Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Patents (Class 438/64)
  • Publication number: 20140263959
    Abstract: A device having a sensor die with a sensor and a control circuit die with at least one control circuit disposed therein, the control circuit die on the sensor die. A plurality of mounting pads is disposed on a second side of the sensor die. A first electrical connection connects a first one of the plurality of mounting pads to a first control circuit of the at least one sensor control circuit and a second electrical connection connects the first control circuit to the sensor. A third electrical connection connects the sensor to a second control circuit of the at least one control circuit and a fourth electrical connection connects the second control circuit to second one of the plurality of mounting pads.
    Type: Application
    Filed: July 5, 2013
    Publication date: September 18, 2014
    Inventors: Tzu-Hsuan Hsu, Dun-Nian Yaung
  • Publication number: 20140264698
    Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.
    Type: Application
    Filed: June 27, 2013
    Publication date: September 18, 2014
    Inventors: Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C.S. Chou, Jung-Kuo Tu, Cheng-Chieh Hsieh
  • Publication number: 20140261685
    Abstract: Embodiments include photovoltaic devices that include at least one absorber layer, e.g. CdTe and/or CdSxTe1-x (where 0?x?1), having an average grain size to thickness ratio from greater than 2 to about 50 and an average grain size of between about 4 ?m and about 14 ?m and methods for forming the same.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: FIRST SOLAR, INC.
    Inventors: Feng Liao, Jigish Trivedi, Zhibo Zhao, Rick C. Powell, Long Cheng, Markus Gloeckler, Benyamin Buller, Igor Sankin, Jeremy Brewer
  • Patent number: 8834664
    Abstract: Certain example embodiments relate to techniques for creating improved photovoltaic (PV) modules. In certain example embodiments and first and second glass substrate are provided. A PV array is provided between the first and second glass substrates. The first and second substrates are laminated together with the PV array between the glass substrates. In certain example embodiments the PV module is dimensioned to be similar to an existing roof system (e.g., a sunroof) in a vehicle. In certain example embodiments, holes are provided in a PV module sandwiched between two substrates, the holes being shaped and arranged within the PV module so as to allow light transmission into the vehicle at desired level while still being substantially filled by the laminate or adhesive material used to secure the PV module to the two surrounding substrates.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: September 16, 2014
    Assignee: Guardian Industries Corp.
    Inventors: Greg Brecht, Vincent E. Ruggero, II, Timothy J. Frey, Robert A. Vandal
  • Patent number: 8835750
    Abstract: The present invention is an optically transparent laminate film comprising: at least three layers of film, wherein at least two of the at least three layers comprise ionomeric films, and wherein the film can be suitable for use in a photovoltaic cell or in packaging.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: September 16, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventor: Geraldine M. Lenges
  • Publication number: 20140252527
    Abstract: A solid-state imaging element including: a sensor substrate in which a photoelectric conversion section is arranged and formed; a circuit substrate in which a circuit for driving the photoelectric conversion section is formed, the circuit substrate being laminated to the sensor substrate; a sensor side electrode drawn out to a surface of the sensor substrate on a side of the circuit substrate and formed as one of a projection electrode and a depression electrode; and a circuit side electrode drawn out to a surface of the circuit substrate on a side of the sensor substrate, formed as one of the depression electrode and the projection electrode, and joined to the sensor side electrode in a state of the circuit side electrode and the sensor side electrode being fitted together.
