Abstract: The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, the polishing machine comprising a polishing disk (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for receiving an abrasive, a positioning device (17) for relative positioning of the polishing disk and of the polishing platform between a polishing position and a set-up position (16), and a drive device for executing a relative polishing movement between the polishing platform and the polishing disk in the polishing position, wherein the polishing machine has a cleaning device for applying dry ice to the polishing platform and/or to the polishing disk.

Abstract: In a polishing apparatus an optical connector polishing jig holds the MT ferrule provided at the connection end portion of the optical connector, the optical connector polishing jig includes: a cylinder base; a cylinder shaft held on the cylinder base to be capable of moving in the up-down direction; and a set block connected to an end of the cylinder shaft and having a hole into which the MT ferrule is inserted and in which fixing means for adjusting the pressing force and fixing the MT ferrule is inserted, and a surface of the fixing means that comes into contact with the MT ferrule has a protrusion that partially protrudes to apply a pressing force to the MT ferrule such that when the MT ferrule is fixed, an end surface of the MT ferrule is slightly deformed and a center portion of the end surface in a longitudinal direction swells.

Abstract: The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine frame, a grinding head hood 2, which defines a space in which the grinding head 1 is rotatable, a hollow and resilient member 4, arranged in the space, and a pressurized fluid source, operatively connected to the hollow member 4 to supply said pressurized fluid, whereby the hollow member 4 is resiliently expandable upon supply of said fluid.

Abstract: A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

Abstract: A method of processing at least one ferrule is disclosed. The at least one ferrule includes an end face. The method includes engaging the end face of the at least one ferrule and an abrasive element with each other at the mating interface; moving the at least one ferrule and the abrasive element relative to each other; and tracing a spiral path in the abrasive element due to the relative movement between the at least one ferrule and the abrasive element. An apparatus for carrying out the method is also disclosed.

Abstract: In a deterministic setting for finishing the support surface of a chuck such as a wafer chuck, the treatment tool may have a contacting surface shaped as a ring, annulus, or toroid, or at least such will be the form of contact when the treatment tool is brought into contact with a flat surface. The treatment tool may have about the same hardness as the work piece (e.g., the wafer chuck) that is being finished. In one embodiment, the treatment tool, or at least the flat contacting surface, is made from silicon carbide (SiC), or contains SiC, for example, in the form of a composite material such as reaction-bonded SiC.

Abstract: The present invention relates to a polishing system (100) for providing a polishing finish to a concrete surface, said system comprises a pad lock (2) which, one a second surface (6) thereof, comprises a number of protrusions (32) which are able to enter into engagement with a voids (16) arranged on a first surface (12) of a pad (10) placed between a fixing ring and said pad lock. The use of such a system provides a higher degree of integrity during use of said polishing system.

Abstract: An apparatus for processing a ferrule with an abrasive element. The apparatus includes a first mount to which the ferrule is secured, a second mount to which the abrasive element is secured, and a controller operatively coupled to at least the second mount. The second mount includes a spindle to which the abrasive element is coupled, with the spindle having a central axis about which the spindle is configured to rotate. At least one of the first or second mounts is movable within a plane such that when the ferrule and the abrasive element are brought into contact with each other, the apparatus provides three degrees of freedom of movement for processing the ferrule with the abrasive element. A method of using the apparatus to process a ferrule is also disclosed.

Abstract: A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.

Abstract: A specimen mover (100) for a grinding and/or polishing machine (120) is disclosed. The specimen mover (100) is configured for rotating one or more specimens (50) in abutment with a preparation surface (75) carried by the grinding and/or polishing machine (120) and the specimen mover (100) includes: a drive housing (20), a driveshaft (30) protruding from said drive housing (20), a thrust housing (10) disposed coaxially on said driveshaft (30) and including at least one thrust pad (12), and a specimen mover plate (15) disposed essentially coaxial with said thrust housing (10) and/or said driveshaft (30) The specimen mover is configured such that the thrust housing (10) is displaceable connected to the driveshaft (30) protruding from said drive housing (20) in a manner allowing the thrust housing (10) to move along, and relative to, the driveshaft (30) protruding from said drive housing (20).

