Abstract: A method for producing a connection contact for a sensor or an actuator of a vehicle, the method including: providing a printed circuit board having at least one electronic component arranged thereon and having an opening; inserting a contact bushing into the opening; and combined soldering the at least one component to the printed circuit board and the contact bushing to the printed circuit board in one task. Also described are a related circuit board and a vehicle control unit.

Abstract: A connector structure includes a female housing and a male housing. The female housing includes a first holding portion holding first female terminals for power supply, a second holding portion adjacent to the first holding portion, formed as one unitary piece with the first holding portion, and holding second female terminals for communication, and a conductive shield layer separating the first holding portion from the second holding portion. The male housing includes a recessed portion configured to fit with the female housing, and holding first male terminals to be connected with the first female terminals and second male terminals to be connected with the second female terminals.

Abstract: A staple cartridge is adapted to enhance cell migration towards a wound site when staples are placed in tissue. In order to enhance cell migration, the staple cartridge is adapted to create an electrical potential within the tissue in the area of a wound or cut line. In embodiments, the electrical potential is created within the tissue by using staples in spaced rows formed of dissimilar metals having different anodic indexes to create a voltage gradient in the tissue to enhance cell migration toward the cut line.

Abstract: A connector includes a male plug and a female socket. The male plug includes a plurality of terminals and a first insulation body. Each of the terminals includes a signal contact portion, a U-shaped terminal fixing portion, and a terminal soldering portion. The U-shaped terminal fixing portion of each of the terminals connects the signal contact portion and the terminal soldering portion. The first insulation body includes a plurality of connection slots, and each of the connection slots is configured to receive the terminal correspondingly. The female socket includes terminal portions, and a second insulation body having a plurality of receiving slots. Each of the receiving slots is configured to receive the terminal portion correspondingly. When the male plug is plugged into the female socket, the plurality of terminal portions are held by the signal contact portions of the male plug.

Abstract: A high-speed electrical connector includes an insulating case, several signal terminals, several grounding terminals, an electrical bridge, and several resilient conductive buffers mounted in the insulating case. Each of the signal and grounding terminals has a fixing segment and a swing segment swingable with respect to the fixing segment. The electrical bridge corresponds to two of the grounding terminals. The conductive buffers are disposed on the electrical bridge and are respectively arranged in the swing paths of the swing segments. Each conductive buffer is configured to transform from an initial state to a deformation state by pressing. Each swing segment can swing to press the corresponding conductive buffer, causing the corresponding conductive buffer to be in the deformation state, thereby establishing an electrical connection path between the electrical bridge and the corresponding grounding terminals. In one example, the buffer can be formed of elastomer mixed with conductive particles.

Abstract: A chip package is described. This chip package includes a substrate having a side at an angle relative to the top and bottom surfaces of the substrate that is between that of a direction parallel to the top and bottom surfaces and that of a direction perpendicular to the top and bottom surfaces (i.e., between 0° and 90°). This side may be configured to couple to a stack of semiconductor dies in which the semiconductor dies are offset from each other in a direction parallel to the top and bottom surfaces so that one side of the stack defines a stepped terrace. For example, the side may include electrical pads. These electrical pads may be coupled to electrical pads on the top surface by through-substrate vias (TSVs) in the substrate. Moreover, the electrical pads on the top surface may be configured to couple to an integrated circuit.

Abstract: A merchandise display security device for displaying and protecting an article of merchandise includes means for retaining a power adapter cord on a sensor housing when the article of merchandise is attached to the sensor housing. The sensor housing includes a body configured for attachment to the article of merchandise and a power output port. A shelf adjacent the power output port includes an outer wall that defines a groove for receiving and retaining a portion of the power adapter cord. The portion of the power adapter cord is disposed within the groove and rotatable between an engaged, but uncoupled position in which the article of merchandise cannot be readily attached to the sensor housing and an engaged and coupled position in which the article of merchandise can be attached to the sensor housing and the power adapter cord is retained on the sensor housing.

Abstract: A connector structure includes an enclosure; a plurality of ground units arranged in the enclosure and respectively including a carrier plate and a plurality of ground terminals electrically connected to one another and associated with the carrier plate; a plurality of signal units arranged in the enclosure side by side to locate between any two adjacent ones of the ground units, and the signal units respectively including a carrier plate and a plurality of signal terminals associated with the carrier plate; and a ground connecting member connected to the carrier plates of the ground units and the signal units. With these arrangements, the connector has simple structure and can be easily assembled for use, and the ground units are connected to the ground connecting member to thereby effectively prevent electromagnetic interference during signal transmission and ensure increased transmission rate.