    Type: Application
    Filed: May 14, 2014
    Publication date: September 11, 2014
    Applicant: Sony Corporation
    Inventor: Naoyuki Sato
  • Patent number: 8829333
    Abstract: A highly reliable solar cell module and method for manufacturing same are disclosed. The solar cell module is provided with first and second solar cell elements, each of which has a semiconductor substrate and an output taking out electrode; a circuit film which electrically connects together the first solar cell element and the second solar cell element; and a sealing material disposed between the circuit film and the second surface of the first and the second solar cell elements. The sealing material has a through hole, and the circuit film has: a base sheet having a protruding section which protrudes toward the second surface of the solar cell element; and a wiring conductor which electrically connects the output taking out electrode of the first solar cell element and the output taking out electrode of the second solar cell element.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: September 9, 2014
    Assignee: KYOCERA Corporation
    Inventors: Mitsuo Yamashita, Takeshi Kyouda
  • Publication number: 20140246086
    Abstract: A photovoltaic module (10) is provided with: photovoltaic elements (14), each of which has a light receiving surface-side electrode and a back surface-side electrode (26); and a connection member which is connected to the photovoltaic elements (14) with resin-containing adhesive layers (50, 52) respectively interposed therebetween. The width of the connection member facing the back surface-side electrode (26) is narrower than the width of the back surface-side electrode (26). The connection member has recesses and projections (40) on the surface facing the back surface-side electrode (26), and connects one photovoltaic element and another photovoltaic element (14) with each other, said photovoltaic elements being arranged adjacent to each other. The back surface-side electrode (26) is an electrode that covers generally all over the back surface of the photovoltaic element (14).
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: SANYO Electric Co., Ltd.
    Inventor: Yukihiro YOSHIMINE
  • Publication number: 20140248735
    Abstract: A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity.
    Type: Application
    Filed: December 17, 2013
    Publication date: September 4, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Fabian Purkl, Gary Yama, Ando Feyh, Andrew Graham, Ashwin Samarao, Gary O'Brien
  • Publication number: 20140249368
    Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: FUJIKURA LTD.
    Inventors: Wei-Zhi HU, Kenichi NAKATATE, Takeshi SEGI, Kenichi ISHIBASHI, Fumihiko NISHIMURA, Satoshi HIDA, Hitoe IIKURA, Hideo SHIRATANI
  • Patent number: 8822253
    Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: September 2, 2014
    Assignee: Micronas GmbH
    Inventors: Tobias Kolleth, Pascal Stumpf, Christian Joos
  • Publication number: 20140239428
    Abstract: According to various embodiments, a chip arrangement may be provided, the chip arrangement including: a chip; an antenna structure disposed over a first side of the chip, wherein the antenna structure may include an antenna being electrically conductively coupled to the chip; and a reinforcement structure, wherein the reinforcement structure supports the chip to increase the stability of the chip arrangement.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Juergen Hoegerl, Peter Stampka
  • Publication number: 20140239179
    Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.
    Type: Application
    Filed: February 24, 2013
    Publication date: August 28, 2014
    Inventors: Vlad Joseph Novotny, Howard Woo
  • Patent number: 8815707
    Abstract: A device fabrication method includes: (1) providing a growth substrate including a base and an oxide layer disposed over the base; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: August 26, 2014
    Assignee: Board of Trustess of the Leland Stanford Junior University
    Inventors: Chi-Hwan Lee, Dong Rip Kim, Xiaolin Zheng
  • Publication number: 20140231887
    Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor in a sensor region and located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads, the bonding pads disposed outside of the sensor region.
    Type: Application
    Filed: February 18, 2013
    Publication date: August 21, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
  • Patent number: 8809103
    Abstract: A simple method that makes it possible to manufacture a highly-workable organic solar cell module having a plurality of connected organic solar cells is provided. The method includes: a first electrode substrate forming step of forming a plurality of first electrode layers on a first substrate to form a first electrode substrate; preparing a single piece of second electrode substrate-forming base material having at least a second electrode layer and capable of being cut into a plurality of second electrode substrates; a functional layer forming step; a cutting step to form a plurality of second electrode substrates; a bonding step so that the first and second electrode substrates are bonded together; and a connecting step of electrically connecting the first electrode layer of one of the organic solar cells to the second electrode layer of another organic solar cell which is adjacent to the one organic solar cell.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: August 19, 2014
    Assignee: DAI Nippon Printing Co., Ltd.
