Abstract: A method for manufacturing a solar cell includes texturing a front surface of a semiconductor substrate having a first conductive type dopant by using a dry etching method, forming an emitter layer by ion-implanting a second conductive type dopant into the front surface of the semiconductor substrate, forming a back passivation film on a back surface of the semiconductor substrate; and forming a first electrode electrically connected to the emitter layer and a second electrode being in partial contact with the back surface of the semiconductor substrate.

Abstract: Processes for fabricating photovoltaic devices in which the front side contact metal semiconductor alloy metallization patterns have a uniform thickness at edge portions as well as a central portion of each metallization pattern are provided.

Abstract: A method of making a solar cell may include depositing in a first pattern a first ink comprising a first dopant on a back surface of a substrate that is doped with a second dopant being of the same type as the first dopant; then, depositing a second ink comprising a set of undoped semiconductor nanoparticles over the first ink on the back surface of the substrate in a second pattern matching the first pattern; then, heating the semiconductor substrate so that the first dopant diffuses into the substrate and thereby, forms a third pattern of localized doped regions; then, exposing the substrate to a doping ambient comprising a third dopant being of the opposite type to the second dopant, thereby forming a doped semiconductor layer on the front surface and a portion of the back surface not covered by the second ink, and then, removing the deposited ink.

Abstract: A solid-state image sensing device includes a substrate provided with an impurity region, an insulating film formed on the substrate, and a contact electrode penetrating the insulating film to be connected to the impurity region. The contact electrode is made of polysilicon containing boron, and has a lower electrode part buried in the insulating film and an upper electrode part protruding from a top surface of the insulating film. The polysilicon constituting the contact electrode has a maximum grain size of 2 nm or more and 30 nm or less. Silicide is formed in at least a surface portion of the upper electrode part.

Abstract: Disclosed are a titanium dioxide nano ink having such a strong dispersibility as to be applicable by inkjet printing and having adequate viscosity without requiring printing several times, and a titanium dioxide nano particle modified by a surface stabilizer included therein. Inkjet printing of the titanium dioxide nano ink enables printing of a minute electrode. In addition, efficiency of a solar cell may be maximized since occurrence of pattern cracking is minimized.

Abstract: Back contact back junction solar cell and methods for manufacturing are provided. The back contact back junction solar cell comprises a substrate having a light capturing frontside surface with a passivation layer, a doped base region, and a doped backside emitter region with a polarity opposite the doped base region. A backside passivation layer and patterned reflective layer on the emitter form a light trapping backside mirror. An interdigitated metallization pattern is positioned on the backside of the solar cell and a permanent reinforcement provides support to the cell.

Abstract: A method for manufacturing a solar cell from a p-doped or n-doped silicon substrate having a first main surface used as an incident-light side and a second main surface used as a back side includes: depositing a thin layer onto the second main surface; depositing a dielectric, glass-forming paste onto the second main surface and drying it, in order to cover the thin layer; heating and/or sintering the paste on the second main surface at temperatures greater than app. 577° C., to produce an aluminum dopant layer in the second main surface; and removing the glass layer formed during the heating and/or sintering, as well as an aluminum-silicon eutectic layer formed during the heating and/or sintering, from the second main surface.

Abstract: Disclosed is a solar cell apparatus and manufacturing method thereof. A solar cell apparatus includes: a support substrate; a first back electrode disposed on the support substrate; a light absorber part disposed on the first back electrode; a buffer disposed on the light absorber part; and a barrier film disposed on a side surface of the light absorber part and extending from the buffer.

Abstract: The present invention aims to provide a titanium oxide paste which is excellent in printability and which allows for production of a porous titanium oxide layer having a high porosity with a small amount of impurities on the surface thereof even by low-temperature firing, a method of producing a porous titanium oxide laminate using the titanium oxide paste, and a dye-sensitized solar cell. The titanium oxide paste of the present invention contains titanium oxide particles, a (meth)acrylic resin, and an organic solvent. The paste has a viscosity of 15 to 50 Pa·s and a thixotropic ratio of 2 or greater. A dried mass obtained by heating the paste at a temperature-increasing rate of 10° C./min from 25° C. to 300° C. in the atmospheric environment contains 1% by weight or less of the (meth)acrylic resin and the organic solvent.

