Abstract: The invention relates to a system (1) for machining a bevel (32, 34) on a disk shaped part (31) including a grinding device (3) having abrasive means (4), a device (5) for securing the part (31) including a support (13) to which said part is fitted and which is integral with an axis of rotation (16). According to the invention, the securing device (5) further includes a means (15) of orienting the axis (16) of rotation (B) to define the angle of said one bevel (32, 34) and a means (17) of moving the support (13) closer to the abrasive means (4) in order to machining the part (13) under stress. The invention concerns the field of crystals for timepieces.

Abstract: This machine includes a base frame (17) and a lens support (19) mounted on the frame (17) with the lens support (19) having elements (29A, 29B) for driving a lens (15) into rotation around a first axis. It includes a tool holder set (21) including a rotary shaft (39) around a second axis (C-C?) and elements (43) for inclining the first axis (A-A?) with respect to the second axis (C-C?). The rotary shaft (39) bears at least two tools (49, 51) for machining the lens, spaced out along the second axis (C-C?), and a spacer (50) positioned in an intermediate area (55) located between both machining tools (49, 51). The spacer (50) defines an outer surface (57) for machining the lens.

Abstract: A green ball grinding method includes the step of supplying a green ball between a first surface of a first member and a second surface of a second member constituting a grinding apparatus, and the step of grinding the green ball between the first surface and the second surface while the green ball rotates around its own axis and in orbital motion. In the step of grinding the green ball, the step of causing the green ball grinding to proceed while applying load between the green ball and each of the first surface and the second surface, and the step of modifying the rotation axis of the green ball by reducing the load lower than in the step of causing the green ball grinding to proceed are executed alternately.

Abstract: The invention relates to a method and an apparatus for handling slabs (2a, 2b), produced in particular by continuous casting, the surfaces of which are ground before they are rolled in a rolling train, wherein the slab, lying on a reversible grinding table (12a, 12b), is moved back and forth under a grinding unit, arranged in a machining cell, of a grinding machine unit (I, II), the grinding table is moved linearly out of the machining cell after the grinding operation has been performed on one surface, the slab is lifted off the grinding table and fed to a turning device, wherein, after turning, the slab is removed from the turning device and, with an unworked, other surface lying uppermost, is brought onto the grinding table, which is then introduced once again into the machining cell for the working of this surface.

Abstract: A multi-axis computer controlled machine tool for relief grinding of single and multiple start threaded hobs (46). The machine comprises an angular oriented spindle (65) that can be angularly (swivel) positioned thereby providing the flexibility to utilize both cup-shaped grinding wheels (55) and pencil-shaped grinding wheels (52) for grinding of hob and milling cutter relieved tooth geometry without exchanging grinding spindles assemblies or modifying the machine construction to accommodate two types of grinding methods or utilizing an additional machine axis for the spindle re-orientation.

Abstract: During grinding of mutually parallel edges of glass plates every edge of the glass plate is ground using a grinding tool or two grinding tools disposed one behind the other and cooling agent is directed from a side of the glass plate toward the grinding tool and supplied using a supply line divided via a redirection and separating segment into a plurality of fine streams of cooling agent, and a position of the grinding tool can be adjusted such that at least the position of the grinding tools relative to the assigned edge of the glass plate, which is passing through, is calibrated and the corners of the glass plate are ground to form a chamfer.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: A low friction flat-lapping abrading apparatus and method for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with flat-surfaced workpieces that are attached to three rotary spindles. The rigid equal-height flat-surfaced rotatable fixed-position workpiece spindles are mounted on a flat abrading machine base. They are positioned to form a triangle to provide stable support of the floating platen. All three spindle-tops are co-planar aligned to provide a precision-flat reference plane for mounting of the workpieces. The lapping operation has very high abrading speeds and very low abrading forces. The lightweight but strong lapping machine employs a pivot-balance structure where the weight of the drive motor is used to balance the weight of the abrading platen. Use of low-friction air bearings provides the capability for precision control of the abrading forces. The lapping machine is robust and well suited for a harsh abrading environment.

Abstract: Provided are a workpiece feeder for roller end face processing which is capable of feeding a roller to a roller end face processing machine in a stable posture, a roller end face processing machine which is capable of stably and highly accurately processing both end faces of the roller fed by such a workpiece feeder for roller end face processing, and a roller for a rolling bearing processed by such a roller end face processing machine.