    Inventors: Kenta Sekikawa, Satoshi Mitsuzuka, Miho Sasaki
  • Patent number: 8809099
    Abstract: Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: August 19, 2014
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Zhihai Wang, Nicole D. Kerness, Stanley Barnett
  • Patent number: 8809984
    Abstract: The present invention provides a substrate connection type module structure comprising a substrate with a through hole structure and a first contact pad. A chip is configured on the through hole structure of the substrate, with a second contact pad and a sensing area. The first contact pad is coupled to the second contact pad via a wire. A second substrate is electrically connected to the first substrate. The second substrate and the chip are located at the same layer. A lens holder is disposed on the substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder. The lens is substantially aligning to the transparent material and the sensing area.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: August 19, 2014
    Assignee: Larview Technologies Corporation
    Inventor: Shin-Dar Jan
  • Publication number: 20140227822
    Abstract: A method for forming a thin film solar cell that includes one or more moisture barrier layer made of a water-insoluble material for protection against water and oxygen damage to the top electrode layer material is disclosed.
    Type: Application
    Filed: April 22, 2014
    Publication date: August 14, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Chin LEE, Yung-Sheng CHIU, Wen-Tsai YEN, Liang-Sheng YU
  • Patent number: 8802475
    Abstract: A method of fabricating a microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is physically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: August 12, 2014
    Assignee: General Electric Company
    Inventors: Kaustubh Ravindra Nagarkar, Christopher Fred Keimel
  • Patent number: 8802503
    Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: August 12, 2014
    Assignee: Cheng Kung Capital, LLC
    Inventor: Jiahn-Chang Wu
  • Patent number: 8796061
    Abstract: Solar cells are packaged by placing the solar cells between sheets of encapsulants. The encapsulants are exposed to ultraviolet (UV) light to cure the encapsulants and bond the encapsulants together to encapsulate the solar cells. The UV curing steps may be performed to bond one of the encapsulants to a transparent top cover and the solar cells, and to bond the other encapsulant to the solar cells and a backsheet. A protective package that includes the transparent top cover, encapsulated solar cells, and the backsheet is then optionally mounted on a frame.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: August 5, 2014
    Assignee: SunPower Corporation
    Inventor: Gabriela Bunea
  • Patent number: 8796532
    Abstract: Methods for fabricating a photovoltaic module, and the resulting photovoltaic module, are provided and include selecting a photovoltaic cell operable to convert photons to electrons, selecting a light transparent superstrate material having a superstrate absorption coefficient and a superstrate refractive index, and selecting an encapsulant having an encapsulant absorption coefficient and an encapsulant refractive index, wherein an absorption coefficient relationship between the superstrate absorption coefficient and the encapsulant absorption coefficient and a refractive index relationship between the superstrate refractive index and the encapsulant refractive index are selected such that there is a gain in efficiency, and assembling the photovoltaic module using the selected materials.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: August 5, 2014
    Assignees: Dow Corning Corporation, The Australian National University
    Inventors: Barry Ketola, Ann Norris, Nick Powell, Keith McIntosh, James Cotsell
  • Publication number: 20140209171
    Abstract: The present invention relates to a solar module comprising a first layer, a solar cell arranged above the first layer and a second layer arranged above the solar cell. The first and/or the second layer comprise a fibre composite material which comprises a preferably aliphatic polyurethane polymer “dual cure” system) crosslinked thermally and by means of electromagnetic radiation. The material of the fibres of the fibre composite material is transparent at least in the region of visible light. The invention further relates to the use of this type of solar module and to a process for production thereof.