Abstract: In a wafer chuck design featuring pins or “mesas” making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits, minimizes sticking of the wafer, and improves wafer settling. In another aspect of the invention is a tool and method for imparting or restoring flatness and roughness to a surface, such as the support surface of a wafer chuck. The tool is shaped such that the contact to the surface being treated is a circle or annulus. The treatment method may take place in a dedicated apparatus, or in-situ in semiconductor fabrication apparatus. The tool is smaller than the diameter of the wafer pin chuck, and may be approximate to the spatial frequency of the high spots to be lapped. The movement of the tool relative to the support surface is such that all areas of the support surface may be processed by the tool, or only those areas needing correction.

Abstract: A planarization processing device for polishing a substrate, such as a semiconductor wafer, includes a drive motor that rotates the substrate about a rotational axis. A support plate holds a pad for polishing the substrate such that the surface of the pad faces the surface of the substrate. The surface of the pad contains a catalyst, e.g., composed of a transition metal compound. A liquid that supports a catalytic reaction for polishing the substrate is supplied between the surfaces of the substrate and the pad. A reciprocating drive device causes the support plate to undergo reciprocating motion in a direction parallel to the surface of the pad by at least an amount that makes possible planarization of the substrate based on the catalytic reaction.

Abstract: A polishing system includes a support to hold a substrate having a substrate surface to be polished, a conditioning system for conditioning a polishing pad, the conditioning system comprising one or more conditioning heads, a movable support structure, and a carrier to hold a polishing pad. The carrier is suspended from the movable support structure, and the support structure is configured to move the carrier between the support to hold the substrate and the conditioning system.

Abstract: A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.

Abstract: The present invention provides a method for fabricating a super mirror finish stainless steel sheet uses the following steps: 1) rough machining, wherein a 400-450 grit sandpaper or scouring pad is used to remove an oxide layer on a surface of a stainless steel decorative sheet; 2) finish machining, wherein a 240-1,000 grit graphite grinding wheel is used to perform finish grinding; and 3) polishing processing, wherein an abrasive material is used to perform polishing. For the finish grinding and the polishing that are performed by using the grinding wheel and the abrasive material respectively, a multi-shaft polishing system is used to drive a grinding wheel, and a cylinder is controlled to adjust a force of each polishing shaft, which enables a stainless steel decorative sheet to have a surface finish under 0.01 ?m and a reflectivity above 69%.

Abstract: A drive unit for imparting rotation to a drum assembly of a floor grinder. The drive unit includes a rotatable pulley positioned adjacent to and in contact with a rotatable drive surface of a driven pulley of the drum assembly and a drive surface of the drum assembly. The rotatable drive surface of the driven pulley is configured to impart rotation to the rotatable drive pulley during rotation of the rotatable drive surface, and the rotatable drive pulley is configured to impart rotation thereof to the drum assembly.

Abstract: A pad conditioning tool includes a sapphire chip having a side surface defining a polishing surface and a plurality of sapphire grains formed on the polishing surface in an integral manner. Each of the sapphire grains had a three-dimensional geometric structure. The sapphire grains are arranged on the polishing surface in a specific form so as to possess a specific pattern.

Abstract: The invention relates to a method and an apparatus for handling slabs (2a, 2b), produced in particular by continuous casting, the surfaces of which are ground before they are rolled in a rolling train, wherein the slab, lying on a reversible grinding table (12a, 12b), is moved back and forth under a grinding unit, arranged in a machining cell, of a grinding machine unit (I, II), the grinding table is moved linearly out of the machining cell after the grinding operation has been performed on one surface, the slab is lifted off the grinding table and fed to a turning device, wherein, after turning, the slab is removed from the turning device and, with an unworked, other surface lying uppermost, is brought onto the grinding table, which is then introduced once again into the machining cell for the working of this surface.

Abstract: An apparatus for grinding a substrate is disclosed. In one aspect, the apparatus includes an inlet which receives a jig seated with a substrate including a curved surface, a grinding part grinding the substrate conveyed from the inlet, and a washing part washing the substrate conveyed from the grinding part. The grinding part includes a plurality of rollers, and each roller includes a concave portion and a convex portion which are adjacently disposed and a plurality of brushes.

