Receives Plural Panel Circuit Edges Patents (Class 439/61)
  • Patent number: 7623358
    Abstract: An improved I/O device, such as an audio/video router, includes at least a motherboard, such as a matrix board, including a plurality of locating slots and a plurality of connectors located on the motherboard such that when the motherboard is mounted in the I/O device, the plurality of connectors are positioned horizontally across the I/O device. The I/O device further includes a plurality of input/output (I/O) cards, such as audio/video cards, each of the I/O cards including a locating slot and two I/O connectors. In an I/O device of the present invention, the locating slot of each of the I/O cards mates with a respective locating slot of the motherboard such that the two I/O connectors of each of the I/O cards vertically straddle a respective connector of the motherboard thus maximizing a number of inputs and outputs able to be provided in the rear of the I/O device.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: November 24, 2009
    Assignee: Thomson Licensing
    Inventors: Steven Edwin Miller, Scott Raitt
  • Patent number: 7613011
    Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.
    Type: Grant
    Filed: May 14, 2007
    Date of Patent: November 3, 2009
    Assignee: Interconnect Portfolio LLC
    Inventors: Kevin P. Grundy, Gary Yasumura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram
  • Publication number: 20090269945
    Abstract: A butterfly interface transfer structure including an interface card, a first add-in card and a second add-in card is disclosed. The interface card includes a plate, a first connector, a second connector and a spacer. The plate has a set of electrical connecting pins, a first surface and a second surface. The first connector is disposed on the first surface, and the second connector is disposed on the second surface, wherein the first connector and the second connector are respectively electrically connected to the electrical connecting pins. The spacer is disposed between the first connector and the plate. The first add-in card is coupled to the first connector, and the second add-in card is coupled to the second connector.
    Type: Application
    Filed: March 9, 2009
    Publication date: October 29, 2009
    Applicant: ASUSTeK Computer Inc.
    Inventors: Ching-Sung Tzeng, Chien-Ying Chen
  • Publication number: 20090163046
    Abstract: A distribution connection module which is used in the telecommunication and data technology field includes a housing defining a cavity in which at least one conductor plate is arranged. The housing includes at least one opening in the front side thereof through which a connection module can be inserted. The connection module is connected to at least the conduction plate in the inserted state. At least one support for a lifting tool is arranged on the housing in a lateral manner in relation to the connection module.
    Type: Application
    Filed: February 23, 2009
    Publication date: June 25, 2009
    Applicant: ADC GmbH
    Inventor: Manfred Stockel
  • Patent number: 7547214
    Abstract: A connector apparatus for connecting at least two electronic component substrates, e.g., printed circuit boards or flex circuits, to one another at the edges thereof, wherein each of the at least two substrates further comprises at least one electrically conductive contact surface, and wherein the connector apparatus further includes: at least one electrically conductive transverse conducting member, wherein a first portion of the at least one transverse conducting member physically touches the contact surface on the first substrate, and wherein a second portion of the transverse conducting member physically touches the contact surface on the second substrate; and mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: June 16, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Scott S. Duesterhoeft, Christopher G. Daily, Ronald M. Weber, Matthew E. Mostoller
  • Patent number: 7539023
    Abstract: A power supply is described. The power supply includes a main power connector and one or more circuit boards rigidly connected to the main power connector, including mechanical and electrical connection. The main power connector has a body that includes a plurality of contacts. The main power connector is configured to mate with a corresponding connector on a motherboard in a computer. The motherboard is coupled to one or more processors. A first plane including a first circuit board in the one or more circuit boards is substantially parallel to a symmetry plane of the body. The symmetry plane includes a direction of insertion of the main power connector when mated with the corresponding connector. The one or more circuit boards include one or more switched mode power supplies to convert an input signal to one or more output signals.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: May 26, 2009
    Inventor: Andrei Bulucea
  • Publication number: 20090130909
    Abstract: An assembly (118) is provided for mating a sensor (22) to a connector (24). The assembly includes an interconnect device (20, 120) and a housing (174a-174b). The interconnect device has conductive pathways (40, 154) provided thereon. The sensor is mounted on the interconnect device and is in electrical communication with the conductive pathways. The housing generally surrounds a portion of said interconnect device. The housing is formed of two portions which mate together. At least one flow tube (178) is attached to the housing. A gasket seals the sensor to the housing.
