Abstract: A system and a method of testing a semiconductor die is provided. An embodiment comprises a plurality of metal tips that are connected to a redistribution layer that fans out the pitch from the tips to metal plugs located in the substrate. The metal tips could be formed using semiconductor processes and either adding smaller layers of metal to larger layers of metal or else removing portions of one piece of metal to form the tips. The metal plugs are connected to a space transformation layer. The space transformation layer is electrically connected to a printed circuit board using, for example, a spring loaded connection such as a pogo pin. The space transformation layer is aligned onto the printed circuit board by a series of guidance mechanisms such as smooth fixtures, and the planarity of the tips is adjusted by adjusting a series of screws.

Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.

Abstract: A probe card which can be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. For this purpose, probe units in which multiple film probes are supported by support rods in a stacked or parallel-arranged manner are placed and fixed in each of the openings in a grid support. A plurality of fixing devices protruding from the grid support at a side to be connected to the circuit board are provided to be inserted in corresponding holes in the circuit board to fix the grid support to the circuit board. There is no or subtle difference between an outer diameter of an inserting section of the fixing device and an inner diameter of the hole in the circuit board around the center of the circuit board with the inserting section inserted in the hole, and the difference is larger at the rest of the area of the circuit board.

Abstract: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element.

Abstract: An elongate electrical contact element (1) for physically contacting electrical components under test, having two electrical contacting end regions (2, 3) and an elongate intermediate region (4) situated between the end regions (2, 3). The intermediate region (4) has an essentially rectangular cross-section and is configured lamellar along its longitudinal extent. Also disclosed is a corresponding contacting apparatus (22) including such a contact element (1) and a contact element holder (23).

Abstract: An interface apparatus 5 mounted on a test head 4 comprises: an electrical cable 54 having one end electrically connected to a socket board 66; a device side connector 541 attached to the other end of the electrical cable 54; and a intermediate connector 53 electrically connecting a test head side connector 41 provided on the test head 4 and the device side connector 541 and the intermediate connector 53 having a connector body 531 provided at a bottommost part of the interface apparatus 5; an engagement hole 532 provided at the connector body 531 and having the device side connector 541 detachably connected to it; and an output terminal 537 provided at the connector body 531 and having the test head side connector 41 detachably connected to it.

Abstract: Provided is a semiconductor device, in which: patterns for detecting displacement at probing are formed of a plurality of minute conductors formed below a protective film; each of the plurality of minute conductors formed below the protective film is electrically insulated and formed to be smaller than a bottom surface of a tip of a probing needle used for carrying out an electrical measurement of IC chips; and the patterns for detecting displacement at probing are provided in a pair for each of the IC chips.

Abstract: An electron beam apparatus comprises a TDI sensor 64 and a feed-through device 50. The feed-through device has a socket contact 54 for interconnecting a pin 52 attached to a flanged 51 for separating different environments and the other pin 53 making a pair with the pin 52, in which the pin 52, the other pin 53 and the socket contact 54 together construct a connecting block, and the socket contact 54 has an elastic member 61. Accordingly, even if a large number of connecting blocks are provided, the connecting force may be kept to such a low level as to prevent the breakage in the sensor. The pin 53 is connected with the TDI sensor 64, in which a pixel array has been adaptively configured based on the optical characteristic of an image projecting optical system. That sensor has a number of integration stages that can reduce the field of view of the image projecting optical system to as small as possible so that a maximal acceptable distortion within the field of view may be set larger.

Abstract: A test pin includes a compression element (110), a first tip (120) physically coupled to a first end (111) of the compression element, a second tip (130) physically coupled to a second end (112) of the compression element, a first arm (140) physically coupled to a first side (121) of the first tip, and a second arm (150) physically coupled to a second side (122) of the first tip.

Abstract: A probe connector includes a barrel, a plunger and an elastic element. The barrel disposes a base at one end thereof. The plunger has a basic portion received in the barrel and a contact portion extending out of the barrel from the other end of the barrel opposite to the base. The elastic element is arranged inside the barrel. Two ends of the elastic element are respectively mounted to the basic portion of the plunger and the base and are mounted in a manner such that the two ends of the elastic element are offset and the elastic element is distorted. As the elastic element is distorted inside the barrel, the supporting force provided by the elastic element is not in line with the longitudinal axis of the plunger. The component force of the supporting force provided by the elastic element along the transverse direction is increased, so the plunger is biased to contact the barrel stably.

