Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heatsink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A card connector includes a housing that houses a card provided with a terminal member, a connecting terminal and a cover member. The connecting member is attached to the housing that connects with the terminal member of the card. The cover member is connected to the housing and forms a card housing space between the housing, and is attached to a substrate.

Abstract: A heat sink socket for cooling electronic devices has a heat conducting body having an upper surface for receiving an electrical component and a lower surface for engaging a supporting circuit board. An insulated terminal has an electrical insulating body supporting a first electrical terminal within the heat conducting body. The first electrical terminal connects an electrical contact of the electrical component to the circuit board. The heat sink socket may include a ground plane on the heat conducting body. The ground plane may have a second electrical terminal that connects an electrical contact of the electrical component to the circuit board.

Abstract: A terminal connecting construction includes a substrate and a terminal. A heat-generating element is mounted on the substrate. A contact portion is provided in the terminal, and is contacted with the heat-generating element.

Abstract: A retention device (2) for positioning a heat sink (3) includes a base (21), a lever (22) and a pressing tab (23), the pressing tab (23) includes a first pushing portion (233) and a second pushing portion (232) for pressing the heat sink (3), the first pushing portion (233) includes an upper surface (2330) and a lower surface opposite (2331) to the upper surface (2330), the second pushing portion (232) includes a top surface (2320) and a bottom surface (2321) opposite to the top surface (2320), the distance between the upper surface (2330) and the lower surface (2331) is smaller than the distance between the top surface (2320) and the bottom surface (2321).

Abstract: A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.

Abstract: A structurally compact connector that dissipates heat quickly and efficiently is disclosed. The connector includes a housing having a plug receiving space. An elastic member is positioned on the housing, and is displaceable outward from the housing. A protrusion is positioned on an inner surface of the elastic member and extends into the plug receiving space. A thermally conductive element is disposed on an outer surface of the elastic member and is contactable with a heat sink positioned outside of the housing.

Abstract: For an object of providing a connector which has improved heat radiating efficiency, the connector includes a terminal 2 including a wire connecting portion 21 which an electric wire is connected, and a connector housing 3 provided with a terminal receiving section 30 receiving the terminal 2. Heat radiating portions 45, 55 are provided at a position of the terminal receiving portion 30, at which the wire connecting portion 21 is covered. In the heat radiating portions 45, 55, a plurality of projections 49, 59 formed to project from the surface 4a, 5a of the terminal receiving section 30 is arranged at intervals to each other.

Abstract: A contact device that electrically connects a first substrate and a second substrate. The contact device includes: a contact that has electrical conductivity and elasticity, the contact including a first terminal that is contactable with a first pad provided on the first substrate and a second terminal that is contactable with a second pad provided on the second substrate, the first terminal and the second terminal being biased in a direction spreading a distance therebetween; and a sheet that has flexibility and heat dissipation, and holds the contact so that the first terminal is arranged opposite to one surface of the sheet and the second terminal is arranged opposite to another surface of the sheet.

Abstract: An electronic device includes a circuit board, a connector fixed on the circuit board, and a heat sink mounted on the circuit board. The heat sink includes a securing portion. The securing portion defines a first cutout, a second cutout, and an arm located between the first and second cutouts. The arm resiliently urges the connector against the circuit board so as to firmly hold the connector between the heat sink and the circuit board.

Abstract: An electrical connector assembly for use with an electronic package, includes an electrical connector having a plurality of contacts, and an assistant heat sink mounted upon the electrical connector and having an opening to allow the electronic package connecting with the contacts.

Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink. The EMI gasket includes electrically conductive spring fingers that are engaged with and electrically connected to the mounting side of the cage.

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract: A heat dissipating system adapted to dissipate heat generated from an IC package mounted onto a socket connector, comprises a heat dissipating device comprising a heat spreader embedded with at least one heat pipe and a supporting plate flexibly seated upon an upper face of the heat spreader, and a clip located upon the heat dissipating device for pressing the heat dissipating device downward toward the socket connector.