Abstract: A polishing apparatus for polishing an optical fiber connector is disclosed. The polishing apparatus has a base portion to support a polishing media; and a polishing puck. The polishing puck includes a connector mount, to receive and hold the optical fiber connector secured to a terminal end of an optical fiber, and a polishing gear configured to engage with a ring gear disposed in the base portion such that a fiber tip of optical fiber mounted in the optical connector traces a roulette pattern on the polishing media upon rotational engagement of the polishing gear within the ring gear.

Abstract: The present invention provides method of double-side polishing a wafer, including: simultaneously polishing both surfaces of the wafer by holding the wafer in a holding hole of a carrier, interposing the held wafer between upper and lower turn tables to which polishing pads are attached, rotating the carrier about an axis of the carrier and revolving the carrier; and repeating the polishing in a batch manner, wherein a direction in which the carrier is revolved is reversed every polishing batch while repeating the polishing in a batch manner. The method enables wafers with high flatness to be stably obtained while inhibiting reduction in productivity due to dressing.

Abstract: Provided is a polishing apparatus capable of maintaining polishing precision although fewer expendable parts are periodically replaced. The polishing apparatus includes a polishing disk (20) having a polishing surface (20a) on the front side thereof to polish an end surface of a workpiece, a support mechanism (30) for supporting a back surface (20b) of the polishing disk (20) while allowing the polishing disk (20) to move along a predetermined plane, a workpiece holder (50) for holding the workpiece so as to contact the end surface of the workpiece with the polishing surface of the polishing disk, and a driving mechanism (70) for concurrently causing circular and reciprocating rectilinear motions of the polishing disk (20).

Abstract: An adaptive uniform polishing system is equipped with feedback control to apply localized adjustments during a polishing operation. The adaptive uniform polishing system disclosed has particular application to the semiconductor industry. Such an adaptive uniform polishing system includes a rotatable head that holds a semiconductor wafer, and a processing unit structured to be placed in contact with an exposed surface of the wafer. The processing unit includes a rotatable macro-pad and a plurality of rotatable micro-pads that can polish different portions of the exposed surface at different rotation speeds and pressures. Thus, uniformity across the exposed surface can be enhanced by applying customized treatments to different areas. Customized treatments can include the use of different pad materials and geometries. Parameters of the adaptive uniform polishing system are programmable, based on in-situ data or data from other operations in a fabrication process, using advanced process control.

Abstract: An apparatus and method for aligning a gemstone such as diamond (106) with a predetermined vertical axis (108) is described. The apparatus includes an upwardly extending nozzle (105) aligned with the vertical axis (108) and sized to allow the gemstone (106) to settle into it under the action of gravity so that the article is supported by the aperture. A fluid supply system supplies fluid to the nozzle (105) under sufficient pressure to support the article within or above the aperture. A fluid pressure control system controls the pressure of fluid supplied to the nozzle (105), so that it can be reduced gradually.

Abstract: An enclosed polishing apparatus include a housing, a fixing seat, a guiding mechanism, and a chain-driven polishing mechanism. The housing includes a bottom housing and a top housing connected to the bottom housing. The fixing seat is securely placed in the bottom housing. The guiding mechanism is placed in the top housing above the fixing seat. The polishing mechanism is movably mounted on the guiding mechanism above the fixing seat. The polishing mechanism is driven and guided by the guiding mechanism to follow a desired polishing contour on a workpiece.

Abstract: An adaptive uniform polishing system is equipped with feedback control to apply localized adjustments during a polishing operation. The adaptive uniform polishing system disclosed has particular application to the semiconductor industry. Such an adaptive uniform polishing system includes a rotatable head that holds a semiconductor wafer, and a processing unit structured to be placed in contact with an exposed surface of the wafer. The processing unit includes a rotatable macro-pad and a plurality of rotatable micro-pads that can polish different portions of the exposed surface at different rotation speeds and pressures. Thus, uniformity across the exposed surface can be enhanced by applying customized treatments to different areas. Customized treatments can include the use of different pad materials and geometries. Parameters of the adaptive uniform polishing system are programmable, based on in-situ data or data from other operations in a fabrication process, using advanced process control.

Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.