Abstract: A thin film photovoltaic device (100) with a tunable, minimally conductive buffer (128) layer is provided. The photovoltaic device (100) may include a back contact (150), a transparent front contact stack (120), and an absorber (140) positioned between the front contact stack (120) and the back contact (150). The front contact stack (120) may include a low resistivity transparent conductive oxide (TCO) layer (124) and a buffer layer (128) that is proximate to the absorber layer (140). The photovoltaic device (100) may also include a window layer (130) between the buffer layer (128) and the absorber (140). In some cases, the buffer layer (128) is minimally conductive, with its resistivity being tunable, and the buffer layer (128) may be formed as an alloy from a host oxide and a high-permittivity oxide. The high-permittivity oxide may further be chosen to have a bandgap greater than the host oxide.

Abstract: A method is provided for producing an electrically conductive contact on a rear face and/or front face of a solar cell. The method interconnects solar cells in a cost-effective manner and ensures that cell damage, which leads to a reduction in power, is avoided. The rear face and/or front face of the solar cell is treated in the region of the contact and, after the treatment in the region, a pasty adhesive or an adhesive tape is applied in strips.

Abstract: In image sensors and methods of manufacturing the same, a substrate has a photoelectric conversion area, a floating diffusion area and a recess between the photoelectric conversion area and the floating diffusion area. A plurality of photodiodes is vertically arranged inside the substrate in the photoelectric conversion area. A transfer transistor is arranged along a surface profile of the substrate having the recess and configured to transfer electric charges generated from the plurality of photodiodes to the floating diffusion area. The transfer transistor includes a gate insulation pattern on a sidewall and a bottom of the recess and on a surface of the substrate around the recess, and a gate conductive pattern including polysilicon doped with impurities and positioned on the gate insulation pattern along the surface profile of the substrate having the recess, wherein a cavity is in an upper surface of the gate conductive pattern.

Abstract: The present disclosure provides a method of manufacturing a solar cell including: providing a first substrate and a second substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell including a top subcell and a bottom subcell; forming a back metal contact over the bottom subcell; applying a conductive polyimide adhesive to the second substrate; attaching the second substrate on top of the back metal contact; and removing the first substrate to expose the surface of the top subcell.

Abstract: A device includes a device isolation region formed into a semiconductor substrate, a doped pickup region formed into the device isolation region, a dummy gate structure that includes at least one structure that partially surrounds the doped pickup region, and a via connected to the doped pickup region.

Abstract: Provided are a method of manufacturing a metal oxide and a substrate for a solar cell. The method of manufacturing the metal oxide according to the inventive concept includes mixing a metal precursor material, a basic material, amphiphilic molecules and distilled water to prepare a metal precursor solution, performing a first heat treatment with the metal precursor solution to form a metal oxide, and performing a second heat treatment with the metal oxide to form a pair of metal oxide disks having a single crystalline structure. A pair of zinc oxide disks includes a first disk, and a second disk separated from the first disk in a perpendicular direction to the first disk.

Abstract: A semiconductor device includes: an integrated circuit having an electrode pad; a first insulating layer disposed on the integrated circuit; a redistribution layer including a plurality of wirings and disposed on the first insulating layer, at least one of the plurality of wirings being electrically coupled to the electrode pad; a second insulating layer having a opening on at least a portion of the plurality of wirings; a metal film disposed on the opening and on the second insulating layer, and electrically coupled to at least one of the plurality of wirings; and a solder bump the solder bump overhanging at least one of the plurality of wirings not electrically coupled to the metal film.

Abstract: A photovoltaic device includes a substrate; a back contact layer disposed on the substrate; an absorber layer for photo absorption disposed above the back contact layer; a buffer layer disposed above the absorber layer; a front contact layer disposed above the buffer layer; and a plasmonic nanostructured layer having a plurality of nano-particles, wherein the plasmonic nanostructured layer is between a topmost back contact layer surface and the absorber layer.

Abstract: Thin film photovoltaic devices that include a transparent substrate; a transparent conductive oxide layer on the transparent substrate; a n-type window layer on the transparent conductive oxide layer; a p-type absorber layer on the n-type window layer; and, a back contact on the p-type absorber layer are provided. The p-type absorber layer comprises cadmium telluride, and forms a photovoltaic junction with the n-type window layer. Generally, the p-type absorber layer defines a plurality of finger structures protruding from the p-type absorber layer into the back contact. The finger structures can have an aspect ratio of about 1 or greater and/or can have a height that is about 20% to about 200% of the thickness of the p-type absorber layer. Methods of forming such finger structures protruding from a back surface of the p-type absorber layer are also provided.