Abstract: Provided is a multi-chip package in which a plurality of semiconductor chips having different sizes are stacked. A multi-chip package may include a substrate, and a plurality of semiconductor chips stacked on the substrate, each of the plurality of semiconductor chips having a different size. Each of the plurality of semiconductor chips including a pad group and a reference region associated with the pad group, each pad group having a plurality of pads, and the plurality of pads in each pad group located at same coordinates with respect to the associated reference region, and each of the plurality of semiconductor chips having their reference regions vertically aligned.

Abstract: Disclosed herein is a card adapter for electrically connecting electrical connecting portions of a card-shaped electronic device such as a CF card to contacts in a slot for a PC card provided in a personal computer. The card adapter 1 includes a chassis 10, a pair of conducting plates 40 provided on the upper and lower sides of the chassis 10, and a grounding member 20, and the like. The grounding member 20 is used to provide an electrical path for electrically connecting a grounding contact portion of the CF card to a grounding part of the slot without using the conducting plates 40 and it is formed into a single part. By using such a grounding member 20, the card adapter 1 can directly connect the grounding contact portion of the CF card to the grounding part of the slot to accomplish stable and reliable grounding.

Abstract: An optical coupling connector portion, including ferrule portions, is provided at a widthwise central portion of a connector housing having a shape flattened in a direction of the width thereof. Female connection terminal portions, serving as electrical connection terminals, are provided in a distributed manner at widthwise opposite side portions of the connector housings disposed outwardly respectively of opposite sides of the optical coupling connector portion. An optical coupling connector portion, including ferrule receiving portions for respectively receiving the ferrule portions, is provided at a widthwise central portion of a second connector housing. Male connection terminal portions, serving as electrical connection terminal portions, are provided in a distributed manner at widthwise opposite side portions of the connector housing in corresponding relation to the female connection terminal portions.

Abstract: A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high density integrated circuit module. Connections between stack elements are made through carrier structures that provide inter-element connections that substantially follow an axis that is substantially perpendicular to the vertical axis of the stack. The carrier structure provides connection between elements through conductive paths disposed to provide connection between the foot of an upper IC element and the upper shoulder of the lower IC element. This leaves open to air flow most of the vertical transit section of the lower lead for cooling while creating an air gap between elements that encourages cooling airflow between the elements of the stack. A method for creating stacked integrated circuit modules according to the invention is provided.

Abstract: An apparatus for measuring a permanent displacement of an elastic contact segment of a terminal having a displacing load imposing unit, wherein a terminal to be measured is clamped on a surface of a terminal mounting plate, a load imposing head is operated to impose load onto the elastic contact segment of the terminal with its load imposer, a displacement of the load imposing head is measured by a measuring instrument and the contact between the load imposer an the elastic contact segment of the terminal is detected by a circuit tester. An initial contact position of the load imposer with the elastic contact segment is measured at first and continuing to load the elastic contact segment until it reaches a predetermined deformed position. This deformed elastic contact segment is inprocess heat treated and then unloaded by reversing the movement of the load imposer after completing the heat treatment.

Abstract: Disclosed is a printed circuit board that includes selectable structures for attenuating EMI/RFI of replaceable components. In one preferred embodiment, the printed circuit board has a power plane that is subdivided into a plurality of power islands, a ground plane, a plurality of bypass capacitors, and a connector mounted on the printed circuit board for receiving electrical components. Each bypass capacitor is connected between the ground plane and an associated one of the power islands. The connector is connected to at least two selected power island, and the selected power islands are arranged such that when a first electrical component is inserted into the connector, a first one of the selected power islands is automatically connected to a power supply pin of the first electrical component to facilitate attenuation of electromagnetic interference generated by the first electrical component in a first frequency band.

Abstract: A printed circuit board plug connector includes first and second mutually perpendicular printed circuit boards. A first contact bank in the form of a multiple plug is disposed on the first board and a second contact bank in the form of a multiple connector is disposed in an edge region and protrudes at a longitudinal edge of the second board. The second contact bank has a plug-in area and a body with a lower surface and electrical connections protruding from a lower surface of the second board. A metal shielding element which is a rigid, rectangular, closed circumferential frame surrounds the sides of the first contact bank. The frame has longitudinal walls and transverse walls with inner surfaces. Circumferential metal sheets being feathered at narrow intervals are attached to inner surfaces of the walls of the frame in the form of inwardly curved, resilient, inner contact elements. Insert pins plug the metal shielding element into bores formed in the first board.

Abstract: On a printed circuit board or module card (20) of a standard size for a particular type of system, one or more different, smaller circuit cards or sub-modules (50) can be selectively mounted on the module card so as to utilize a maximum of its area. The module card has openings or holes (30) therein so as to provide component clearance and thus prevent the thickness of the module card from reducing the maximum permissible height of the components that can be mounted on the sub-modules. In order to minimize the amount of module card area devoted to interconnecting to the sub-modules, the sub-modules plug into the module card as the sub-module is moved in a direction perpendicular to the plane of the module card rather than in a direction parallel to the plane of the module card. Circuit wiring and switching (FIG.