Abstract: A drive assembly for a grinder has a housing device, a drive device, multiple transmission devices and multiple grinding devices. The drive device has a motor, a driving wheel and a driving band connected with the motor and the driving wheel. Each transmission device has a transmission wheel, multiple driven wheels and a transmission band. Each transmission band is engaged with the driven wheels and the transmission wheel is engaged with the driving band. With two-layer arrangement of the bands, the driving band and the transmission bands are not long and can be rotated smoothly to reduce energy waste. Accordingly, the motor's load is greatly reduced, and life spans of the driving band and the transmission bands are prolonged.

Abstract: A polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector includes a connector housing and a ferrule. The polishing apparatus includes a mount to receive and hold the optical connector and a polisher housing supported by a base. The polisher housing houses a polisher that comprises a platen that supports a polishing media, the platen being coupled to a planetary gear system. The mount is disposed on a cover that encloses the polisher housing when the cover is placed in a closed position. A rotatable knob is exposed at an opening of the base, the rotatable knob being engaged with the planetary gear system to move the planetary gear system. The polishing media is disposed proximate to a fiber tip extending from an end face of the ferrule of the optical connector disposed in the mount when the cover is placed in the closed position.

Abstract: The present invention comprises of a process for lapping a high-throughput of ultra-flat wafers by utilizing a lapping apparatus containing a rotary flat, grooved polishing platen, at least two rotating pressurized heads each having a polishing wafer carrier that is adapted to receive a plurality of mounted wafers, and a plurality of concentric conditioning rings surrounding each pressurized head. The rotating pressurized heads are counterbalanced throughout the inventive process, and the lapping platen is continuously conditioned by simultaneously rotating the concentric conditioning rings over the lapping platen. This process allows continuous and controllable planarization thus allowing for a high throughput of wafers, while at the same time it prevents distortions in the lapping platen which reduces maintenance by providing continuous conditioning of the lapping platen.

Abstract: A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.

Abstract: A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface treatment region, a surface treatment disc for supporting and spinning the bowling ball in the surface treatment region, the surface treatment disc having a surface treatment element for making frictional contact with the bowling ball, a temporary support disc for temporarily supporting the bowling ball in the temporary waiting region when the bowling ball is moved out of the surface treatment region, and a disc drive unit for rotatingly driving the surface treatment disc and the temporary support disc.

Abstract: A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable use using a 9 volt battery. The method is capable of using lower contact pressures between fiber ends and a polishing surface and higher rates of rotation of the drive mechanism, reducing the polishing time for preparing fiber ends for applications. The polishing pattern changes when pressure is applied between a fiber end and the polishing surface. The fiber end provides one intermittent axis of rotation and the friction cam provides another intermittent axis of rotation.

Abstract: A holder for workpieces with end surfaces thereof being polished comprises a main body and a framework in which the main body is provided with a plurality of fixtures for holding the workpieces and the ring-shaped first supporting portion, and the framework is provided with the second supporting portion surrounding the outer side of the first supporting portion. The second supporting portion limits the angular movement of the first supporting portion to enable the main body to keep parallel to the polishing surface during the end surface of the respective workpiece is brought into contact with the polishing surface. The structure of the holder is capable of reducing the fabrication time and cost of the first supporting portion tremendously.

Abstract: A bowling ball surface treatment apparatus is designed to uniformly abrade and polish a bowling ball. The apparatus includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball and confining the bowling ball within a limited surface treatment area, and a surface treatment disc arranged below the ball movement guider for supporting, rotating and revolving the bowling ball. The surface treatment disc has a disc shaft and a surface treatment element for abrading or polishing the bowling ball. The apparatus further includes a disc rotating device for rotating the surface treatment disc about a disc center axis and a disc revolving device for rotatably holding the disc shaft of the surface treatment disc and for causing the surface treatment disc to make revolving movement around a sun axis offset from the disc center axis.

Abstract: A grinding machine includes a machine frame with a work piece support surface on which a work piece may be transporter through the machine. A grinding bar arrangement including two grinding shoes positioned in parallel is arranged transversely with respect to a work piece feeding direction across the width of the work piece support surface. The two grinding shoes carry a grinding medium on their surfaces facing the work piece support surface and are suspended via an eccentric drive. The two grinding shoes perform rotary movements in a plane parallel to the work piece support surface achieving a high quality grinding result.