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract: Disclosed is a method and apparatus for contacting the thermal connectors of expansion circuit boards characterized by having a thermal connector. The apparatus configured to be contacted by the thermal connector of an expansion circuit board when the expansion circuit board is installed and cooled by a combination of cooling means and heat transfer means including heatpipes, fans and heatsinks.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses a against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A connector is provided, including a housing, a base, a circuit board, a receptacle, a plurality of first terminals, and a filtering element. The base is disposed in the housing and forms a recess. The circuit board is disposed at a rear side of the base. The circuit board is coupled to the recess of the base to form an accommodating space. The receptacle is formed on the housing to receive an external plug. A plurality of first terminals are disposed on the base to electrically connect to the external plug. The filtering element is disposed in the accommodating space and is electrically connected to the circuit board.

Abstract: A cage can include a thermal plate positioned so as to be aligned with a bottom of a channel. An adjustable biasing system is provided to urge a module toward the thermal plate. The adjustable biasing system may be a riding heat sink. The thermal plate may include a fin to help increase its surface area. A housing with a card slot aligned with the channel can be provided in the cage to provide a receptacle that has a card slot aligned with the channel. A receptacle so configured allows for greater thermal energy to be removed from a module.

Abstract: A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferred from the module to spring fingers and then to the heat transfer plate and then to a thermal dissipation system.

Abstract: An active electrical connection system includes a first connector, a second connector for releasably connecting with the first connector, active circuitry for affecting a data signal, and a heat sink for dissipating heat. A heat sink positioning system comprising a plurality of protrusions and corresponding recesses precisely positions the heat sink during insertion to prevent sliding contact with a thermal interface material applied between the heat sink and a plug.

Abstract: A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB.

Abstract: A socket assembly, comprising a socket, a package received in the socket, a pressing member arranged upon the package and downwardly pressing the package and two heat pipes attached to the pressing member. The pressing member is formed with four arch grooves along a peripheral thereof, and the arch grooves allow linking members to pass therethrough and rotatablely retain the pressing member on a printed circuit board. Therefore, the pressing member can rotate in a certain range, by sliding the arch groove with respect to the linking member, to provide a flexible arrangement for heat pipes.

Abstract: An electrical connector system includes a first electrical connector having a mounting interface and a mating interface, wherein the mounting interface is configured to electrically connect to an electrical component, and the mating interface is configured to electrically connect to a complementary electrical connector along a forward insertion direction. The electrical connector system further includes a heat sink disposed forward of the first electrical connector, the heat sink defining an engagement surface configured to contact the complementary electrical connector when the first electrical connector is mated with the complementary electrical connector. The heat sink is movably supported in a direction substantially perpendicular with respect to the insertion direction so as to maintain the engagement surface in thermal contact with the complementary electrical connector.

Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract: A connector assembly that includes a communication connector comprising a base frame and a moveable side that is supported by the base frame. The moveable side has a mating array of terminals thereon and is configured to move with respect to the base frame between retracted and engaged positions to engage a communication component. The connector assembly also includes a flexible circuit including a flex interconnect that has opposite exterior surfaces. The flexible circuit is coupled to the moveable side. The connector assembly also includes a plurality of heat-dissipation elements that are attached to the flex interconnect and project away from one of the exterior surfaces. The heat-dissipation elements are configured to conduct thermal energy from the flex interconnect and transfer the thermal energy to an ambient environment.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: An insulating plate (20) made of synthetic resin for transferring heat transferred from conductors to nuts (10) to a heat sink (40) is provided with nut accommodating recesses (21) for accommodating the nuts (10). Each nut accommodating recess (21) includes a bottom plate (22) to be sandwiched between the nuts (10) and the heat sink (40) and a surrounding wall (23) vertically extending from the bottom plate (22) to surround the side surface of the nut (10). The surrounding walls (23) are provided with first and second pressing surfaces (28, 29) to be pressed by ejector pins (83).

Abstract: A USB device is provided. The USB device includes a housing, a circuit board, a chip, a USB connector and a metal connector. The circuit board is disposed in the housing. The chip is disposed on the circuit board. The USB connector is connected to the circuit board. The metal connector is connected to the USB connector, wherein the metal connector includes an extended portion, and the extended portion contacts the chip to dissipate heat from the chip.

