Precision Device Or Process - Or With Condition Responsive Control Patents (Class 451/1)
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Patent number: 7643928Abstract: A system and method for controlling the speed of a turbine engine, the turbine engine being operative to provide power to a primary load. When a decrease in the power requirement of the primary load is detected, at least a portion of the power generated by the turbine engine is redirected to a secondary load, thereby maintaining the speed of the turbine engine below a rated maximum speed. In the example of a turbine-powered train in which the turbine engine provides power to electric traction motors driving the wheels of the train, when a wheel spin is detected, at least a portion of the power generated by the turbine engine is diverted from the respective electric traction motor to rheostats for conversion to heat.Type: GrantFiled: January 5, 2004Date of Patent: January 5, 2010Assignee: Bombardier Transportation GmbHInventor: Richard Soucy
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Patent number: 7627390Abstract: Method for the optimization of the surface geometry or of a variable, dependent on this, or variables, dependent on this, of bevel or hypoid gears for their production on a free-form machine which can be mapped to a free-form basic machine with at most six axes uniquely in a reversible way, even to symmetries, which has a gearwheel to be machined and a tool which are in each case rotatable about an axis, and the tool and the gearwheel to be machined are moveable, preferably displaceable or rotatable, with respect to one another along or about a plurality of axes, the optimization of the surface geometry or of the variable or variables, dependent on this, of the bevel or hypoid gearwheel taking place in that one or more control parameters, which has or have influence on the surface geometry or the variable or variables, dependent on this, of the bevel or hypoid gearwheel, is or are varied by means of a simulation of the gearwheel production process and/or a roll and/or a load-contact analysis on the free-formType: GrantFiled: January 12, 2009Date of Patent: December 1, 2009Assignee: Klingelnberg GmbHInventors: Hartmuth Mueller, Olaf Vogel, Roland Dutschk, Carsten Huenecke
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Patent number: 7627389Abstract: Method for the optimization of the surface geometry or of a variable, dependent on this, or variables, dependent on this, of bevel or hypoid gears for their production on a free-form machine which can be mapped to a free-form basic machine with at most six axes uniquely in a reversible way, even to symmetries, which has a gearwheel to be machined and a tool which are in each case rotatable about an axis, and the tool and the gearwheel to be machined are moveable, preferably displaceable or rotatable, with respect to one another along or about a plurality of axes, the optimization of the surface geometry or of the variable or variables, dependent on this, of the bevel or hypoid gearwheel taking place in that one or more control parameters, which has or have influence on the surface geometry or the variable or variables, dependent on this, of the bevel or hypoid gearwheel, is or are varied by means of a simulation of the gearwheel production process and/or a roll and/or a load-contact analysis on the free-formType: GrantFiled: June 13, 2006Date of Patent: December 1, 2009Assignee: Klingelnberg GmbHInventors: Hartmuth Muller, Olaf Vogel, Roland Dutschk, Carsten Hunecke
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Patent number: 7557904Abstract: A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.Type: GrantFiled: February 24, 2006Date of Patent: July 7, 2009Assignee: Disco CorporationInventors: Naoki Ohmiya, Satoshi Genda, Noboru Takeda, Koichi Takeyama, Yukio Morishige, Hiroshi Morikazu, Hiroshi Nomura
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Patent number: 7552630Abstract: A method of positioning a load wheel in a tire uniformity machine to load a tire for testing, the method comprising providing a drive assembly including a drive motor and a drive controller, electrically connected to each other, said drive controller being adapted to switch between analog velocity control and position control; moving the load wheel with the drive motor using analog velocity control; and switching to position control to cause said motor to maintain a selected position of said load wheel without a mechanical brake.Type: GrantFiled: February 28, 2005Date of Patent: June 30, 2009Assignee: Akron Special Machinery, Inc.Inventors: Richard Delmoro, David Krause, David Poling, Sr.
