Precision Device Or Process - Or With Condition Responsive Control Patents (Class 451/1)
  • Publication number: 20080166877
    Abstract: A method for manufacturing a semiconductor device, including depositing an interconnect material including Cu or Cu alloy over an insulating film, and polishing the interconnect material by CMP with a polishing liquid, wherein the oxidation-reduction potential (ORP) of the polishing liquid is controlled so as to be in the range of 400 mV to 700 mV vs. Ag/AgCl.
    Type: Application
    Filed: January 3, 2008
    Publication date: July 10, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi Kanki, Takahiro Kimura, Tetsuya Shirasu
  • Patent number: 7367865
    Abstract: The electronic semiconductor component has a crystalline wafer substrate with an active surface and a semiconductor layer coating the active surface. So that the semiconductor layer has a few surface defects the crystalline wafer substrate is a sapphire or silicon carbide single crystal and the active surface has a pit density of less than 500 pit/cm2, preferably less than 100 pit/cm2. The polishing method for obtaining the active surface with these pit densities includes polishing with a polishing agent, such as a silicon suspension, and a polishing tool, which is pressed on the active surface with a pressure of preferably from 0.05 to 0.2 kg/cm2 and moved over the active surface with polishing motions distributed statistically and uniformly over a 360° angle during polishing.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: May 6, 2008
    Assignee: Schott AG
    Inventors: Peter Blaum, Burkhard Speit, Ingo Koehler, Bernd Ruediger, Wolfram Beier
  • Patent number: 7357695
    Abstract: Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members. The method further includes applying pressure against a back side of the microfeature workpiece in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members. In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members, a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: April 15, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Jason B. Elledge
  • Publication number: 20080051006
    Abstract: A tangential grinding resistance measuring method comprises a section area obtaining step of obtaining an abrasive grain section area which is at a predetermined infeed depth from the highest top surface of abrasive grains on a grinding wheel; a tangent calculation step of calculating the tangent of a half vertex angle of a conical model for cutting edges of the abrasive grains which model takes the abrasive grain section area as its bottom surface and the predetermined depth as its height; a parameter setting step of setting grinding parameters; a tangential grinding resistance calculation step of calculating a tangential grinding resistance from the grinding parameters and the tangent.
    Type: Application
    Filed: August 13, 2007
    Publication date: February 28, 2008
    Applicant: JTEKT Corporation
    Inventors: Yasuhira YAMADA, Hiroshi Morita
  • Patent number: 7329168
    Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: February 12, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Jim Hofmann
  • Patent number: 7287316
    Abstract: A lapping monitor element that is juxtaposed with a magnetic transducer element having a magnetoresistance effect film to determine the lapping position upon lapping the element height of the magnetic transducer element to a predetermined dimension. The lapping monitor element includes a resistance film to be resistance measured. The resistance film is a metal film of nonmagnetic transition metal or of alloy composed mainly of nonmagnetic transition metal, or a multilayered film where two or more such metal films are laid one upon another. The lapping monitor makes it possible to extremely stabilize the ELG sensor resistance measured values upon lapping as well as to provide a high accuracy MR height control.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: October 30, 2007
    Assignee: TDK Corporation
    Inventors: Noriaki Kasahara, Nozomu Hachisuka, Yasutoshi Fujita
  • Patent number: 7273405
    Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: September 25, 2007
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Kiyoshi Yamada, Hirofumi Takei, Masami Kamada, Toshinori Eba
  • Patent number: 7254996
    Abstract: A method and apparatus for testing rubber tires includes an abrader for rubbing against the surface of the tire and an eraser for removing particles of rubber left on the abrading surface by the tire. The eraser has the capability of absorbing oil or wax included in the tire being tested and in the particles deposited on the abrading surface.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: August 14, 2007
    Assignee: Cooper Tire & Rubber Co.