Abstract: An electrical connection device includes a platform and a moving head. Between these components a semiconductor component is received and retained. The semiconductor component includes an electrical connection plate bearing an integrated circuit chip. The platform supports the making of electrical connection with front electrical connection terminals provided on a front panel of the electrical connection plate. The moving head bears a printed circuit board having interlinked pairs of contact terminals and associated pairs of electrical connection posts which make contact between the pairs of contact terminals of the printed circuit board and rear link terminals and rear transfer terminals provided on a rear panel of the electrical connection plate. The electrical connection plate includes circuitry which electrically connects the rear link terminals to the chip and also circuitry which electrically connects rear transfer terminals to front transfer terminals.

Abstract: Provided is an electrical connector for interconnecting electrical components such as a printed wiring assembly to one or more additional printed wiring assemblies. The connector includes a housing containing one or more compliant pins, one or more spring probes, and an interconnect for mechanically and electrically interfacing the pins with the probes. An alignment pin mounted in the housing helps to ensure alignment between one end of the connector and a corresponding PWA. In use, the compliant pins are inserted through a conformal coating and into vias in a first PWA, while the spring probes contact connector pads on a second PWA. Multiple connectors may be used to interconnect the two PWA, depending on PWA design.

Abstract: An insulative casing has a bottom face to be mounted on a board member. A conductive pin is disposed in the casing so as to be slidable in a first direction parallel to the bottom face. A conductive terminal is disposed in the casing and has at least one elastic piece which is always brought into contact with an outer periphery of the pin from a second direction perpendicular to the first direction. An elastic member is disposed between the pin and the terminal so that a tip end of the pin is projected from the casing while being retractable in the first direction.

Abstract: In an electric-connection testing device of the present invention, a base and a rigid body, to which a substrate provided with a plurality of contacts are secured, are integrated and sandwich a leaf spring. The leaf spring has a spring structure with two or more independent elastic degrees of freedom. Such a small, simple, and adjustment-free structure can uniformize a pressing force applied from the contacts to electrodes of an object to be tested.

Abstract: A socket for a microelectronic component is provided. The socket contains power, ground and signal conductors. It further contains a plurality of electrical conductors, each with a respective stop component, interconnection element, spring portion and protrusions. A plurality of protrusions is equal amongst each respective electrical conductor and identical in height. A plurality of electrical conductors are inserted into a respective opening within the socket body, a select plurality of electrical conductors electrically connects, via protrusions that frictionally fit, to either a power, ground or signal plane for the purpose of providing current to the integrated circuit. While a first plurality of electrical conductors are electrically connected through the same power, ground or signal conductor, they are also electrically disconnected from a second plurality of electrical conductors that are electrically connected though another conductors, not the same as the first.

Abstract: A contact-making apparatus for making contact with circuit units to be tested in a tester contains a printed circuit board device that has electrical connections to the tester, and a test module device. The test module device has first contact-making elements for making electrical contact between the test module device and the printed circuit board device, and second contact-making elements for making electrical contact between the test module device and the circuit unit to be tested. When the printed circuit board device and the circuit unit to be tested are pressed onto each other, a spring force of the first contact-making elements is lower than the spring force of the second contact-making elements under a low initial compression, and a spring force of the first contact-making elements are higher than the spring force of the second contact-making elements under a high final compression.

Abstract: A method of fabricating a polysilicon film by an excimer laser crystallization process. First, a substrate comprising a first region and a second region is provided. An amorphous silicon layer and a mask layer are formed on the substrate in sequence. Then, a photo-etching process is performed to remove the mask layer in the first region. A heat-retaining capping layer is formed on the mask layer and the amorphous silicon layer. After that, an excimer laser crystallization process is performed so that the amorphous silicon layer in the first region is crystallized into a polysilicon film.