Abstract: Provided is a wafer polishing apparatus. The wafer polishing apparatus comprises a first polishing part and a second polishing part. The first part is disposed at a position higher than a top surface of a wafer and configured to be rotated on a first rotation axis. The second polishing part is disposed at a position lower than a bottom surface of the wafer and configured to be rotated on a second rotation axis.

Abstract: The present invention is a method for polishing a silicon wafer, in which an oxide film is formed on a back surface side of the wafer, wherein the oxide film on a chamfered portion of the silicon wafer is removed, and the oxide film on a peripheral portion of the back surface of the wafer is polished over at least 2 mm from the outermost peripheral portion of the back surface of the wafer so that a thickness of the polished oxide film decreases from inside to outside of the wafer, a method for producing such a silicon wafer, and a silicon wafer.

Abstract: A method for producing ball rollers. The following method steps are performed to produce the ball rollers: (A) cutting unfinished sections at a defined length from a round wire that has a defined diameter, (B) compression molding ball roller blanks that have end face depressions in the form of a die tool, and (C) grinding the ball roller blanks to the desired final dimensions in a ball grinding machine. The cut-off unfinished sections have a volume by which during compression molding an approximately tangential raceway transition from one ball roller half to the other ball roller half and material fibers extending under the running surfaces of the ball rollers parallel or approximately parallel to the running surfaces arise. In addition, the ball roller blanks are ground to the final dimensions in a horizontal ball grinding machine loaded exclusively with ball roller blanks of the same size.

Abstract: A grinder including a grinding unit including a grinding surface and a shaft connected to the grinding unit for rotating the grinding unit. The grinding unit includes polyurethane and a mixture of a repairer and an abrasive, and an angle ? between a plane perpendicular to a rotational axis of the shaft and the grinding surface satisfies 1°???7°.

Abstract: A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and carries a dressing spindle (21) that is capable of being driven in rotary movement.

Abstract: A polisher includes a connecting member, a polishing member mounted on the connecting member, an elastic member sleeved on the connecting member, and a fixing assembly for movably receiving the connecting member. An end of the elastic member resists the polishing member, and the other end of the elastic member resists the fixing assembly, such that the connecting member is moveable to adjust a position of the polishing member when polishing.

Abstract: A multi-station polish system and process for polishing thin, flat (planar) and rigid workpieces. Workpieces are conveyed through multiple polishing stations that include a bulk material removal belt polishing station and finishing rotary polishing station. The bulk of the material is relatively quickly removed at the bulk removal station using a conformable abrasive belt and the workpiece surface is then polished to the desired finish at the finishing station using a conformable annular rotary polishing pad.

Abstract: In one embodiment, a polishing device includes: a rotatable turntable, a holding unit, a separation wall, a slurry supply tube, and a cooling medium supply tube. On an upper surface of the rotatable turntable, a polishing pad is attached. The holding unit rotatably holds an object to be polished and disposes a polished surface of the object to be polished in a manner to face the polishing pad. The separation wall abuts on the upper surface of the polishing pad and sections the polishing pad into a polished region in which the holding unit is provided and an unpolished region in which the holding unit is not provided. The slurry supply tube supplies a slurry to the upper surface of the polishing pad in a polished region side. The cooling medium supply tube supplies a cooling medium to the upper surface of the polishing pad in the unpolished region.

Abstract: The invention relates to a method for the operation of a gear or profile grinding machine (1) for the grinding of pre-geared or pre-profiled workpieces (2), wherein the machine comprises at least one tool spindle (3) which can carry at least one grinding tool (4) and wherein the machine comprises at least two workpiece spindles (5, 6) which can at least temporarily be driven to the tool spindle (3) for cooperation of the workpiece (2) with the grinding tool (4). To improve the ratio between primary processing time and secondary processing time the invention proposes that the at least two workpiece spindles (5, 6) are pivoted around a respective axis of rotation (7, 8) for transportation from a grinding position (I) to a loading station (II) and vice versa, wherein the rotation of the two workpiece spindles (5, 6) takes place independently from another. Furthermore, the invention relates to a gear or profile grinding machine.