    Inventor: George B. Ouyang
  • Patent number: 7206172
    Abstract: An electrical lapping guide (ELG) incorporated into a shield of a magnetic head for measuring lapping process during construction of the magnetic head.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: April 17, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Meng Ding, Huey-Ming Tzeng
  • Patent number: 7182882
    Abstract: A method for buffering a chemical mechanical polish chemical slurry is disclosed. Buffering the slurry reduces buildup of local acidic areas at the interface between the polished metal and the polishing pad. Reduction of the local acidic areas improves the uniformity of the polish and an endpoint signal used to determine when to finish the polish operation.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: February 27, 2007
    Assignee: Intel Corporation
    Inventors: Allen D. Feller, Kenneth C. Cadien
  • Patent number: 7131891
    Abstract: Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members. The method further includes applying pressure against a back side of the microfeature workpiece in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members. In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members, a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: November 7, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Jason B. Elledge
  • Patent number: 7101251
    Abstract: A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: September 5, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
  • Patent number: 7055379
    Abstract: In a method and apparatus for checking the uniformity of a pneumatic tire of a vehicle wheel, first and second unbalance measuring operations are performed to determine unbalance vectors of the vehicle wheel, which are ascertained at differing wheel speeds and/or with differing tire pressures and the difference is formed between the unbalance vectors for evaluation of the uniformity of the tire.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: June 6, 2006
    Assignee: Snap-On Equipment GmbH
    Inventor: Karl Rothamel
  • Patent number: 7016799
    Abstract: An apparatus and a method are provided for checking a machining process of a machine tool, for example a grinding machine, to obtain information about the quantity of a material removed and the wear condition of a grinding-wheel. The apparatus comprises an acoustic sensor adapted to detect acoustic signals generated by contact between the grinding-wheel and the piece being machined, and a force-detecting sensor adapted to detect the force applied between the grinding-wheel and the piece during the machining. The method comprises processing signals provided by both sensors, defining time intervals on the basis of the signals of the acoustic sensor, and monitoring the signals of the force-detecting sensor in the time intervals.
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: March 21, 2006
    Assignee: Marposs Società per Azioni
    Inventor: Valerio Dondi
  • Patent number: 6971944
    Abstract: A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: December 6, 2005
    Assignee: LSI Logic Corporation
    Inventors: Michael J. Berman, Steven E. Reder, Bruce Whitefield
  • Patent number: 6951624
    Abstract: A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: October 4, 2005
    Assignee: Lam Research Corporation
    Inventors: Yehiel Gotkis, Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas J. Bright
  • Patent number: 6921317
    Abstract: An automated lapping system is provided for lapping a work product using a robot. Because the robot can apply continuous consistent pressure that far exceeds the capabilities of a human operator, lapping and polishing evolutions take a fraction of the time taken by a human operator. The system includes a robot having one or more lapping end effectors and a control component that controls the robot to lap the work product. The control component includes a processor, a user interface coupled to the processor, a communication component that receives final work product dimensions, and a positioning component that detects a lapping zone on the work product and sends the detected lapping zone to the control component. The control component controls the robot based on the sent lapping zone and received work product dimensions.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: July 26, 2005
    Assignee: The Boeing Company
    Inventors: Jeffrey H. Wood, Robert E. Bender, Terry A. Sewell
  • Patent number: 6752573
    Abstract: The invention relates to a machining center provided with a workpiece machining tool. Said machine tool comprises: an essentially horizontal working plate (10) which is supported by a machine tool stand (2); a workpiece support (20) which is accommodates a workpiece (2) and which is placed on the working plate (10); a machining head (30) which accommodates a machining tool (29) and which is mounted on a vertical machining column (32) that can pivot around a vertical axis (37) by means of a rotary plate (36), said rotary plate being arranged underneath the working plate (10) and integrated in the machine stand (2), and; a first carrying arm (34) for the machining column (32). One end of said carrying arm is connected in a fixed manner to the rotary plate (36), and the other end is laterally guided out over the working plate (10) in such a manner that the machining column (32) mounted there can be pivoted around the working plate (10).
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: June 22, 2004
    Inventor: Hubert Haller
  • Patent number: 6736696
    Abstract: A method of improving uniformity control in chemical mechanical polishing (CMP). A CMP apparatus is provided with at least a platen, a polishing pad disposed on the platen and at least a polishing carrier installed over the platen. The platen rotates in a first rotating direction, and the polishing carrier is used to press a wafer on the polishing pad and drive the wafer to rotate. First, in a first-CMP step, the polishing carrier rotates in a second rotating direction. Then, in a second-CMP step, the polishing carrier rotates in a third rotating direction different from the second rotating direction.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: May 18, 2004
    Assignee: ProMOS Technologies Inc.