    Type: Application
    Filed: November 17, 2005
    Publication date: May 21, 2009
    Applicant: MOLEX INCORPORATED
    Inventors: Victor Zaderej, Samuel C. Ramey, Dennis Berek, Michael R. Kamarauskas
  • Patent number: 7533460
    Abstract: Systems and methods for operatively connecting processor banks in large computer systems are disclosed herein. In one embodiment, a computer system includes a first bank of processors, a second bank of processors spaced apart from the first bank of processors, and a connector assembly configured to operatively connect at least a portion of the first bank of processors to at least a portion of the second bank of processors. The connector assembly can include a first connector unit having a plurality of first connector sets and a second connector unit having a plurality of corresponding second connector sets. At least one of the first and second connector units is movable relative to the other one of the first and second connector units to at least approximately concurrently engage the plurality of first connector sets with the plurality of corresponding second connector sets.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: May 19, 2009
    Assignee: Cray Inc.
    Inventors: Wade J. Doll, Douglas P. Kelley
  • Patent number: 7529858
    Abstract: A hard disk controller (HDC) chip has interchangeable “A” and “B” ports of differential connector element pairs, with one connector element of each pair being disposed closest to the edge of the chip and with the other element inboard of it to facilitate connection to more than one printed circuit board (PCB) serial interface pinout without crossing traces of a pair and with maintaining traces of a pair parallel and on the same PCB level.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: May 5, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Philip Joseph Engelmeyer, Miroki Nonaka, Paul Emmit Larson, Jr., Dennis Carl Mairet
  • Publication number: 20090103385
    Abstract: An exemplary motherboard includes a driving module, at least two first slots arranged for mounting two first type of memories, at least two second slots arranged for mounting two second type of memories, and a voltage regulator. The driving module is electronically connected to the at least two first slots, the at least two second slots, and the voltage regulator in turn via a channel. The first type of memories and the second type of memories are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of memory mounted on the motherboard accordingly.
    Type: Application
    Filed: December 28, 2007
    Publication date: April 23, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, DUEN-YI HO, CHENG-SHIEN LI
  • Patent number: 7520781
    Abstract: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: April 21, 2009
    Assignee: Microelectronics Assembly Technologies
    Inventors: James E. Clayton, Zakaryae Fathi
  • Publication number: 20090093137
    Abstract: A communications adaptor card is disclosed herein. One embodiment of the communications adaptor card comprises, a printed-circuit board, the printed circuit board having at least one keep-out area, the at least one keep-out area configured to accept a multi-contact electrical connector receptacle and at least one optical module attached to the printed circuit board. The at least one optical module can be attached to the printed circuit board substantially within the at-least-one keep-out area.
    Type: Application
    Filed: September 10, 2008
    Publication date: April 9, 2009
    Applicant: XLoom Communications, (Israel) Ltd.
    Inventors: Avner Badehi, Sylvie Rockman, Oded Globerman, Dubravko Babic
  • Publication number: 20090086561
    Abstract: An exemplary motherboard includes a driving module, a first slot module arranged for mounting a first type of memory and connected to the driving module via a first channel, a second slot module arranged for mounting a second type of memory and connected to the driving module via a second channel, and a voltage regulator electronically connected to the first slot module and the second slot module. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly.
    Type: Application
    Filed: December 7, 2007
    Publication date: April 2, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, DUEN-YI HO, CHENG-SHIEN LI
  • Patent number: 7488180
    Abstract: A testing device is disclosed for testing a first circuit board having a first connector. The testing device includes a protective casing, a second circuit board, a second connector and a third circuit board. At least one portion of the second circuit board is disposed in the protective casing. The second connector has a first side, which is electrically connected to the second circuit board, and a second side. The third circuit board has a third side electrically connected to the second side of the second connector, and a fourth side electrically connected to the first circuit board.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: February 10, 2009
    Assignee: Asutek Computer Inc.