Abstract: A connector that includes a male connector assembly having a nose portion that removably fits within an axial cavity in a female connector assembly and which has removable, replaceable contacts. The connector assemblies are constructed for attachment to equipment and instrumentation in wet or dry environments. Each connector assembly may include a plurality of conductors that are constructed for attachment to conductors in the equipment and instrumentation. Each conductor in the male connector assembly is matched with a conductor in the female connector assembly for transmission of a signal therethrough. Electrical contacts within the connector assemblies provide individual contact of the matching conductors. Insulators separate and insulate the electrical contacts from one another.

Abstract: An electronic probe extender. In representative embodiments, an electronic probe extender is disclosed which includes a probe connector that is capable of electronic contact to an electronic test probe, an electronic signal conductor connected electronically to the probe connector, and an electronic probe tip connected electronically to the signal conductor. The electronic probe tip includes a tapered electronically conductive tip. The electronic probe tip is capable of electronic connection to an electronic test point.

Abstract: A probe card for testing semiconductor devices includes a main board member, an upper reinforcing plate, a lower reinforcing plate, an interface member, a sub board member, a needle guide member, a needle member, a side cover member, and a clamping member. The probe card achieves an interface between the circuit boards through elastic connection pins so as to cope with a connection shock with the connection terminals of a semiconductor device, thereby preventing damages on the boards, and has the component parts combined together simply by face contacts to facilitate assembly and disassembly of the component parts and thereby to provide a great economical advantage in the aspect of maintenance and repair.

Abstract: A pin having a voltage probe pin-head is provided. The pin includes a pin-head having a substantially flat surface at one end and a pin-head tip at an opposing end, the substantially flat surface is configured to attach to a resistor, and the pin-head tip contacts an electrical test point. The pin also has a neck-like portion that extends between a shaft and the pin-head, wherein the neck-like portion is shorter than the shaft and has a diameter that is smaller than a diameter of a cross-section of the shaft.

Abstract: A cartridge system includes a main probing head body with electronics positioned therein. Further, the cartridge system includes a probing tip cartridge having a probing tip. A minimally inductive electrical contact mechanism electrically couples the electronics to the probing tip when the probing tip cartridge is in mating relationship with the main probing head body. The types may be, for example, a pointed tip, a socket tip, or a grabber tip. In one preferred embodiment the probing tip cartridge further includes at least one foot.

Abstract: A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for engaging a solder ball lead of an IC package, and the contact includes an intermediate collar which maintains the contact within the through hole. The helical spring is disposed about the contact, with one end thereof engaging the lower end of the collar. The other end of the helical spring has contiguous coils and is of a reduced diameter so as to extend beyond the lower end of the non-conductive substrate to make electrical contact with a printed circuit board. When the test probe is compressed between the IC package and the printed circuit board, the inherent twisting of the helical spring causes the contact to tilt and make electrical contact with the contiguous coils, thereby establishing a direct electrical path between the IC package and the printed circuit board, with minimum resistance and minimum inductance.

Abstract: A probe block assembly has an electrically insulative housing and an electrically conductive plate. The front side of the housing has a forward face and a recessed face. The electrically conductive plate is positioned against the recessed face of the housing. A plurality of probes extend from the forward face of the housing and are electrically isolated from each other and from the conductive plate. A plurality of probes extend from a front surface of the conductive plate and are in electrical contact with each other.

Abstract: Multiple-contact electrical connectors comprising in particular a base 1, two pairs 2, 3 of input/output terminals 4-6, two electrically conductive needles 11, 12, two electrically insulating plates 21, 22 having orifices 31-34, the needles being slidably mounted relative at least to the plate 22, and means for fixing the two plates 21, 22 relative to the base 1. The connector further comprises: at least two other plates 23, 24 positioned between the two plates 21, 22 and in which orifices 41-44 are formed, the needles being slidable in the orifices 41-44; and elements for causing the plates 23, 24 to move respectively in two substantially opposite directions so as to impart two pre-buckles 61-64 to each needle in opposite directions on either side of its rest position. The invention is applicable in particular to connectors for making an electrical connection between a test device and electronic components such as chips, for example.