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract: An electrical connector system includes a first electrical connector having a mounting interface and a mating interface, wherein the mounting interface is configured to electrically connect to an electrical component, and the mating interface is configured to electrically connect to a complementary electrical connector along a forward insertion direction. The electrical connector system further includes a heat sink disposed forward of the first electrical connector, the heat sink defining an engagement surface configured to contact the complementary electrical connector when the first electrical connector is mated with the complementary electrical connector. The heat sink is movably supported in a direction substantially perpendicular with respect to the insertion direction so as to maintain the engagement surface in thermal contact with the complementary electrical connector.

Abstract: A connector fixation structure includes: a connector having a rectangular connector body, protrusions protruding from facing sides in a wing like manner, and a terminal embedded in and protruding from the connector body; a heat sink having a plate shape body, a through hole and columnar convexities; and a printed board. The bottom of the connector is inserted into the through hole of the heat sink. Each columnar convexity is disposed on the plate shape body at a predetermined position corresponding to the protrusion. The top of the connector contacts a first surface of the printed board, and each columnar convexity is fixed to the printed board via the corresponding protrusion with a first screw.

Abstract: The invention relates to a component arrangement. In at least one embodiment, the component arrangement comprises: an electronics module; a heat sink contacted by the electronics module; a printed circuit board, and; a fastening means for fastening the electronics module to the printed circuit board and to the heat sink. The electronics module has at least one elastic connecting limb for the solder-free contacting of the electronics module with the printed circuit board and has a location for the fastening means. The electronics module additionally comprises a decoupling means for decoupling the force of pressure between the connecting limb and the printed circuit board from the contact force between the heat sink and the electronics module. In at least one embodiment of the invention an electronics module is provided that can be used in the aforementioned component arrangement.

Abstract: In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.

Abstract: A connector apparatus connects the flat electrical conductors of a photovoltaic panel with a plurality of insulated electrical output conductors, respectively. The terminal portions of the flat conductors are bent into electrical engagement with corresponding blade contacts mounted on the photovoltaic panel. A plurality of resilient first electrical contacts are clamped in electrical engagement with the flat conductor bent portions, respectively, and a plurality of second electrical contacts are connected with the output conductors, respectively. An electrical circuit including a plurality of diodes is connected between the first and second electrical contacts. In order to dissipate the heat generated by the diodes, the diodes are mounted on a heat conducting plate that transmits the heat toward the photovoltaic panel. A cover member formed of heat conducting material is adhesively secured to the panel to enclose the connector arrangement, thereby to also transfer the diode-generated heat to the panel.

Abstract: A socket and heat sink unit includes a socket portion configured to releasably couple to a removable LED light module. The unit also includes a heat sink portion attached to the socket portion and extending about a central axis. The heat sink portion comprises a plurality of fins, as well as one or more apertures configured to receive fasteners therein to fix the unit to a light fixture housing. The socket and heat sink portions are monolithic.

Abstract: An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

Abstract: A universal mounting supports high intensity LEDs in a lighting fixture with heat removal and electrical connection facilities. A holder includes a peripheral sidewall defining a cavity for accepting a printed circuit board assembly. A support member supports the printed circuit board assembly along the peripheral sidewall. Electrical contact elements are provided the printed circuit board. A thermal conduction member is in thermal communication with the printed circuit board assembly. The receptacle portion removably engages with the holder portion. A plurality of contact sockets conductively engages the electrical contact elements of the holder portion to interconnect the contact elements to external wires. An aperture in the receptacle portion accepts the thermal conduction member, wherein the thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board.

Abstract: A socket assembly includes a lighting package and a socket housing having a receptacle that removably receives the lighting package. A thermal management structure is coupled to the socket housing and is positioned at the receptacle in thermal engagement with the lighting package. The thermal management structure is configured to engage a heat sink to dissipate heat from the lighting package to the heat sink. Optionally, at least one of the socket housing and the thermal management structure may have mounting features configured to mount the socket assembly to a heat sink, where the lighting package is removable from the receptacle while the socket assembly remains mounted to the heat sink. The thermal management structure may be coupled to the socket housing such that the thermal management structure and the socket housing are coupled to a heat sink as a unit.