    Inventors: In-Hui Liu, Tien-En Hsu
  • Patent number: 7458815
    Abstract: A chassis includes a plurality of slots to receive modules. The chassis further includes a first backplane to couple to modules that are received in the plurality of slots. The modules are to couple to the first backplane via a first communication interface on each module. The chassis also includes a second backplane to couple to at least a subset of the modules via a second communication interface on each of the subset of modules. One of the backplanes may be located in an upper or lower air plenum and used to interconnect modules slid along the slots from opposite directions. Some of the module connectors may be retractable to enable the modules to move into the chassis. The interface may be electrical, optical inductive or capacitive.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 2, 2008
    Assignee: Intel Corporation
    Inventors: Hassan Fallah-Adl, Edoardo Campini, Robert J. Albers
  • Publication number: 20080293262
    Abstract: A connector apparatus for connecting at least two electronic component substrates, e.g., printed circuit boards or flex circuits, to one another at the edges thereof, wherein each of the at least two substrates further comprises at least one electrically conductive contact surface, and wherein the connector apparatus further includes: at least one electrically conductive transverse conducting member, wherein a first portion of the at least one transverse conducting member physically touches the contact surface on the first substrate, and wherein a second portion of the transverse conducting member physically touches the contact surface on the second substrate; and mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Scott S. Duesterhoeft, Christopher G. Daily, Ronald M. Weber, Matthew E. Mostoller
  • Patent number: 7448876
    Abstract: The card mounting configuration includes a card with a height that is approximately half that of conventional cards and integration of a front plate and a back plate of the card with a support to prevent circuit board distortion. A card ejector is attached on the front plate, and a plug-in connector is provided on the back plate. A housing with guides to receive the cards contains two levels, upper and lower, wherein six cards are mounted into each level. A plug-in connector on the card passes through a hole in a back board or supplemental backplane of the housing and is connected to a part of an external line connector that appears inside the housing.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: November 11, 2008
    Assignee: Fujitsu Limited
    Inventors: Kazuo Hirafuji, Yoshihisa Nakagawa, Hideki Sonobe
  • Patent number: 7445156
    Abstract: A data management device and library are provided for organizing, holding, and providing electrical connectivity to multiple memory cards. The data management device can comprise a device body, a plurality of sockets to accommodate the data storage media, an electrical connector, and a power management circuit. Data can be retrieved from or transferred to the selected memory cards utilizing the device. The data management library can be utilized to interconnect multiple devices and can be daisy chained to other libraries.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: November 4, 2008
    Inventor: James A. McDonald
  • Patent number: 7445456
    Abstract: A highly reliable printed circuit board which is capable of preventing a short circuit between traces from being caused by a solder bridge formed by excess solder. The printed circuit board has a solder resist covering copper foil traces formed on a substrate and the substrate, for insulation. The solder resist is formed such that exposed portions of the substrate between adjacent ones of the conductive traces each have a shape protruding in a direction of where the other printed circuit board is connected, with respect to exposed portions of the adjacent ones of the conductive traces, in a boundary between the connection part and a portion on which an insulating layer is formed.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: November 4, 2008
    Assignee: Canon Kabushiki Kaisha
    Inventor: Koji Ishikawa
  • Patent number: 7445457
    Abstract: A midplane has plated through holes (PTHs) which form a first profile and a second profile. The first profile has (i) an overlapping portion which overlaps at least part of the second profile and (ii) a non-overlapping portion which does not overlap any part of the second profile. A first connector mounts to a first side of the midplane over the first profile, and a second connector mounts to a second side of the midplane over the second profile. At least one PTH is a shared PTH which resides in both the first and second profiles and which engages a pin of the first connector and a pin of the second connector. Additionally, at least one PTH is a non-shared PTH which resides in the non-overlapping portion of the first profile and which engages a pin of the first connector without engaging any pins of the second connector.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: November 4, 2008
    Assignee: EMC Corporation
    Inventors: Ralph C. Frangioso, Jr., Robert Wierzbicki, Michael L. Schillinger
  • Patent number: 7443844
    Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504).