    Inventors: Cheng-An Peng, Guan-Jiun Yi
  • Patent number: 6712668
    Abstract: A pipe electropolishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a nonuniform portion (70) of the pipe (28), then increased polishing action is provided as by increasing the voltage using a variable power supply (30a) and/or by slowing down the progress of the cathode (14) using a variable speed cable puller (18).
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: March 30, 2004
    Assignee: Therma Corporation, Inc.
    Inventor: Thomas A. Lorincz
  • Publication number: 20040038622
    Abstract: The invention is based on a hand power tool, in particular a disk-type sander, that comprises a motor (12) with a drive shaft (14) located in a housing, whereby the drive shaft (14)—by way of its side furthest from the motor (12)—is joined via an eccentric (18) with a sanding disk (16) that can walk around an annular, turnably supported means (20, 72) that is capable of being braked via braking means (22, 62).
    Type: Application
    Filed: January 14, 2003
    Publication date: February 26, 2004
    Inventor: Joerg Dehde
  • Patent number: 6682628
    Abstract: Methods and apparatuses for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressing a substrate assembly against a planarizing surface of a polishing pad at a pad/substrate interface defined by a surface area of the substrate assembly contacting the planarizing surface. The method continues by moving the substrate assembly and/or the polishing pad with respect to the other to rub at least one of the substrate assembly and the planarizing surface against the other at a relative velocity. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals. The measured drag force can be used to generate a plot of work versus time.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: January 27, 2004
    Assignee: Micron Technology, Inc.
    Inventors: James J. Hoffmann, Gundu M. Sabde, Stephen J. Kramer, Michael James Joslyn
  • Patent number: 6638138
    Abstract: An arrangement of grinding modules in a track grinder wherein a radial mismatch in narrow track bend radii can be considered in an exact manner without occurrence of constraining forces, enabling reprofiling to be reproduced in a simple manner. The arrangement provides a grinding tool with five degrees of freedom. Each grinding module is accommodated in an at least approximately vertical manner with a frame and in an at least horizontally manner on the frame with a holder. A housing in the holder is pivotably arranged around a shaft that is at least approximately parallel to the track to be ground. The grinding tool in the housing can be adjusted in a rectangular manner in relation to the track to be ground.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: October 28, 2003
    Inventors: Michael Luddeneit, Wilfried Scherf
  • Patent number: 6609948
    Abstract: An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer is removed and ELG material is deposited therein. This is followed by forming track widths and back edges for each of the ELG and the read sensor to be followed by lapping to the ABS. Various films are employed for the ELG to minimize magnetoresistance and optimize the resistance of the ELG. The resistance of the ELG is then sensed by a computer for controlling a lapping tool to lap to the aforementioned ABS.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: August 26, 2003
    Assignee: International Business Machines Corporation
    Inventors: Robert Edward Fontana, Jr., Richard Hsiao
  • Patent number: 6568988
    Abstract: A chemical mechanical polishing apparatus has a plurality of electric machines for executing mechanical polishing motions, at least two control systems for controlling the mechanical polishing motions, at least two signal wires connected with the two control systems for transmitting signals of the two control systems, and a wave filter comprising two terminals connected with the two signal wires respectively for filtering out the signal whose voltage exceeds a predetermined value in the two signal wires.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: May 27, 2003
    Assignee: Mosel Vitelic Inc.