Abstract: A circuit card assembly adapted to be coupled to a housing for reducing the amount of electromagnetic interference (EMI) escaping from the housing into the environment. The circuit card assembly includes a printed circuit board, an insulative faceplate coupled to the front edge of the printed circuit board, and a shielding assembly. The shielding assembly includes an electrically conductive strip extending along the rear surface of the insulative faceplate, and a grounding path coupled to the printed circuit board and electrically coupled to the conductive strip. The grounding path provides a reliable, solid, positive ground between the conductive strip and the housing upon insertion of the printed circuit board into the housing.

Abstract: A DC power supply device for use with a video tape recorder with a built-in camera has a plurality of power supply blocks for supplying a plurality of voltages, each of the power supply blocks being composed of a switching circuit for being supplied with a DC voltage and a smoothing circuit connected to an output terminal of the switching circuit. The power supply blocks are mounted on a multilayer circuit board which includes a layer of a ground pattern with an electric conductor extending substantially fully thereover, the ground pattern being separated into a plurality of ground pattern portions by a plurality of recesses defined therein, the power supply blocks having respective ground terminals connected to the ground pattern portions, respectively.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: The main system printed circuit board of a computer is mounted on a tray structure that also supports other CPU components of the computer and is removably insertable into the housing portion of the computer. A specially designed card edge connector portion of the system board is operatively insertable into a socketed connector on another circuit board interiorly mounted within the housing. Electrically conductive signal fingers and grounding fingers are respectively mounted on first and second sides of the card edge, with the signal fingers being connected to the signal plane of the system board, and the grounding fingers being connected to its ground plane.

Abstract: An electronic assembly includes an electronic module mountable to a backplane having a ground plane for grounding and EMI shielding. The electronic module includes a conductive chassis having a floating chassis board. Interface connectors are mounted to the chassis board and to the backplane and mate with one another when the electronic module engages the backplane. A grounding clip is mounted to the chassis board and is used to engage an alignment pin extending from the backplane. The grounding clip includes a laterally extending resilient arm which grounds the clip to the chassis. The alignment pin is electrically connected to the backplane ground plane and the grounding clip is electrically connected to the chassis board ground plane so that both ground planes are grounded to the chassis through the grounding clip. The backplane includes a ground pad which circumscribes the interface connectors and is connected to the ground plane.

Abstract: In order to achieve a partial shielding with different shielding potentials, the shieldings per plug are composed of angled-off shields at the solder side and/or at the component side of a printed circuit board, whereby the length of the shields corresponds to the single or, respectively, multiple length of an individual segment of the spring contact housing of the plug. For fastening the shields to the module, the shields have hooks that are engageable into entry funnels of the outer spring chambers of the spring contact housing and also have press-in pins with which they are secured to the printed circuit board. Also, the shields comprise spring sections in the region of the contact blades, the spring sections being outwardly arced, separated from one another by slots and extending parallel to the contact blades.

Abstract: Electromagnetic shielding apparatus for portable telephones (300) and other electronic equipment, includes shield clips (100) for intercoupling the conductive surfaces of a housing (302 and 303) to the metal layer (205) of the circuit board (200). Each shield clip (100) mates with a corresponding edge (204) of the circuit board (200) such that tabs (208, 209, 210) insert into holes (108, 109, 110) in the central channel (111--113) of the clip (100) and feet (101, 102, 103) of the clip rest on other tabs (201, 202, 203). The clip (100) is bonded to the metal layer (205) of the circuit board preferably by resistance welding, thereby reliably connecting the clip (100) and the conductive housing surfaces to signal ground.

Abstract: Electromagnetic shielding apparatus for portable telephones (300) and other electronic equipment, includes shield clips (100) for intercoupling the conductive surfaces of a housing (302 and 303) to the metal layer (205) of the circuit board (200). Each shield clip (100) mates with a corresponding edge (204) of the circuit board (200) such that tabs (208, 209, 210) insert into holes (108, 109, 110) in the central channel (111-113) of the clip (100) and feet (101, 102, 103) of the clip rest on other tabs (201, 202, 203). The clip (100) is bonded to the metal layer (205) of the circuit board preferably by resistance welding, thereby reliably connecting the clip (100) and the conductive housing surfaces to signal ground.

Abstract: A connector structure comprising an electrically conductive plate having a plurality of through holes formed therein, an electrically insulated film formed on the inner wall of at least one of the through holes, an electrically conductive film formed on the inner wall of at least one other through hole, and an electrically conductive material of a low melting point provided within the through holes. The low melting point material provided in the through holes whose inner walls are coated with an electrically insulating film is insulated from the electrically conductive plate and such through holes may serve to receive signal propagating pins.