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 28, 2008
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventors: Douglas L. Sandy, Jeffrey M. Harris, Robert C. Tufford
  • Patent number: 7442094
    Abstract: A telecommunications module includes a housing, a plurality of contacts, which are exposed to allow the connection of wires herewith, and a connecting device for connecting at least some of the contacts with other contacts of the telecommunications module, wherein the connecting device is partially accommodated in the housing an d partially extends outside the housing.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: October 28, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Friedrich Wilhelm Denter, Hans-Dieter Otto, Christine B. Bund, Cornel Schaub, Bernd Lindenbeck
  • Patent number: 7440450
    Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 21, 2008
    Assignee: Emerson Network Power-Embedded Computing, Inc.
    Inventors: Jeffrey M. Harris, Douglas L. Sandy, Robert C. Tufford
  • Patent number: 7438556
    Abstract: An electrical interconnection system includes a stationary board (200), a removable board (300) having a number of conductive pads (304-306), and a connector (100). The connector includes an insulative housing (1) defining thereon a number of passageways (121, 122), a number of contacts (2) retained in the passageways. The contacts include a number of first contacts (21) each having a first contacting end (21b) and a number of second contacts (22) each having a second contacting end (22b). The first and the second contacting ends are offset from each other and come to contact with corresponding conductive pads in sequence.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: October 21, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chong Yi
  • Patent number: 7435095
    Abstract: An electrical interconnection system includes a plurality of first boards (11) and a plurality of second boards (13) intersecting with each other for forming an array configuration. Electrical connectors (15) are set at quadrants defined by each horizontal board and each vertical board for an electrical connection therebetween. Electrical connectors on every two adjacent first boards cooperate each other to control a distance between the two adjacent first boards. This arrangement will have no mid-plane set between the horizontal boards and the vertical boards, which will improve system performance while reducing signal interference and signal attenuation.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: October 14, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chong Yi
  • Patent number: 7435098
    Abstract: An electrical interconnection system includes a stationary board (20, 20?), a removable board (30, 30?), an electrical connector (1, 1?) interconnecting the two boards, and an actuator (90, 90?). The electrical connector has a plurality of contacts (11) received in a dielectric housing (10), each comprising a first contact end (11a) contacting with the stationary board and a second contact end (11b) contacting with the removable board. The actuator includes an actuation plate (12, 12?) assembled on the connector and a driving member (31, 31?) mounted on the removable board. The driving member cooperates with and exerts a force on the actuation plate to drive the contacts move to electrically interconnect the two boards.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: October 14, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chong Yi, Scott K. Mickievicz
  • Publication number: 20080247751
    Abstract: A printed circuit board comprises at least one printed circuit board with at least one electrical contact and one circuit board connector. The circuit board connector includes a printed circuit board provided with one or several open tracks on at least one side for connection with electrical contact(s) of the printed circuit board.
    Type: Application
    Filed: September 27, 2006
    Publication date: October 9, 2008
    Inventors: Werner Lang, Michael Witzke, Harald Emmert
  • Patent number: 7425133
    Abstract: A display device includes a panel assembly for forming an image, a printed circuit board (PCB) connected with the panel assembly and having a connector; a support member for supporting the panel assembly and having the PCB installed on a rear surface thereof, and a cover member combined with the support member, covering the PCB, and having an opening exposing the connector. A fixing part formed at the opening of the cover member fixes the connector to the PCB.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: September 16, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hyoung-Jun Park
  • Publication number: 20080207011
    Abstract: The invention relates to a board-to board connector (9) comprising at least a first contact module (9a) with a first set of board contacts (20) for connecting to a first board (8), and a second contact module (9B) with a second set of board contacts (21). The connector further comprises an interconnection element (22) for interconnecting at least one of said first set of contacts with at least one of said second set of contacts. The interconnection element enables rerouting and compensation of skew.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 28, 2008
    Applicant: FCI
    Inventors: Thierry Clementine Louis Maria Goosens, Bernardus Lambertus Franciscus Paagman, Eugene Maria Brinkhof, Ludwig Gerardus Martinus Antonius Lange
  • Publication number: 20080153317
    Abstract: Disclosed is a fabric interfacing architecture for a node blade. The fabric interfacing architecture comprises a fabric interface unit and a control unit. The fabric interface unit includes a switch and an E-keying element. The control unit receives control signals from an external web server to control the fabric interface unit. The control unit respectively controls the switch and the E-keying element through different control signals. The fabric interfacing architecture is utilized together with a back plane of a shelf and one or more physical layers of the node blade. This allows flexible PHY-to-Channel/Port routings, thereby achieving the support for multiple topology modes. The invention may on-line adjust the assignments of communication channels and ports according to the needs for physically applied bandwidths, which optimizes the bandwidth utilization.