    Inventors: Yi-Hua Chin, Hua-Jen Tseng, Chun-Chieh Lee, Dong-Tay Tsai
  • Publication number: 20030073379
    Abstract: The invention is an endface polishing method and an endface polishing apparatus improving polishing accuracy of an optical fiber and making polishing time and polishing work shorten. Polishing is performed making a boundary line center axis while observing the boundary line of brightness and darkness formed at outer circumference face of an optical fiber by irradiating substantial parallel light from the predetermined direction crossing at the right angle to the axis of the optical fiber in an endface polishing method polishing a tip end of the optical fiber held by a jig by a polishing member attached at a polishing disk in an apparatus providing the polishing disk supported by a main body of the apparatus and the jig holding the optical fiber.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 17, 2003
    Inventors: Kazumasa Katakura, Kouji Minami
  • Patent number: 6405146
    Abstract: The invention relates to a warm-up cycle for each tire being tested on a force variation machine to stabilize the measurement parameters and optimize the warm-up cycle. The method for cycling each tire comprises the following steps. A tire type and preset tolerance values for each parameter of the tire being measured is inputted into the force variation machine. The tire is rotated in a first direction for two successive revolutions, data values for each of the parameters are calculated, and the differences between the calculated data values and the preset tolerance values are determined. Then the tire is rotated in a second opposite direction and the warm-up cycle is repeated. Continuing, the tire is rotated for one or more additional revolutions and the data values for the measured parameters are again calculated if necessary.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: June 11, 2002
    Assignee: The Goodyear Tire & Rubber Company
    Inventor: Jean Engel
  • Publication number: 20020012204
    Abstract: Herein is disclosed a method and apparatus for controlling a lapping process, so as to create a read/write head that contains a primary magnetoresistive read element with a desired stripe height. An improved lapping guide is achieved by incorporating a secondary magnetoresistive element into a read/write head. By virtue of its location on the same read/write head as a primary magnetoresistive element (used for reading data during operation of the disc drive), the secondary element is located in close proximity to the primary element, resulting in smaller tolerances in aligning or relating the top edges of the primary and secondary elements. Accordingly, the secondary magnetoresistive element more reliably serves as a proxy for the primary element. Optionally, the secondary magnetoresistive element may be fashioned with identical dimensions as the primary element, so as to render the secondary element equivalent to the primary element with regard to magnetic sensitivity.
    Type: Application
    Filed: May 25, 2001
    Publication date: January 31, 2002
    Inventors: Zine-Eddine Boutaghou, Edward Stephens Murdock
  • Publication number: 20020006764
    Abstract: A very versatile device is proposed for high-precision machining of optical workpieces, in particular optical lenses, which comprises a horizontally displaceable gantry with at least one vertically displaceable tool spindle and a yoke with workpiece holding means mounted so as to be rotatable about a swivel axis by means of journals fitted on both sides. For swivelling of the yoke without gearing and therefore without backlash, a torque motor is provided concentrically to the swivel axis, which motor is directly connected actively with one of the journals.
    Type: Application
    Filed: June 25, 2001
    Publication date: January 17, 2002
    Applicant: Loh Optikmaschinen AG
    Inventors: Manfred Hanisch, Joachim Diehl, Holger Schafer
  • Patent number: 6330488
    Abstract: A method for controlling a machining process of a workpiece includes a step of measuring amounts of machining of the workpiece by a plurality of sensors located at different positions on the workpiece, the sensors providing detection signals which represent the respective measured amounts, a step of removing the detection signal when the detection signal has an abnormal value which is extremely different in comparison with values of the other detection signals by using a smoothing method, and a step of controlling the machining of the workpiece depending upon the remaining detection signals from the sensors.
    Type: Grant
    Filed: October 27, 1998
    Date of Patent: December 11, 2001
    Assignee: TDK Corporation
    Inventors: Tomoyuki Yoshida, Noritsugu Kakegawa
  • Publication number: 20010034190
    Abstract: A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system comprises a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 25, 2001
    Inventors: Mutsumi Tanikawa, Mitsunori Komatsu, Kiyotaka Kawashima, Hiroshi Shimomoto, Katsuya Okumura
  • Publication number: 20010024927
    Abstract: An apparatus for the in situ superfinishing of crankshaft thrust bearing surfaces includes an oscillator, an oscillation arm connected to the oscillator such that the oscillation arm is reciprocable by the oscillator, a caliper disposed on the oscillation arm remote from the oscillator, and at least two abrasive pads disposed on the caliper. The oscillation arm facilitates the extension of the arm into the engine to cause the abrasive pads to engage the bearing and to abrasively superfinish the surfaces of the bearing. A method for the in situ superfinishing of the surfaces of the bearing includes operably locating a superfinishing apparatus adjacent the engine, extending the abrasive pads into the engine, causing the abrasive pads to engage the surfaces to be superfinished, and oscillating the abrasive pads in contact with the surfaces to be superfinished.