    Type: Application
    Filed: August 22, 2012
    Publication date: July 31, 2014
    Applicant: Bayer Intellectual Property GmbH
    Inventors: Hubert Ehbing, Frithjof Hannig, Stephanie Vogel, Nusret Yuva, Wolfgang Fischer, Helmut Kuczewski, Ernst-Ulrich Reisner
  • Publication number: 20140210027
    Abstract: There is provided an image sensor module, including: an image sensor having a small thickness of 175 ?m or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 31, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Bum CHA, Sung Jae LEE, In Cheol CHANG, Sung Jun BYUN
  • Patent number: 8790950
    Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: July 29, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takanori Suzuki, Tadashi Kosaka, Koji Tsuduki, Yasuhiro Matsuki, Shin Hasegawa, Akiya Nakayama
  • Patent number: 8792031
    Abstract: A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 29, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Katsuhisa Mochiduki, Takanori Suzuki, Fujio Ito
  • Patent number: 8790951
    Abstract: A carrier assembly is provided for solar cell laminates that include an encapsulating layer and that are conveyed through a lamination plant having a conveying surface. The assembly includes a housing of heat conductive material defining an inner volume, the housing having an upper plate for receiving the laminates and a lower plate defining a plurality of apertures, the inner volume including at least one connecting element interconnecting the first and second plates. An air supply system provides a continuous outward air flow through the apertures when the lower plate is received on the conveying surface, wherein the airflow yields an elevated pressure on the lower plate for providing lift to the housing, allowing substantially friction-free movement of the housing relative to the conveying surface. A thermal transfer system provides thermal energy to the upper plate for melting and curing the encapsulating layer.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: July 29, 2014
    Assignee: Saphire Solar Technologies APS
    Inventor: Yakov Safir
  • Publication number: 20140196771
    Abstract: A thin-film photovoltaic module with hydrophobic rear-side coating is described. The module has a substrate, wherein at least one hydrophobic coating is arranged on a rear side of the substrate, a photovoltaic layer structure on a front side of the substrate, and a covering sheet, which is areally connected to the front side of the substrate via a rear side of the substrate with at least one intermediate layer.
    Type: Application
    Filed: July 5, 2012
    Publication date: July 17, 2014
    Inventors: Stephane Auvray, Dana Pakosch, Dang Cuong Phan
  • Publication number: 20140197506
    Abstract: A semiconductor device includes: an organic substrate; an integrated circuit and a chip part provided on the organic substrate; a molded section including a central portion and a peripheral portion, and forming, as a whole, a concave shape, the central portion sealing the integrated circuit and the chip part on the organic substrate, and the peripheral portion standing around the central portion; and a solid-state image pickup element provided on the central portion of the molded section, the solid-state image pickup element having a top edge that is lower in position in a thickness direction than a top edge of the peripheral portion of the molded section.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 17, 2014
    Applicant: Sony Corporation
    Inventor: Tsuyoshi Watanabe
  • Patent number: 8778739
    Abstract: A method of manufacturing a lead frame, includes forming a rectangular first dimple includes, first inclined side surfaces inclined to a depth direction, and arranged in two opposing sides in one direction, and standing side surfaces standing upright to a depth direction, and arranged in two opposing sides in other direction, on a backside of a die pad by a first stamping, and forming a second dimple having second inclined side surfaces inclined on the backside of the die pad by a second stamping, such that a second inclined side surfaces of the second dimple are arranged in side areas of the standing side surfaces of the first dimple, wherein the standing side surfaces are transformed into reversed inclined side surfaces inclined to a reversed direction to the first inclined side surfaces, and a front side of the die pad is semiconductor element mounting surface.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: July 15, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Hitoshi Miyao
  • Patent number: 8780211
    Abstract: A method of mutually aligning first and second imaging system fixturing components forms a first alignment structure on the first imaging system fixturing component, a second alignment structure on the second imaging system fixturing component, and engages the first and second alignment structures to align, with optical accuracy, the first and second imaging system fixturing components.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: July 15, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: George C. Barnes, IV, Goran M. Rauker, Mark Meloni
  • Patent number: 8778718
    Abstract: Disclosed are a method of manufacturing a dye sensitized solar battery and a solar battery assembling apparatus. The method includes: forming electrode pads on electrodes of respective solar battery sub modules; applying a conductive adhesive on the electrode; and overlapping the electrodes of the solar battery sub modules, applying a current to the electrode pads, and then heating and hardening the conductive adhesive.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: July 15, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventor: Moo Jung Chu
  • Publication number: 20140191253
    Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.