Abstract: A holder for supporting an end surface of a workpiece during polishing comprises a main body and a framework which are respectively provided with fixing portions corresponding to each other; at least one of the two fixing portions has at least one set of upper and lower contact portions, and the upper and the lower contact portions on each set are respectively disposed above and below a contact plane formed between the end surface of the workpiece and a polishing surface; when the upper and lower contact portions and another one of the fixing portions one another, the main body is capable of keeping parallel to the polishing surface, and the pressure acting on the end surface of each workpiece is capable of being approximately uniform. Hence, the number of end surfaces of the optical fibers can be increased tremendously during polishing so as to enhance the polishing speed and quality.

Abstract: In a machine for processing the edges and outer surfaces of flat workpieces, including a machine frame with a workpiece support surface 12 and at least one dressing head 14 with a work tool carrier, which work tool carrier is rotatably supported on the machine frame for rotation about a first axis perpendicular to the workpiece support surface 12 and is driven by a drive, and which work tool carrier carries at least two work tools 32 rotatably supported eccentrically to the first axis on the work tool carrier each for rotation about a second axis perpendicular to the workpiece support surface 12, and each of which tools is connected with a planet gear 44 which stands in meshing drive engagement with a sun gear 26 coaxial to the first axis so that each circulating work tool carrier defines an effective circle 46 of its work tools 32, with at least two dressing heads 14 being so arranged next to one another that the effective circles 46 of their work tools 32 overlap, with the movement of the work tool carriers

Abstract: A removable head assembly for a combination rotary, including: a body; a rotatable element connected to the body and including an indentation or protrusion for fixing a pad assembly to the rotatable element; and a locking assembly including first and second elements. The body is connectable to a combination rotary tool and is rotatable about a first axis; the rotatable element is rotatable about a second axis; the indentation or protrusion is aligned with a third axis substantially parallel to the second axis; and the first element is displaceable to displace the second element to rotationally fix the rotatable element with respect to the body so that the first and third axes are co-linear, and the second axis is out of alignment with the first and third axes.

Abstract: A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable use using a 9 volt battery. The method is capable of using lower contact pressures between fiber ends and a polishing surface and higher rates of rotation of the drive mechanism, reducing the polishing time for preparing fiber ends for applications. The polishing pattern changes when pressure is applied between a fiber end and the polishing surface. The fiber end provides one intermittent axis of rotation and the friction cam provides another intermittent axis of rotation.

Abstract: An edge section of a wafer can be polished, and at same time, a polishing surface of a polishing member can be dressed by a dresser mechanism. A polishing member has annular concave trenches, which are coaxially formed in the front surface thereof, and at least an inner surface of the concave trenches is composed of an inclined polishing surface for polishing an edge section of the wafer, and a wafer pressing mechanism presses the edge section of the wafer against the inner surfaces in at least one side of the concave trench of the polishing member, and a dresser mechanism dresses at least the inner surfaces in at least one side of the concave trench of the polishing member.

Abstract: The invention concerns a device for abrading a wall of stone or concrete material. The invention comprises a shell (2) with which is operationally connected an abrading head (1), and a carriage intended to move at least along the surface and support the shell (2) movably so that the abrading head (1) by means of the movement of the shell (2) performs an upward and downward abrading movement. The abrading head (1) is of the type which has a rotatably mounted and driven planet wheel with a number of driven abrading discs rotatably mounted thereon and fitted with abrading elements. The device has an element for placing the abrading head (1) with a predeterminable force against the surface to be abraded.

Abstract: A fiber optic polishing apparatus is disclosed including a single degree-of-freedom (DOF) gear transmission system, a pressurizing module, a fixture module, and a housing assembly. The single DOF gear transmission system would enable a fiber optic polishing machine, . or polisher to be driven by only one motor, or by human hand. The manual polisher is a unique field polishing machine where electricity or battery is not available or not allowed. Both manual polisher and motorized polisher have the following features: polishing up to four connectors or ferrules simultaneously; adjustable force ensures consistent finish for a wide variety of connector types and the number of connectors in the fixture; quick release for convenient removal of polish fixture; low center of gravity for high stability; small footprint for multiple-machine operation to avoid time-consuming film change.