    Type: Application
    Filed: March 21, 2001
    Publication date: September 27, 2001
    Inventors: Douglas Garvin, Floyd Curry
  • Patent number: 6287170
    Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: September 11, 2001
    Assignee: Seagate Technology LLC
    Inventors: Shanlin Hao, Lars Halvar Ahlen, Edward Michael Erickson
  • Patent number: 6170149
    Abstract: According to a method of manufacturing a magnetic head, a magnetoresistive device is formed on a substrate, a top end portion of the magnetoresistive device is placed in an external magnetic field, and a height of the magnetic head is adjusted by ceasing a polishing operation at an instant when change in resistance of the magnetoresistive device relative to change in the external magnetic field comes up to a predetermined value.
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: January 9, 2001
    Assignee: Fujitsu Limited
    Inventors: Mitsumasa Oshiki, Nobuo Iijima, Motoichi Watanuki
  • Patent number: 6050878
    Abstract: A processing jig is provided for deforming an object to be processed that is long in one direction into a complicated shape and processing the object with accuracy. The jig comprises: a main body to be fixed to the processing apparatus; a retainer that is long in one direction for retaining a bar as the object long in one direction; four couplers for coupling the retainer and the main body to each other; three load application sections, coupled to the retainer, to which a load is applied for deforming the retainer; and arms for coupling the load application sections to the retainer. The retainer takes a shape of a narrow and long beam that is bent with an application of external force. The two load application sections on both ends each have three degrees of freedom in two directions orthogonal to each other and a direction of rotation, for example. The load application section in the middle has one degree of freedom in the vertical direction only.
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: April 18, 2000
    Assignee: TDK Corporation
    Inventors: Noboru Kanzo, Masahiro Sasaki, Masaki Kozu
  • Patent number: 6027397
    Abstract: A dual element electrical lapping guide system is disclosed for a row of multi-layer dual element magnetoresistive and inductive magnetic transducers formed on a substrate, which will be used to form sliders, the sliders being separated by separation kerfs, and the multi-layer transducers aligned along an edge of the substrate for lapping of the edge. The dual element lapping guide system comprises superposed resistive elements and electrical switch elements, each positioned in one of the separation kerfs, and having an edge thereof positioned so as to be aligned with the edge of the row and subject to lapping of the row. Each electrical switch element comprises a bottom and a top layer connected at one end thereof and separated at the other end thereof by an insulation layer, so as to be initially closed at the connected end, which end is aligned with the edge of the multi-layer transducers and subject to lapping of the row at the connected end to open the switch element.
    Type: Grant
    Filed: April 25, 1997
    Date of Patent: February 22, 2000
    Assignee: International Business Machines Corporation
    Inventors: Mark A. Church, Alain Michael Desouches
  • Patent number: 5991698
    Abstract: A lapping system data acquisition unit is disclosed for use in measuring resistances of multiple resistors embedded in a structure to be machined. Each of multiple independent current sources directs a current through one of the multiple resistors embedded in the structure during machining of a surface of the structure. Each of multiple voltage sensing devices couples to a separate one of the multiple resistors and provides a separate analog voltage output signal indicative of the resistance of the resistor. Each of multiple filters is coupled to a separate one of the multiple voltage sensing devices Analog-to-digital conversion circuitry coupled to the multiple filters generates a digitized signal for each of the filtered output signals.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: November 23, 1999
    Assignee: Seagate Technology, Inc.