Abstract: A grinding apparatus (100) includes: a rotating grinding tool (102) for grinding a workpiece (101) immersed in a cooling liquid (106); vibration generating mechanisms (107a) to (107f) for applying vibrations to the cooling liquid (106) and generating cavitation; and a controller (108) for causing the vibration generating mechanisms (107a) to (107f) to generate the cavitation when the rotating grinding tool (102) is operated. The controller (108) turns on/off the vibration generating mechanisms (107a) to (107f) and adjusts amplitudes of the vibrations of the cooling liquid (106) generated by the vibration generating mechanisms (107a) to (107f) depending on a region in the workpiece (101) to be machined and one out of a plurality of machining steps to be performed.

Abstract: A rotary finishing device is provided comprising a substantially solid hub having an inner periphery and an outer periphery, the inner periphery defining an axial throughhole. The device further provides a plurality of slots formed about the outer periphery of a generally circular hub, each of the plurality of slots being defined by a pair of side portions extending from the outer periphery. Each of the pair of side portions includes a tip portion, an intermediate side surface portion, and a base portion. The slot increases in width from the outer periphery to the base portion. A finishing media is secured in each of the plurality of slots by an epoxy resin, wherein each of the slots is consumed in its entirety by a combination of mounting ends of the finishing media and the epoxy resin. The hub and the consumed slots form a solid integral finishing device extending from the inner periphery to the outer periphery.

Abstract: Methods and systems for removing dirt and/or debris from a CMP pad surface during CMP pad processing are provided. In one aspect, a method for removing debris from a CMP pad surface during CMP processing can include rotating a CMP pad having a polishing surface, and pressing a CMP pad dresser into the polishing surface of the CMP pad, the CMP pad dresser having a plurality of superabrasive particles coupled thereto and oriented toward the CMP pad. The method can further include spraying a jet of liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface of the CMP pad.

Abstract: The invention relates to a tooth flank polishing tool (31) comprising a base (32) that can be rotated about a central axis. A polishing fleece (33) which can be introduced into at least one tooth gap (39) of a gear (30) that is to be polished is mounted on the base (32). At least some sections of the polishing fleece (33) have an external contour that is adapted to the shape of a tooth flank (37). The tooth flank polishing tool can be used for polishing gears (30) or threads.

Abstract: A micro-grinding device with a micro ball at an end is made. The micro ball is deposited with grinding particles. The grinding device is able to grind a surface having an arc degree more than 180 degrees. Thus, the present invention is suitable to be used for forming micro molds, removing burr, and micro-milling, micro-paring or micro-grinding a surface.

Abstract: The present invention is a polishing head having at least: an approximately discoid mid plate; a rubber film covering at least a lower face portion and a side face portion of the mid plate; and a space portion surrounded by the mid plate and the rubber film; in which pressure of the space portion can be changed by a pressure adjustment mechanism, a back surface of a workpiece is held on a lower face portion of the rubber film and a front surface of the workpiece is brought into sliding contact with a polishing pad attached onto a turn table for performing polishing; wherein the mid plate and the rubber film do not contact one another to have a gap at least throughout a whole of the lower face portion of the mid plate. As a result, there is provided a polishing head etc by a rubber chuck method in which a uniform polishing load is applied over the workpiece without influence of stiffness or flatness of the mid plate.

Abstract: A tool for surface machining of a workpiece includes a drive, a spindle operatively and detachably connected to the drive so as to be acted upon by the drive and a basic body connected to the spindle having at least two working surfaces. The drive is configured to act on the basic body so that the at least two working surfaces simultaneously machine the workpiece.

Abstract: An apparatus and method for spiral polishing with electromagnetic abrasive has adopted the principle of electromagnetic and magnetic abrasive along with a lead screw to polish the inner or outer surface of a precise screw or a complicated part. The apparatus includes a clamp, a lead screw, a first electromagnet, and a second electromagnet assembled in an airtight space, wherein the airtight space is filled with magnetic abrasive which is driven by the rotation of the lead screw and the electromagnetic function to polish a processed part in a regular shape or in an irregular shape.

Abstract: The relationship between polishing conditions constituting elements and the worked shape (amount of polishing) obtained by way of these polishing conditions is input beforehand into polishing condition determining mechanism along with the type of the object of polishing, and polishing conditions (invariable polishing conditions) that are used in common for the polishing of this object of polishing. The polishing condition determining mechanism determines the polishing conditions on the basis of these conditions. Specifically, the above-mentioned polishing conditions constituting elements are given in a time series, or combinations of the above-mentioned polishing conditions constituting elements are converted into variations in the swinging velocity of the polishing body, and the swinging velocity corresponding to the swinging position is determined.