    Type: Application
    Filed: May 21, 2007
    Publication date: June 26, 2008
    Inventors: Ping-Hai Hsu, Yen-Liang Liu, Kuo-Pao Fan
  • Patent number: 7390192
    Abstract: An electronic system comprises a system board, one or more cards adapted to couple to the system board, wherein the system board transfers signals to and from the one or more cards, at least one electrically conductive plate, and one or more connectors coupled to the at least one electrically conductive plate to or from the one or more cards. A plurality of power supplies and voltages may be used. A measurement point on the at least one electrically conductive plate may be used to exert additional control over the plurality of power supplies.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: June 24, 2008
    Assignee: Honeywell International Inc.
    Inventor: Ernest F. J. Graetz
  • Publication number: 20080146047
    Abstract: A compact PCB connector is disclosed to facilitate connection between various components of computer system. The PCB connector comprises a housing having a front side adjacent to the bottom side of the housing. A plurality of connectors supported by the housing are provided to facilitate connection between the various components of a computer system.
    Type: Application
    Filed: December 19, 2006
    Publication date: June 19, 2008
    Inventors: Beng Keat Tan, Vishva Lakshmanan, Kai Yong Cheng
  • Patent number: 7361043
    Abstract: An apparatus including a substrate and a card element to be installed on the substrate includes a first plane which inclines at a predetermined angle with respect to the substrate; a second plane which is provided on the card element, inclines at the angle with respect to the substrate, and slides on the first plane in a direction corresponding to the angle; a first terminal which is provided on the substrate, and inclines at the angle with respect to the substrate; and a second terminal which is provided on the card element, inclines at the angle with respect to the substrate, and connects with the first terminal.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: April 22, 2008
    Assignee: NEC Corporation
    Inventor: Isao Takahashi
  • Patent number: 7354274
    Abstract: An connector assembly comprises a first connector comprising a first plurality of compliant electrical contacts arranged in first a linear array, a first insertion side, and a first opposed end. The illustrative connector assembly also comprises a second connector comprising a second plurality of compliant electrical contacts arranged in a second linear array, a second insertion side, and a second opposed end. The second plurality of compliant electrical contacts face and are parallel to the first plurality of compliant electrical contacts. The second plurality of compliant electrical contacts are spaced apart from the first linear array of electrical contacts and form a recess there between having an insertion end and termination end.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: April 8, 2008
    Assignee: FCI Americas Technology, Inc.
    Inventor: Steven E. Minich
  • Patent number: 7354275
    Abstract: The present invention relates to a graphics card connector module for being connected to a motherboard device, the motherboard including a primary slot coupling over N channels, said graphics card connector module comprising a first coupling connector adapted to be coupled to the primary slot of the motherboard; and a second coupling connector adapted to be connected electrically to a display device; the first coupling connector having a plurality of up to N conductive terminals adapted to be each electrically coupled to a corresponding one of the channels of the primary slot.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: April 8, 2008
    Assignee: Micro-Star International Co., Ltd.
    Inventors: Chien-Fa Chuang, Teng-Chang Su, Che-Yi Lin, Yu-Wen Li
  • Patent number: 7347697
    Abstract: Interconnection assemblies which adjust their alignment and performance through the use of control feedback from the data transferred through the assemblies.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: March 25, 2008
    Assignee: Novias, Inc.