    Inventors: Shanlin Hao, Ray V. Rigles, William P. Wood, Lars H. Ahlen, John C. Heitke
  • Patent number: 5947799
    Abstract: Method for identifying, monitoring, and controlling the blank frequencies in each separate carrier of a planetary lap machine, based on measuring blank frequency signals via an electrode imbedded in a lap plate, analyzing the time frequency pattern of these signals as they pass the electrode, correlating it with the sequence of carriers passing the electrode, and from that identifying and correlating groups of signals with the loads of blanks in each carrier, then monitoring the frequencies and the frequency spread in each carrier and, optionally, terminating lapping when frequencies and spread in a carrier exceed a target value.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: September 7, 1999
    Inventors: Michihiko Kaoyashi, Franz L. Sauerland
  • Patent number: 5948204
    Abstract: The present invention discloses an improvement on a wafer carrier ring for use in a chemical-mechanical polishing apparatus for uniformly polishing semiconductor wafers. The apparatus comprises of a ring assembly, a stainless steel backing plate and a rubber bladder for holding the ring assembly and the backing plate. The ring assembly comprises of two rings. The first ring is made of a soft material such as Delrin or PBT for holding the stainless steel backing plate which is attached to the wafer. A top portion of the first ring is cutoff to leave an annular notch. The second ring is made of a hard material such as stainless steel and is fitted into the annular notch of the first ring. Both rings are attached to the rubber bladder through two sets of screws which are evenly spaced through a circular path concentric to the circumference of the first ring.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: September 7, 1999
    Assignee: Intel Corporation
    Inventors: James G. Maveety, George T. Waller, Wayne Gaynor
  • Patent number: 5816890
    Abstract: An electrical lap guide (ELG) system and method are disclosed for use in lapping a bar 10 of magnetic transducer carrying sliders to a desired transducer height. A first ELG ELG1 contained within the bar has at least two first ELG resistive elements R.sub.11 and R.sub.12. A second ELG ELG 2 contained within the bar has at least two second ELG resistive elements R.sub.21 and R.sub.23. A first of the at least two first ELG resistive elements is electrically coupled to a first of the at least two second ELG resistive elements to thereby reduce a total number of leads needed between a data acquisition unit 100 and the bar 10 during lapping. The reduction in required data acquisition unit 100 leads allow more ELGs to be included on each bar 10 in order to more accurately control the lapping process.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: October 6, 1998
    Assignee: Seagate Technology, Inc.
    Inventors: Shanlin X. Hao, Lance E. Stover, Beat G. Keel
  • Patent number: 5755612
    Abstract: An electrical lap guide (ELG) for use in lapping a bar of magnetic transducer carrying sliders to a desired height is disclosed. A first lapped or analog ELG element is positioned in a first dice lane on the bar between first and second sliders. A first electrical connection is positioned on a surface of the first dice lane for coupling the first ELG element to external circuitry. A second reference ELG element is positioned in the first slider at a position recessed from the lapped surface. A second electrical connection is positioned on the first slider for coupling the second ELG element to external circuitry.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: May 26, 1998
    Assignee: Seagate Technology, Inc.
    Inventors: Mark J. Schaenzer, Beat G. Keel, Lance E. Stover, Shanlin X. Hao
  • Patent number: 5738566
    Abstract: A lapping guide system, method and article of manufacture is disclosed. A method of fabricating a lapping guide for use in conjunction with the machining of a magnetic recording transducer includes the following steps. A plurality of lap switch fingers of the lapping guide and a bottom pole of the transducer are fabricated at the same time and from the same material. Each lap switch finger has the same topology as the topology of the bottom pole. An insulating layer is fabricated on the plurality of lap switch fingers of the lapping guide and on the bottom pole of the transducer. A top conductor is fabricated on the insulating layer above a plurality of lap switch fingers, while a top pole is fabricated on the insulating layer above the bottom pole. The top conductor and top pole are fabricated at the same time and from the same material.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: April 14, 1998
    Assignee: Seagate Technology, Inc.
    Inventors: Zhihao Li, Ganesan Doraisami, Beat G. Keel
  • Patent number: 5688159
    Abstract: A device for automatically polishing a mother blank of sheet copper has a starting sheet auto-stripping line including a delivery device for carrying in mother blanks of sheet copper, a stripping device for stripping starting sheets from the mother blanks, a removal device for carrying out mother blanks after the starting sheets are stripped off and a device for polishing the surfaces of a mother blank from which starting sheets have been stripped off at a forward position in the direction in which the mother blanks are transferred.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: November 18, 1997
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Mineharu Kusano, Kenzou Takabatake, Yutaka Kataoka
  • Patent number: 5683287
    Abstract: At least one brush rotatable about an axis parallel to the plate (1) and to a plane containing a row of bearing surfaces (4) of openings (2) of the plate (1), is moved along a rectilinear path (5a, 5b, 5c) parallel to the plane of the bearing surfaces (4) of the openings (2) of the row of the plate (1). Preferably, the device comprises a brushing unit mounted at the end of an articulated arm of a robot permitting the movement of the brushing unit in succession along rectilinear paths (5a, 5b, 5c) constituting several groups in which the paths are parallel to the same direction.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: November 4, 1997
    Assignee: Framatome
    Inventors: Francois Martineau, Noel Martin
  • Patent number: 5660579
    Abstract: The metal bond wheel forming apparatus includes rotation speed control means 11 for controlling the rotation speed of a grinding wheel 6; energy control means 9 for controlling discharge energy that is supplied to the gap between a wire electrode 1 and the grinding wheel 6; relative speed control means 17 for controlling a relative movement speed either for the wire electrode 1 or for the grinding wheel 6; and detailed machining control means 23 for controlling the rotation speed control means, the energy control means and the relative speed control means, for setting the rotation speed of the grinding wheel and discharge energy appropriate for detailed machining, and for setting the relative movement speed for the wire electrode or for the grinding wheel to enable high speed shaping during the detailed machining.