Abstract: A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

Abstract: The present invention relates to a method for operating a gear grinding machine, with the following operating phases of the gear grinding machine: machining a workpiece on the gear grinding machine by means of a grinding disk and/or grinding worm and dressing a profiling tool for profiling a grinding disk and/or grinding worm on the gear grinding machine.

Abstract: An improved low pressure low speed concrete polishing apparatus and method of cleaning and polishing a floor is used with a conventional rotary flooring machine. A polishing pad has interchangeable polymer strips that are slideably received within the housing of the pad. The polymer strips have an abrasive material embedded therein which collectively work to polish the floor while cleaning the floor during normal low speed floor cleaning conditions.

Abstract: The present invention relates to the reduction or complete prevention of Cu corrosion during a planarization or polishing process. In one aspect of the invention, RF signal is used to establish a negative bias in front of the wafer surface following polishing to eliminate Cu+ or Cu2+ migrations. In another aspect of the invention, a DC Voltage power supply is used to establish the negative bias.

Abstract: A method for processing a work-piece is disclosed herein. The method includes the step of removing material from a work-piece to a predetermined depth with a tool that changes size. The method also includes the step of passing the tool across the work-piece in one or more passes during the removing step such that a cutting depth into the work-piece changes during a particular pass. Each pass is defined by a pass depth. The method also includes the step of maintaining a substantially constant chip thickness during the removing step. The method also includes the step of selectively maximizing one of a feed rate and a pass depth of material removal at the expense of the other during the removing step to minimize the time of the passing step.

Abstract: A device for deburring at least one of a groove and an edge of a workpiece includes a shaft, a receptacle connected to the shaft, a tool held in the receptacle, and a swivel drive configured to pneumatically and/or hydraulically press the receptacle with the tool against a burr of the groove or against the edge of the workpiece. The tool is configured to be actively lifted from the groove or edge of the workpiece.

Abstract: A tomographic system includes a reporting device colocated and juxtaposed an object so that both are ground through grinding to various sectioning depths as the reporting device is ground down exposing a reporting marker along a length of the reporting device for indicating the depth of sectioning for accurate precise depth of grinding well suited for precise sectioned tomographic imaging.

Abstract: A shaft adapter for removably mounting to the output or drive shaft of a grinding machine is disclosed. The shaft adapter is a three-component device which includes a collar portion, a compressible drive sleeve and an extension member. The extension member has a free-end adapted to matingly engage with a particular grinding cup. When the shaft adapted is mounted on the drive shaft, the compressible drive sleeve is compressed and elastically deformed between the corresponding, engaging ends of the collar portion and extension member so as to create a secure driving force between the rotating drive shaft of the grinding machine and the shaft adapter so that they rotate together as a unit when the grinding machine is in use.

Abstract: An eyeglass lens processing apparatus includes: a processing apparatus body for processing a lens, which includes a grinding water supply unit for ejecting grinding water to a portion to be processed of the lens; a centrifugal separator which separates processing refuse from grinding water by rotating a dewatering bin to discharge the grinding water to the outside of the dewatering bin; and a calculation control unit which includes a counter for multiplying a processing refuse amount of the lens on the basis of a control signal of the apparatus and a memory for storing a processing refuse extraction reference provided to maintain filtering efficiency of the dewatering bin, the processing refuse extraction reference being determined on the basis of the multiplied processing refuse amount of the lens, and which generates an alarm signal when the multiplied processing refuse amount of the lens reaches the processing refuse extraction reference.

Abstract: Methods of and systems for polishing an edge of a substrate are provided. The invention includes a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film; and a first sensor coupled to the rotation driver adapted to detect one of an energy and torque exerted by the substrate rotation driver as it rotates the substrate against the polishing film. Numerous other aspects are provided.

Abstract: The invention relates to a grinding-spindle assembly comprising a fixed shaft and a ring motor that has a stator and a rotor, wherein the stator is connected in a fixed fashion to the shaft, the rotor is a hollow shaft and is pivotal on the fixed shaft, and the grinding tool is connected in a rotationally fixed fashion to the rotor, and the ring motor extends through the grinding tool. The fact that the grinding tool is mounted directly on the rotor produces an especially space-saving construction.

Abstract: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided.

Abstract: Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape, ii) a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm and iii) a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm. Numerous other aspects are provided.