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Publication number: 20090124170Abstract: Disclosed in the present application is a sharpening apparatus and method for sharpening a cutting bit. The apparatus comprises a sharpening member and a laser for accurately positioning the cutting bit surface to be sharpened with respect to the sharpening member. The apparatus and method are particularly useful for sharpening a router or shaper bit.Type: ApplicationFiled: October 2, 2008Publication date: May 14, 2009Inventor: Charles M. Thomas
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Publication number: 20090108266Abstract: Apparatus comprising, in use, a wide bandgap semiconductor, a conductor which is moveable relative to the semiconductor and means for applying a potential across the junction between a conductor and semiconductor to control the friction generated by the relative movement between the semiconductor and the conductor. A method of controlling friction between a wide bandgap semiconductor and conductor which are moveable relative to each other comprising applying a potential across the junction between the semiconductor and the conductor.Type: ApplicationFiled: August 28, 2008Publication date: April 30, 2009Inventors: Jonathan Hird, Avik Chakravarty, Satyendra Chakravarty, Chhaya Chakravarty
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Patent number: 7465214Abstract: A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.Type: GrantFiled: February 25, 2004Date of Patent: December 16, 2008Assignee: Ebara CorporationInventors: Tetsuji Togawa, Osamu Nabeya
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Patent number: 7448261Abstract: An eraser having the capability of absorbing oil or wax as a formulation of more than 50% styrene butadiene rubber (SBR). The eraser is particularly well suited for use in testing tires having oil or wax therein.Type: GrantFiled: June 14, 2007Date of Patent: November 11, 2008Assignee: Cooper Tire & Rubber Co.Inventor: George B. Ouyang
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Patent number: 7434454Abstract: There is provided a method and a apparatus for measuring tire uniformity. The apparatus comprises a spindle, a rotating drum, a sensor and a computing means. The method comprises the steps of mounting a tire on the spindle, pressing a circumferential surface of a rotating drum against the tread surface of the tire with a first pressing force, rotating the tire around rotational axis thereof, and computing the forces which the tire acts on first and second planes of the tire by the computing means while the tire is rotating. The first plane is perpendicular to the rotational axis and in one sidewall side of the tire. The second plane is perpendicular to the rotational axis and in the other sidewall side of the tire. The forces are computed based on values obtained by the sensor measuring forces transmitted to the spindle from the tire at first and second positions. The first and second positions have different distances from the tire in the rotational axis direction.Type: GrantFiled: August 25, 2004Date of Patent: October 14, 2008Assignee: Kokusai Keisokuki Kabushiki KaishaInventor: Sigeru Matsumoto
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Publication number: 20080227374Abstract: A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.Type: ApplicationFiled: March 15, 2007Publication date: September 18, 2008Applicant: APPLIED MATERIALS, INC.Inventors: Jeffrey P. Schmidt, Jay Rohde, Stacy Meyer
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Publication number: 20080188161Abstract: A method for shaping a workpiece having a base portion using a tool is provided. The method includes rotating the tool at a fixed rotational speed in a first direction and rotating the workpiece in the first direction. The tool is positioned in contact with the workpiece at a first portion of the base portion of the workpiece. The workpiece is rotated at a first rotational speed when the tool contacts the first portion of the base portion of the workpiece. The workpiece is rotated at a second rotational speed when the tool contacts a second portion of the base portion of the workpiece. The first rotational speed and the second rotational speed are different.Type: ApplicationFiled: February 5, 2007Publication date: August 7, 2008Applicant: GM Global Technology Operations, Inc.Inventors: SHANE E. BREMER, Ihab M. Hanna, Jason J. Wiedyk, Aleksandar J. Filipovic
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Publication number: 20080166877Abstract: A method for manufacturing a semiconductor device, including depositing an interconnect material including Cu or Cu alloy over an insulating film, and polishing the interconnect material by CMP with a polishing liquid, wherein the oxidation-reduction potential (ORP) of the polishing liquid is controlled so as to be in the range of 400 mV to 700 mV vs. Ag/AgCl.Type: ApplicationFiled: January 3, 2008Publication date: July 10, 2008Applicant: FUJITSU LIMITEDInventors: Tsuyoshi Kanki, Takahiro Kimura, Tetsuya Shirasu