Abstract: A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for engaging a solder ball lead of an IC package, and the contact includes an intermediate collar which maintains the contact within the through hole. The helical spring is disposed about the contact, with one end thereof engaging the lower end of the collar. The other end of the helical spring has contiguous coils and is of a reduced diameter so as to extend beyond the lower end of the non-conductive substrate to make electrical contact with a printed circuit board. When the test probe is compressed between the IC package and the printed circuit board, the inherent twisting of the helical spring causes the contact to tilt and make electrical contact with the contiguous coils, thereby establishing a direct electrical path between the IC package and the printed circuit board, with minimum resistance and minimum inductance.

Abstract: A cartridge system includes a main probing head body with electronics positioned therein. Further, the cartridge system includes a probing tip cartridge having a probing tip. A minimally inductive electrical contact mechanism electrically couples the electronics to the probing tip when the probing tip cartridge is in mating relationship with the main probing head body. The types may be, for example, a pointed tip, a socket tip, or a grabber tip. In one preferred embodiment the probing tip cartridge further includes at least one foot.

Abstract: A pull tab (1) for electrical connector includes a body (2), a first outspread arm (3) and a second outspread arm (4). The body includes a through hole (21) and a receiving space (24). A bottom wall (27), two side walls (22, 23) and two upper walls (25, 26) of the body define the receiving space. Each outspread arm bends from a corresponding upper wall perpendicular to the bottom wall. The pull tab is assembled to an electrical connector with the through hole mating with a mating portion of the electrical connector. The electrical connector is pulled out from a complementary device by the first and second outspread arms.

Abstract: An electric signal taking-out method and a device therefor capable of taking out electric signals for measurement easily from opposite ends of an arbitrary chip part soldered to a circuit board. A pair of contact elements having sharp distal ends and bent obliquely inward are arranged so that the distal ends thereof face each other. The contact elements are shifted inward by a holding member so that the distal ends bite into solder joints by which the chip part is soldered to the circuit board. The contact elements are held in the biting state so that electric signals are taken out independently from the respective contact elements.

Abstract: A thermoelectric connector module (C) is disclosed which comprises input (2) and output (1E) connectors and contains signal conditioning circuitry (1C). The input connectors (2) are interfaced with a hand-held detector (7), and the output connectors (1E) are connected to signal-utilising apparatus (11). The module does not contain a battery but receives its power supply for the conditioning circuitry from the signal-utilising apparatus supplied via the output connectors (1E). In this way, the module may be miniaturised, making it particularly suitable for mounting directly on a hand-held temperature detector or probe. Since the connector does not have to be opened for a battery replacement, it can be permanently hermetically sealed, providing resistance to dirt, dust, moisture, water and the like.

Abstract: An electrical connector has a compressible portion that expands to accept an inserted lead and then contracts around the lead to provide both an electrical and a spring-like mechanical connection to the lead. The connector may have a fluted pin that collapses around the lead body when a set screw of the connector port is tightened. Alternatively, a middle segment of a pin may have indentations or slots that collapse around an inserted lead body. The connector can be attached to the lead body after the lead body is implanted in the body of the patient. In lead systems in which the lead body is implanted using a guide catheter, attaching the connector to the lead body after implantation makes removal of the guide catheter much less difficult.

Abstract: A fixed electrical connection member of an electronic device for connecting one or more electrical conductors of the electronic device to a mobile electrical connection member external to the electronic device includes, on the side external to the electronic device, 2N conductive terminals disposed on a front face and connected, inside the electronic device, to the electrical conductor of the electronic device, and aligned in pairs. The N pairs are aligned to form two rows of N terminals that are symmetrical with respect to a longitudinal axis. Each terminal of a pair is electrically connected to the terminal of the adjacent pair on the other side of the longitudinal axis.

