Abstract: An electrical connector is revealed that has unique useful characteristics. A sheet metal fork supplies the stored energy that imparts a force to a second member—a plunger that makes contact with the mating circuit. The plunger can be configured to increase or decrease the force or deflection and can be designed with various connection ends with different contact characteristics.

Abstract: A probe pin includes a coil spring, a first plunger, and second and third plungers. The second and third plungers respectively are independently operable and include a main body and first and second elastic pieces that extend from the main body in the same direction to each other. The first plunger is inserted between the first and second elastic pieces each of the second and third plungers.

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Abstract: An electrical connector includes an insulative housing and a plurality of contacts retained in the housing to commonly form a terminal module, a metallic shield enclosing the terminal module and forming a mating cavity, and a glue groove formed in a base of the housing and located behind the mating cavity, in which a glue part is received. The shield forms an opening communicating with the glue groove, through which the liquid type glue is injected into the glue groove and solidified therein.

Abstract: A connector comprises an insulating housing (10) defining a plurality of isolated terminal chambers and a plurality of conductive terminals (20) disposed in respective terminal chambers of the insulating housing. Each of the terminal chambers has a bottom portion (101) on one side of the insulating housing and an opening (102) through a surface (103) on the opposite side of the insulating housing. Each of the conductive terminals comprises a fixing portion (201) that is fixed on the bottom portion of a corresponding terminal chamber, a contact portion (203) that is projecting out of the opening, and a middle portion (202) that is connected between the fixing portion and the contact portion and slanting from one end of the fixing portion towards the other end of the fixing portion. The middle portion and the contact portion are configured to move both towards the bottom portion and in a longitudinal direction of the insulating housing in response to pressure imposed on the contact portion.

Abstract: An improved BGA spring probe pin with a spring actuated solder ball receptacle that grips the sides of the solder ball during probing. A method of operating a BGA prober with improved BGA spring probe pins.

Abstract: A method and structure is provided for constructing elastomeric pin arrays using solder interconnects and a non-conductive medium. Pin to pin interconnects are constructed using a solder connection through a non-conductive medium. This structure eliminates the need for PCB structures as the medium, reducing manufacturing cost. In another embodiment one or more elastomeric columns extend through holes or openings in the non conductive medium. The elastomeric columns are fixed securely within the holes preferably with adhesive material. Compression stops are provided on both sides of each elastomeric column for both the upper and bottom surfaces of the non conductive medium.

Abstract: A connector has contacts and a housing having holding grooves which accommodate the contacts. Each of the holding grooves has an inner wall extending in a first direction. Each of the contacts has a fixed portion, a contact arm portion and a support arm portion. The fixed portion is fixed to a corresponding one of the holding grooves. The contact arm portion and the support arm portion extend from the fixed portion in the first direction and are disposed apart from each other in a second direction. The contact arm portion has a contact point and is resiliently deformable to move the contact point in the second direction. The support arm portion comes into contact with the inner wall of the corresponding one of the holding grooves at least when the contact arm portion is resiliently deformed so that the contact point comes close to the support arm portion.

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device.

Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

Abstract: An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second surface, distal ends extending above the first surface, and intermediate portions engaged with an engagement region of the substrate located between the first surface and the recesses. Retention members are coupled with at least a portion of the proximal ends to retain the contact members in the through holes. The retention members can be made from a variety of materials with different levels of conductivity, ranging from highly conductive to non-conductive.

Abstract: Methods and structures of connecting at least two integrated circuits in a 3D arrangement by a zigzag conductive chain are disclosed. The zigzag conductive chain, acting as a spring or self-adaptive contact structure (SACS) in a wafer bonding process, is designed to reduce bonding interface stress, to increase bonding interface reliability, and to have an adjustable height to close undesirable opens or voids between contacts of the two integrated circuits.

Abstract: An electrical connector for high-frequency transmission comprises an elongate insulative housing including a top wall and a bottom wall opposite to each other, and a pair of end walls respectively connecting two ends thereof, and a receiving cavity surrounded thereby; a terminal assembly received in the top wall and the bottom wall respectively, and stacked in an up-to-down direction; and a metal case enclosing the insulative housing; wherein the terminal assembly includes a signal terminal group, and a ground terminal group including a first contact portion and a second contact portion, wherein the first contact portion and the second contact portion are arranged in a front-to-back direction perpendicular to both the up-to-down direction and the elongate direction, and respectively protruding into the receiving cavity.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

Abstract: A connection arrangement (10) for electrically connecting at least one sensor (12) or actuator to at least one conductor track (22) on a circuit board (24) has at least one compression spring (18) for electrically conductive connection. The compression spring (18) is arranged between the at least one sensor (12) or actuator and the circuit board (24) so as to be under a mechanical preload. The compression spring has a contact end section (36) of the at least one compression spring (18) configured to rest against a contact plate (20, 70, 80, 90) that is electrically conductively connected to the conductor track (22). As a result, the connection arrangement (10) achieves a high level of electrical contact reliability and corrosion-resistance.