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Patent number: 7367865Abstract: The electronic semiconductor component has a crystalline wafer substrate with an active surface and a semiconductor layer coating the active surface. So that the semiconductor layer has a few surface defects the crystalline wafer substrate is a sapphire or silicon carbide single crystal and the active surface has a pit density of less than 500 pit/cm2, preferably less than 100 pit/cm2. The polishing method for obtaining the active surface with these pit densities includes polishing with a polishing agent, such as a silicon suspension, and a polishing tool, which is pressed on the active surface with a pressure of preferably from 0.05 to 0.2 kg/cm2 and moved over the active surface with polishing motions distributed statistically and uniformly over a 360° angle during polishing.Type: GrantFiled: March 1, 2005Date of Patent: May 6, 2008Assignee: Schott AGInventors: Peter Blaum, Burkhard Speit, Ingo Koehler, Bernd Ruediger, Wolfram Beier
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Patent number: 7357695Abstract: Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members. The method further includes applying pressure against a back side of the microfeature workpiece in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members. In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members, a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.Type: GrantFiled: September 8, 2006Date of Patent: April 15, 2008Assignee: Micron Technology, Inc.Inventor: Jason B. Elledge
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Publication number: 20080051006Abstract: A tangential grinding resistance measuring method comprises a section area obtaining step of obtaining an abrasive grain section area which is at a predetermined infeed depth from the highest top surface of abrasive grains on a grinding wheel; a tangent calculation step of calculating the tangent of a half vertex angle of a conical model for cutting edges of the abrasive grains which model takes the abrasive grain section area as its bottom surface and the predetermined depth as its height; a parameter setting step of setting grinding parameters; a tangential grinding resistance calculation step of calculating a tangential grinding resistance from the grinding parameters and the tangent.Type: ApplicationFiled: August 13, 2007Publication date: February 28, 2008Applicant: JTEKT CorporationInventors: Yasuhira YAMADA, Hiroshi Morita
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Patent number: 7329168Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.Type: GrantFiled: August 31, 2005Date of Patent: February 12, 2008Assignee: Micron Technology, Inc.Inventor: Jim Hofmann
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Patent number: 7287316Abstract: A lapping monitor element that is juxtaposed with a magnetic transducer element having a magnetoresistance effect film to determine the lapping position upon lapping the element height of the magnetic transducer element to a predetermined dimension. The lapping monitor element includes a resistance film to be resistance measured. The resistance film is a metal film of nonmagnetic transition metal or of alloy composed mainly of nonmagnetic transition metal, or a multilayered film where two or more such metal films are laid one upon another. The lapping monitor makes it possible to extremely stabilize the ELG sensor resistance measured values upon lapping as well as to provide a high accuracy MR height control.Type: GrantFiled: July 15, 2002Date of Patent: October 30, 2007Assignee: TDK CorporationInventors: Noriaki Kasahara, Nozomu Hachisuka, Yasutoshi Fujita
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Patent number: 7273405Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.Type: GrantFiled: September 16, 2005Date of Patent: September 25, 2007Assignee: Dowa Mining Co., Ltd.Inventors: Kiyoshi Yamada, Hirofumi Takei, Masami Kamada, Toshinori Eba
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Patent number: 7254996Abstract: A method and apparatus for testing rubber tires includes an abrader for rubbing against the surface of the tire and an eraser for removing particles of rubber left on the abrading surface by the tire. The eraser has the capability of absorbing oil or wax included in the tire being tested and in the particles deposited on the abrading surface.Type: GrantFiled: January 31, 2006Date of Patent: August 14, 2007Assignee: Cooper Tire & Rubber Co.Inventor: George B. Ouyang
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Patent number: 7206172Abstract: An electrical lapping guide (ELG) incorporated into a shield of a magnetic head for measuring lapping process during construction of the magnetic head.Type: GrantFiled: February 20, 2004Date of Patent: April 17, 2007Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Meng Ding, Huey-Ming Tzeng
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Patent number: 7182882Abstract: A method for buffering a chemical mechanical polish chemical slurry is disclosed. Buffering the slurry reduces buildup of local acidic areas at the interface between the polished metal and the polishing pad. Reduction of the local acidic areas improves the uniformity of the polish and an endpoint signal used to determine when to finish the polish operation.Type: GrantFiled: January 2, 2002Date of Patent: February 27, 2007Assignee: Intel CorporationInventors: Allen D. Feller, Kenneth C. Cadien
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Patent number: 7131891Abstract: Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members. The method further includes applying pressure against a back side of the microfeature workpiece in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members. In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members, a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.Type: GrantFiled: April 28, 2003Date of Patent: November 7, 2006Assignee: Micron Technology, Inc.Inventor: Jason B. Elledge