    Inventors: Kevin P. Grundy, Gary Yasumura
  • Patent number: 7338332
    Abstract: A system includes a rigid electrical device including a first contact, and a flexible electrical device including a second contact. The system further includes a spring clip connecting the first contact to the second contact to electrically interconnect the rigid electrical device to the flexible electrical device.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 4, 2008
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Olof Simon Simonsson, Omid Kazemifar, Mikael Pär-Oskar Häll, Maiko Anneli Karlsson, Håkan Klas Petersson
  • Patent number: 7339786
    Abstract: A modular server system includes a midplane having a system management bus and a plurality of blade interfaces on the midplane. The blade interfaces are in electrical communication with each other. A server blade is removeably connectable to one of the plurality of blade interfaces on the midplane. The server blade has a server blade system management bus in electrical communication with the system management bus of the midplane, and a network interface to connect to a network. A media blade is removeably connectable to one of the plurality of blade interfaces on the midplane, and the media blade has at least one storage medium device.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: March 4, 2008
    Assignee: Intel Corporation
    Inventors: David A Bottom, Tim Harvey
  • Patent number: 7334052
    Abstract: A hard disk controller (HDC) chip has interchangeable “A” and “B” ports of differential connector element pairs, with one connector element of each pair being disposed closest to the edge of the chip and with the other element inboard of it to facilitate connection to more than one printed circuit board (PCB) serial interface pinout without crossing traces of a pair and with maintaining traces of a pair parallel and on the same PCB level.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: February 19, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Philip Joseph Engelmeyer, Hiroki Nonaka, Paul Emmit Larson, Jr., Dennis Carl Mairet
  • Patent number: 7331794
    Abstract: A device (20) for interconnecting electrical bundles, includes a plurality of pluggable connection and cross-connect cards (34 to 38) for the electrical bundles. The device further includes a “main” printed circuit (28, 28b) fitted with connectors or slots (29 to 33) designed and arranged to receive the pluggable cards, the printed circuit having a plurality of parallel tracks (46), each enabling two tracks (61 to 63, 68) or tracks starters (70 to 72) provided respectively on two distinct pluggable cards plugged in the connectors of the main printed circuit to be put to the same potential, each of the parallel tracks (46) being in contact with a respective pin (50, 150) of a plurality of connectors of the main printed circuit.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: February 19, 2008
    Assignee: Eurocopter
    Inventors: Nicolas Imbert, Charles Chuc
  • Publication number: 20080032517
    Abstract: A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
    Type: Application
    Filed: August 1, 2006
    Publication date: February 7, 2008
    Applicant: General Dynamics Advanced Information Systems
    Inventor: Deepak Pai
  • Patent number: 7275935
    Abstract: A universal backplane connection (3) for computer storage chassis. The overall backplane connection (3) has at least one universal backplane (30) that is connected to the SAS expander daughter board (33), and to the hard disk drives (10) through its HDD (e.g. SAS) connector (39). Each universal backplane board has discrete components on-board, such as resistors, capacitors, voltage regulation ICs, Light Emitted Diodes (LED), HDD connector receptacles, power connector, General Purpose Input and Output ICs and a high-speed connector. Some of the discrete components and ICs Regulate the DC current to provide a safe and stable power source to the HDDs (10). The HDD connector (39) enable “hot-swap” function to the HDD (10), while other discrete components and amplifiers ensure data integrity of the system. LEDs provide a system status signal to the users. A high-speed connector (37), e.g.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: October 2, 2007
    Inventors: Kuang Wei Chen, Sio Fu
  • Publication number: 20070218709
    Abstract: A computer system comprises a main board equipped with a HT device. The HT interface comprises a first connector and a riser card. The first connector is compatible with HT Device-Under-Test (HT-DUT) specifications and electrically connected onto the main board. The riser card, inserted onto the main board, includes a second connector compatible with HT-DUT specifications and a third connector compatible with HT expansion (HTX) specifications. The first connector and the second connector are electrically connected for data transmission. Therefore, the main board equipped with both the HT-DUT connector and the HTX connector achieves smaller on-board space and fewer on-board connection interfaces.