Abstract: A socket assembly has a socket and a heat sink module detachably mounted on the socket. The socket has a base, a sliding board mounted on the base, a lid disposed upon the base and an actuator disposed between the base and the cover. The heat sink module has a fastening frame surrounding the base, a cover pivotally assembled to an end of the fastening frame and a heat sink mounted on the cover. The cover has a latching portion which latches with a top wall of the lid when the cover rotates to a closed position. The heat sink is brought by the cover to pass an open defined on the lid and to abut against an IC package seating on the sliding board.

Abstract: A thermal module directly press-forged from magnesium alloy is disclosed having a peripheral wall, a recessed chamber surrounded by the peripheral wall. The body is made of magnesium alloy by means of softening magnesium alloy with heat and then press forging softened magnesium alloy into the desired shape.

Abstract: An electrical connector assembly (100) includes an insulative housing (1), a number of contacts (2) received in the insulative housing, an integrated circuit (IC) package (3) mounted onto the insualtive housing, and a heat sink (4) attached on the IC package. The insulative housing includes a main portion (11) and a number of side walls (12) extending upwardly from the main portion. The IC package includes a base (31) and a die (32) attached to the base. The heat sink is supported by the side walls of the insulative housing and is in contact with the die of the IC package.

Abstract: An electrical connector assembly for electrically connecting an electrical package to a printed circular board, includes an electrical connector mounted on a printed circular board, and a heat dissipating device located upon the electrical package. The heat dissipating device includes a supporting body located upon the electrical connector, two latching pieces retaining the supporting body and heat pipes assembled on the supporting body. The latching piece rivets with the supporting body on a center part thereof, so when one end of the latching pieces is pressed downwardly, the opposite end will not be influenced.

Abstract: An electrical connector for electrically connecting with a complementary connector includes an insulative housing defining a number of contact-receiving passages, and a number of conductive contacts respectively received in the contact-receiving passages adapted for electrically connecting with conductive contacts of the complementary connector and generating heat. The insulative housing defines a pair of first heat-radiating channels located at opposite lateral sides thereof and extending through the insulative housing along a mating direction, and at least one second heat-radiating channel extending through the insualtive housing along the mating direction and located between at least a pair of contact-receiving passages adjacent thereto. The heat generated by the conductive contacts is capable of radiated out of the insualtive housing through the first heat-radiating channels and the at least one second heat-radiating channel.

Abstract: The present invention provides a high-temperature ceramic lampholder with an integral thermal switch for use in recessed or portable recessed lighting fixtures for general lighting in residential, institutional and commercial buildings. Lampholders according to the invention extend lamp life by reducing lamp base temperatures; improve fixture safety by lowering the heat on wire insulation; and lower fixture toxicity and enhance fixture reliability by eliminating solder joints with spade connectors.

Abstract: The object of this invention is, in an electronic device provided with a supporting member that supports a drive member driven with vibration by engaging therewith, to provide the fixing structure of wiring that realizes the following: alleviation of the wobble generated by the vibration at the operating time of the drive member, reduction of unwanted sound and vibration caused by the above wobble, and inexpensive fixing of a wire without additional and specific members for wiring. This invention is constituted as a fixing structure of wiring for fixing a wire wired in an electronic device, wherein a drive member driven with vibration and a supporting member for supporting the drive member by engaging therewith are provided in the electronic device, and wherein the wire is fixed by being interposed in a gap formed between the drive member and the supporting member.

Abstract: A socket assembly has a socket and a heat sink module detachably mounted on the socket. The socket has a base, a sliding board mounted on the base, a lid disposed upon the base and an actuator disposed between the base and the cover. The heat sink module has a fastening frame surrounding the base, a cover pivotally assembled to an end of the fastening frame and a heat sink mounted on the cover. The cover has a latching portion which latches with a top wall of the lid when the cover rotates to a closed position. The heat sink is brought by the cover to pass an open defined on the lid and to abut against an IC package seating on the sliding board.

Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.