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Patent number: 7101251Abstract: A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.Type: GrantFiled: June 23, 2005Date of Patent: September 5, 2006Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Patent number: 7055379Abstract: In a method and apparatus for checking the uniformity of a pneumatic tire of a vehicle wheel, first and second unbalance measuring operations are performed to determine unbalance vectors of the vehicle wheel, which are ascertained at differing wheel speeds and/or with differing tire pressures and the difference is formed between the unbalance vectors for evaluation of the uniformity of the tire.Type: GrantFiled: December 10, 2003Date of Patent: June 6, 2006Assignee: Snap-On Equipment GmbHInventor: Karl Rothamel
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Patent number: 7016799Abstract: An apparatus and a method are provided for checking a machining process of a machine tool, for example a grinding machine, to obtain information about the quantity of a material removed and the wear condition of a grinding-wheel. The apparatus comprises an acoustic sensor adapted to detect acoustic signals generated by contact between the grinding-wheel and the piece being machined, and a force-detecting sensor adapted to detect the force applied between the grinding-wheel and the piece during the machining. The method comprises processing signals provided by both sensors, defining time intervals on the basis of the signals of the acoustic sensor, and monitoring the signals of the force-detecting sensor in the time intervals.Type: GrantFiled: July 5, 2002Date of Patent: March 21, 2006Assignee: Marposs Società per AzioniInventor: Valerio Dondi
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Patent number: 6971944Abstract: A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.Type: GrantFiled: February 17, 2004Date of Patent: December 6, 2005Assignee: LSI Logic CorporationInventors: Michael J. Berman, Steven E. Reder, Bruce Whitefield
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Patent number: 6951624Abstract: A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.Type: GrantFiled: June 29, 2004Date of Patent: October 4, 2005Assignee: Lam Research CorporationInventors: Yehiel Gotkis, Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas J. Bright
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Patent number: 6921317Abstract: An automated lapping system is provided for lapping a work product using a robot. Because the robot can apply continuous consistent pressure that far exceeds the capabilities of a human operator, lapping and polishing evolutions take a fraction of the time taken by a human operator. The system includes a robot having one or more lapping end effectors and a control component that controls the robot to lap the work product. The control component includes a processor, a user interface coupled to the processor, a communication component that receives final work product dimensions, and a positioning component that detects a lapping zone on the work product and sends the detected lapping zone to the control component. The control component controls the robot based on the sent lapping zone and received work product dimensions.Type: GrantFiled: November 21, 2002Date of Patent: July 26, 2005Assignee: The Boeing CompanyInventors: Jeffrey H. Wood, Robert E. Bender, Terry A. Sewell
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Patent number: 6752573Abstract: The invention relates to a machining center provided with a workpiece machining tool. Said machine tool comprises: an essentially horizontal working plate (10) which is supported by a machine tool stand (2); a workpiece support (20) which is accommodates a workpiece (2) and which is placed on the working plate (10); a machining head (30) which accommodates a machining tool (29) and which is mounted on a vertical machining column (32) that can pivot around a vertical axis (37) by means of a rotary plate (36), said rotary plate being arranged underneath the working plate (10) and integrated in the machine stand (2), and; a first carrying arm (34) for the machining column (32). One end of said carrying arm is connected in a fixed manner to the rotary plate (36), and the other end is laterally guided out over the working plate (10) in such a manner that the machining column (32) mounted there can be pivoted around the working plate (10).Type: GrantFiled: September 13, 2002Date of Patent: June 22, 2004Inventor: Hubert Haller
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Patent number: 6736696Abstract: A method of improving uniformity control in chemical mechanical polishing (CMP). A CMP apparatus is provided with at least a platen, a polishing pad disposed on the platen and at least a polishing carrier installed over the platen. The platen rotates in a first rotating direction, and the polishing carrier is used to press a wafer on the polishing pad and drive the wafer to rotate. First, in a first-CMP step, the polishing carrier rotates in a second rotating direction. Then, in a second-CMP step, the polishing carrier rotates in a third rotating direction different from the second rotating direction.Type: GrantFiled: April 30, 2002Date of Patent: May 18, 2004Assignee: ProMOS Technologies Inc.Inventors: Cheng-An Peng, Guan-Jiun Yi