Abstract: A low voltage photodetector structure including a semiconductor device layer, which may be Ge, is disposed over a substrate semiconductor, which may be Si, for example within a portion of a waveguide extending laterally within a photonic integrated circuit (PIC) chip. In exemplary embodiments where the device layer is formed over an insulator layer, the insulator layer is removed to expose a surface of the semiconductor device layer and a passivation material formed as a replacement for the insulator layer within high field regions. In further embodiments, controlled avalanche gain is achieved by spacing electrodes in a metal-semiconductor-metal (MSM) architecture, or complementary doped regions in a p-i-n architecture, to provide a field strength sufficient for impact ionization over a distance not significantly more than an order of magnitude greater than the distance that a carrier must travel so as to acquire sufficient energy for impact ionization.

Abstract: A photovoltaic (PV) cell comprises a base substrate which comprises silicon and includes at least one doped region. The PV cell further comprises a collector disposed on the doped region of the base substrate and having a lower portion in physical contact with the doped region of the base substrate, and an upper portion opposite the lower portion. The PV cell further comprises an electrically conductive layer which is electrically isotropic or anisotropic and disposed adjacent the collector. The electrically conductive layer is in electrical communication with the base substrate via the collector. The electrically conductive layer comprises a binder and electrically conductive particles comprising at least one metal selected from the group consisting of Group 8 through Group 14 metals of the Periodic Table of Elements. The electrically conductive particles impart isotropic or anisotropic electrical conductivity to the electrically conductive layer.

Abstract: A metal contact of a solar cell is formed by electroplating copper using an electroplating seed that is formed on a dielectric layer. The electroplating seed includes an aluminum layer that connects to a diffusion region of the solar cell through a contact hole in the dielectric layer. A nickel layer is formed on the aluminum layer, with the nickel layer-aluminum layer stack forming the electroplating seed. The copper is electroplated in a copper plating bath that has methanesulfonic acid instead of sulfuric acid as the supporting electrolyte.

Abstract: A method for producing an opto-microelectronic micro-imaging device includes a step of forming a first functional part on the base of a first substrate, a base layer, and first electric connection pad. The first functional part is transferred onto a second substrate. The first substrate is thinned until the base layer is reached. A second functional part is formed on the base layer. One via is connected to the first electric connection pad and through the first functional part. The step of forming the second functional part includes connecting the via with the second electric connection pad.

Abstract: Room temperature IR and UV photodetectors are provided by electrochemical self-assembly of nanowires. The detectivity of such IR detectors is up to ten times better than the state of the art. Broad peaks are observed in the room temperature absorption spectra of 10-nm diameter nanowires of CdSe and ZnS at photon energies close to the bandgap energy, indicating that the detectors are frequency selective and preferably detect light of specific frequencies. Provided is a photodetector comprising: an aluminum substrate; a layer of insulator disposed on the aluminum substrate and comprising an array of columnar pores; a plurality of semiconductor nanowires disposed within the pores and standing vertically relative to the aluminum substrate; a layer of nickel disposed in operable communication with one or more of the semiconductor nanowires; and wire leads in operable communication with the aluminum substrate and the layer of nickel for connection with an electrical circuit.

Abstract: A stack of a first anti-reflective coating (ARC) layer and a titanium layer is formed on a front surface of a semiconductor substrate including a p-n junction, and is subsequently patterned so that a semiconductor surface is physically exposed in metal contact regions of the front surface of the semiconductor substrate. The remaining portion of the titanium layer is converted into a titania layer by oxidation. A metal layer is plated on the metal contact regions, and a copper line is subsequently plated on the metal layer or a metal semiconductor alloy derived from the metal layer. A second ARC layer is deposited over the titania layer and the copper line, and is subsequently patterned to provide electrical contact to the copper line.

Abstract: A dye-sensitized solar cell is provided. The solar cell includes a transparent substrate; a conductive transparent electrode formed on a surface of the transparent substrate; a metal oxide particle electrode layer in which a photosensitive dye capable of absorbing light is adsorbed; a counter electrode, and an electrolyte injected between the metal oxide particle electrode layer and the counter electrode. The metal oxide particle electrode layer comprises a first electrode layer comprising metal oxide particles and having a predetermined pattern formed thereon and a second electrode layer comprising metal oxide particles and formed on the first electrode layer. Refractive indexes of the first and second electrode layers are different from each other.