    Type: Application
    Filed: June 7, 2006
    Publication date: September 20, 2007
    Inventor: Shan-Kai Yang
  • Patent number: 7264480
    Abstract: A display device includes a panel assembly for forming an image, a printed circuit board (PCB) connected with the panel assembly and having a connector; a support member for supporting the panel assembly and having the PCB installed on a rear surface thereof, and a cover member combined with the support member, covering the PCB, and having an opening exposing the connector. A fixing part formed at the opening of the cover member fixes the connector to the PCB.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: September 4, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hyoung-Jun Park
  • Patent number: 7255569
    Abstract: A system for coupling a variety of circuit cards to a circuit board, each circuit card having a respective function, the system comprising: a sequence of connectors mounted on the circuit board, each connector in the sequence of connectors having a respective function; and, one or more connectors mounted on a circuit card for mating with respective ones of the sequence of connectors mounted on the circuit board to thereby couple the circuit card to the circuit board, the respective function of the circuit card determining which ones of the sequence of connectors mounted on the circuit board that the one or more connectors mounted on the circuit card mates with; whereby space on the circuit card opposite ones of the sequence of connectors mounted on the circuit board that the one or more connectors mounted on the circuit card do not mate with is available for mounting components.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: August 14, 2007
    Assignee: Alcatel Lucent
    Inventors: Marc Armah Preuss, Dion Pike, Renato Devito
  • Patent number: 7257660
    Abstract: A memory card having a plurality of different interfaces is disclosed. The memory card comprises a function module, a controller coupled to the function module for accessing, a first buffer coupled to the controller for sending a first control signal, and a second buffer coupled to the controller for sending a second control signal. The memory card activates one interface for detecting a first voltage level of the first buffer when the memory card is inserted into a first card reader, and the first buffer is activated to send the first control signal if the detection is positive. Alternatively, the memory card activates the other interface for detecting a second voltage level of the second buffer when the memory card is inserted into a second card reader, and the second buffer is activated to send the second control signal if the detection is positive.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: August 14, 2007
    Assignees: C-One Technology Corporation, Pretec Electronics Corporation
    Inventors: Jung Ta Chang, Ping-Chang Liu, Gordon Yu
  • Publication number: 20070184675
    Abstract: A highly reliable printed circuit board which is capable of preventing a short circuit between traces from being caused by a solder bridge formed by excess solder. The printed circuit board has a solder resist covering copper foil traces formed on a substrate and the substrate, for insulation. The solder resist is formed such that exposed portions of the substrate between adjacent ones of the conductive traces each have a shape protruding in a direction of where the other printed circuit board is connected, with respect to exposed portions of the adjacent ones of the conductive traces, in a boundary between the connection part and a portion on which an insulating layer is formed.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 9, 2007
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Koji ISHIKAWA
  • Patent number: 7254016
    Abstract: A data storage system having an interconnect, storage devices coupled to a first side of the interconnect, and a processing subsystem coupled to a second side of the interconnect that is substantially opposite the first side. The method involves a user (e.g., a customer) receiving a fault signal from the data storage system (e.g., an email notification, a GUI message, an LED pattern, etc.), identifying a component of the data storage system as faulty in response to receiving the fault signal, and replacing the identified component with a new component. In general, the user replaces the identified component in a hot-swapping manner when the identified component is a storage device or a power supply. Additionally, the user replaces the identified component in a powered-down manner when the identified component is a portion of a storage processing circuit (e.g., an internal fan, a memory circuit, a storage processing circuit, etc.).
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: August 7, 2007
    Assignee: EMC Corporation
    Inventors: Stephen E. Strickland, Adrianna D. Bailey, Steven D. Sardella, Alan McIlvene, Maida Boudreau
  • Patent number: 7238030
    Abstract: A system having expansion slots is capable of multiple configurations. In a first configuration, a first blade is coupled to a first module via a first expansion slot and a second blade is coupled to a second module via a second expansion slot. The first and second modules may be I/O modules such as PCI Express modules. In a second configuration the first and second blades are both coupled to a third module via the first and second expansion slots. The third module may be a shared resource such as a cache card.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: July 3, 2007
    Assignee: EMC Corporation
    Inventors: Douglas Sullivan, Robert P. Valentine, Steven D. Sardella
  • Patent number: 7187555
    Abstract: An apparatus in one example comprises a card guide that provides an installation path for an extension circuit card. The installation path promotes a coupled relationship between the extension circuit card and a circuit board. The card guide comprises a first connector and a second connector. To form the coupled relationship the extension circuit card attaches to one of the first connector and the second connector based on a configuration of the extension circuit card.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: March 6, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert G. Campbell, Raymond Chin