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Patent number: 6712668Abstract: A pipe electropolishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a nonuniform portion (70) of the pipe (28), then increased polishing action is provided as by increasing the voltage using a variable power supply (30a) and/or by slowing down the progress of the cathode (14) using a variable speed cable puller (18).Type: GrantFiled: December 6, 2000Date of Patent: March 30, 2004Assignee: Therma Corporation, Inc.Inventor: Thomas A. Lorincz
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Publication number: 20040038622Abstract: The invention is based on a hand power tool, in particular a disk-type sander, that comprises a motor (12) with a drive shaft (14) located in a housing, whereby the drive shaft (14)—by way of its side furthest from the motor (12)—is joined via an eccentric (18) with a sanding disk (16) that can walk around an annular, turnably supported means (20, 72) that is capable of being braked via braking means (22, 62).Type: ApplicationFiled: January 14, 2003Publication date: February 26, 2004Inventor: Joerg Dehde
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Patent number: 6682628Abstract: Methods and apparatuses for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressing a substrate assembly against a planarizing surface of a polishing pad at a pad/substrate interface defined by a surface area of the substrate assembly contacting the planarizing surface. The method continues by moving the substrate assembly and/or the polishing pad with respect to the other to rub at least one of the substrate assembly and the planarizing surface against the other at a relative velocity. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals. The measured drag force can be used to generate a plot of work versus time.Type: GrantFiled: May 2, 2002Date of Patent: January 27, 2004Assignee: Micron Technology, Inc.Inventors: James J. Hoffmann, Gundu M. Sabde, Stephen J. Kramer, Michael James Joslyn
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Patent number: 6638138Abstract: An arrangement of grinding modules in a track grinder wherein a radial mismatch in narrow track bend radii can be considered in an exact manner without occurrence of constraining forces, enabling reprofiling to be reproduced in a simple manner. The arrangement provides a grinding tool with five degrees of freedom. Each grinding module is accommodated in an at least approximately vertical manner with a frame and in an at least horizontally manner on the frame with a holder. A housing in the holder is pivotably arranged around a shaft that is at least approximately parallel to the track to be ground. The grinding tool in the housing can be adjusted in a rectangular manner in relation to the track to be ground.Type: GrantFiled: September 25, 2001Date of Patent: October 28, 2003Inventors: Michael Luddeneit, Wilfried Scherf
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Patent number: 6609948Abstract: An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer is removed and ELG material is deposited therein. This is followed by forming track widths and back edges for each of the ELG and the read sensor to be followed by lapping to the ABS. Various films are employed for the ELG to minimize magnetoresistance and optimize the resistance of the ELG. The resistance of the ELG is then sensed by a computer for controlling a lapping tool to lap to the aforementioned ABS.Type: GrantFiled: November 27, 2000Date of Patent: August 26, 2003Assignee: International Business Machines CorporationInventors: Robert Edward Fontana, Jr., Richard Hsiao
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Patent number: 6568988Abstract: A chemical mechanical polishing apparatus has a plurality of electric machines for executing mechanical polishing motions, at least two control systems for controlling the mechanical polishing motions, at least two signal wires connected with the two control systems for transmitting signals of the two control systems, and a wave filter comprising two terminals connected with the two signal wires respectively for filtering out the signal whose voltage exceeds a predetermined value in the two signal wires.Type: GrantFiled: July 28, 2000Date of Patent: May 27, 2003Assignee: Mosel Vitelic Inc.Inventors: Yi-Hua Chin, Hua-Jen Tseng, Chun-Chieh Lee, Dong-Tay Tsai
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Publication number: 20030073379Abstract: The invention is an endface polishing method and an endface polishing apparatus improving polishing accuracy of an optical fiber and making polishing time and polishing work shorten. Polishing is performed making a boundary line center axis while observing the boundary line of brightness and darkness formed at outer circumference face of an optical fiber by irradiating substantial parallel light from the predetermined direction crossing at the right angle to the axis of the optical fiber in an endface polishing method polishing a tip end of the optical fiber held by a jig by a polishing member attached at a polishing disk in an apparatus providing the polishing disk supported by a main body of the apparatus and the jig holding the optical fiber.Type: ApplicationFiled: September 30, 2002Publication date: April 17, 2003Inventors: Kazumasa Katakura, Kouji Minami