Abstract: The contact includes a contact protrusion that is inserted into the contact insertion hole protrudes from the optical axis direction partition wall into the camera lens module side, and functions as an electric contact for the camera lens module, a fixing part fixed to the housing, and a connection part that elastically connects the contact protrusion with the fixing part. The connection part includes a connection main body extending in the radial direction so as to recede from the fixing part, and a folding part disposed on the opposite side to the fixing part across the connection main body. The fixing part is disposed on the opposite side to the folding part across the connection protrusion in the radial direction.

Abstract: An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.

Abstract: An array substrate comprises: a plurality of flexible cushions; and a plurality of signal lines, wherein the signal lines have ends respectively located on the flexible cushions.

Abstract: A grounding part, an electronic device, an imaging device, and a method of producing a grounding part are provided. The grounding part includes a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon, and a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member. The first connecting component includes a substrate connecting part connected to the circuit board, and a second-connecting-component connecting part connected to the second connecting component, and the second connecting component includes a first-connecting-component connecting part connected to the first connecting component, and a grounding-part connecting part connected to the grounding member. The imaging device includes the circuit board and the grounding member.

Abstract: A universal serial bus (USB) connector includes a case, an insulation tongue, a plurality of spaced electric conduction bars installed to the insulation tongue, a resilient supporting pole connected between the insulation tongue and the case, and two rows of electric coupling pins respectively located above and below the insulation tongue. The electric conduction bars are spaced in a horizontal direction of the insulation tongue. The top surface of each electric conduction bar faces the corresponding electric coupling pin locating above the insulation tongue, and the bottom surface of each electric conduction bar faces the corresponding electric coupling pin locating below the insulation tongue. The electric coupling pins locating above the insulation tongue and the electric coupling pins locating below the insulation tongue are reversely and symmetrically arranged by type.

Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.

Abstract: Connecting structures to mechanically connect to a connector receptacle tongue and a printed circuit board and to electrically connect contacts on the connector receptacle tongue to traces on the printed circuit board. One example may provide an interposer having a housing and a plurality of contacts to connect a vertical tongue to a horizontal printed circuit board. The contacts may have a side or tongue connecting portion extending beyond a side of the housing and a bottom or board contacting portion extending beyond a bottom of the housing. The contacts may form a ninety-degree bend. A shield may at least substantially surround a vertical side of the housing.

Abstract: A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper (30) and lower (32) section and a hinge (44/46) in between which allow flex of both upper and lower contact (24/26) which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability.

Abstract: A package includes a package component and an interposer over and bonded to the package component. The package component includes a solder region. The interposer includes a core dielectric material, a conductive pipe penetrating through the core dielectric material, with the first solder region in contact with a bottom end of the conductive pipe, and a through-opening in a center region of the interposer.

Abstract: The instant disclosure relates to bi-direction data transmission method, high-frequency connector and an optical connector using the same. The optical connector includes a first circuit board, a second circuit board, a high-frequency connector and an optical fiber cable. One optical engine is set on the first circuit board. The high-frequency connector is set between the first circuit board and the second circuit board for connecting both two circuit boards. The high-frequency connector includes an insulation base. The insulation base has at least one terminal-accommodating region. Pluralities of connection terminals are inserted into the terminal-accommodating regions of the insulation base. The optical fiber cable connects to the one optical engine.

Abstract: Provided are a ground device and a portable terminal having the same. The ground device for connecting an inner metallic material with an outer metallic material includes a ground piece electrically connected with the inner metallic material and a connection terminal portion which is bent to extend as one piece from the ground piece and is connected with the outer metallic material. A portable terminal includes an inner metallic material provided in an inner side of a main body of the portable terminal, an outer metallic material provided in a battery cover provided in an outer side of the main body, and a ground device for connecting the inner metallic material with the outer metallic material, and the ground device includes a ground piece mounted in the main body to be connected with the inner metallic material and a connection terminal portion which is multi-step bent as one piece from the ground piece to be connected with the outer metallic material.

Abstract: In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor.