Abstract: A method of fabricating an all-back-contact (ABC) solar cell is disclosed. A doped layer of a first polarity (102) is formed on a rear side of a wafer (100). A first masking structure (106, 110) is formed on the doped layer of the first polarity. Portions of the first masking structure (106, 110) are removed using a first laser ablation process. Doped regions of a second polarity (118, 135, 137) are formed in areas where the first masking structure has been removed. Contact bars (134, 136) are formed by screen printing and firing such that each contact bar is in contact with one of the doped regions (135, 137).

Abstract: A solar cell core is produced such that a charge separation and a charge transfer to an emitter and to a base located on a side of the solar cell that is opposite from the emitter are provided when there is incident light in a front side of the solar cell. An electrically conductive emitter-contact structure is produced in the form of contact fingers that are in direct electrical contact with the emitter. A solderable metallic emitter-terminal structure is produced in the form of conductor bars that are in direct electrical contact with the emitter-contact structures and transversely connect the contact fingers of the emitter-contact structure. The solderable metallic emitter-terminal structure is produced at least from nickel, a nickel alloy, tin and/or a tin alloy, and a solder or an electrically conductive strip arrangement covered with a solder is applied to this emitter-terminal structure.

Abstract: Use of chemical mechanical polishing (CMP) and/or pure mechanical polishing to separate sub-cells in a thin film solar cell. In one embodiment the CMP is only used to separate the active, thin film layer into sub-cells, with scribing still being used to achieve sub-cell separation in conductive layers above and below the active, thin film layer. Also, the active layer may be placed over a series of protrusions so that the CMP removes the active layer that is over the protrusion, while leaving intact the flat, planar portions of the active layer. In this way, the removed active layer, from over the protrusions then becomes the division between sub-cells in the active layer.

Abstract: In accordance with some embodiments of the disclosed subject matter, mechanisms for pulsed laser deposition are provided. In some embodiments, a system for pulsed laser deposition is provided, the system comprising: a pulsed laser configured to project a pulsed laser beam at a rotating target material and cause metal clusters to be ablated from the rotating target material; and a confinement mechanism configured to control deposition of the metal clusters on a substrate.

Abstract: A method for producing a solar cell with a selective emitter is disclosed. A semiconductor substrate (1) is provided. A layer (3) of dopant source material with a dopant type opposite to the dopant type of the substrate (1) is formed at a surface of the substrate (1). By applying heat to the layer (3), a homogeneous lightly doped emitter region (5) is formed. In a first lasering step, selective heavily doped emitter regions (11) are formed by applying laser light (7) to contact surface areas (9). Optionally, the layer (3) is subsequently removed and an additional dielectric layer (15) is applied to the front side of the substrate (1). In a second lasering step, the layer (3) or the layer (15) are locally removed by applying laser light (21) to the contact surface areas (9), thereby locally exposing the surface of the substrate (1). In the locally exposed contact surface areas (9), metal contacts (23) are finally formed, using for example metal-plating techniques.

Abstract: The invention discloses an image sensor (100) and a method of fabricating the image sensor. The image sensor (100) includes: a substrate (101) with a metal interconnection layer (102) formed on a first side thereof; a first type of doped area (103) located in the substrate (101); a second type of doped area (105) located in the substrate (101) adjacent to the first type of doped area (103) to form a photoelectric diode; an electrode layer (107) located on a second side of the substrate (101), wherein the electrode layer (107) is light-transmissive; and an insulation layer (109) located between the electrode layer (107) and the substrate (101); wherein there is a predetermined potential difference between the electrode layer (107) and the substrate (101) such that a second type of conductive layer (111) is generated on the surface of the second side of the substrate (101).

Abstract: A flexible display device manufacturing method includes preparing a substrate assembly in which a flexible substrate is formed on a carrier substrate; piling up a plurality of the prepared substrate assemblies in a heating furnace in multi-stages; performing heat treatment by providing hot blast onto each of the piled substrate assemblies in a horizontal direction; forming a display unit on the flexible substrate of the heat-treated substrate assembly; and separating the flexible substrate and the carrier substrate from each other. According to the above-described manufacturing method, since warpage of a flexible substrate after a carrier substrate and the flexible substrate are separated from each other may be suppressed, a subsequent process may be appropriately performed, productivity may be improved, and damage of products caused while the flexible substrate is handled may be reduced.

Abstract: In one embodiment, a method is provided for fabrication of a semitransparent conductive mesh. A first solution having conductive nanowires suspended therein and a second solution having nanoparticles suspended therein are sprayed toward a substrate, the spraying forming a mist. The mist is processed, while on the substrate, to provide a semitransparent conductive material in the form of a mesh having the conductive nanowires and nanoparticles. The nanoparticles are configured and arranged to direct light passing through the mesh. Connections between the nanowires provide conductivity through the mesh.