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Patent number: 6405146Abstract: The invention relates to a warm-up cycle for each tire being tested on a force variation machine to stabilize the measurement parameters and optimize the warm-up cycle. The method for cycling each tire comprises the following steps. A tire type and preset tolerance values for each parameter of the tire being measured is inputted into the force variation machine. The tire is rotated in a first direction for two successive revolutions, data values for each of the parameters are calculated, and the differences between the calculated data values and the preset tolerance values are determined. Then the tire is rotated in a second opposite direction and the warm-up cycle is repeated. Continuing, the tire is rotated for one or more additional revolutions and the data values for the measured parameters are again calculated if necessary.Type: GrantFiled: June 8, 1999Date of Patent: June 11, 2002Assignee: The Goodyear Tire & Rubber CompanyInventor: Jean Engel
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Publication number: 20020012204Abstract: Herein is disclosed a method and apparatus for controlling a lapping process, so as to create a read/write head that contains a primary magnetoresistive read element with a desired stripe height. An improved lapping guide is achieved by incorporating a secondary magnetoresistive element into a read/write head. By virtue of its location on the same read/write head as a primary magnetoresistive element (used for reading data during operation of the disc drive), the secondary element is located in close proximity to the primary element, resulting in smaller tolerances in aligning or relating the top edges of the primary and secondary elements. Accordingly, the secondary magnetoresistive element more reliably serves as a proxy for the primary element. Optionally, the secondary magnetoresistive element may be fashioned with identical dimensions as the primary element, so as to render the secondary element equivalent to the primary element with regard to magnetic sensitivity.Type: ApplicationFiled: May 25, 2001Publication date: January 31, 2002Inventors: Zine-Eddine Boutaghou, Edward Stephens Murdock
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Publication number: 20020006764Abstract: A very versatile device is proposed for high-precision machining of optical workpieces, in particular optical lenses, which comprises a horizontally displaceable gantry with at least one vertically displaceable tool spindle and a yoke with workpiece holding means mounted so as to be rotatable about a swivel axis by means of journals fitted on both sides. For swivelling of the yoke without gearing and therefore without backlash, a torque motor is provided concentrically to the swivel axis, which motor is directly connected actively with one of the journals.Type: ApplicationFiled: June 25, 2001Publication date: January 17, 2002Applicant: Loh Optikmaschinen AGInventors: Manfred Hanisch, Joachim Diehl, Holger Schafer
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Patent number: 6330488Abstract: A method for controlling a machining process of a workpiece includes a step of measuring amounts of machining of the workpiece by a plurality of sensors located at different positions on the workpiece, the sensors providing detection signals which represent the respective measured amounts, a step of removing the detection signal when the detection signal has an abnormal value which is extremely different in comparison with values of the other detection signals by using a smoothing method, and a step of controlling the machining of the workpiece depending upon the remaining detection signals from the sensors.Type: GrantFiled: October 27, 1998Date of Patent: December 11, 2001Assignee: TDK CorporationInventors: Tomoyuki Yoshida, Noritsugu Kakegawa
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Publication number: 20010034190Abstract: A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system comprises a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.Type: ApplicationFiled: March 27, 2001Publication date: October 25, 2001Inventors: Mutsumi Tanikawa, Mitsunori Komatsu, Kiyotaka Kawashima, Hiroshi Shimomoto, Katsuya Okumura
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Publication number: 20010024927Abstract: An apparatus for the in situ superfinishing of crankshaft thrust bearing surfaces includes an oscillator, an oscillation arm connected to the oscillator such that the oscillation arm is reciprocable by the oscillator, a caliper disposed on the oscillation arm remote from the oscillator, and at least two abrasive pads disposed on the caliper. The oscillation arm facilitates the extension of the arm into the engine to cause the abrasive pads to engage the bearing and to abrasively superfinish the surfaces of the bearing. A method for the in situ superfinishing of the surfaces of the bearing includes operably locating a superfinishing apparatus adjacent the engine, extending the abrasive pads into the engine, causing the abrasive pads to engage the surfaces to be superfinished, and oscillating the abrasive pads in contact with the surfaces to be superfinished.Type: ApplicationFiled: March 21, 2001Publication date: September 27, 2001Inventors: Douglas Garvin, Floyd Curry