Abstract: A device with pillar-shaped components, includes a substrate; a wiring layer disposed on the substrate; and pillar-shaped components disposed on any of the substrate and the wiring layer, each of the pillar-shaped components having a bottom part connected to the substrate and/or the wiring layer, a top part opposed to the bottom part, and a lateral face part extending from the bottom part and connected to the top part; wherein each of the pillar-shaped components includes a first pillar-shaped part formed by plating, a second pillar-shaped part formed on the first pillar-shaped part by plating, and a ring-like projection part formed on the lateral face part to project outward and extend in a circumferential direction, and to be in a position higher than a joint position between the first pillar-shaped part and the second pillar-shaped part.

Abstract: An electrical connector has one or more body portions in which is disposed an electrical terminal having at least one contact pad interface for coupling to a contact pad of at least one printed circuit board (PCB). The body has an associated fastening device which is used to mechanically and electrically couple the electrical connector to the at least one PCB. The electrical connector may be provided with a full or partial hourglass-like shape, when viewed from the side and/or from above, to facilitate its use with a PCB that carries a source of light, such as an LED.

Abstract: The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed.

Abstract: An integrated circuit package having a multilayer interposer has one or more metal wiring beads provided in the interposer, each of the one or more metal wiring beads has a convoluted wiring pattern that is formed in one of the multiple layers of wiring structures in the interposer, and two terminal end segments connected to the power lines in the integrated circuit package, wherein the one or more metal wiring beads operate as power noise filters.

Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the test pin is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested. The test pin has a hard stop edge which engages a hard stop wall which limits its rotation movement. The bottom of the pin has a shallow convex curvature preferably with a flat region and the tip of the test pin has a chisel edge.

Abstract: An electrical connector for connecting a first electronic element and a second electronic element, includes an insulating body, multiple elastic bodies integrally formed with the insulating body, and multiple conductors. Each of the elastic bodies has a receiving slot, and each conductor is received in a corresponding receiving slot in an inclined manner. The receiving slot has a first urging portion and a second urging portion respectively providing an inclined upward elastic counterforce and an inclined downward elastic counterforce against the conductor, so that the conductor has a large normal force. Multiple stopping portions of the receiving slot and multiple shoulder portions of the conductor are in clearance fit, so that the conductor can be displaced vertically in the receiving slot when receiving a force.

Abstract: A contact unit includes a first conduction path in the form of a thin film arranged along a peripheral surface of an insulating elastic body, a second conduction path arranged along the first conduction path, and a connecting conduction path electrically connecting the first and second conduction paths to each other. A frame has a through hole. The frame supports the contact unit so that the first conduction path exposed from both openings of the through hole is brought into contact with connection objects and that the second conduction path is entirely received in the through hole.

Abstract: A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.

Abstract: Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates coupled by through-substrate-vias (TSVs). An active device (AD) substrate has contacts on its upper portion. An isolator substrate is bonded to the AD substrate so that TSVs in the isolator substrate are coupled to the contacts on the AD substrate. An IPD substrate is bonded to the isolator substrate so that TSVs therein are coupled to an interconnect zone on the isolator substrate and/or TSVs therein. The IPDs of the IPD substrate are coupled by TSVs in the IPD and isolator substrates to devices in the AD substrate. The isolator substrate provides superior IPD to AD cross-talk attenuation while permitting each substrate to have small high aspect ratio TSVs, thus facilitating high circuit packing density and efficient manufacturing.

Abstract: A high performance electrical interconnect adapted to provide an interface between terminals on first and second circuit members. The electrical interconnect includes a first circuitry layer with a first surface and a second surface having a plurality of contact pads adapted to electrically coupled with the terminals on the first circuit member. At least one dielectric layer is printed on the first surface of the first circuitry layer. The dielectric layer includes a plurality recesses. A conductive material is deposited in at least a portion of the recesses to create circuit geometry electrically coupled with the first circuitry layer. A second circuitry layer includes a first surface a plurality of contact pads adapted to electrically couple with the terminals on the second circuit member and a second surface attached to the dielectric layers. The circuit geometry electrically couples the first circuitry layer to the second circuitry layer.

Abstract: An electrical connector includes contact units and housing units for retaining the contact units. The contact unit includes an insulating body and a plurality of contacts retained therein. The housing unit includes a shielding member defining an upper end and a lower end opposite to each other, an insulating cover seated on the upper end of the shielding member, and an insulating base seated on the lower end of the shielding member. A cavity is defined between the insulating cover and the insulating base for decreasing the plastic content so as to reduce the crosstalk.

Abstract: Board-to-board connectors that consume a minimal amount of board area, are simple to assemble, and provide a clear indication that a proper connection has been made. One example may consume minimal area, since only a retention key and slots in boards and connectors are needed. The connector may be simple to assemble since it may be as simple as stacking components, pushing down, and turning a retention key. Further, a first and a first line on a key and a cowling may be aligned after assembly to provide a clear indication that the connector has been properly assembled.