Abstract: A PIN photovoltaic (PIN PV) device is composed of a first electrode layer, a p-type semiconductor layer, an intrinsic semiconductor layer, an n-type semiconductor substrate, and a back surface electrode. Also described is a method for manufacturing a PIN PV device. In a first embodiment, the method includes cleaning an n-type semiconductor substrate; introducing an inert gas under vacuum and a high temperature to form a high resistivity layer on the top surface of the substrate; forming or depositing a p-type semiconductor layer on the high resistivity layer; forming a transparent electrode layer on the p-type semiconductor layer; and forming a metal electrode on the bottom surface of the substrate. In a second embodiment, an SiC or SiO2 isolation layer is formed on the bottom surface of the substrate after initial cleaning of the wafer before the high resistivity layer is formed on the top of the substrate.

Abstract: A photovoltaic device includes a substrate, a back contact layer disposed above the substrate, an absorber layer comprising an absorber material disposed above the back contact layer, and a buffer layer disposed above the absorber layer. The buffer layer includes a first layer comprising the absorber material doped with zinc, and a second layer comprising a zinc-containing compound and a cadmium-containing compound.

Abstract: This invention relates an aluminum conductor paste formulation and its method of application on rear side passivated locally opened vias; dot or line geometry or combination thereof employing laser ablation or chemical etching methods. Such Back Surface Passivated Si-solar cells include dielectric layers of Al203, SiNx, Si02, SiC, ?-Si, Si02/SiNx, Al203/SiNx, Si02/Al203/SiNx. The Al-conductor paste of this invention achieves; (i) non-degradation of passivation stack, (ii) defect free surfaces and void free vias, (iii) a strong and uniform Back Surface Field (BSF) layer within dot vias and line vias.

Abstract: A method to fabricate monolithically-integrated optoelectronic module apparatuses (100) comprising at least two series-interconnected optoelectronic components (104, 106, 108). The method includes deposition and scribing on an insulating substrate or superstate (110) of a 3-layer stack in order (a, b, c) or (c, b, a) comprising: (a) back-contact electrodes (122, 124, 126, 128), (b) semiconductive layer (130), and (c) front-contact components (152, 154, 156, 158). Via holes (153, 155, 157) are drilled so that heat of the drilling process causes a metallization at the surface of said via holes that renders conductive the semi-conductive layer's surface (132, 134, 136, 138) of said via holes, thereby establishing series-interconnecting electrical paths between optoelectronic components (104, 106, 108) by connecting first front-contact components (154, 156) to second back-contact electrodes (124, 126).

Abstract: A method for fabricating a semiconductor device utilizing a plurality of masks and spacers. The method includes forming parallel first trenches in a substrate using a first lithographic process. The substrate includes sidewalls adjacent to the parallel first trenches. Forming first spacers adjacent to the sidewalls. Removing the sidewalls, which in part includes using a second lithographic process. Forming second spacers adjacent to the first spacers, resulting in spacer ridges. Etching portions of the substrate between the spacer ridges resulting in second trenches.

Abstract: A method for the production of a wafer-based, back-contacted heterojunction solar cell includes providing at least one absorber wafer. Metallic contacts are deposited as at least one of point contacts and strip contacts in a predetermined distribution on a back side of the at least one absorber wafer. The contacts have steep flanks that are higher than a cumulative layer thickness of an emitter layer and an emitter contact layer and are sheathed with an insulating sheath. The emitter layer is deposited over an entire surface of the back side of the at least one absorber wafer. The emitter contact layer is deposited over an entire surface of the emitter layer so as to form an emitter contact system. At least one of the emitter layer and the emitter contact layer is selectively removed so as to expose the steep flanks of the contacts that are covered with the insulating sheath.

Abstract: In a method for manufacturing a solar cell where the solar cell includes a dopant layer having a first portion of a first resistance and a second portion of a second resistance lower than the first resistance, the method includes ion-implanting a dopant into the semiconductor substrate to form the dopant layer; firstly activating by heating the second portion and activating the dopant at the second portion; and secondly activating by heating the first portion and the second portion and activating the dopant at the first portion and the second portion.

Abstract: A metal contact of a solar cell is formed by electroplating copper using an electroplating seed that is formed on a dielectric layer. The electroplating seed includes an aluminum layer that connects to a diffusion region of the solar cell through a contact hole in the dielectric layer. A nickel layer is formed on the aluminum layer, with the nickel layer-aluminum layer stack forming the electroplating seed. The copper is electroplated in a copper plating bath that has methanesulfonic acid instead of sulfuric acid as the supporting electrolyte.