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Patent number: 6287170Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.Type: GrantFiled: February 9, 1998Date of Patent: September 11, 2001Assignee: Seagate Technology LLCInventors: Shanlin Hao, Lars Halvar Ahlen, Edward Michael Erickson
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Patent number: 6170149Abstract: According to a method of manufacturing a magnetic head, a magnetoresistive device is formed on a substrate, a top end portion of the magnetoresistive device is placed in an external magnetic field, and a height of the magnetic head is adjusted by ceasing a polishing operation at an instant when change in resistance of the magnetoresistive device relative to change in the external magnetic field comes up to a predetermined value.Type: GrantFiled: January 30, 1997Date of Patent: January 9, 2001Assignee: Fujitsu LimitedInventors: Mitsumasa Oshiki, Nobuo Iijima, Motoichi Watanuki
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Patent number: 6050878Abstract: A processing jig is provided for deforming an object to be processed that is long in one direction into a complicated shape and processing the object with accuracy. The jig comprises: a main body to be fixed to the processing apparatus; a retainer that is long in one direction for retaining a bar as the object long in one direction; four couplers for coupling the retainer and the main body to each other; three load application sections, coupled to the retainer, to which a load is applied for deforming the retainer; and arms for coupling the load application sections to the retainer. The retainer takes a shape of a narrow and long beam that is bent with an application of external force. The two load application sections on both ends each have three degrees of freedom in two directions orthogonal to each other and a direction of rotation, for example. The load application section in the middle has one degree of freedom in the vertical direction only.Type: GrantFiled: June 29, 1998Date of Patent: April 18, 2000Assignee: TDK CorporationInventors: Noboru Kanzo, Masahiro Sasaki, Masaki Kozu
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Patent number: 6027397Abstract: A dual element electrical lapping guide system is disclosed for a row of multi-layer dual element magnetoresistive and inductive magnetic transducers formed on a substrate, which will be used to form sliders, the sliders being separated by separation kerfs, and the multi-layer transducers aligned along an edge of the substrate for lapping of the edge. The dual element lapping guide system comprises superposed resistive elements and electrical switch elements, each positioned in one of the separation kerfs, and having an edge thereof positioned so as to be aligned with the edge of the row and subject to lapping of the row. Each electrical switch element comprises a bottom and a top layer connected at one end thereof and separated at the other end thereof by an insulation layer, so as to be initially closed at the connected end, which end is aligned with the edge of the multi-layer transducers and subject to lapping of the row at the connected end to open the switch element.Type: GrantFiled: April 25, 1997Date of Patent: February 22, 2000Assignee: International Business Machines CorporationInventors: Mark A. Church, Alain Michael Desouches
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Patent number: 5991698Abstract: A lapping system data acquisition unit is disclosed for use in measuring resistances of multiple resistors embedded in a structure to be machined. Each of multiple independent current sources directs a current through one of the multiple resistors embedded in the structure during machining of a surface of the structure. Each of multiple voltage sensing devices couples to a separate one of the multiple resistors and provides a separate analog voltage output signal indicative of the resistance of the resistor. Each of multiple filters is coupled to a separate one of the multiple voltage sensing devices Analog-to-digital conversion circuitry coupled to the multiple filters generates a digitized signal for each of the filtered output signals.Type: GrantFiled: May 7, 1997Date of Patent: November 23, 1999Assignee: Seagate Technology, Inc.Inventors: Shanlin Hao, Ray V. Rigles, William P. Wood, Lars H. Ahlen, John C. Heitke
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Patent number: 5948204Abstract: The present invention discloses an improvement on a wafer carrier ring for use in a chemical-mechanical polishing apparatus for uniformly polishing semiconductor wafers. The apparatus comprises of a ring assembly, a stainless steel backing plate and a rubber bladder for holding the ring assembly and the backing plate. The ring assembly comprises of two rings. The first ring is made of a soft material such as Delrin or PBT for holding the stainless steel backing plate which is attached to the wafer. A top portion of the first ring is cutoff to leave an annular notch. The second ring is made of a hard material such as stainless steel and is fitted into the annular notch of the first ring. Both rings are attached to the rubber bladder through two sets of screws which are evenly spaced through a circular path concentric to the circumference of the first ring.Type: GrantFiled: December 30, 1996Date of Patent: September 7, 1999Assignee: Intel CorporationInventors: James G. Maveety, George T. Waller, Wayne Gaynor