Abstract: This disclosure provides for an electrical probe, which can include a shell extending along a longitudinal axis and defining an internal cavity with an opening at a first end, where the shell can include a neck portion defined by a hollow polygonal shaft twisted about the longitudinal axis to form an internal cam surface. The electrical probe can also include a plunger slidably received in the internal cavity. The plunger can include a tip configured to extend at least partially through the opening at the first end and a cam element integrally formed with the tip and having a cross-sectional shape substantially corresponding to a cross-sectional shape of the hollow polygonal shaft, such that, when the plunger is reciprocated along the longitudinal axis of the shell, the cam element can engage with the internal cam surface of the neck portion to cause rotation of the tip.

Abstract: Transferable probe tips including a metallic probe, a delamination layer covering a portion of the metallic probe, and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer are provided herein. Also, techniques for creating a transferable probe tip are provided, including etching a handler substrate to form one or more via arrays, depositing a delamination layer in each via array, depositing one or more metals in each via array to form a probe tip structure, and depositing a bonding alloy on a portion of the probe tip structure that is not covered by the delamination layer. Additionally, techniques for transferring transferable probe tips are provided, including removing a handler substrate from a probe tip structure, and transferring the probe tip structure via flip-chip joining the probe tip structure to a target probe head substrate.

Abstract: A connector capable of realizing a narrower pitch of contact members, and suppressing displacement of the contact members. A connector comprises a frame and a plurality of contact members held by the frame. The contact members held by the frame are elastically deformed by being sandwiched between an IC package and a printed board. At this time, terminal portions of the IC package and terminal portions of the printed board are electrically connected via a plurality of conductive path portions of each contact member. The frame is formed by a frame portion, a plurality of longitudinal ribs extending in a manner bridging the frame portion, and a plurality of transverse ribs extending orthogonal to the longitudinal ribs in a manner bridging the frame portion. The contact members are held in slits formed by the longitudinal ribs and the transverse ribs.

Abstract: A substrate and a method for manufacturing the same, and a probe card employing the substrate as a space transformer. The substrate includes: a substrate body; a key forming groove formed in one surface of the substrate body; and an alignment key formed on the key forming groove. The recognition rate of the alignment key formed on the substrate can be increased, resulting in improved accuracy in a micro electro mechanical system (MEMS) process for forming micro probes on the substrate, thereby improving productivity and reliability of the substrate and the probe card including the same.

Abstract: Axially compressible F-connectors for conventional installation tools for interconnection with coaxial cable include radially compressed grounding inserts seated within a body fitted to a nut socket. Each connector has a rigid nut, a post penetrating the nut, a tubular, metallic body, and an end cap. The conductive post coaxially extends through the connectors, linking the nut and body. A post end penetrates the coaxial cable. The nut has an integral, tubular socket at its rear that is engaged by a tubular, metallic connector body. The body front has at least one groove for receiving a peripheral grounding insert, preferably in the form of a coiled spring wrapped around the body, that is radially sandwiched within the nut socket to insure grounding. An end cap press fitted to the assembly coaxially engaging the body, closing the fitting. Internal O-rings may be combined for sealing the connector.

Abstract: Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump.

Abstract: A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body.

Abstract: Light emitting diode (LED) display modules, display screens comprising a plurality of display modules and methods of forming display screens are disclosed. Each display module 10 forming a display screen comprises a flexible substrate 11 supporting a plurality of LEDs 14. A set of connectors 16, 50, 52, 54 comprising male connectors and female connectors are coupled to the flexible substrate for connecting the display module to a respective set of connectors 16, 50, 52, 54 of an adjacent display module along at least one first edge 18 of the display module such that horizontal and vertical alignment of the display modules and the LED pitch size is maintained during flexing of the display screen.

Abstract: Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

Abstract: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (?m). The interconnect structure comprises a dielectric body element and at least one interconnection array that provides a conductive path between two electronic components. Each interconnection array comprises a plurality of wires that provide both conductivity and compliance to the overall interconnect structure. The versatility and scalability of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures.

Abstract: A connection carrier for at least one semiconductor chip is disclosed. The connection carrier has a carrier body having a main surface. A first connection area and a second connection area at a distance from the first connection area are formed on the main surface. The connection carrier has a mechanical decoupling device which is intended to reduce transmission of mechanical forces from the carrier body to at least one region of the first connection area. A semiconductor component having such a connection carrier is also stated.