, 2015
    Assignee: Toyoda Gosei Co., Ltd.
    Inventor: Mineo Okuyama
  • Patent number: 8987771
    Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: March 24, 2015
    Assignees: Koninklijke Philips N.V., Philips Lumileds Lighting Company, LLC
    Inventors: Serge J. Bierhuizen, James G. Neff
  • Patent number: 8987765
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 24, 2015
    Assignee: Luxvue Technology Corporation
    Inventors: Andreas Bibl, Charles R. Griggs
  • Publication number: 20150076538
    Abstract: A method according embodiments of the invention includes providing a wafer of semiconductor devices. The wafer of semiconductor devices includes a semiconductor structure comprising a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor devices further includes first and second metal contacts for each semiconductor device. Each first metal contact is in direct contact with the n-type region and each second metal contact is in direct contact with the p-type region. The method further includes forming a structure that seals the semiconductor structure of each semiconductor device. The wafer of semiconductor devices is attached to a wafer of support substrates.
    Type: Application
    Filed: March 22, 2013
    Publication date: March 19, 2015
    Inventors: Jipu Lei, Stefano Schiaffino, Alexander H. Nickel
  • Publication number: 20150076368
    Abstract: An assembly and method for irradiating a surface utilizing a plurality of LEDs in a pattern such that a linear fill factor characterizing such pattern is at least 80% along a focusing direction and/or at least 20% along a direction transverse to said focusing direction, the radiation emitted from the LEDs and reflected onto the surface from a trough reflector. Non-linear disposal of LEDs on an LED assembly is disclosed.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 19, 2015
    Inventors: ROBERT L. SARGENT, Robert F. Karlicek, JR.
  • Patent number: 8981580
    Abstract: A bonding pad structure is provided that includes two conductive layers and a connective layer interposing the two conductive layers. The connective layer includes a contiguous, conductive structure. In an embodiment, the contiguous conductive structure is a solid layer of conductive material. In other embodiments, the contiguous conductive structure is a conductive network including, for example, a matrix configuration or a plurality of conductive stripes. At least one dielectric spacer may interpose the conductive network. Conductive plugs may interconnect a bond pad and one of the conductive layers.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: March 17, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen
  • Patent number: 8981352
    Abstract: A display unit includes, on a substrate, a plurality of organic EL devices, and an insulating film provided in an inter-device region between the plurality of organic EL devices, the insulating film including a groove in a position between the organic EL devices adjacent to each other.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: March 17, 2015
    Assignee: Sony Corporation
    Inventors: Jiro Yamada, Seiichi Yokoyama, Eiji Hasegawa, Atsuya Makita, Masanao Uesugi, Shoichi Gondo, Tomoyoshi Ichikawa, Junichi Yamashita
  • Patent number: 8980660
    Abstract: A method of manufacturing a light emitting device is provided in which satisfactory image display can be performed by the investigation and repair of short circuits in defect portions of light emitting elements. A backward direction electric current flows in the defect portions if a reverse bias voltage is applied to the light emitting elements having the defect portions. Emission of light which occurred from the backward direction electric current flow is measured by using an emission microscope, specifying the position of the defect portions, and short circuit locations can be repaired by irradiating a laser to the defect portions, turning them into insulators.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: March 17, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hirokazu Yamagata, Yoshimi Adachi, Noriko Shibata
  • Publication number: 20150069339
    Abstract: An organic light-emitting display apparatus including: a first substrate including at least one organic light-emitting diode (OLED); a second substrate facing the first substrate; an inorganic sealant between the first and second substrates and attaching the first and second substrates together; a shock absorber between the first and second substrates and configured to absorb a shock applied to at least one of the first and second substrates; and a block member between the inorganic sealant and the shock absorber and configured to separate the shock absorber from the inorganic sealant, is disclosed.
    Type: Application
    Filed: March 31, 2014
    Publication date: March 12, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventor: Byung-Uk Han
  • Publication number: 20150070893
    Abstract: A LED grid device comprising a LED grid and a plate-shaped member at which the LED grid has been arranged. The LED grid has several electrically conducting wires arranged side by side, and several LED modules, each LED module having a LED package, wherein each LED package is coupled to at least two wires of the electrically conducting wires. Each LED module further has a thermally conducting element positioned between two adjacent wires of the wires that the LED package is coupled to. The thermally conducting element carries the LED package, and protrudes from the LED package, and the thermally conducting element is attached to the plate-shaped member.
    Type: Application
    Filed: April 2, 2013
    Publication date: March 12, 2015
    Inventors: Sebastien Paul Rene Libon, Dmitri Anatolievich Chestakov
  • Publication number: 20150069425
    Abstract: A light-emitting device module includes a substrate and a light-emitting device disposed on the substrate. The light-emitting device may have a first pad and a second pad disposed thereon. A coating layer may cover the light-emitting device. The coating layer has a first via hole and a second via hole configured to respectively expose the first pad and the second pad therethrough. Wirings configured to be electrically connected to the first pad and the second pad through the first via hole and the second via hole are disposed on the coating layer.
    Type: Application
    Filed: February 25, 2014
    Publication date: March 12, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong-Hwan Kim, Yong-Hoon Kwon, Hyuk-Hwan Kim, Seok-Hyun Nam