Abstract: A multi-meter test lead system has a probe having a pointed distal end and a proximal end couplable to supplemental electronic components. An outer sleeve has a distal end with a semi-cylindrical opening and a proximal end with a circular opening at the end and slots adjacent thereto. An inner sleeve has and open distal with an adjacent opening and a pair of diametrically opposed slots adjacent to the proximal end. The inner sleeve is adapted to slidably receive the probe and with the inner sleeve and probe are adapted to be slidably positioned within the outer sleeve to allow movement of the inner sleeve axially inwardly of the outer sleeve in response to a force by the user. A coil spring is within the outer sleeve. A pair of finger pads with an action pin extending through the outer sleeve and inner sleeve.

Abstract: A socket for an electrical part comprises a socket body and a contact pin through which an electrical part having a terminal and a printed circuit board are electrically connected. The socket body is provided with a lower plate to be mounted to the printed circuit board and an upper plate which is disposed above the lower plate and on which the electrical part is mounted. The upper plate is exchanged with one having a seating portion of different height. A contact portion of the contact pin is also exchangeable with one having different shape or type.

Abstract: A method of producing a contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors. The contactor is uniformly formed of conductive material and has an intermediate portion which is inserted in the through hole provided on the contact substrate in a vertical direction, a contact portion which is connected to the intermediate portion and positioned at one end of the contactor to function as a contact point for electrical connection with a contact target, and a base portion which is provided at other end of the contactor, and a spring portion which is substantially straight and upwardly inclined relative to the surface of the contact substrate and provided between the base portion and the intermediate portion.

Abstract: A testing device for connection to a relay is provided. The testing device comprises a binding post and a test paddle. The test paddle includes a body portion, a stud, a contact and a handle. The body portion has a stud opening, a contact opening associated with the stud opening and a barrier extending from a first end of the body. The contact extends through the contact opening and is electrically coupled to the stud. The handle is coupled to the body and configured for grasping by an individual's hand to promote insertion and removal of the test paddle from the relay. The binding post includes a cover configured for rotating the binding post, the cover having an inner chamber for receiving an insert of the binding post. The insert is configured to couple test equipment to the stud on the test paddle for testing relay switches.

Abstract: A method of producing an electrode brain probe assembly, using a flexible substrate comprising a polymeric layer bearing a conductive material coating. Photolithography and electroplating are used to form a set of contacts and conductors on the polymeric layer of the flexible substrate. Also, the flexible substrate is shaped to have a distal end and to be at least 5 mm long, but less than 5 mm wide and less than 1 mm thick.

Abstract: An insulating holder has a first face and a second face, with a first hole that has a first diameter at the first face, and a second hole that has a second diameter larger than the first diameter and extended from the second face so as to communicate with the first hole. Inside the second hole is a plate-shaped conductive terminal that has a base portion and at least one pair of guide portions extended from the base portion so as to define a concave portion between opposed inner edges of the guide portions. The concave portion faces the first hole. Included in between the opposed inner edges of the guide portions is a conductive pin with a plunger portion that has a diameter smaller than the first diameter and a bulged portion that has a diameter larger than the first diameter. The bulged portion of the pin has opposed grooves at its periphery that run parallel to the plunger portion's longitudinal axis and is fitted with the guide portions so as to be slidable along the concave portion.

Abstract: A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface.

Abstract: Probes and methods for testing electrical circuits are provided. One such probe includes a conductive socket, a conductive spring, and a housing that guides the conductive spring to the conductive socket to form an electrical connection between the spring and the socket. Once such method includes providing a conical housing and a spring and guiding the spring to the socket via the conical housing. The guiding step ensures that the spring contacts the socket during assembly and, therefore, ensures that a conductive path from the socket to the spring is provided. Methods and other probes are also provided.

Abstract: The logic analyzer interface assembly connects to a unit under test (UUT). The interface assembly includes an interface board having interface contact points matching the pattern of the UUT contact points. The interface board is mounted to a transfer interface including a probe plate and multiple spring loaded probes extending through the probe plate. The probes contact the UUT contact points at one end and the interface contact points at the other end. When assembled, the UUT and interface assembly form a sandwiched testing assembly that can be inserted into a chassis to aid in approaching an “at speed” observation opportunity.