    Type: Application
    Filed: May 19, 2011
    Publication date: July 10, 2014
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Stephan Haslbeck, Markus Foerste, Michael Schwind, Martin Haushalter, Hubert Halbritter, Frank Möllmer
  • Patent number: 8772919
    Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: July 8, 2014
    Inventors: Wen-Cheng Chien, Wen-Ken Huang, Chien-Hung Liu, Joey Lai
  • Patent number: 8772916
    Abstract: An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: July 8, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: Ki Youn Jang, Sungmin Song, JoHyun Bae
  • Patent number: 8772624
    Abstract: The present invention provides a solar cell module comprising at least one encapsulant layer which has 1) a total thickness of from about 0.1 to about 20 mils and 2) at least one surface layer made of ionomers containing a finite amount of polymerized residues of ?-olefins and from about 18 to about 25 wt % of polymerized residues of ?,?-ethylenically unsaturated carboxylic acids. The present invention also provides a process of manufacturing the solar cell module.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 8, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Richard Allen Hayes, Geraldine M. Lenges, Steven C. Pesek, Sam Louis Samuels, Charles Anthony Smith
  • Patent number: 8772069
    Abstract: A method and apparatus used for forming a lens and spacer combination, and imager module employing the spacer and lens combination. The apparatus includes a mold having a base, spacer section, and mold feature. The method includes using the mold with a blank to create a spacer that includes an integral lens. The spacer and lens combination and imager modules can be formed on a wafer level.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: July 8, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Rick Lake, Jacques Duparre
  • Patent number: 8773561
    Abstract: A solid-state image pickup apparatus includes a photoelectric converter, a wiring portion, a micro lens, and an adjustment film. The photoelectric converter is formed on a light incident side in a substrate. The wiring portion is formed on a side of the substrate that is opposite to the light incident side. The micro lens is formed on a light incident side of the photoelectric converter. The adjustment film adjusts variation of a light reception sensitivity in the photoelectric converter with respect to a wavelength of light that enters the photoelectric converter through the micro lens, and the adjustment film is formed between the photoelectric converter and the micro lens.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: July 8, 2014
    Assignee: Sony Corporation
    Inventor: Koji Kikuchi
  • Publication number: 20140183591
    Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: APTOS TECHNOLOGY INC.
    Inventors: EN-MIN JOW, CHI-JANG LO, NAN-CHUN LIN, SHANG YU CHANG CHIEN
  • Publication number: 20140186988
    Abstract: A chemical bath deposition apparatus includes: a reaction vessel for containing a reaction solution for chemical bath deposition to form a film on a surface of a substrate; a substrate holding section for holding the substrate such that at least the surface of the substrate contacts the reaction solution, the substrate holding section including a fixing surface made of stainless steel on which a back side of the substrate is closely fixed; a heater disposed at a rear side of the fixing surface, the heater heating the substrate from the back side of the substrate; and a reaction solution temperature control unit for controlling temperature of the reaction solution in the reaction vessel.
    Type: Application
    Filed: March 4, 2014
    Publication date: July 3, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Tetsuo KAWANO, Hiroshi ARAI
  • Publication number: 20140182669
    Abstract: To provide a dye-sensitized solar cell with suppressed photoelectric conversion efficiency deterioration due to a gap to be possibly be generated between a transparent member on which a light is incident and the dye-sensitized solar cell components. A dye-sensitized solar cell 10 is provided with a dye-sensitized solar cell components unit 14 arranged within a cylindrical transparent member 12, the unit having an electrolyte layer, current collecting electrode 18, and porous semiconductor layer 20 carrying dye cylindrically laminated in this order centering around a cathode electrode layer 16. The cathode electrode layer 16 is a spring body, and the dye-sensitized solar cell components unit 14 is pressed to the transparent member 12 with an elastic restoring force of the spring.