Abstract: An apparatus for lapping sliders comprises a rotatable lapping plate for lapping elements that are to be formed into sliders, a pushing force adjusting member that has an internal space therein and that extends vertically along an lapping plate axis that is perpendicular to the lapping plate, a pusher for pressing the elements, the pusher being connected to the pushing force adjusting member, and gas supply means for supplying a gas into the internal space, the gas supply means being connected to the pushing force adjusting member. The pushing force adjusting member comprises a first part that includes a connection with the pusher, a second part that includes a coupling between the internal space and the gas supply means, and an axially deformable part that is located between the first part and the second part.

Abstract: An abrading device features a flexible abrading membrane supported by two supports. The device may be used in either linear or rotary configurations. The device can be used in conjunction with devices that impart continuous or vibratory linear or rotary motion.

Abstract: The invention relates to a grinding machine for grinding of a gear or of a gear-like workpiece, which has a grinding worm (1) with a tooth-shaped profile (2), which consists at least partly from a dressable abrasive material and which is arranged rotatably on a grinding spindle, so that it can rotate around an axis of rotation (C) during grinding and a dressing device (3), with which at least a part of the forming areas (4, 5) of the grinding worm (1) can be profiled, wherein the dressing device (3) has a dressing spindle (6), which bears a disk-shaped dressing tool (7), so that it can rotate around an axis of rotation (B). To allow a faster dressing of the grinding worm the invention is characterized in that the grinding machine further has a dressing bar (8) which has a dressing edge (9), wherein the form of the dressing edge (9) corresponds at least partly to the ideal envelope of the grinding worm (1).

Abstract: An apparatus for processing wafer is provided, in which a re-adhesion of the slurry to the wafer edge, which has been adhered to the elastic abrasion member, can be inhibited, since a stronger contact of the rotating elastic abrasion member with the wafer edge, which is occurred when the rotating elastic abrasion member enters to the surface of the wafer, is avoided, and further, an abrasion of the elastic abrasion member can be inhibited.

Abstract: The invention relates to a method for grinding a cutting tool, especially a knife. The aim of the invention is to provide a method which allows configuration of individual leaf or blade geometries at comparatively low costs. For this purpose, the cutting tool is contacted with the effective surface of a grinding device, and the cutting tool and the grinding device can be displaced in relation to each other by at least three degrees of freedom.

Abstract: Scrubbing apparatus is configured by methods so that discs are quickly cleaned and conveyed by selecting a total number of spiral brush segments, rates of brush rotation, and a pitch length of a helical junction that receives discs for cleaning and transport. A time period for cleaning and transporting discs depends on the pitch length, rotational speed and configurations of the segments. An increase of the cleaning time period may result from use of an increased number of brush segments. A group of discs is cleaned by the same spiral brush, by one-by-one insertion of the discs into the junctions, and transporting the discs through the same segments.

Abstract: A chemical mechanical polishing (CMP) slurry and a chemical mechanical polishing (CMP) apparatus and method reduce defects, such as scratches, while maintaining a high polishing rate of a target film to be polished through a CMP process. The CMP slurry includes a ceria-based abrasive having a concentration of 0.001-10 percent by weight and a silica-based abrasive having a concentration of 1-24 percent by weight.

Abstract: A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.

Abstract: The present invention is directed to a machine programmed to edge an ophthalmic lens blank. The machine includes an edger device for forming a bevel in a peripheral edge of the lens blank, a central processing unit operably associated with the edger device for controlling operation thereof, and a computer program stored on a medium in communication with the central processing unit. The computer program includes a first instruction set operably causing the edger device to form a bevel in a peripheral edge of a lens blank. A second instruction set operably causes the edger device to form a step in the peripheral edge intermediate an apex of the bevel and an interface between the peripheral edge and a major surface of the lens blank. A method of controlling an edger device for edging an ophthalmic lens blank and a computer program are also disclosed.

Abstract: A perpendicular magnetic recording media substrate, suitable for magnetic recording media using the perpendicular magnetic recording method, is disclosed. Texturing is used to polish the substrate. A polishing tape is pressed against a substrate, while a polishing slurry comprising abrasive particles is supplied onto the substrate for perpendicular magnetic recording media while it is rotated, to perform texturing of the substrate. The average fiber diameter of polishing fibers contained in the polishing tape is 400 nm or less, and the average particle diameter of abrasive particles contained in the polishing slurry is 150 nm or less.