Abstract: A contact structure for establishing electrical connection with contact targets has a unique mounting mechanism for easy assembly. The contact structure is formed of a contactor carrier and a plurality of contactors. The contactor carrier includes a sliding layer for locking the contactors on the contactor carrier. The contactor has an upper end having a cut-out to engage with the sliding layer, a lower end oriented in a direction opposite to the upper end and functions as a contact point for electrical connection with a contact target, and a diagonal beam portion provided between the upper end and the lower end to function as a spring.

Abstract: A probe is provided so as to obtain an electrical contact between a semiconductor device having a plurality of first electrodes as external terminals and an inspection substrate having a plurality of second electrodes so as to inspect the semiconductor device. A first substrate has through holes formed at positions corresponding to the first electrodes. Probe pins are fixed in the through holes. A second substrate has a rewiring layer for extending a pitch of the first electrodes and penetration electrodes for drawing out the first electrodes to a back surface. A contact is disposed between the penetration electrodes and the second electrodes and has conductivity and elasticity only in a vertical direction.

Abstract: A semiconductor socket is provided which is capable of saving time and efforts required for replacement of a probe and of reducing time required for replacement of the probe. The semiconductor socket of the present invention has a plurality of external input and output terminals at its bottom and is provided with a stage used for positioning, a probe used to come into contact with the external input and output terminals in the semiconductor device by approaching of the stage, a socket base housing the probe in a manner so as to be inserted and pulled out on a side of a face of the socket base being opposite to the stage, and a falling-off preventing portion being placed in a manner to be removable on the face of the socket base being opposite to the stage to prevent the probes from falling off.

Abstract: In order to make a conductive contact that is appropriate for fine pitching, without using a lead wire whose diameter is needlessly thin, a compressed coil spring 5 and the shells 6a and 7a of needle-like elements 6 and 7 that are connected to the two ends of the coil are accepted into a through hole 3a in an intermediate-layer member 3 that is laminated with three layers in an axial direction. A holding hole 8a is formed in a wiring plate 8 that is laminated on the top face of an upper-layer member 4, and an approximately circular flat part 9a that is formed at the end of a signal-transmitting lead wire 9 is accepted in the holding hole 8a of the wiring plate 8, and extraction of the flat part 9a from the holding hole 8a is prevented by making the lead-wire insertion hole 8b narrower in diameter than the holding hole 8a.

Abstract: A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contactor carrier and a plurality of contactors attached to a contactor adapter. The contactor adapter is inserted in a slot of the contactor carrier, thereby locking the contactors on the contactor carrier. The contactor has an upper end having a cut-out to engage fit in contactor adapter, a lower end oriented in a direction opposite to the upper end and functions as a contact point for electrical connection with a contact target, and a diagonal portion provided between the upper end and the lower end to function as a spring.

Abstract: A probe structure for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.

Abstract: A connector for testing shunted electrical terminal assemblies includes a selectively actuatable shunt displacement member for moving a terminal shunt between a shunted and unshunted position in response to a control signal. The connector allows for the testing of shunted circuits and connectors in a shunted and unshunted position. The connector is readily adaptable to systems for automated testing of airbag actuators and the like.

Abstract: The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to predetermined portions of the conducting frame to form the pre-assembly. A plurality of fine pitch electrical leads are disposed in parallel spaced apart relation and connected to each other by connecting strips. An insulating material is applied to the conducting frame to form the insulating frame. The insulating frame encapsulates portions of the electrical leads which extend from opposite sides of the center of the insulating frame retaining, therefore, the electrical leads in position and electrically isolated from one another. Portions of the conducting frame are then removed from the pre-assembly to obtain the electrical device.

Abstract: A probe whose characteristic impedance can be accurately adjusted to a desired value with the production of a small number of prototypes. The probe includes a first line with a signal terminal to be connected to a signal electrode of a circuit to be measured and at least one first region connected to the signal terminal and to which one end of a chip capacitor is connected, a second line connected to a terminal of the first line and a junction to be connected to a measuring instrument at the remaining terminal, and an impedance matched to a characteristic impedance of the measuring instrument, a ground connector with a ground terminal to be connected to the ground electrode of the circuit to be measured, and at least one second region connected to the ground terminal and on which the remaining terminal of the chip capacitor is mounted in one-to-one correspondence with the first region.