Abstract: A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable use using a 9 volt battery. The method is capable of using lower contact pressures between fiber ends and a polishing surface and higher rates of rotation of the drive mechanism, reducing the polishing time for preparing fiber ends for applications. The polishing pattern changes when pressure is applied between a fiber end and the polishing surface. The fiber end provides one intermittent axis of rotation and the friction cam provides another intermittent axis of rotation.

Abstract: A sanding machine (1; 300) comprising a support structure (2; 302) for the piece (3) to be processed and a sanding unit (4) for the piece (3) itself. The sanding unit (4) comprises a frame (40) that supports a winding element (8) cooperating with kinematic means (9) suitable for setting it in motion according to a closed ring configuration on a plane (?1) substantially parallel to the plane (?2) defined by the support structure (2; 302) and a plurality of abrasive elements (10) combined with the winding element (8) spaced from one another and provided with an abrasive surface (16; 416) that comes in contact with the piece (3) during the movement of the winding element (8).

Abstract: The present invention relates to a two-way rotary multi-function polisher, which comprises an input shaft driven to rotate by a power resource, a first spur gear and a second spur gear engagably transmitted by the end of input shaft; wherein the first spur gear is in response to the second spur gear and fixed to an output shaft having an inner polishing disc at the end thereof, so as to rotate the inner polishing disc in the first direction, while the second spur gear is coupled to a sleeve having an outer polishing disc at the end thereof and disposed to the exterior of output shaft by a bearing, so as to rotate the outer polishing disc in the second direction; hence, while the input shaft rotating, the inner and the outer polishing disc can respectively rotate in the opposite direction, enabling the two-way polishing and grinding to be achieved.

Abstract: The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a lower polishing plates; a sun gear and an internal gear; and a carrier provided between the polishing plates and engaged with the gears. Both side faces of the work piece held by the carrier are simultaneously polished by the polishing plates. DD motors respectively rotate the lower polishing plate and the gears. Each DD motor has a ring-shaped output member. A first DD motor has the output member directly connected to a rotary holding member rotatably holding the lower polishing plate. A second DD motor is provided under the first DD motor.

Abstract: A ferrule polishing control machine has a ferrule type input part for selecting one type of ferrule from various ferrule types stored in a computer. A ferrule end face shape input part selects one type of ferrule end face shape from various types of ferrule end face shapes stored in the computer. A connector type input part selects one type of connector from various connector types stored in the computer. A ferrule polishing number input part selects from ferrule polishing numbers stored in the computer a number of ferrules to be mounted on a polishing jig for a polishing operation. A transmitting part selects polishing pressure information stored in the computer in accordance with polishing information inputted from the ferrule type input part, the ferrule end face shape input part, the connector type input part, and the ferrule polishing number input part, and transmits the polishing pressure information to a ferrule polishing machine.

Abstract: An optical connector machining apparatus (500) is comprised of an operation circuit box (1) containing a drive motor (9) and a battery (10) while serving as a grasping section, and a planetary gear mechanism box (2) having a drive mechanism (8) that rotatably holds a polishing table (4) with a polishing table retainer (3) while permitting rotation of the drive motor to be delivered to the polishing table retainer through a planetary gear mechanism, wherein a chuck mounting section (5) is fixedly secured to the planetary gear mechanism box through two pieces of columns (6, 6), and a chuck (43), slidably guiding a ferrule (A) with respect to the polishing table in a vertical direction, and a pressure-applying mechanism (7) for urging the ferrule to the polishing table in a vertical direction, are mounted to the chuck mounting section.

Abstract: This invention pertains to methods and apparatus for polishing and planarization of workpieces, such as fiber optics connectors, metallographic samples, semiconductor wafers, microelectronic substrate, optical devices and the like. The polishing pattern is a hypotrochoid generated by a spur gear rotating inside of an internal gear. The hypotrochoid is a superior polishing pattern because it not only provides a pattern similar to a figure eight pattern for producing optimal polishing conditions, but it also appears to precess around the center of the polishing space and maximize the utilization of the polishing pad or film.