    Type: Application
    Filed: August 7, 2012
    Publication date: July 3, 2014
    Applicants: National University Corporation Kyushu Institute of Technology, NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
    Inventors: Shuzi Hayase, Ken-ichi Fujino, Yoshihiro Yamaguchi
  • Patent number: 8765514
    Abstract: A center region of conductive material/s may be disposed or “sandwiched” between transition regions of relatively lower conductivity materials to provide substantially low defect density interfaces for the sandwiched material. The center region and surrounding transition regions may in turn be disposed or sandwiched between dielectric insulative material to form a sandwiched and transitioned device structure. The center region of such a sandwiched structure may be implemented, for example, as a device layer such as conductive microbolometer layer for a microbolometer detector structure.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: July 1, 2014
    Assignee: L-3 Communications Corp.
    Inventors: Athanasios J. Syllaios, Michael F. Taylor, Sameer K. Ajmera
  • Patent number: 8766428
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: July 1, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jairus Legaspi Pisigan
  • Publication number: 20140174509
    Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.
    Type: Application
    Filed: June 28, 2012
    Publication date: June 26, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Publication number: 20140179050
    Abstract: Solar cells are packaged by placing the solar cells between sheets of encapsulants. The encapsulants are exposed to ultraviolet (UV) light to cure the encapsulants and bond the encapsulants together to encapsulate the solar cells. The UV curing steps may be performed to bond one of the encapsulants to a transparent top cover and the solar cells, and to bond the other encapsulant to the solar cells and a backsheet. A protective package that includes the transparent top cover, encapsulated solar cells, and the backsheet is then optionally mounted on a frame.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Inventor: Gabriela BUNEA
  • Publication number: 20140179036
    Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 26, 2014
    Applicant: SKORPIOS TECHNOLOGIES, INC.
    Inventors: Stephen B. Krasulick, John Dallesasse
  • Publication number: 20140174519
    Abstract: One embodiment relates to a method of fabricating a solar cell. A silicon lamina is cleaved from the silicon substrate. The backside of the silicon lamina includes the P-type and N-type doped regions. A metal foil is attached to the backside of the silicon lamina. The metal foil may be used advantageously as a built-in carrier for handling the silicon lamina during processing of a frontside of the silicon lamina. Another embodiment relates to a solar cell that includes a silicon lamina having P-type and N-type doped regions on the backside. A metal foil is adhered to the backside of the lamina, and there are contacts formed between the metal foil and the doped regions. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Inventors: Seung Bum RIM, Gabriel HARLEY
  • Patent number: 8760559
    Abstract: A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: June 24, 2014
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Ti-Lun Liu, Ying-Cheng Wu
  • Patent number: 8759138
    Abstract: A solar cell receiver for use in a concentrating solar system which concentrates the solar energy onto a solar cell for converting solar energy to electricity. The solar cell receiver may include a solar cell mounted on a support and with one or more III-V compound semiconductor layers. An optical element may be positioned over the solar cell and have an optical channel with an inlet that faces away from the solar cell and an outlet that faces towards the solar cell. A frame may be positioned over the support and extend around the solar cell with the frame having an inner side that extends above the support and faces towards the optical element. An encapsulant may be positioned over the support and contained between the optical element and the frame. The encapsulant may have enlarged heights at contact points with the optical element and the frame and a reduced height between the contact points away from the optical element and the frame. The solar cell receiver may be used in a solar cell module.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: June 24, 2014
    Assignee: Suncore Photovoltaics, Inc.
    Inventors: Lei Yang, Sunil Vaid, Mikhail Kats, Gary Hering, Philip Blumenfeld, Damien Buie, John Nagyvary, James Foresi, Peter Allen Zawadzki