    Type: Grant
    Filed: August 13, 1996
    Date of Patent: August 26, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshiro Nakayama, Osamu Yasuda, Kouzo Nomura
  • Patent number: 5649849
    Abstract: A method for interferometrically determining error continuously in the radius of curvature of a planetary polishing surface and for providing compensating correction of the surface shape while the polishing machine is in operation. A conditioner glass body disposed on the polishing surface for reshaping the surface is itself a Fizeau cavity having upper and lower partially-reflective surfaces which are parallel or slightly non-parallel for plano polishing and spherical polishing. The conditioner is illuminated by a plano, monochromatic, coherent light wavefront substantially perpendicular to the polishing surface, preferably over the entire upper surface of the conditioner. A portion of the incident wavefront is reflected from the upper surface as a reference wavefront, and another portion of the incident wavefront is reflected from the lower surface as a measurement wavefront.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: July 22, 1997
    Assignee: Eastman Kodak Company
    Inventors: David Pileri, John Hannon, Donald A. Gildner, Mark Baumler
  • Patent number: 5641321
    Abstract: The invention provides a novel cutting tool used in wood working, which has a sufficiently thick cutting edge allowing stable cutting of a veneer from a log as well as an apparatus for and a method of grinding the cutting edge to have a favorable shape and a relatively large angle. The apparatus of the invention includes a table which an elongated cutting tool extending along a longitudinal axis of the table is mounted on, a fixing element for pressing the cutting tool upright against an upright plate, and a carriage which is reciprocatingly movable along the longitudinal axis of the table. The carriage is provided with a pair of grinding wheels which are respectively movable into and out of endwise grinding contact with an upper surface and a lower surface of the cutting edge of the upright cutting tool at desirable angles.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: June 24, 1997
    Assignee: Kabushiki Kaisha Taihei Seisakusho
    Inventor: Hiromi Suzuki
  • Patent number: 5616063
    Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.
    Type: Grant
    Filed: September 20, 1994
    Date of Patent: April 1, 1997
    Assignees: Kabushiki Kaisya Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Masako Kodera, Shirou Mishima, Atsushi Shigeta, Masayoshi Hirose, Norio Kimura, Seiji Ishikawa
  • Patent number: 5613894
    Abstract: Method to hone curved and shaped profiles which belong to furniture elements, which are advantageously of furniture of an antique style, such as surfaces of tables, mouldings of furniture or pictures, panels, doors of kitchen cupboards, seat elements, etc.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: March 25, 1997
    Assignee: Delle Vedove Levigatrici SpA
    Inventor: Gaetano Delle Vedove
  • Patent number: 5580298
    Abstract: A method of producing flank surface modifications in gear teeth by controlled removal of stock material from a work gear with a tool. The method comprises providing a gear producing machine the tool and work gear being movable with respect to one another along and/or about a plurality of axes. A theoretical basic machine is provided comprising a plurality of machine settings for relatively positioning and moving said tool and work gear with respect to one another. Each of the machine settings is defined as an active setting with each active setting being represented by a function. A desired tooth flank surface modification is determined and defined by a set of coefficients for each of the active settings. The function for each active setting is then determined based upon the respective coefficients for each active setting and the functions are transformed from the theoretical machine to the axes arrangement of the gear producing machine.
    Type: Grant
    Filed: September 27, 1994
    Date of Patent: December 3, 1996
    Assignee: The Gleason Works
    Inventor: Hermann J. Stadtfeld