Abstract: The method for producing a photoelectric converter of the present invention comprises a preparation step for preparing a substrate (2) that has a photoelectric conversion layer (2a) and is formed from silicon; a first film-formation step for the formation of a first protective film (3) by deposition of aluminum oxide on a top surface (2B) of the substrate (2) using the atom deposition method or chemical vapor deposition method in an atmosphere containing hydrogen; and a second film-formation step for forming a second protective film (4) by deposition of aluminum oxide on the first protective film (3) using sputtering after the first film-formation step.

Abstract: A method of fabricating an all-back-contact (ABC) solar cell, and an ABC solar cell. The method comprises the steps of forming respective pluralities of different polarity rear side doped regions on a wafer; forming an insulating layer on the doped regions; and forming conducting bars on the insulating layer such that each conducting bar is in electrical contact with different ones of the doped regions of the same polarity.

Abstract: A solar cell includes a photoelectric conversion body and an electrode. One principal surface of the photoelectric conversion body includes a silicon surface made of silicon. The electrode is disposed on the photoelectric conversion body. The electrode includes a tin oxide layer and a metal layer. The tin oxide layer is disposed on the silicon surface. The metal layer is disposed on the tin oxide layer. The tin oxide layer includes a first tin oxide layer and a second tin oxide layer. The second tin oxide layer is stacked on the first tin oxide layer. The oxygen concentration in the second tin oxide layer is lower than that in the first tin oxide layer. At least of one of the surfaces of the tin oxide layer comprises the second tin oxide layer.

Abstract: The present disclosure relates to a method of forming a back-end-of-the-line metal contact that eliminates RC opens caused by metal dishing during chemical mechanical polishing. The method is performed by depositing a sacrificial UV/thermal decomposition layer (UTDL) above an inter-level dielectric (ILD) layer. A metal contact is formed that extend through the ILD layer and the sacrificial UTDL. A chemical mechanical polishing (CMP) process is performed to generate a planar surface comprising the sacrificial UTDL. The sacrificial UTDL is then removed through an ultraviolet exposure or a thermal anneal, so that the metal contact protrudes from the ILD layer.

Abstract: Methods for increasing the power output of a TFPV solar panel using thin absorber layers comprise techniques for roughening and/or texturing the back contact layer. The techniques comprise roughening the substrate prior to the back contact deposition, embedding particles in sol-gel films formed on the substrate, and forming multicomponent, polycrystalline films that result in a roughened surface after a wet etch step, etc.

Abstract: In one aspect of the present invention, a photovoltaic device is provided. The photovoltaic device includes a transparent layer; a first porous layer disposed on the transparent layer, wherein the first porous layer comprises a plurality of pores extending through a thickness of the first porous layer; a first semiconductor material disposed in the plurality of pores to form a patterned first semiconductor layer; and a second semiconductor layer disposed on the first porous layer and the patterned first semiconductor layer, wherein the patterned first semiconductor layer is substantially transparent. Method of making a photovoltaic device is also provided.

Abstract: Paste compositions, methods of making paste compositions, contacts, and methods of making contacts are disclosed. The paste compositions include a solid portion and a vehicle system. The solid portion includes a conductive metal component and a glass binder. The vehicle system includes organometallic compound containing zinc. The organometallic compounds containing zinc can be dissolved in the vehicle system and the vehicle system does not include particles that contain zinc. The paste compositions can be used to form contacts in solar cells or other related components.

Abstract: A method for producing a metallic contact structure for making electrical contact with a photovoltaic solar cell, wherein, in order to create the contact structure, a paste, which contains metal particles, is applied to a surface of a carrier substrate via at least one dispensing opening, wherein the dispensing opening and the carrier substrate are moved in relation to one another during the dispensing of the paste. The paste is circulated in a circulating region, and in each case a part of the paste is branched off out of the circulating region at a plurality of branching points and each branching point is assigned at least one dispensing opening, via which the paste branched off at the branching point is applied to the surface of the carrier substrate, wherein the paste flows through a flow path having a length of less than 1 cm in each case between being branched off out of the circulating region and being dispensed from the dispensing opening assigned to the branching point.

Abstract: An electronic device includes a substrate and a plurality of particles anchored to the substrate. An electrode material is formed over the particles and configured to form peaks over the particles. One or more operational layers are fog led over the electrode material for performing a device function.